利基市场上的化学物质及材料供应商市场和策略

本报告书内容包括:太阳能、MEMS、高亮度LED、HDD用薄膜导线／头灯、晶圆加工等领域中的化学物质及材料供应商市场的趋势彙整、各市场的趋势和今后的预测和展望、内容纲要摘记如下:

第1章　介绍

第2章　太阳能

• 介绍
• 结晶・多结晶电池的製造
  • 硅成长和载体媒介搬运工具
  • 蚀刻和喷砂
  • 防止反射镀膜
• 薄膜电池的製造
  • 微结晶硅气相沉积
  • 微结晶硅气相沉积
  • CdTe
  • CIGS
  • GaA
• 材料供应商市场
  • 结晶・多结晶电池
  • 薄膜电池
  • 化学物质及材料
• 奈米材料
  • 无机奈米结晶
  • CdSe及CdTe奈米管
  • 量子点
  • 奈米复合材料和量子点的合成
  • 量子井
  • 有机聚合物 - 富勒烯
  • 离子有机聚合物
  • CIGS
  • 色素増感太阳能电池
  • 太阳能电池专用奈米材料市场的分析

第3章　MEMS

• MEMS市场基础建设
• 主要用途和市场预测
  • MEMS设备市场预测
  • MEMS系统市场预测
  • 材料供应商市场

第4章　高亮度LED（HB-LED）

• 高亮度LED技术及应用上近年的进歩
• 结构材料
  • 萤光物质
  • 基板
• OLED的製造
• 全球的OLED市场展望
• 全球的高亮度LED市场展望

第5章　HDD用薄膜导线／头灯

• HDD趋势
• 墨头市场预测
• 头灯加工
• 头灯製造
• 气相沉积课题
• CMP的课题
• CMP研磨垫市场

第6章　晶圆等级过程

• 介绍
• 生产覆晶晶片／WLP加工上的课题和趋势
• 金属化的课题和趋势
• UBM蚀刻的课题和趋势
  • 蚀刻过程
  • 蚀刻物质
• WLP市场分析

图表

The report is segmented in two chapters. In Chapter 2 we identify high-tech applications that are fabricated on 300mm wafers. This is the realm of the large equipment manufacturers, and so the focus of the chapter is on how a small or mid-sized company can compete - namely in the area of niche processing capabilities from a technology point of view.

In Chapter 3 we discuss high-tech applications that are built on non- 300mm wafers. These should be the focal point of a small and mid-size company because often the large companies will address applications on 300mm wafers and ignore niche applications where the size of the market does not represent a need for the semiconductor manufacturer to invest in a 300mm fab or utilize a foundry for small runs. In-house manufacturing is performed on 150mm and 200mm wafer sizes.

In this report we identify areas of semiconductor-related technologies where a small or mid-sized company can compete. These high-tech applications segmented include Wafer Level Processing (WLP), 3-D TSV, Non-volatile Memory Devices MRAM, RRAM and FeRAM, Ultrathin Wafers, MEMs, HB-LEDs, Compound Semiconductors, Thin Film Read/Write Heads for HDD, and SAW Vs. BAW filters. Each of these applications is analyzed and forecast.

Table of Contents

Chapter Introduction

Chapter 2 Niche Markets for PROCESSES for 300mm Wafers

• 2.1. Introduction
• 2.2. Wafer Level Processing (WLP)
  • 2.2.1. Introduction
  • 2.2.2. Flip Chip/WLP Processing Issues and Trends
    • Wafer Bumping
    • Wafer Level Packaging
    • Pad Redistribution
    • Wafer Bumping Costs
  • 2.2.3. Lithography Issues And Trends
  • 2.2.4. UBM Etch Issues And Trends
  • 2.2.5. Metallization Issues and Trends
    • Gold Bumping Metallization
    • Solder Bumping Metallization
  • 2.2.6. Analysis of WLP Market
• 2.3. 3-D TSV
  • 2.3.1. Insight Into Critical Issues
  • 2.3.2. Cost Structure
  • 2.3.3. Critical Processing Technologies
  • 2.3.4. Evaluation Of Critical Development Segments
  • 2.3.5. TSV Device Forecast
• 2.4. Non-volatile Memory Devices MRAM, RRAM and FeRAM
  • 2.4.1. Processing Requirements for MRAMs
  • 2.4.2. Processing Requirements for RRAMs
  • 2.4.3. Processing Requirements for FeRAMs
  • 2.4.4. Roadmap for Commercialization
• 2.5. Ultrathin Wafers
  • 2.5.1. Applications for Ultrathin Wafers
  • 2.5.2. Substrate Thinning
  • 2.5.3. Backside Metallization Requirements
  • 2.5.4. Surface Stress Relief
  • 2.5.5. Ultrathin Wafer Market

