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市场调查报告书
商品编码
1458917

全球印刷基板(PCB) 市场

Printed Circuit Boards (PCBs)
出版日期: | 出版商: Global Industry Analysts, Inc. | 英文 441 Pages | 商品交期: 最快1-2个工作天内

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简介目录

到 2030 年，全球印刷电路基板(PCB) 市场将达到 901 亿美元

全球印刷电路基板（PCB）市场预计到2023年将达到634亿美元，预计2023年至2030年复合年增长率为4.5%，到2030年将达到901亿美元。多层PCB是本报告分析的细分市场之一，预计复合年增长率为4.8%，到分析期结束时将达到599亿美元。预计未来八年双面 PCB 领域的复合年增长率为 3.6%。

美国市场预估成长70亿美元，中国复合年增长率5.3%

预计到 2023 年，美国印刷电路基板(PCB) 市场将达到 70 亿美元。中国作为全球第二大经济体，预计2030年市场规模将达240亿美元，2023年至2030年分析期间复合年增长率为5.3%。其他值得注意的地理市场包括日本和加拿大，预计 2023 年至 2030 年将分别成长 3.3% 和 4%。在欧洲，德国的复合年增长率预计约为 3.7%。

推出 2024 年令人兴奋的新报告功能

完全访问影响者参与统计数据

免费存取数位檔案和「MarketGlass」研究平台。我们独特的 MarketGlass 平台使我们能够集体协作地释放世界各地专家的创造力和市场知识。我们的尖端工具提供世界一流的市场可视性，同时保护市场参与企业的隐私和身分。报告中的数字、统计数据和市场描述是基于该领域专家和影响者共用的全面见解。

使用即时资料模拟器工具和自订报告产生参与互动式调查。

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1 年免费报告更新

竞争覆盖范围，包括主要参与者的全球市场占有率

多个地区参与者的市场影响分析（强/活跃/利基/次要）

访问专家/影响者访谈、播客、新闻公告和活动主题演讲的 YouTube 视频

2024 年世界经济有何预期

货币紧缩和相关利率上升导致的地缘政治和经济不稳定将在 2024 年造成动盪的局面。一些因素将继续给復苏之路带来压力，包括中东的敌对行动和日益频繁的气候灾害。儘管存在风险，但一些积极因素正在显现，包括通货紧缩征兆更加明显、对顽固通膨的担忧有所缓解、供应链正常化以及儘管能源成本波动但价格仍有所回落。这一切已经开始发生。印度和美国等二十一国集团国家的选举可能会影响资本流动和投资策略。儘管印度作为全球投资目的地的地位日益突出，但在充满活力的人才和资本生态系统的推动下，美国科技公司将继续占据主导地位。儘管该国经济放缓，但由于国内经济富有弹性和有利的法规环境，高科技机会（尤其是硅谷）仍然对寻求高成长潜力的投资者俱有吸引力。欧洲持续应对紧缩的货币政策和景气衰退风险，但英国的前景最严峻，2024 年景气衰退的风险最高。中国仍然是通用凭证，其成长预计将受到政府支出和消费者支出改善的支持。动盪的环境可能为投资者和公司带来机会和挑战。指导投资决策的灵活性和策略远见，以及将波动性视为成长的催化剂，对于生存仍然至关重要。

受访企业范例

  • Amphenol Corporation
  • Amperex Technology Ltd.
  • Apex Microelectronics Company Limited
  • Autosplice, Inc.
  • Auter Elektronics Ltd.
  • Advance Circuit Technology, Inc.
  • Altron, Inc.
  • Applied Magnetics Corporation
  • Atrenne Integrated Solutions, Inc.
  • Arbell Electronics Inc.
  • Advantech Technology Australia Pty Limited
  • Advanced Graphene Solutions, Inc.
  • Addcom Solution Pte Ltd
  • Arround Inc.
  • ASM Assembly Systems GmbH & Co. KG

