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蜂窝/LPWA IoT 设备生态系统 - 第七版
市场调查报告书
商品编码
1290718

蜂窝/LPWA IoT 设备生态系统 - 第七版

Cellular and LPWA IoT Device Ecosystems - 7th Edition
出版日期: | 出版商: Berg Insight | 英文 120 Pages | 商品交期: 最快1-2个工作天内

价格

蜂窝/LPWA（非3GPP）物联网模块的市场规模预计将从2022年的5.14亿个增至2027年的11亿个，复合年增长率为16.3%。

本报告调查并分析了蜂窝和 LPWA 物联网设备生态系统，提供了技术和标准比较、LPWA 技术的采用趋势以及到 2027 年的市场预测。

内容

图表列表

执行摘要

第 1 章物联网广域网

  • 连接到广域网的物体
    • 电錶
    • 汽车
    • 建筑
    • 低价值资产 - 工业 4.0 和消费品
    • 建设更智能、更安全城市的机会
  • 技术选项
    • 网络部署模型
    • 授权/非授权频段
    • 移动电话技术与LPWA技术的成本比较
  • 主要的技术生态系统有哪些？

第 2 章 3GPP 生态系统

  • 技术特点
  • 半导体供应商
    • ASR Microelectronics
    • Eigencomm
    • Intel
    • MediaTek
    • MLINK
    • Qualcomm
    • Samsung Electronics
    • Sequans Communications
    • Sony
    • UNISOC
    • Xinyi Information Technology
    • 其他半导体供应商
  • 模块供应商
    • China Mobile IoT
    • Fibocom
    • Gosuncn WeLink
    • MeiG Smart Technology
    • Murata
    • Neoway
    • Nordic Semiconductor
    • Quectel
    • Rolling Wireless (Fibocom)
    • Sierra Wireless (Semtech)
    • Sunsea AIoT (SIMCom & Longsung)
    • Telit Cinterion
    • u-blox
    • 其他蜂窝物联网模块供应商

第 3 章 LoRa/LoRaWAN 生态系统

  • 技术特点
  • 网路足迹
    • 欧洲
    • 亚太地区
    • 美洲
    • 中东和非洲
  • 半导体/模块供应商
    • Semtech
    • 其他半导体供应商
    • LoRa模块供应商

第 4 章 Sigfox 生态系统

  • 技术特点
  • 网络足迹
    • 欧洲
    • 美洲
    • 亚太地区
    • 中东和非洲
    • UnaBiz 与 LoRaWAN 生态系统合作
    • Sigfox 主要用例示例
  • 半导体/模块供应商
    • 半导体供应商
    • Sigfox 模块供应商

第 5 章新 LPWA 生态系统

  • IEEE 802.15.4
  • 丝网
  • DECT-2020 NR (NR+)
  • 米蒂
  • 芯片组/模块供应商

第 6 章市场预测和趋势

  • 市场概况
  • 3GPP 家族
    • 欧洲
    • 北美
    • 拉丁美洲
    • 中国
    • 亚太地区其他地区
    • 中东和非洲
  • LoRa
  • Sigfox
  • 全新 LPWA 技术
  • 首字母缩写词和缩写词列表

The Internet of Things is weaving a new worldwide web of interconnected objects. As of Q1-2023, about 3.1 billion devices were connected to wide area networks based on cellular or LPWA technologies. The market is highly diverse and divided into multiple ecosystems. Berg Insight forecasts that annual shipments of cellular and non-3GPP LPWA IoT modules will grow at a compound annual growth rate (CAGR) of 16.3 percent from 514 million units in 2022 to 1.1 billion units in 2027. Get up to date with the latest trends from all main regions and vertical markets with this unique 120-page report.

Highlights from the report:

  • 360-degree overview of the main IoT wide area networking ecosystems.
  • Comparison of technologies and standards.
  • Updated profiles of the main suppliers of IoT chipsets and modules.
  • Cellular IoT module market data for 2022.
  • Adoption trends for LPWA technologies including NB-IoT, LTE-M, LoRa and Sigfox.
  • Cellular and non-3GPP LPWA IoT device market forecasts until 2027.

Table of Contents

Table of Contents

Table of Contents

List of Figures

Executive Summary

1. Wide Area Networks for the Internet of Things

  • 1.1. Which things will be connected to wide area networks?
    • 1.1.1. Utility meters
    • 1.1.2. Motor vehicles
    • 1.1.3. Buildings
    • 1.1.4. Low value assets-Industry 4.0 and consumer products
    • 1.1.5. The opportunity to create smarter and safer cities
  • 1.2. What are the technology options?
    • 1.2.1. Network deployment models
    • 1.2.2. Unlicensed and licensed frequency bands
    • 1.2.3. Cost comparison for cellular and LPWA technologies
  • 1.3. Which are the leading technology ecosystems?

