市场调查报告书
商品编码
1182062
SiC 晶圆全球市场研究与预测:晶圆尺寸、应用、最终用户行业、区域分析,2022-2029 年Global SiC Wafer Market Size study & Forecast, by Wafer Size, Application, End-user Industry, and Regional Analysis, 2022-2029 |
SiC 晶圆是具有极高强度的硅碳半导体化合物。
出色的机械、热和化学稳定性。 晶圆製造过程涉及将 SiC 固体包转化为外延或设备就绪的原始晶圆。 主要应用于电源、高频等领域。 由于对LED照明设备的需求增加和对电动汽车的需求增加等因素,SiC晶圆的市场正在扩大。
根据 2022 Statista 的数据,电子设备的使用在全球范围内迅速增长。 预计2022年消费电子市场将实现10566.93亿美元的市场增长。 据估计,中国是产生最高电子产品销售额的主要地区,即 2509.11 亿美元。 这包括各种耗电设备(例如可穿戴设备和汽车设备)中的 LED 照明。 另一方面,SiC 晶圆在电力电子领域的应用不断增加,以及全球市场参与者不断增加的研发活动,为市场创造了有利可图的机会。 然而,在整个 2022-2029 年的预测期内,散热、可扩展性以及与封装相关的芯片和基板供应压力等限制因素将阻碍市场增长。
全球 SiC 晶圆市场研究考虑的主要区域是亚太地区、北美、欧洲、拉丁美洲和世界其他地区。 由于严格的政府监管、对 LED 照明设备的需求增加以及对功率设备的投资等因素,亚太地区被认为是全球创收的关键地区。 由于主要参与者的增长和开发活动的增加等因素,预计亚太地区在预测期内将显着增长。
这项研究的目的是揭示近年来各个细分市场和国家/地区的市场规模,并预测未来几年的市场规模。 本报告旨在捕捉被调查国家行业的定性和定量方面的情况。
它还提供了关键方面的详细信息,例如决定市场未来增长的驱动因素和挑战。 此外,它还包含供利益相关者投资的微观市场潜在机会,以及对主要参与者的竞争格局和产品供应的深入分析。
Global SiC Wafer Market is valued at approximately USD XX billion in 2021 and is anticipated to grow with a healthy growth rate of more than XX % over the forecast period 2022-2029. SiC Wafer is a silicon carbon semiconductor compound that is extremely strong. It provides excellent mechanical thermal and chemical stability. The wafering process involves converting a solid puck of SiC into an epi or device-ready prime wafer. It has major applications across power, radio frequency, others. The SiC Wafer market is expanding because of factors such as rising demand for LED lighting devices and increasing demand for electric vehicles.
According to Statista in 2022, the adoption of electronic devices is rising rapidly all over the world. The consumer electronics market is projected to attain market growth of about USD 1,056,693 million by in 2022. China is estimated to be the dominating region in terms of highest revenue generation in electronic devices i.e., USD 250,911 million. It includes LED lights across various power consumption devices such as wearable devices, automotive devices, and so on. Whereas the rising application of Sic Wafers across power electronics and growing R&D activities by market players across the globe create lucrative opportunities for the market. However, limiting Constraints such as Heat Dissipation, Scalability, and Packaging-related Pressure on the Die and Substrate Supply hampers the market growth throughout the forecast period of 2022-2029.
The key regions considered for the Global SiC Wafer Market study include Asia Pacific, North America, Europe, Latin America, and the Rest of the World. The Asia Pacific is considered the dominating region across the globe in terms of revenue generation owing to the factors such as stringent government regulations, increasing demand for LED lighting devices, and investment in power devices. Whereas the Asia Pacific is expected to grow significantly during the forecast period, owing to factors such as increasing growth and development activities by key players in the forecast period.
Major market players included in this report are:
Wolfspeed, Inc.
II-VI Incorporated
Xiamen Powerway Advanced Material Co. Ltd
STMicroelectronics (Norstel AB)
Showa Denko KK
Atecom Technology Co., Ltd.
SK Siltron
SiCrystal GmbH
TankeBlue Co., Ltd.
Semiconductor Wafer Inc.
Recent Developments in the Market:
Global SiC Wafer Market Report Scope:
Historical Data: 2019-2020-2021
Base Year for Estimation: 2021
Forecast period: 2022-2029
Report Coverage: Revenue forecast, Company Ranking, Competitive Landscape, Growth factors, and Trends
Segments Covered: Wafer Size, Application, End-user Industry Region
Regional Scope: North America; Europe; Asia Pacific; Latin America; Rest of the World
Customization Scope: Free report customization (equivalent up to 8 analyst's working hours) with purchase. Addition or alteration to country, regional & segment scope*
The objective of the study is to define the market sizes of different segments & countries in recent years and to forecast the values for the coming years. The report is designed to incorporate both qualitative and quantitative aspects of the industry within the countries involved in the study.
The report also caters the detailed information about the crucial aspects such as driving factors & challenges which will define the market's future growth. Additionally, it also incorporates potential opportunities in micro markets for stakeholders to invest along with a detailed analysis of the competitive landscape and product offerings of key players. The detailed segments and sub-segment of the market are explained below:
By Wafer Size:
2-, 3-, and 4 inches,
6-inch,
8- and 12-inch
By Application:
Power
Radio Frequency (RF)
By End-User:
Telecom & Communications,
Automotive & Electric Vehicles (EVs),
Photovoltaic/Power Supply/Energy Storage,
Industrial (UPS and Motor Drives)
By Region:
North America
U.S.
Canada
Europe
UK
Germany
France
Spain
Italy
ROE
Asia Pacific
China
India
Japan
Australia
South Korea
RoAPAC
Latin America
Brazil
Mexico
Rest of the World
List of tables and figures and dummy in nature, final lists may vary in the final deliverable
List of figures
List of tables and figures and dummy in nature, final lists may vary in the final deliverable