目录

第一章调查方法

第 2 章执行摘要

  • 市场概况
  • 主要企业
  • 市场趋势和驱动因素
  • 全球市场展望

第三章市场分析

  • 美国
  • 加拿大
  • 日本
  • 中国
  • 欧洲
  • 法国
  • 德国
  • 义大利
  • 英国
  • 其他欧洲国家
  • 亚太地区
  • 韩国
  • 台湾
  • 其他亚太地区
  • 世界其他地区

第四章 比赛

简介目录
Product Code: MCP-1883

Global Printed Circuit Boards (PCBs) Market to Reach $90.1 Billion by 2030

The global market for Printed Circuit Boards (PCBs) estimated at US$63.4 Billion in the year 2023, is expected to reach US$90.1 Billion by 2030, growing at a CAGR of 4.5% over the period 2023-2030. Multi-Layer PCBs, one of the segments analyzed in the report, is expected to record 4.8% CAGR and reach US$59.9 Billion by the end of the analysis period. Growth in the Double-Sided PCBs segment is estimated at 3.6% CAGR for the next 8-year period.

The U.S. Market is Estimated at $7 Billion, While China is Forecast to Grow at 5.3% CAGR

The Printed Circuit Boards (PCBs) market in the U.S. is estimated at US$7 Billion in the year 2023. China, the world`s second largest economy, is forecast to reach a projected market size of US$24 Billion by the year 2030 trailing a CAGR of 5.3% over the analysis period 2023 to 2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 3.3% and 4% respectively over the 2023-2030 period. Within Europe, Germany is forecast to grow at approximately 3.7% CAGR.

Introducing Our Exciting New Report Features for 2024

Full access to influencer engagement stats

Free access to our digital archives & "MarketGlass" research platform. Our proprietary MarketGlass platform is fully enabled to unlock creativity and market knowledge of domain experts worldwide in a cohesive and collaborative manner. Our state-of-art tools bring world class market perspectives while protecting participants` privacy and identity. Numbers, statistics and market narrative in the report are based on fully curated insights shared by domain experts and influencers in this space.

Opportunity to engage with interactive questionnaires that come with real-time data simulator tools & bespoke report generation capabilities

Full client access to peer collaborative and interactive platform for cross-enterprise smart exchange of ideas

Complimentary report updates for one year

Competitor coverage with global market shares of major players

Player market presence analysis (Strong/Active/Niche/Trivial) across multiple geographies

Access to curated YouTube video transcripts of domain experts/influencer interviews, podcasts, press statements and event keynotes

What to Expect from the Global Economy in 2024

Edgy geopolitics, and economic instability caused by monetary policy tightening and ensuing higher interest rates will create a tumultuous landscape for 2024. Several factors will continue to exert pressure on the path to recovery including hostilities in the Middle East and increasingly common climate disasters. Among the risks, several positives are also taking shape such as growing signs of disinflation and easing of anxiety over stubborn inflation, supply chain normalization and price moderation despite volatility in energy costs. Elections across several G21 jurisdictions, notably in India and the United States, will have potential ramifications for capital flows and investment strategies. While India emerges as a compelling destination in the global investment landscape, U.S, based tech firms will continue to dominate, fueled by a dynamic ecosystem of talent and capital. Tech opportunities in Silicon Valley and beyond remain attractive for investors seeking high-growth prospects supported largely by a resilient albeit slowing domestic economy and conducive regulatory environment. Europe will continue to battle tight monetary policy and recession risks with U.K. having the most challenging outlook and running the greatest risk of recession in 2024. China remains a wild card with hope for growth in the country underpinned by government spending and improvements in consumer spending. The volatile environment will offer both opportunities and challenges for investors and businesses alike. Embracing volatility as a catalyst for growth together with agility and strategic foresight in navigating investment decisions will remain important for survival.

