Product Code: 5315
The global SiC wafers reclaim service market is speculated to register significant growth through 2030 owing to the rapidly expanding electrification trend in the automotive sector. The growing acceptance of automated solutions in various companies will also lead to an upsurge in product demand.
For instance, in 2018, Tesla, the well-known EV pioneer, began incorporating SiC devices inside their cars. Since then, several OEMs are working on changing to a zero-emission policy through the promotion of EVs.
The proliferating trend of e-mobility and the emergence of new energy markets will have a profound impact on SiC wafers reclaim service industry outlook. Companies are increasingly investing in wafer technology and are devising suitable development plans in accordance with the rising product demand. Improvement in the manufacturing process and increasing focus on the adoption of SiC products will push the market growth in the forthcoming years.
Based on diameter type, the 5-10 inches SiC wafer reclaim service market may depict an appreciable growth rate during the projection period. The robust trend of IoT adoption and the increasing penetration of smart devices have led to a substantial rise in the demand for 5-10 inch diameter components. Technological developments in artificial intelligence, automation, and 5G have prompted manufacturers to incline toward 5-10 inch diameter SiC wafers.
SiC fabs are switching from 15cm (6-inch) to 20cm (8-inch) wafers to minimize the high cost of creating SiC devices. Major SiC wafer producers and researchers are working on developing wafer sizes between 5-10 inches in order to improve manufacturing units per wafer.
With respect to applications, the SiC wafers reclaim service market size from optoelectronic devices segment is anticipated to grow at a CAGR of more than 10% between 2022-2030. The segment growth can be credited to the growing use of reclaimed SiC wafers in several optoelectronic devices including solar cells, optical fiber, blue lasers, telecommunications lasers, and photodiodes owing to the characteristics of the material, such as high heat resistance, quick cooling, and low dielectric loss at higher frequencies.
In terms of regional segmentation, the North America SiC wafer reclaim service market was worth over USD 150 million in 2021. The expansion of the regional SiC wafer reclaim industry will be driven by the rising number of government policies and efforts encouraging the development of optoelectronics in North American economies.
To take advantage of the upward trend in high-growth areas like electric vehicles (EVs), ADAS, energy infrastructure, and factory automation, semiconductor companies are taking charge and working on SiC capacity expansions. For instance, one of the leading American semiconductor suppliers, onsemi, announced the development of its SiC facility in Hudson, New Hampshire, in August 2022.
The emerging demand for EVs and growing requirement for automated devices across different sectors may push the market growth.
Table of Contents
Chapter 1 Methodology & Scope
- 1.1 Scope and definition
- 1.2 Methodology & forecast parameters
- 1.3 COVID-19 impact
- 1.3.1 North America
- 1.3.2 Europe
- 1.3.3 Asia Pacific
- 1.3.4 LAMEA
- 1.4 Data Sources
- 1.4.1 Secondary
- 1.4.2 Primary
- 1.5 Industry Glossary
Chapter 2 Executive Summary
