半导体行业的增材製造:技术扩散和路线图
市场调查报告书
商品编码
1167931

半导体行业的增材製造:技术扩散和路线图

Additive Manufacturing in the Semiconductor Industry: Technology Penetration and Roadmap

出版日期: | 出版商: Frost & Sullivan | 英文 69 Pages | 商品交期: 最快1-2个工作天内

价格
简介目录

本报告分析了增材製造 (AM)(也称为 3D 打印)在半导体行业中的市场机遇。 它详细介绍了市场趋势和驱动因素,总结了半导体行业到 2028 年的预测,并提供了主要参与者简介等。

内容

战略要务

  • 为什么增长越来越难?
  • 战略要务
  • 半导体行业增材製造三大战略要务的影响
  • 增长机会加速增长管道引擎
  • 调查方法
  • 调查结果摘要

增长机会分析

  • 分析范围
  • 受 AM 在半导体中的使用影响的终端市场细分
  • 增长动力
  • 抑制增长的因素

行业展望、技术与应用趋势、招聘趋势

  • 全球半导体行业展望
  • 2020 年至 2021 年 IC 短缺对汽车行业的影响
  • 大流行期间增材製造对半导体製造的影响
  • AM 製造的半导体零件
  • 气溶胶喷射打印 (AJP) 和选择性激光烧结 (SLS) 是能够实现半导体製造的增材製造技术。
  • 立体光刻 (SLA) 和数字光处理 (DLP) 是能够实现半导体製造的增材製造技术
  • 增材製造对六个终端市场半导体行业的影响分析
  • 半导体行业增材製造应用情况分析
  • 影响 3D 打印半导体采用的全球趋势
  • 技术开发:专注于微型电子印刷和先进材料
  • 技术开发:专注于缩短打印交付週期和打印复杂零件
  • 3D 打印半导体零件的市场趋势(按应用分类)

区域形势与价值链分析

  • 区域采用情况:推动采用 3D 打印的因素
  • 全球竞争格局
  • 促进市场渗透和采用的新业务模式
  • 半导体 3D 打印工艺价值链
  • 市场发展战略:按服务战略进行地域扩张和消费者获取
  • 用例 1:Nano Dimension(美国)和 Hensoldt(德国)- 多层电路板
  • 用例 2:Optomec(美国)和 Lite-On Technology Corporation(台湾):电子元件的可扩展打印
  • 用例 3:BotFactory(美国)- 温度计的短交货期 PCB 印刷

行业最佳实践:领先企业的发展战略

  • 战略合作伙伴关係:进一步探索 3D 打印技术
  • 研发合作:5G 性能增强与半导体製造创新的融合
  • 政府倡议:有利的政策和研究合作,以探索芯片製造的新可能性
  • 併购:专注于使用先进材料和人工智能的精密半导体印刷
  • 新产品发布:使用微型导电墨水的微型半导体 3D 打印机
  • 为先进材料、新创新和市场扩张提供资金
  • 资金分析 (2020-2022):政府支持初创企业

技术路线图

  • 半导体行业增材製造技术路线图

活跃的公司

  • Nano Dimension
  • Optomec
  • Fabric8Labs
  • Scrona
  • ATLANT 3D Nanosystems

增长机会领域

  • 增长机会 1:战略併购和合作伙伴关係
  • 增长机会 2:技术竞争力
  • 增长机会 3:标准化印刷流程和严格的质量控制

附录

下一步

简介目录
Product Code: D9F2

Disruptive technologies are driving the adoption of 3D printing in the semiconductor industry

The research report analyzes the market opportunities for additive manufacturing (AM), also known as 3D printing, in the semiconductor industry. The study discusses technological development, including semiconductor 3D printing innovations. It elaborates on the market trends and drivers and charts the expected evolution of this technology in the semiconductor industry up to 2028. The ecosystem analysis includes research breakthroughs for semiconductor 3D printing and the profiles of some key players. The study also discusses market restraints that potentially hinder the adoption of semiconductor 3D printing. This report concludes with a growth opportunity analysis of related industries and recommendations for market players and stakeholders that will accelerate the growth of 3D printing in the semiconductor industry.

The commercialization of 3D printing for the semiconductor industry largely centers on printing electronic components, resistors, transistors, capacitors, antennas, radio frequency (RF) devices, etc. Researchers believe that 3D printing will enhance the 5G connection in mobile devices by enabling the manufacture of densely printed electronic components.

Many 3D printing companies are pioneering advanced chip packaging technologies as the conventional method is labor-intensive and time-consuming. In terms of applications, 3D semiconductor printing impacts many industries, especially the automotive, consumer electronics, and medical industries, with large-scale adoption expected in the next 2 to 5 years resulting from improved functional requirements of 3D-printed electronic parts.