Select Competitors (Total 225 Featured) -

  • Amphenol Corporation
  • Amperex Technology Ltd.
  • Apex Microelectronics Company Limited
  • Autosplice, Inc.
  • Auter Elektronics Ltd.
  • Advance Circuit Technology, Inc.
  • Altron, Inc.
  • Applied Magnetics Corporation
  • Atrenne Integrated Solutions, Inc.
  • Arbell Electronics Inc.
  • Advantech Technology Australia Pty Limited
  • Advanced Graphene Solutions, Inc.
  • Addcom Solution Pte Ltd
  • Arround Inc.
  • ASM Assembly Systems GmbH & Co. KG

TABLE OF CONTENTS

I. METHODOLOGY

II. EXECUTIVE SUMMARY

  • 1. MARKET OVERVIEW
    • Influencer Market Insights
    • World Market Trajectories
    • What are PCBs, Where are they Used & Why are they the Backbone of Electronics?
    • PCBs Are a Key Part of the Electronics Value Chain. COVID-19 Exposes the Risk of Value Chain Modularity
    • Printed Circuit Boards (PCBs) - Global Key Competitors Percentage Market Share in 2023 (E)
    • Competitive Market Presence - Strong/Active/Niche/Trivial for Players Worldwide in 2023 (E)
    • Recent Market Activity
    • World Brands
  • 2. FOCUS ON SELECT PLAYERS
  • 3. MARKET TRENDS & DRIVERS
    • Digital Transformation Catalyzed by the Pandemic Provides the Perfect Platform for Growth in the Post COVID-19 Period.
    • The Scenario Bodes Well for All Things Electronic & Digital. Special Focus on PCBs for Electronic Wearables
    • It's Not CIOs or CFOs, its COVID-19 Leading Digital Transformation Globally: Global Digital Transformation Spending (In US$ Trillion) for the Years 2019 through 2023
    • Post COVID-19 As Technology Steps Forward to Help With Social Distancing, Renewed Focus Will Be Shed on Industrial Automation
    • As a Lesson Learnt in Social Distancing from the COVID-19 Pandemic, Use of Industrial Robots to Spike in the Post COVID-19 Period: Industrial Robot Density (Units Per 10,000 Workers) for the Years 2019 & 2023
    • As Telemedicine Storms into the Spotlight in the Post COVID-19 Period, Medical Wearables to Offer Opportunities for Rigid-flex PCBs
    • COVID-19 Pandemic Catalyzes Migration to New Models of Remote Care Delivery & Boosts Importance of Electronics Subsystems Supporting Smart Wearables: Global Number of Telemedicine Patients (In Million) for the Years 2016, 2018, 2020, 2023 & 2025
    • A Return to Economic Normalcy Will Reignite Growth Drivers in the Consumer Electronics End-Use Sector
    • Smart Homes Emerge as a Disruptive Trend Enhancing Lives of Homeowners & Also Creating New Market Opportunities Players in the Electronics Value Chain: Global Smart Homes Market by Category in US$ Billion for the Years 2020 and 2022
    • The Coming Era of Electronification of Medical Devices to Bring Attractive Opportunities for Medical PCBs
    • A 47.1% Increase in Growth in the Post COVID-19 Period for the Medical Devices Industry Encourages an Optimistic Outlook for Medical PCBs: Global Medical Devices Industry (In US$ Billion) for the Years 2000, 2023 & 2025
    • PCBs are the Core of IoT Devices. Disruptions Caused by the Pandemic & the Push for Connected Tech to Benefit Market Growth
    • A Review of the IoT Opportunity for Flex and HDI PCBs
    • IoT to Take a Quantum Leap With the Pandemic Highlighting the Importance of Remote Operations in Ensuring Business Resiliency: Global Number of IoT Connected Devices (In Billion Units) for the Years 2016, 2018, 2020, 2022 & 2025
    • Coronavirus Outbreak Makes Driverless Cars Attractive. Autonomous Cars Hold Robust Potential for Growth of PCBs in the Post COVID Period
    • Non-Contact Deliveries Made Popular by the Pandemic Will Ready the PCB Market for the Coming Age of Drones
    • What Does this Mean for PCB Designers and Manufacturers?
    • In the "Touch-Me-Not" Environment to Follow in the Post Pandemic Period, Use of Drones Will Rise to New Highs: Number of Countries Worldwide Using Drones/UAVs by Type 2019 & 2025
    • As Post Pandemic Economic Rebuilding Efforts Get Underway, Focus on Pandemic Ready Smart Cities Will Create a Hotbed of Opportunities for PCBs
    • Focus on Reshaping City Resilience to Future Pandemics & Crisis Will Spur Rejuvenated Spending on Smart City Projects in the Post COVID-19 Period, Providing a Goldmine of Opportunities for Electronic Technologies: Global Smart City Spending (In US$ Billion) for the Years 2021, 2023 & 2025
    • It's a Slower & Longer Road to Recovery for PCBs Used in Defense & Avionics
    • With the Aviation Industry on the Brink of Annihilation, Pre-Pandemic Digitalization Plans Will Take a Long Time to Witness a Return to Implementation: Expected Revenue Losses in Global Aviation (In US$ Billion)
    • Integration of Artificial Intelligence Into PCB Design & Production Comes of Age
  • 4. GLOBAL MARKET PERSPECTIVE
    • TABLE 1: World Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 2: World Historic Review for Printed Circuit Boards (PCBs) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 3: World 16-Year Perspective for Printed Circuit Boards (PCBs) by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets for Years 2014, 2024 & 2030
    • TABLE 4: World Recent Past, Current & Future Analysis for Multi-Layer by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 5: World Historic Review for Multi-Layer by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 6: World 16-Year Perspective for Multi-Layer by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
