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市场调查报告书
商品编码
123278

利基市场上的化学物质及材料供应商市场和策略

Niche Markets and Strategies for Small/Mid-size Semiconductor Material and Chemical Companies

出版日期: | 出版商: Information Network | 英文 | 商品交期: 2-3个工作天内

价格

本报告书内容包括:太阳能、MEMS、高亮度LED、HDD用薄膜导线/头灯、晶圆加工等领域中的化学物质及材料供应商市场的趋势彙整、各市场的趋势和今后的预测和展望、内容纲要摘记如下:

第1章 介绍

第2章 太阳能

  • 介绍
  • 结晶・多结晶电池的製造
    • 硅成长和载体媒介搬运工具
    • 蚀刻和喷砂
    • 防止反射镀膜
  • 薄膜电池的製造
    • 微结晶硅气相沉积
    • 微结晶硅气相沉积
    • CdTe
    • CIGS
    • GaA
  • 材料供应商市场
    • 结晶・多结晶电池
    • 薄膜电池
    • 化学物质及材料
  • 奈米材料
    • 无机奈米结晶
    • CdSe及CdTe奈米管
    • 量子点
    • 奈米复合材料和量子点的合成
    • 量子井
    • 有机聚合物 - 富勒烯
    • 离子有机聚合物
    • CIGS
    • 色素増感太阳能电池
    • 太阳能电池专用奈米材料市场的分析

第3章 MEMS

  • MEMS市场基础建设
  • 主要用途和市场预测
    • MEMS设备市场预测
    • MEMS系统市场预测
    • 材料供应商市场

第4章 高亮度LED(HB-LED)

  • 高亮度LED技术及应用上近年的进歩
  • 结构材料
    • 萤光物质
    • 基板
  • OLED的製造
  • 全球的OLED市场展望
  • 全球的高亮度LED市场展望

第5章 HDD用薄膜导线/头灯

  • HDD趋势
  • 墨头市场预测
  • 头灯加工
  • 头灯製造
  • 气相沉积课题
  • CMP的课题
  • CMP研磨垫市场

第6章 晶圆等级过程

  • 介绍
  • 生产覆晶晶片/WLP加工上的课题和趋势
  • 金属化的课题和趋势
  • UBM蚀刻的课题和趋势
    • 蚀刻过程
    • 蚀刻物质
  • WLP市场分析

图表

The report is segmented in two chapters. In Chapter 2 we identify high-tech applications that are fabricated on 300mm wafers. This is the realm of the large equipment manufacturers, and so the focus of the chapter is on how a small or mid-sized company can compete - namely in the area of niche processing capabilities from a technology point of view.

In Chapter 3 we discuss high-tech applications that are built on non- 300mm wafers. These should be the focal point of a small and mid-size company because often the large companies will address applications on 300mm wafers and ignore niche applications where the size of the market does not represent a need for the semiconductor manufacturer to invest in a 300mm fab or utilize a foundry for small runs. In-house manufacturing is performed on 150mm and 200mm wafer sizes.

In this report we identify areas of semiconductor-related technologies where a small or mid-sized company can compete. These high-tech applications segmented include Wafer Level Processing (WLP), 3-D TSV, Non-volatile Memory Devices MRAM, RRAM and FeRAM, Ultrathin Wafers, MEMs, HB-LEDs, Compound Semiconductors, Thin Film Read/Write Heads for HDD, and SAW Vs. BAW filters. Each of these applications is analyzed and forecast.

Table of Contents

Chapter Introduction

Chapter 2 Niche Markets for PROCESSES for 300mm Wafers

  • 2.1. Introduction
  • 2.2. Wafer Level Processing (WLP)
    • 2.2.1. Introduction
    • 2.2.2. Flip Chip/WLP Processing Issues and Trends
      • Wafer Bumping
      • Wafer Level Packaging
      • Pad Redistribution
      • Wafer Bumping Costs
    • 2.2.3. Lithography Issues And Trends
    • 2.2.4. UBM Etch Issues And Trends
    • 2.2.5. Metallization Issues and Trends
      • Gold Bumping Metallization
      • Solder Bumping Metallization
    • 2.2.6. Analysis of WLP Market
  • 2.3. 3-D TSV
    • 2.3.1. Insight Into Critical Issues
    • 2.3.2. Cost Structure
    • 2.3.3. Critical Processing Technologies
    • 2.3.4. Evaluation Of Critical Development Segments
    • 2.3.5. TSV Device Forecast
  • 2.4. Non-volatile Memory Devices MRAM, RRAM and FeRAM
    • 2.4.1. Processing Requirements for MRAMs
    • 2.4.2. Processing Requirements for RRAMs
    • 2.4.3. Processing Requirements for FeRAMs
    • 2.4.4. Roadmap for Commercialization
  • 2.5. Ultrathin Wafers
    • 2.5.1. Applications for Ultrathin Wafers
    • 2.5.2. Substrate Thinning
    • 2.5.3. Backside Metallization Requirements
    • 2.5.4. Surface Stress Relief
    • 2.5.5. Ultrathin Wafer Market