Key questions this study will answer:

  • 1. What is the outlook of the global semiconductor industry? What impact has the chip shortage had on the automotive industry?
  • 2. What impact has 3D printing had on the global semiconductor sector and the key emerging application landscape of semiconductor 3D printing across different industry verticals?
  • 3. What are the influencing factors driving the opportunities for semiconductor 3D printing? What do the competitive landscape and regional adoption scenario look like?
  • 4. What developmental strategies have companies adopted to leverage 3D printing technology and enhance market penetration?

Table of Contents

Strategic Imperatives

  • Why Is It Increasingly Difficult to Grow?The Strategic Imperative 8™: Factors Creating Pressure on Growth
  • The Strategic Imperative 8™
  • The Impact of the Top 3 Strategic Imperatives of Additive Manufacturing (AM) in the Semiconductor Industry
  • Growth Opportunities Fuel the Growth Pipeline Engine™
  • Research Methodology
  • Summary of Findings

Growth Opportunity Analysis

  • Scope of Analysis
  • Segmentation of End Markets that the Use of AM in Semiconductors has Impacted
  • Growth Drivers
  • Growth Restraints

Industry Outlook, Technology and Application Landscape, and Adoption Trends

  • Global Semiconductor Sector Outlook
  • The Impact of the IC Shortage on the Automotive Industry between 2020 and 2021
  • The Impact of AM on Semiconductor Production During the Pandemic
  • Semiconductor Components Manufactured Using AM
  • Aerosol Jet Printing (AJP) and Selective Laser Sintering (SLS) are AM Technologies Enabling Semiconductor Manufacturing
  • Stereolithography (SLA) and Digital Light Processing (DLP) are AM Technologies that Enable Semiconductor Manufacturing
  • Impact Analysis of AM on the Semiconductor Industry across 6 End Markets
  • Application Landscape Analysis of AM in the Semiconductor Industry
  • Global Trends Influencing 3D-printed Semiconductor Adoption
  • Technology Development: A Focus on Micro-sized Electronic Printing and Advanced Materials
  • Technology Development: A Focus on Shorter Printing Lead Time and Intricate Part Printing
  • Market Trends by Application of 3D-printed Semiconductor Components

Regional Landscape and Value Chain Analysis

  • Regional Adoption Scenario: Factors Driving the Adoption of 3D Printing
  • Global Competitive Landscape
  • Emerging Business Models Encouraging Market Penetration and Adoption
  • Process Value Chain of Semiconductor 3D Printing
  • Go-to-market Strategy: Consumer Acquisition through Geographical Expansion and Service Strategy
  • Use Case 1: Nano Dimension (United States) and Hensoldt (Germany)-The Multilayered Circuit Board
  • Use Case 2: Optomec (United States) and Lite-On Technology Corporation (Taiwan): Printing Electronic Parts at Scalable Volumes
  • Use Case 3: BotFactory (United States)-Short Lead Time PCB Printing for Thermometers

Industry Best Practices: Developmental Strategies Adopted by Key Players

  • Strategic Partnership: Further Exploration in 3D Printing Technology
  • R&D Collaboration: Convergence to 5G Performance Enhancement and Innovation in Semiconductor Production
  • Government Initiatives: Favorable Policies and Research Collaboration to Explore New Possibilities in Chip Manufacturing
  • M&As: A Focus on Precision Semiconductor Printing Using Advanced Material and AI
  • New Product Launches: 3D Printers for Miniaturized Semiconductors Using Micro-sized Conductive Ink
  • Funding for Advanced Material, New Innovations, and Market Expansion
  • Funding Analysis from 2020 to 2022: Governments Support Start-ups

Technology Roadmap

  • Technology Roadmap of AM in the Semiconductor Industry

Companies to Action

  • Nano Dimension, United States
  • Optomec, United States
  • Fabric8Labs, United States
  • Scrona, Switzerland
  • ATLANT 3D Nanosystems, Denmark

Growth Opportunity Universe

  • Growth Opportunity 1: Strategic M&As and Partnerships
  • Growth Opportunity 1: Strategic M&As and Partnerships (continued)
  • Growth Opportunity 2: Technology Competitiveness
  • Growth Opportunity 2: Technology Competitiveness (continued)
  • Growth Opportunity 3: Standardized Printing Process and Stringent Quality Control
  • Growth Opportunity 3: Standardized Printing Process and Stringent Quality Control (continued)

Appendix

  • Technology Readiness Levels (TRL): Explanation

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