- 2.1 SiC wafer reclaim service industry 360 degree synopsis, 2018 - 2030
- 2.2 Business trends
- 2.3 Regional trends
- 2.4 Diameter trends
- 2.5 Application trends
Chapter 3 SiC Wafer Reclaim Service Industry Insights
- 3.1 Introduction
- 3.2 COVID-19 impact
- 3.2.1 Impact by region
- 3.2.1.1 North America
- 3.2.1.2 Europe
- 3.2.1.3 Asia Pacific
- 3.2.1.4 LAMEA
- 3.2.2 Impact by value chain
- 3.2.3 Impact by competitive landscape
- 3.3 Russia-Ukraine war impact
- 3.4 SiC wafer reclaim service industry ecosystem analysis
- 3.4.1 Component suppliers
- 3.4.2 Techology providers
- 3.4.3 Service providers
- 3.4.4 End use Landscape
- 3.4.5 Distribution channel analysis
- 3.4.6 Vendor matrix
- 3.5 Technology & innovation landscape
- 3.5.1 Process of reclaim silicon wafers
- 3.5.2 Rapid growth in epitaxy technologies
- 3.5.3 Future of silicon wafers reclaim services
- 3.6 Regulatory landscape
- 3.6.1 International
- 3.6.2 North America
- 3.6.3 Europe
- 3.6.4 Asia Pacific
- 3.6.5 LAMEA
- 3.7 Industry impact forces
- 3.7.1 Growth drivers
- 3.7.1.1 Rising demand of SiC wafers in consumer electronics
- 3.7.1.2 Increasing adoption of semiconductors in solar energy
- 3.7.1.3. Growing penetration of SiC wafers for 5 G and IoT devices
- 3.7.1.4 The increasing adoption of Electric Vehicles (EV)
- 3.7.1.5 Rising government initiative to increase semiconductor manufacturing
- 3.7.2 Industry pitfalls & challenges
- 3.7.2.1 High maintenance cost of manufacturing facilities
- 3.8 Investment portfolio
- 3.9 Growth potential analysis
- 3.10 Porter's analysis
- 3.10.1 Threat of new entrant
- 3.10.2 Bargaining power of supplier
- 3.10.3 Bargaining power of buyer
- 3.10.4 Threat of substitution
- 3.10.5 Competitive rivalry
- 3.11 PESTEL analysis
- 3.11.1 Political
- 3.11.2 Economical
- 3.11.3 Social
- 3.11.4 Technological
- 3.11.5 Legal
- 3.11.6 Environmental
Chapter 4 Competitive Landscape, 2021
- 4.1 Introduction
- 4.2 Company market share, 2021
- 4.3 Competive analysis of key market players, 2021
- 4.3.1 Mimasu Semiconductor Industry Co.,Ltd
- 4.3.2 Kinik Company
- 4.3.3 TOPCO Scientific
- 4.3.4 RS Technologies Co., Ltd.
- 4.3.5 Scientech Corporation
- 4.4 Competive analysis of innovative players, 2021
- 4.4.1 Monocrystal
- 4.4.2 Phoenix Silicon International Corporation
- 4.4.3 Micro Reclaim Technologies LLC (MRT)
- 4.4.4 Pure Wafer
- 4.4.5 NOVA Electronic Materials, LLC
- 4.5 Vendor adoption matrix
Chapter 5 SiC Wafer Reclaim Service Market, By Diameter
- 5.1 Key trends, by diameter
- 5.2 Below 5 inch
- 5.2.1 Market estimates and forecast, 2018 - 2030
- 5.3 5-10 inch
- 5.3.1 Market estimates and forecast, 2018 - 2030
- 5.4 Above 10 inch
- 5.4.1 Market estimates and forecast, 2018 - 2030
Chapter 6 SiC Wafer Reclaim Service Market, By Application
- 6.1 Key trends, by application
- 6.2 Optoelectronics
- 6.2.1 Market estimates and forecast, 2018 - 2030
- 6.3 Power devices
- 6.3.1 Market estimates and forecast, 2018 - 2030
- 6.4 High temperature devices
- 6.4.1 Market estimates and forecast, 2018 - 2030
- 6.5 High frequency devices
- 6.5.1 Market estimates and forecast, 2018 - 2030
Chapter 7 SiC Wafer Reclaim Service Market, By Region
- 7.1 Key trends, by region
- 7.2 North America
- 7.2.1 Market estimates and forecast, 2018 - 2030
- 7.2.2 Market estimates and forecast, by diameter, 2018 - 2030
- 7.2.3 Market estimates and forecast, by application, 2018 - 2030
- 7.2.4 U.S.