Chapter 3 Niche Markets for EQUIPMENT for SUB 300mm Wafers

  • 3.1. Introduction
  • 3.2. MEMs
    • 3.2.1. The MEMS Market Infrastructure
    • 3.2.2. Forecast Of The Key Applications And Markets
      • MEMS Device Market Forecast
      • MEMS System Market Forecast
    • 3.2.3. Markets for Equipment and Materials Suppliers
  • 3.3. HB-LEDs
    • 3.3.1. Recent Progress in High Brightness LED Technology and Applications
    • 3.3.2. LED Manufacturing Process. 3.
    • 3.3.3. OLED Manufacturing Process
    • 3.3.4. Outlook for the Worldwide HB-LED Market
  • 3.4. Compound Semiconductors
    • 3.4.1. GaAs Devices
    • 3.4.2. Equipment Trends
    • 3.4.3. Wafer Sizes
    • 3.4.4. GaAs IC Market Forecast
    • 3.4.5. Competing Against SiGe
    • 3.4.6. Competing Against Gallium Nitride
      • Costs
      • Starting Material
      • Epitaxial Growth
      • Challenges
      • R&D Needs
  • 3.5. Thin Film Read/Write Heads for HDD
    • 3.5.1. Trends in HDDs
    • 3.5.2. Recording Head Market Forecast
    • 3.5.3. Head Processing
    • 3.5.4. Head Fabrication - CMP, Deposition, Lithography
    • 3.5.5. CMP Challenges
    • 3.5.6. Lithography Challenges
  • 3.6 The Filtering Options Across Spectrum: SAW Vs. BAW
    • 3.6.1 Surface Acoustic Wave (SAW) Filtering
    • 3.6.2 Temperature Compensated SAW (TC-SAW)
    • 3.6.3 Bulk Acoustic Wave (BAW) Filtering
    • 3.6.4 Film Bulk Acoustic Resonator (FBAR)
    • 3.6.5 Filter Market

TABLES

  • 2.1. Common UBM Stacks For Solder And Gold Bumping
  • 2.2. Solder Bumping Guidelines
  • 2.3. ITRS Pin Counts For Different Applications
  • 2.4. Pillar-WLP CSP Guidelines
  • 2.5. Pad Redistribution Guidelines
  • 2.6. UBM Film Etchants
  • 2.7. Common UBM Stacks For Gold And Solder Bumping
  • 2.8. WLP Demand By Device (Units)
  • 2.9. WLP Demand By Device (Wafers)
  • 2.10. Cost Of Ownership Comparison
  • 2.11. Forecast Of TSV Devices By Wafers
  • 3.1. MEMS Device Markets
  • 3.2. MEMS System Markets
  • 3.3. MEMS Equipment Markets
  • 3.4. Current Status And Cost Targets For Panels Produced By Traditional Methods
  • 3.5. Worldwide Led Market Forecast
  • 3.6. GaAs IC Market Forecast
  • 3.7. 5G Handset and RF Content Forecast

FIGURES

  • 2.1. Solder Bumping Process
  • 2.2. Pillar-WLPCSP Process
  • 2.3. Pad Redistribution Process
  • 2.4. Cost Of Ownership For 5 X 50 TSV VIA Middle
  • 2.5. Cost Of CMP For TSV VIA Middle Process
  • 2.6. Cost Of Ownership For 10 X 100 TSV Via Middle
  • 2.7. Cost Structure Of TSVs 5 X 50 μm
  • 2.8. Interposer TSV: Upscaling To 10 X 100 μm
  • 2.9. TSV Downscaling To 3x50 μm
  • 2.10. Cost Structure Of Different Vias And Tools
  • 2.11. Via First Cost Of Ownership
  • 2.12. Via First Cost Of Ownership Front And Back Side
  • 2.13. Via First Process Flow
  • 2.14. iTSV Versus pTSV Cost Of Ownership
  • 2.15. Effect Of TSV Depth And Diameter On Cost
  • 2.16. Illustration Of Bosch Process
  • 2.17. Via First, Middle, And Last Process Flows
  • 2.18. Via First TSV Process Flow
  • 2.19. Forecast Of TSV Devices By Wafers
  • 2.20. Comparison Of Non-Volatile RAM Write Times
  • 2.21. Competition In Dissipation Speed And Memory Capacity
  • 2.22. Comparison Of Non-Volatile RAM Technology
  • 2.23. Comparison Of MRAM Technologies
  • 2.24. Tunneling Magnetoresistive (TMR) Device For MRAM
  • 2.25. Al / TiOx / Al "Sandwich Of An RRAM
  • 2.26. Different FeERAM Cell Designs
  • 2.27. MRAM Market Size
  • 2.28. Wafer Thinning Forecast
  • 3.1. LED-Based SSL Manufacturing Supply Chain
  • 3.2. High-Power, Mid-Power, Chip-On-Board, And Chip Scale LED Packages
  • 3.3. OLED-Based SSL Manufacturing Supply Chain
  • 3.4. Schematic of GaAs MESFET
  • 3.5. Schematic of GaAs HEMT Device
  • 3.6. Schematic of GaAs HBT Device
  • 3.7. Schematic of GaAs HBT Device
  • 3.8. pHEMT MMIC Process Flow Chart
  • 3.9. 0.15 Micron 3MI Process Cross Section
  • 3.10. InGaP HBT Process
  • 3.11. Hard Disk Drive Roadmap
  • 3.12. Change In Average Price Of Storage
  • 3.13. Heads Per Drive
  • 3.14. Increase In Areal Density
  • 3.15. Market Forecast Of Recording Head Consumption
  • 3.16. Thin Film Head Structure
  • 3.17. Critical Features In Thin Film Head Structure
  • 3.18. Spin Valve Head Structure
  • 3.19. Cross-Sectional View TFH Stacks
  • 3.20. Cross-Sectional View Of A TFH Design
  • 3.21. CMP Slurry System For TFH wafer Polishing
  • 3.22. Critical Feature Trends In Thin Film Heads
  • 3.23. SAW Filter Market Shares
  • 3.24. BAW Filter Market Shares
  • 3.25. Adaption Of Filters In Smartphone By Communications Generation