2. 3GPP Ecosystem

  • 2.1. Technology characteristics
    • 2.1.1. 3GPP Release 13-Introducing LTE-M and NB-IoT
    • 2.1.2. 3GPP Release 14-IoT enhancements and C-V2X
    • 2.1.3. 3GPP Release 15-The first phase of 5G specifications
    • 2.1.4. 3GPP Release 16-URLLC enhancements, IIoT features and 5G NR C-V2X
    • 2.1.5. 3GPP Release 17-RedCap and non-terrestrial network communications
    • 2.1.6. Network footprint
    • 2.1.7. 2G/3G mobile networks
    • 2.1.8. 4G mobile networks
    • 2.1.9. 4G/5G mobile IoT networks (LTE-M and NB-IoT)
    • 2.1.10. 5G mobile networks
  • 2.2. Semiconductor vendors
    • 2.2.1. ASR Microelectronics
    • 2.2.2. Eigencomm
    • 2.2.3. Intel
    • 2.2.4. MediaTek
    • 2.2.5. MLINK
    • 2.2.6. Qualcomm
    • 2.2.7. Samsung Electronics
    • 2.2.8. Sequans Communications
    • 2.2.9. Sony
    • 2.2.10. UNISOC
    • 2.2.11. Xinyi Information Technology
    • 2.2.12. Other semiconductor vendors
  • 2.3. Module vendors
    • 2.3.1. China Mobile IoT
    • 2.3.2. Fibocom
    • 2.3.3. Gosuncn WeLink
    • 2.3.4. MeiG Smart Technology
    • 2.3.5. Murata
    • 2.3.6. Neoway
    • 2.3.7. Nordic Semiconductor
    • 2.3.8. Quectel
    • 2.3.9. Rolling Wireless (Fibocom)
    • 2.3.10. Sierra Wireless (Semtech)
    • 2.3.11. Sunsea AIoT (SIMCom & Longsung)
    • 2.3.12. Telit Cinterion
    • 2.3.13. u-blox
    • 2.3.14. Other cellular IoT module vendors

3. LoRa and LoRaWAN Ecosystem

  • 3.1. Technology characteristics
  • 3.2. Network footprint
    • 3.2.1. Europe
    • 3.2.2. Asia-Pacific
    • 3.2.3. The Americas
    • 3.2.4. Middle East & Africa
  • 3.3. Semiconductor and module vendors
    • 3.3.1. Semtech
    • 3.3.2. Other semiconductor vendors
    • 3.3.3. LoRa module vendors

4. Sigfox Ecosystem

  • 4.1. Technology characteristics
  • 4.2. Network footprint
    • 4.2.1. Europe
    • 4.2.2. The Americas
    • 4.2.3. Asia-Pacific
    • 4.2.4. Middle East & Africa
    • 4.2.5. UnaBiz partners with the LoRaWAN ecosystem
    • 4.2.6. Examples of major Sigfox use cases
  • 4.3. Semiconductor and module vendors
    • 4.3.1. Semiconductor vendors
    • 4.3.2. Sigfox module vendors

5. Emerging LPWA Ecosystems

  • 5.1. IEEE 802.15.4
    • 5.1.1. Connectivity stacks based on 802.15.4
    • 5.1.2. Network footprint
  • 5.2. Wirepas Mesh
  • 5.3. DECT-2020 NR (NR+)
  • 5.4. Mioty
  • 5.5. Chipset and module vendors

6. Market Forecasts and Trends

  • 6.1. Market summary
  • 6.2. 3GPP family
    • 6.2.1. Europe
    • 6.2.2. North America
    • 6.2.3. Latin America
    • 6.2.4. China
    • 6.2.5. Rest of Asia-Pacific
    • 6.2.6. Middle East & Africa
  • 6.3. LoRa
  • 6.4. Sigfox
  • 6.5. Emerging LPWA technologies
  • List of Acronyms and Abbreviations