- 7.2.4.1 Market estimates and forecast, 2018 - 2030
- 7.2.4.2 Market estimates and forecast, by diameter, 2018 - 2030
- 7.2.4.3 Market estimates and forecast, by application, 2018 - 2030
- 7.2.5 Canada
- 7.2.5.1 Market estimates and forecast, 2018 - 2030
- 7.2.5.2 Market estimates and forecast, by diameter, 2018 - 2030
- 7.2.5.3 Market estimates and forecast, by application, 2018 - 2030
- 7.3 Europe
- 7.3.1 Market estimates and forecast, 2018 - 2030
- 7.3.2 Market estimates and forecast, by diameter, 2018 - 2030
- 7.3.3 Market estimates and forecast, by application, 2018 - 2030
- 7.3.4 UK
- 7.3.4.1 Market estimates and forecast, 2018 - 2030
- 7.3.4.2 Market estimates and forecast, by diameter, 2018 - 2030
- 7.3.4.3 Market estimates and forecast, by application, 2018 - 2030
- 7.3.5 Germany
- 7.3.5.1 Market estimates and forecast, 2018 - 2030
- 7.3.5.2 Market estimates and forecast, by diameter, 2018 - 2030
- 7.3.5.3 Market estimates and forecast, by application, 2018 - 2030
- 7.3.6 France
- 7.3.6.1 Market estimates and forecast, 2018 - 2030
- 7.3.6.2 Market estimates and forecast, by diameter, 2018 - 2030
- 7.3.6.3 Market estimates and forecast, by application, 2018 - 2030
- 7.3.7 Italy
- 7.3.7.1 Market estimates and forecast, 2018 - 2030
- 7.3.7.2 Market estimates and forecast, by diameter, 2018 - 2030
- 7.3.7.3 Market estimates and forecast, by application, 2018 - 2030
- 7.4 Asia Pacific
- 7.4.1 Market estimates and forecast, 2018 - 2030
- 7.4.2 Market estimates and forecast, by diameter, 2018 - 2030
- 7.4.3 Market estimates and forecast, by application, 2018 - 2030
- 7.4.4 China
- 7.4.4.1 Market estimates and forecast, 2018 - 2030
- 7.4.4.2 Market estimates and forecast, by diameter, 2018 - 2030
- 7.4.4.3 Market estimates and forecast, by application, 2018 - 2030
- 7.4.5 India
- 7.4.5.1 Market estimates and forecast, 2018 - 2030
- 7.4.5.2 Market estimates and forecast, by diameter, 2018 - 2030
- 7.4.5.3 Market estimates and forecast, by application, 2018 - 2030
- 7.4.6 Japan
- 7.4.6.1 Market estimates and forecast, 2018 - 2030
- 7.4.6.2 Market estimates and forecast, by diameter, 2018 - 2030
- 7.4.6.3 Market estimates and forecast, by application, 2018 - 2030
- 7.4.7 South Korea
- 7.4.7.1 Market estimates and forecast, 2018 - 2030
- 7.4.7.2 Market estimates and forecast, by diameter, 2018 - 2030
- 7.4.7.3 Market estimates and forecast, by application, 2018 - 2030
- 7.4.8 Taiwan
- 7.4.8.1 Market estimates and forecast, 2018 - 2030
- 7.4.8.2 Market estimates and forecast, by diameter, 2018 - 2030
- 7.4.8.3 Market estimates and forecast, by application, 2018 - 2030
- 7.5 LAMEA
- 7.5.1 Market estimates and forecast, 2018 - 2030
- 7.5.2 Market estimates and forecast, by diameter, 2018 - 2030
- 7.5.3 Market estimates and forecast, by application, 2018 - 2030
- 7.5.4 Brazil
- 7.5.4.1 Market estimates and forecast, 2018 - 2030
- 7.5.4.2 Market estimates and forecast, by diameter, 2018 - 2030
- 7.5.4.3 Market estimates and forecast, by application, 2018 - 2030
- 7.5.5 Mexico
- 7.5.5.1 Market estimates and forecast, 2018 - 2030
- 7.5.5.2 Market estimates and forecast, by diameter, 2018 - 2030
- 7.5.5.3 Market estimates and forecast, by application, 2018 - 2030
- 7.5.6 GCC
- 7.5.6.1 Market estimates and forecast, 2018 - 2030
- 7.5.6.2 Market estimates and forecast, by diameter, 2018 - 2030
- 7.5.6.3 Market estimates and forecast, by application, 2018 - 2030
Chapter 8 Company Profiles
- 8.1 Global Silicon Technologies Inc.