Chapter 3 Niche Markets for EQUIPMENT for SUB 300mm Wafers

• 3.1. Introduction
• 3.2. MEMs
  • 3.2.1. The MEMS Market Infrastructure
  • 3.2.2. Forecast Of The Key Applications And Markets
    • MEMS Device Market Forecast
    • MEMS System Market Forecast
  • 3.2.3. Markets for Equipment and Materials Suppliers
• 3.3. HB-LEDs
  • 3.3.1. Recent Progress in High Brightness LED Technology and Applications
  • 3.3.2. LED Manufacturing Process. 3.
  • 3.3.3. OLED Manufacturing Process
  • 3.3.4. Outlook for the Worldwide HB-LED Market
• 3.4. Compound Semiconductors
  • 3.4.1. GaAs Devices
  • 3.4.2. Equipment Trends
  • 3.4.3. Wafer Sizes
  • 3.4.4. GaAs IC Market Forecast
  • 3.4.5. Competing Against SiGe
  • 3.4.6. Competing Against Gallium Nitride
    • Costs
    • Starting Material
    • Epitaxial Growth
    • Challenges
    • R&D Needs
• 3.5. Thin Film Read/Write Heads for HDD
  • 3.5.1. Trends in HDDs
  • 3.5.2. Recording Head Market Forecast
  • 3.5.3. Head Processing
  • 3.5.4. Head Fabrication - CMP, Deposition, Lithography
  • 3.5.5. CMP Challenges
  • 3.5.6. Lithography Challenges
• 3.6 The Filtering Options Across Spectrum: SAW Vs. BAW
  • 3.6.1 Surface Acoustic Wave (SAW) Filtering
  • 3.6.2 Temperature Compensated SAW (TC-SAW)
  • 3.6.3 Bulk Acoustic Wave (BAW) Filtering
  • 3.6.4 Film Bulk Acoustic Resonator (FBAR)
  • 3.6.5 Filter Market

TABLES

• 2.1. Common UBM Stacks For Solder And Gold Bumping
• 2.2. Solder Bumping Guidelines
• 2.3. ITRS Pin Counts For Different Applications
• 2.4. Pillar-WLP CSP Guidelines
• 2.5. Pad Redistribution Guidelines
• 2.6. UBM Film Etchants
• 2.7. Common UBM Stacks For Gold And Solder Bumping
• 2.8. WLP Demand By Device (Units)
• 2.9. WLP Demand By Device (Wafers)
• 2.10. Cost Of Ownership Comparison
• 2.11. Forecast Of TSV Devices By Wafers
• 3.1. MEMS Device Markets
• 3.2. MEMS System Markets
• 3.3. MEMS Equipment Markets
• 3.4. Current Status And Cost Targets For Panels Produced By Traditional Methods
• 3.5. Worldwide Led Market Forecast
• 3.6. GaAs IC Market Forecast
• 3.7. 5G Handset and RF Content Forecast

FIGURES

• 2.1. Solder Bumping Process
• 2.2. Pillar-WLPCSP Process
• 2.3. Pad Redistribution Process
• 2.4. Cost Of Ownership For 5 X 50 TSV VIA Middle
• 2.5. Cost Of CMP For TSV VIA Middle Process
• 2.6. Cost Of Ownership For 10 X 100 TSV Via Middle
• 2.7. Cost Structure Of TSVs 5 X 50 μm
• 2.8. Interposer TSV: Upscaling To 10 X 100 μm
• 2.9. TSV Downscaling To 3x50 μm
• 2.10. Cost Structure Of Different Vias And Tools
• 2.11. Via First Cost Of Ownership
• 2.12. Via First Cost Of Ownership Front And Back Side
• 2.13. Via First Process Flow
• 2.14. iTSV Versus pTSV Cost Of Ownership
• 2.15. Effect Of TSV Depth And Diameter On Cost
• 2.16. Illustration Of Bosch Process
• 2.17. Via First, Middle, And Last Process Flows
• 2.18. Via First TSV Process Flow
• 2.19. Forecast Of TSV Devices By Wafers
• 2.20. Comparison Of Non-Volatile RAM Write Times
• 2.21. Competition In Dissipation Speed And Memory Capacity
• 2.22. Comparison Of Non-Volatile RAM Technology
• 2.23. Comparison Of MRAM Technologies
• 2.24. Tunneling Magnetoresistive (TMR) Device For MRAM
• 2.25. Al / TiOx / Al "Sandwich Of An RRAM
• 2.26. Different FeERAM Cell Designs
• 2.27. MRAM Market Size
• 2.28. Wafer Thinning Forecast
• 3.1. LED-Based SSL Manufacturing Supply Chain
• 3.2. High-Power, Mid-Power, Chip-On-Board, And Chip Scale LED Packages
• 3.3. OLED-Based SSL Manufacturing Supply Chain
• 3.4. Schematic of GaAs MESFET
• 3.5. Schematic of GaAs HEMT Device
• 3.6. Schematic of GaAs HBT Device
• 3.7. Schematic of GaAs HBT Device
• 3.8. pHEMT MMIC Process Flow Chart
• 3.9. 0.15 Micron 3MI Process Cross Section
• 3.10. InGaP HBT Process
• 3.11. Hard Disk Drive Roadmap
• 3.12. Change In Average Price Of Storage
• 3.13. Heads Per Drive
• 3.14. Increase In Areal Density
• 3.15. Market Forecast Of Recording Head Consumption
• 3.16. Thin Film Head Structure
• 3.17. Critical Features In Thin Film Head Structure
• 3.18. Spin Valve Head Structure
• 3.19. Cross-Sectional View TFH Stacks
• 3.20. Cross-Sectional View Of A TFH Design
• 3.21. CMP Slurry System For TFH wafer Polishing
• 3.22. Critical Feature Trends In Thin Film Heads
• 3.23. SAW Filter Market Shares
• 3.24. BAW Filter Market Shares
• 3.25. Adaption Of Filters In Smartphone By Communications Generation