    • TABLE 7: World Recent Past, Current & Future Analysis for Double-Sided by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 8: World Historic Review for Double-Sided by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 9: World 16-Year Perspective for Double-Sided by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
    • TABLE 10: World Recent Past, Current & Future Analysis for Single-Sided by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 11: World Historic Review for Single-Sided by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 12: World 16-Year Perspective for Single-Sided by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
    • TABLE 13: World Recent Past, Current & Future Analysis for Standard Multilayer by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 14: World Historic Review for Standard Multilayer by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 15: World 16-Year Perspective for Standard Multilayer by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
    • TABLE 16: World Recent Past, Current & Future Analysis for High-Density Interconnect (HDI) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 17: World Historic Review for High-Density Interconnect (HDI) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 18: World 16-Year Perspective for High-Density Interconnect (HDI) by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
    • TABLE 19: World Recent Past, Current & Future Analysis for IC Substrate by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 20: World Historic Review for IC Substrate by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 21: World 16-Year Perspective for IC Substrate by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
    • TABLE 22: World Recent Past, Current & Future Analysis for Rigid 1-2 Sided by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 23: World Historic Review for Rigid 1-2 Sided by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 24: World 16-Year Perspective for Rigid 1-2 Sided by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
    • TABLE 25: World Recent Past, Current & Future Analysis for Rigid-Flex by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 26: World Historic Review for Rigid-Flex by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 27: World 16-Year Perspective for Rigid-Flex by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
    • TABLE 28: World Recent Past, Current & Future Analysis for Other Substrate Types by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 29: World Historic Review for Other Substrate Types by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 30: World 16-Year Perspective for Other Substrate Types by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
    • TABLE 31: World Recent Past, Current & Future Analysis for Computer & Peripherals by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 32: World Historic Review for Computer & Peripherals by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 33: World 16-Year Perspective for Computer & Peripherals by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
    • TABLE 34: World Recent Past, Current & Future Analysis for Communications by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 35: World Historic Review for Communications by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 36: World 16-Year Perspective for Communications by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
    • TABLE 37: World Recent Past, Current & Future Analysis for Consumer Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 38: World Historic Review for Consumer Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 39: World 16-Year Perspective for Consumer Electronics by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
    • TABLE 40: World Recent Past, Current & Future Analysis for Industrial Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 41: World Historic Review for Industrial Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 42: World 16-Year Perspective for Industrial Electronics by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
    • TABLE 43: World Recent Past, Current & Future Analysis for Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 44: World Historic Review for Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 45: World 16-Year Perspective for Automotive by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
    • TABLE 46: World Recent Past, Current & Future Analysis for Aerospace & Defense by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 47: World Historic Review for Aerospace & Defense by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 48: World 16-Year Perspective for Aerospace & Defense by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
    • TABLE 49: World Recent Past, Current & Future Analysis for Other End-Uses by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 50: World Historic Review for Other End-Uses by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 51: World 16-Year Perspective for Other End-Uses by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
    • TABLE 52: World Printed Circuit Boards (PCBs) Market Analysis of Annual Sales in US$ Million for Years 2014 through 2030