- 8.1.1 Business Overview
- 8.1.2 Financial Data
- 8.1.3 Product Landscape
- 8.1.4 Strategic Outlook
- 8.1.5 SWOT Analysis
- 8.2 KINIK Company
- 8.2.1 Business Overview
- 8.2.2 Financial Data
- 8.2.3 Product Landscape
- 8.2.4 Strategic Outlook
- 8.2.5 SWOT Analysis
- 8.3 Micro Reclaim Technologies
- 8.3.1 Business Overview
- 8.3.2 Financial Data
- 8.3.3 Product Landscape
- 8.3.4 Strategic Outlook
- 8.3.5 SWOT Analysis
- 8.4 Mimasu Semiconductor Industry Co. Ltd
- 8.4.1 Business Overview
- 8.4.2 Financial Data
- 8.4.3 Product Landscape
- 8.4.4 Strategic Outlook
- 8.4.5 SWOT Analysis
- 8.5 Monocrystal
- 8.5.1 Business Overview
- 8.5.2 Financial Data
- 8.5.3 Product Landscape
- 8.5.4 Strategic Outlook
- 8.5.5 SWOT Analysis
- 8.6 MOSPEC Semiconductor Corporation
- 8.6.1 Business Overview
- 8.6.2 Financial Data
- 8.6.3 Product Landscape
- 8.6.4 Strategic Outlook
- 8.6.5 SWOT Analysis
- 8.7 Nano Quarz Wafer
- 8.7.1 Business Overview
- 8.7.2 Financial Data
- 8.7.3 Product Landscape
- 8.7.4 Strategic Outlook
- 8.7.5 SWOT Analysis
- 8.8 Nano SILICON, Inc
- 8.8.1 Business Overview
- 8.8.2 Financial Data
- 8.8.3 Product Landscape
- 8.8.4 Strategic Outlook
- 8.8.5 SWOT Analysis
- 8.9 NOVA Electronic Materials LLC
- 8.9.1 Business Overview
- 8.9.2 Financial Data
- 8.9.3 Product Landscape
- 8.9.4 Strategic Outlook
- 8.9.5 SWOT Analysis
- 8.10 NOVA SiC
- 8.10.1 Business Overview
- 8.10.2 Financial Data
- 8.10.3 Product Landscape
- 8.10.4 Strategic Outlook
- 8.10.5 SWOT Analysis
- 8.11 Optim Wafer Services
- 8.11.1 Business Overview
- 8.11.2 Financial Data
- 8.11.3 Product Landscape
- 8.11.4 Strategic Outlook
- 8.11.5 SWOT Analysis
- 8.12 PAM-XIAMEN
- 8.12.1 Business Overview
- 8.12.2 Financial Data
- 8.12.3 Product Landscape
- 8.12.4 Strategic Outlook
- 8.12.5 SWOT Analysis
- 8.13 Phoenix Silicon International
- 8.13.1 Business Overview
- 8.13.2 Financial Data
- 8.13.3 Product Landscape
- 8.13.4 Strategic Outlook
- 8.13.5 SWOT Analysis
- 8.14 Pure Wafer
- 8.14.1 Business Overview
- 8.14.2 Financial Data
- 8.14.3 Product Landscape
- 8.14.4 Strategic Outlook
- 8.14.5 SWOT Analysis
- 8.15 Rokko Electronics Co. Ltd
- 8.15.1 Business Overview
- 8.15.2 Financial Data
- 8.15.3 Product Landscape
- 8.15.4 Strategic Outlook
- 8.15.5 SWOT Analysis
- 8.16 RS Technologies Co., Ltd.
- 8.16.1 Business Overview
- 8.16.2 Financial Data
- 8.16.3 Product Landscape
- 8.16.4 Strategic Outlook
- 8.16.5 SWOT Analysis
- 8.17 Scientech
- 8.17.1 Business Overview
- 8.17.2 Financial Data
- 8.17.3 Product Landscape
- 8.17.4 Strategic Outlook
- 8.17.5 SWOT Analysis
- 8.18 Si Wave Corporation (SWC)
- 8.18.1 Business Overview
- 8.18.2 Financial Data
- 8.18.3 Product Landscape
- 8.18.4 Strategic Outlook
- 8.18.5 SWOT Analysis
- 8.19 Silicon Materials, Inc
- 8.19.1 Business Overview
- 8.19.2 Financial Data
- 8.19.3 Product Landscape
- 8.19.4 Strategic Outlook
- 8.19.5 SWOT Analysis
- 8.20 Silicon Valley Microelectronics (SVM)
- 8.20.1 Business Overview
- 8.20.2 Financial Data
- 8.20.3 Product Landscape
- 8.20.4 Strategic Outlook
- 8.20.5 SWOT Analysis
- 8.21 Thai Advantec Co. Ltd
- 8.21.1 Business Overview
- 8.21.2 Financial Data
- 8.21.3 Product Landscape
- 8.21.4 Strategic Outlook
- 8.21.5 SWOT Analysis
- 8.22 TOPCO Scientific
- 8.22.1 Business Overview
- 8.22.2 Financial Data
- 8.22.3 Product Landscape
- 8.22.4 Strategic Outlook
- 8.22.5 SWOT Analysis