List of Figures

  • Figure 1.1: Top wide area IoT target segments (2022)
  • Figure 1.2: Building stock by category (EU27+3/US 2022)
  • Figure 1.3: Unlicensed and reserved radio frequencies available for wireless IoT
  • Figure 1.4: Cost comparison for wireless modules (2023)
  • Figure 2.1: Comparison of LTE-M and NB-IoT specifications
  • Figure 2.2: Technology positioning of RedCap in relation to eMBB, URLLC and mMTC
  • Figure 2.3: The number of LTE-M and NB-IoT networks (World 2018-2022)
  • Figure 2.4: IoT solution design options
  • Figure 2.5: Cost comparison between module and chipset designs
  • Figure 2.6: Routes to market for cellular IoT chipsets
  • Figure 2.7: Cellular IoT chipset vendor volume market shares (World 2022)
  • Figure 2.8: Business activities of key cellular chipset providers (Q1-2023)
  • Figure 2.9: MLINK's product portfolio roadmap
  • Figure 2.10: Qualcomm's IoT modem chipsets (Q1-2023)
  • Figure 2.11: QCT revenues by segment (2019-2022)
  • Figure 2.12: Samsung's latest automotive chip solutions
  • Figure 2.13: Sequans' revenues by product segment (2019-2022)
  • Figure 2.14: Top cellular IoT module vendors, by revenues and shipments (World 2022)
  • Figure 2.15: Fibocom's embedded cellular IoT modules (Q2-2023)
  • Figure 2.16: Gosuncn WeLink's embedded cellular IoT modules (Q2-2023)
  • Figure 2.17: MeiG's embedded cellular IoT modules (Q2-2023)
  • Figure 2.18: Neoway's embedded cellular IoT modules (Q2-2023)
  • Figure 2.19: Regulatory certifications overview for nRF9160
  • Figure 2.20: Quectel's cellular IoT module series (Q2-2023)
  • Figure 2.21: Sierra Wireless' device-to-cloud offering
  • Figure 2.22: Sierra Wireless' embedded cellular modules (Q2-2023)
  • Figure 2.23: SIMCom's and Longsung's embedded cellular IoT modules (Q2-2023)
  • Figure 2.24: Telit Cinterion's embedded cellular IoT modules (Q2-2023)
  • Figure 2.25: u-blox' embedded cellular IoT modules (Q2-2023)
  • Figure 2.26: u-blox Thingstream platform overview
  • Figure 3.1: LoRaWAN network architecture
  • Figure 3.2: Public LoRaWAN network operators in Europe (Q2-2023)
  • Figure 3.3: Public LoRaWAN network operators in Asia-Pacific (Q2-2023)
  • Figure 3.4: Public LoRaWAN network operators in the Americas (Q2-2023)
  • Figure 3.5: Amazon Sidewalk network coverage
  • Figure 3.6: Total onboarded Helium LoRaWAN gateways
  • Figure 3.7: Public LoRaWAN network operators in Middle East & Africa (Q2-2023)
  • Figure 3.8: Semtech's LoRa business KPIs (FY-2020-FY-2023)
  • Figure 3.9: LoRa module vendors (Q2-2023)
  • Figure 4.1: Sigfox network architecture
  • Figure 4.2: Sigfox network partners in Europe (Q2-2023)
  • Figure 4.3: Sigfox networks in the Americas (Q2-2023)
  • Figure 4.4: Sigfox networks in Asia-Pacific and MEA (Q2-2023)
  • Figure 4.5: List of Sigfox module vendors by supported regions (Q2-2023)
  • Figure 5.1: Major 802.15.4 networking platforms for smart metering (Q1-2023)
  • Figure 5.2: Members of the Mioty Alliance
  • Figure 6.1: Cellular/LPWA IoT device shipment forecast, by region (World 2021-2027)
  • Figure 6.2: Cellular/LPWA IoT device shipment forecast, by technology (2021-2027)
  • Figure 6.3: Cellular IoT module shipments, by region (World 2021-2027)
  • Figure 6.4: Cellular IoT module shipment forecast (World 2021-2027)
  • Figure 6.5: Cellular IoT module shipment forecast (Europe 2021-2027)
  • Figure 6.6: Cellular IoT module shipment forecast (North America 2021-2027)
  • Figure 6.7: Cellular IoT module shipment forecast (Latin America 2021-2027)
  • Figure 6.8: Cellular IoT module shipment forecast (China 2021-2027)
  • Figure 6.9: Cellular IoT module shipment forecast (Rest of Asia-Pacific 2021-2027)
  • Figure 6.10: Cellular IoT module shipment forecast (Middle East & Africa 2021-2027)
  • Figure 6.11: LoRa device shipments forecast (World 2021-2027)
  • Figure 6.12: Sigfox device shipments forecast (World 2021-2027)
  • Figure 6.13: 802.15.4 WAN device shipments forecast (World 2021-2027)