III. MARKET ANALYSIS

  • UNITED STATES
    • Printed Circuit Boards (PCBs) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United States for 2024 (E)
    • Semiconductor Industry in the U.S.
    • TABLE 53: USA Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 54: USA Historic Review for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 55: USA 16-Year Perspective for Printed Circuit Boards (PCBs) by Type - Percentage Breakdown of Value Sales for Multi-Layer, Double-Sided and Single-Sided for the Years 2014, 2024 & 2030
    • TABLE 56: USA Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 57: USA Historic Review for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 58: USA 16-Year Perspective for Printed Circuit Boards (PCBs) by Substrate Type - Percentage Breakdown of Value Sales for Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types for the Years 2014, 2024 & 2030
    • TABLE 59: USA Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 60: USA Historic Review for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 61: USA 16-Year Perspective for Printed Circuit Boards (PCBs) by End-Use - Percentage Breakdown of Value Sales for Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses for the Years 2014, 2024 & 2030
  • CANADA
    • TABLE 62: Canada Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 63: Canada Historic Review for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 64: Canada 16-Year Perspective for Printed Circuit Boards (PCBs) by Type - Percentage Breakdown of Value Sales for Multi-Layer, Double-Sided and Single-Sided for the Years 2014, 2024 & 2030
    • TABLE 65: Canada Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 66: Canada Historic Review for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 67: Canada 16-Year Perspective for Printed Circuit Boards (PCBs) by Substrate Type - Percentage Breakdown of Value Sales for Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types for the Years 2014, 2024 & 2030
    • TABLE 68: Canada Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 69: Canada Historic Review for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 70: Canada 16-Year Perspective for Printed Circuit Boards (PCBs) by End-Use - Percentage Breakdown of Value Sales for Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses for the Years 2014, 2024 & 2030
  • JAPAN
    • Printed Circuit Boards (PCBs) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Japan for 2024 (E)
    • Semiconductor Industry in Japan
    • TABLE 71: Japan Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 72: Japan Historic Review for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 73: Japan 16-Year Perspective for Printed Circuit Boards (PCBs) by Type - Percentage Breakdown of Value Sales for Multi-Layer, Double-Sided and Single-Sided for the Years 2014, 2024 & 2030
    • TABLE 74: Japan Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 75: Japan Historic Review for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 76: Japan 16-Year Perspective for Printed Circuit Boards (PCBs) by Substrate Type - Percentage Breakdown of Value Sales for Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types for the Years 2014, 2024 & 2030
    • TABLE 77: Japan Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 78: Japan Historic Review for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 79: Japan 16-Year Perspective for Printed Circuit Boards (PCBs) by End-Use - Percentage Breakdown of Value Sales for Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses for the Years 2014, 2024 & 2030
  • CHINA
    • Printed Circuit Boards (PCBs) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in China for 2024 (E)
    • TABLE 80: China Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 81: China Historic Review for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 82: China 16-Year Perspective for Printed Circuit Boards (PCBs) by Type - Percentage Breakdown of Value Sales for Multi-Layer, Double-Sided and Single-Sided for the Years 2014, 2024 & 2030
    • TABLE 83: China Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 84: China Historic Review for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 85: China 16-Year Perspective for Printed Circuit Boards (PCBs) by Substrate Type - Percentage Breakdown of Value Sales for Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types for the Years 2014, 2024 & 2030
    • TABLE 86: China Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 87: China Historic Review for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 88: China 16-Year Perspective for Printed Circuit Boards (PCBs) by End-Use - Percentage Breakdown of Value Sales for Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses for the Years 2014, 2024 & 2030
  • EUROPE
    • Printed Circuit Boards (PCBs) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Europe for 2024 (E)
    • TABLE 89: Europe Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 90: Europe Historic Review for Printed Circuit Boards (PCBs) by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 91: Europe 16-Year Perspective for Printed Circuit Boards (PCBs) by Geographic Region - Percentage Breakdown of Value Sales for France, Germany, Italy, UK and Rest of Europe Markets for Years 2014, 2024 & 2030
    • TABLE 92: Europe Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 93: Europe Historic Review for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 94: Europe 16-Year Perspective for Printed Circuit Boards (PCBs) by Type - Percentage Breakdown of Value Sales for Multi-Layer, Double-Sided and Single-Sided for the Years 2014, 2024 & 2030
    • TABLE 95: Europe Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 96: Europe Historic Review for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 97: Europe 16-Year Perspective for Printed Circuit Boards (PCBs) by Substrate Type - Percentage Breakdown of Value Sales for Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types for the Years 2014, 2024 & 2030
    • TABLE 98: Europe Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 99: Europe Historic Review for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 100: Europe 16-Year Perspective for Printed Circuit Boards (PCBs) by End-Use - Percentage Breakdown of Value Sales for Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses for the Years 2014, 2024 & 2030
  • FRANCE
    • Printed Circuit Boards (PCBs) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in France for 2024 (E)
    • TABLE 101: France Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 102: France Historic Review for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 103: France 16-Year Perspective for Printed Circuit Boards (PCBs) by Type - Percentage Breakdown of Value Sales for Multi-Layer, Double-Sided and Single-Sided for the Years 2014, 2024 & 2030
    • TABLE 104: France Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 105: France Historic Review for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 106: France 16-Year Perspective for Printed Circuit Boards (PCBs) by Substrate Type - Percentage Breakdown of Value Sales for Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types for the Years 2014, 2024 & 2030
    • TABLE 107: France Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 108: France Historic Review for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 109: France 16-Year Perspective for Printed Circuit Boards (PCBs) by End-Use - Percentage Breakdown of Value Sales for Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses for the Years 2014, 2024 & 2030
  • GERMANY
    • Printed Circuit Boards (PCBs) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Germany for 2024 (E)
    • TABLE 110: Germany Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 111: Germany Historic Review for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 112: Germany 16-Year Perspective for Printed Circuit Boards (PCBs) by Type - Percentage Breakdown of Value Sales for Multi-Layer, Double-Sided and Single-Sided for the Years 2014, 2024 & 2030
    • TABLE 113: Germany Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 114: Germany Historic Review for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 115: Germany 16-Year Perspective for Printed Circuit Boards (PCBs) by Substrate Type - Percentage Breakdown of Value Sales for Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types for the Years 2014, 2024 & 2030
    • TABLE 116: Germany Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 117: Germany Historic Review for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 118: Germany 16-Year Perspective for Printed Circuit Boards (PCBs) by End-Use - Percentage Breakdown of Value Sales for Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses for the Years 2014, 2024 & 2030
  • ITALY
    • TABLE 119: Italy Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 120: Italy Historic Review for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 121: Italy 16-Year Perspective for Printed Circuit Boards (PCBs) by Type - Percentage Breakdown of Value Sales for Multi-Layer, Double-Sided and Single-Sided for the Years 2014, 2024 & 2030
    • TABLE 122: Italy Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 123: Italy Historic Review for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 124: Italy 16-Year Perspective for Printed Circuit Boards (PCBs) by Substrate Type - Percentage Breakdown of Value Sales for Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types for the Years 2014, 2024 & 2030
    • TABLE 125: Italy Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 126: Italy Historic Review for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 127: Italy 16-Year Perspective for Printed Circuit Boards (PCBs) by End-Use - Percentage Breakdown of Value Sales for Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses for the Years 2014, 2024 & 2030
  • UNITED KINGDOM
    • Printed Circuit Boards (PCBs) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United Kingdom for 2024 (E)
    • TABLE 128: UK Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 129: UK Historic Review for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 130: UK 16-Year Perspective for Printed Circuit Boards (PCBs) by Type - Percentage Breakdown of Value Sales for Multi-Layer, Double-Sided and Single-Sided for the Years 2014, 2024 & 2030
    • TABLE 131: UK Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 132: UK Historic Review for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 133: UK 16-Year Perspective for Printed Circuit Boards (PCBs) by Substrate Type - Percentage Breakdown of Value Sales for Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types for the Years 2014, 2024 & 2030
    • TABLE 134: UK Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 135: UK Historic Review for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 136: UK 16-Year Perspective for Printed Circuit Boards (PCBs) by End-Use - Percentage Breakdown of Value Sales for Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses for the Years 2014, 2024 & 2030
  • REST OF EUROPE
    • TABLE 137: Rest of Europe Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 138: Rest of Europe Historic Review for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 139: Rest of Europe 16-Year Perspective for Printed Circuit Boards (PCBs) by Type - Percentage Breakdown of Value Sales for Multi-Layer, Double-Sided and Single-Sided for the Years 2014, 2024 & 2030
    • TABLE 140: Rest of Europe Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 141: Rest of Europe Historic Review for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 142: Rest of Europe 16-Year Perspective for Printed Circuit Boards (PCBs) by Substrate Type - Percentage Breakdown of Value Sales for Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types for the Years 2014, 2024 & 2030
    • TABLE 143: Rest of Europe Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 144: Rest of Europe Historic Review for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 145: Rest of Europe 16-Year Perspective for Printed Circuit Boards (PCBs) by End-Use - Percentage Breakdown of Value Sales for Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses for the Years 2014, 2024 & 2030
  • ASIA-PACIFIC
    • Printed Circuit Boards (PCBs) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Asia-Pacific for 2024 (E)
    • TABLE 146: Asia-Pacific Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by Geographic Region - South Korea, Taiwan and Rest of Asia-Pacific Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 147: Asia-Pacific Historic Review for Printed Circuit Boards (PCBs) by Geographic Region - South Korea, Taiwan and Rest of Asia-Pacific Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 148: Asia-Pacific 16-Year Perspective for Printed Circuit Boards (PCBs) by Geographic Region - Percentage Breakdown of Value Sales for South Korea, Taiwan and Rest of Asia-Pacific Markets for Years 2014, 2024 & 2030
    • TABLE 149: Asia-Pacific Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 150: Asia-Pacific Historic Review for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 151: Asia-Pacific 16-Year Perspective for Printed Circuit Boards (PCBs) by Type - Percentage Breakdown of Value Sales for Multi-Layer, Double-Sided and Single-Sided for the Years 2014, 2024 & 2030
    • TABLE 152: Asia-Pacific Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 153: Asia-Pacific Historic Review for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 154: Asia-Pacific 16-Year Perspective for Printed Circuit Boards (PCBs) by Substrate Type - Percentage Breakdown of Value Sales for Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types for the Years 2014, 2024 & 2030
    • TABLE 155: Asia-Pacific Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 156: Asia-Pacific Historic Review for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 157: Asia-Pacific 16-Year Perspective for Printed Circuit Boards (PCBs) by End-Use - Percentage Breakdown of Value Sales for Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses for the Years 2014, 2024 & 2030
  • SOUTH KOREA
    • TABLE 158: South Korea Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 159: South Korea Historic Review for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 160: South Korea 16-Year Perspective for Printed Circuit Boards (PCBs) by Type - Percentage Breakdown of Value Sales for Multi-Layer, Double-Sided and Single-Sided for the Years 2014, 2024 & 2030
    • TABLE 161: South Korea Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 162: South Korea Historic Review for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 163: South Korea 16-Year Perspective for Printed Circuit Boards (PCBs) by Substrate Type - Percentage Breakdown of Value Sales for Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types for the Years 2014, 2024 & 2030
    • TABLE 164: South Korea Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 165: South Korea Historic Review for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 166: South Korea 16-Year Perspective for Printed Circuit Boards (PCBs) by End-Use - Percentage Breakdown of Value Sales for Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses for the Years 2014, 2024 & 2030
  • TAIWAN
    • Taiwan, a Semiconductor Behemoth
    • TABLE 167: Taiwan Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 168: Taiwan Historic Review for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 169: Taiwan 16-Year Perspective for Printed Circuit Boards (PCBs) by Type - Percentage Breakdown of Value Sales for Multi-Layer, Double-Sided and Single-Sided for the Years 2014, 2024 & 2030
    • TABLE 170: Taiwan Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 171: Taiwan Historic Review for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 172: Taiwan 16-Year Perspective for Printed Circuit Boards (PCBs) by Substrate Type - Percentage Breakdown of Value Sales for Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types for the Years 2014, 2024 & 2030
    • TABLE 173: Taiwan Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 174: Taiwan Historic Review for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 175: Taiwan 16-Year Perspective for Printed Circuit Boards (PCBs) by End-Use - Percentage Breakdown of Value Sales for Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses for the Years 2014, 2024 & 2030
  • REST OF ASIA-PACIFIC
    • TABLE 176: Rest of Asia-Pacific Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 177: Rest of Asia-Pacific Historic Review for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 178: Rest of Asia-Pacific 16-Year Perspective for Printed Circuit Boards (PCBs) by Type - Percentage Breakdown of Value Sales for Multi-Layer, Double-Sided and Single-Sided for the Years 2014, 2024 & 2030
    • TABLE 179: Rest of Asia-Pacific Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 180: Rest of Asia-Pacific Historic Review for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 181: Rest of Asia-Pacific 16-Year Perspective for Printed Circuit Boards (PCBs) by Substrate Type - Percentage Breakdown of Value Sales for Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types for the Years 2014, 2024 & 2030
    • TABLE 182: Rest of Asia-Pacific Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 183: Rest of Asia-Pacific Historic Review for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 184: Rest of Asia-Pacific 16-Year Perspective for Printed Circuit Boards (PCBs) by End-Use - Percentage Breakdown of Value Sales for Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses for the Years 2014, 2024 & 2030
  • REST OF WORLD
    • TABLE 185: Rest of World Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 186: Rest of World Historic Review for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 187: Rest of World 16-Year Perspective for Printed Circuit Boards (PCBs) by Type - Percentage Breakdown of Value Sales for Multi-Layer, Double-Sided and Single-Sided for the Years 2014, 2024 & 2030
    • TABLE 188: Rest of World Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 189: Rest of World Historic Review for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 190: Rest of World 16-Year Perspective for Printed Circuit Boards (PCBs) by Substrate Type - Percentage Breakdown of Value Sales for Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types for the Years 2014, 2024 & 2030
    • TABLE 191: Rest of World Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 192: Rest of World Historic Review for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 193: Rest of World 16-Year Perspective for Printed Circuit Boards (PCBs) by End-Use - Percentage Breakdown of Value Sales for Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses for the Years 2014, 2024 & 2030

IV. COMPETITION