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市场调查报告书
商品编码
1225410

高密度互连 (HDI) PCB 市场：2023-2028 年全球行业趋势、份额、规模、增长、机遇和预测

High-Density Interconnect (HDI) PCB Market: Global Industry Trends, Share, Size, Growth, Opportunity and Forecast 2023-2028
出版日期: | 出版商: IMARC | 英文 142 Pages | 商品交期: 2-3个工作天内

价格

市场概览

  • 到 2022 年，高密度互连 (HDI) PCB 的全球市场规模将达到 82 亿美元。 展望未来，IMARC Group 预测到 2028 年将达到 115 亿美元，显示 2023 年至 2028 年的增长率 (CAGR) 为 5.5%。
  • 高密度布线板 (HDI) 是单位布线密度高于传统布线板的布线板。 盲孔和埋孔具有比传统电路板更高的电路密度，但包含直径更小的微孔，并且具有比传统电路板相对更高的焊盘密度。 高密度 PCB 技术为工程师提供了更大的设计自由度和灵活性，使他们能够将组件放置得更小、更紧密，从而减少信号损失和交叉延迟。 高密度互连 PCB 可以增加设计人员可以使用的表面积。 因此，高密度互连 PCB 可以实现更好的信号质量和更快的信号传输。

高密度互连 (HDI) PCB 市场趋势

  • 全球市场的主要驱动力是电信、消费电子和汽车等许多最终用途行业不断增长的产品需求。 这是由于它们在各种电子设备（如触摸屏设备、移动电话、笔记本电脑和数码相机）中的使用迅速扩大。 此外，电子设备小型化的趋势和对高性能小工具的需求不断增加也正在振兴市场。 此外，随着医疗费用的扩大，医疗器械和器械的普及也在为市场带来利好迹象。 此外，飞机电子零部件产量的增加也是推动市场增长的关键因素。 其他市场发展因素包括先进安全系统的普及、自动驾驶的增长趋势、智能设备和游戏机销量的扩大、可支配收入水平的提高以及大规模的研发活动。

主要市场细分

  • IMARC Group 对全球高密度互连 (HDI) PCB 市场报告的每个子部分的主要趋势进行了分析，并预测了 2023 年至 2028 年在全球、区域和国家层面的增长。 该报告根据 HDI 层数和最终用途行业对市场进行分类。

按 HDI 层数细分

  • 4-6层HDI印刷电路板
  • 8-10 层 HDI PCB
  • 10 层或更多 HDI PCB

按最终用途行业细分

  • 智能手机、平板电脑
  • 计算机
  • 电信/数据通信
  • 消费类电子产品
  • 车载
  • 其他

按地区划分

  • 北美
  • 美国
  • 加拿大
  • 亚太地区
  • 中国
  • 日本
  • 印度
  • 韩国
  • 澳大利亚
  • 印度尼西亚
  • 其他
  • 欧洲
  • 德国
  • 法国
  • 英国
  • 意大利
  • 西班牙
  • 俄罗斯
  • 其他
  • 拉丁美洲
  • 巴西
  • 墨西哥
  • 其他
  • 中东和非洲

本报告中回答的关键问题

  • 全球高密度互连 (HDI) PCB 市场迄今进展如何，未来将如何发展？
  • COVID-19 对全球高密度互连 (HDI) PCB 市场有何影响？
  • 主要的区域市场是什么？
  • HDI 市场按层数细分的情况如何？
  • 按最终用途行业划分的市场细分情况如何？
  • 行业价值链中有哪些不同阶段？
  • 该行业的主要驱动因素和挑战是什么？
  • 全球高密度互连 (HDI) PCB 市场的结构如何，主要参与者有哪些？
  • 您所在行业的竞争力如何？

内容

第一章前言

第 2 章研究方法和范围

  • 调查的目的
  • 利益相关者
  • 数据源
    • 主要信息
    • 次要信息
  • 市场评估
    • 自下而上的方法
    • 自上而下的方法
  • 预测方法

第 3 章执行摘要

第四章介绍

  • 概览
  • 主要行业趋势

第 5 章全球高密度互连 (HDI) PCB 市场

  • 市场概览
  • 市场结果
  • COVID-19 的影响
  • 市场展望

第 6 章按 HDI 层数划分的市场细分

  • 4-6层HDI印刷电路板
    • 市场趋势
    • 市场展望
  • 8-10层HDI印刷电路板
    • 市场趋势
    • 市场展望
  • 10层以上的HDI印刷电路板
    • 市场趋势
    • 市场展望

第 7 章最终用户行业的市场细分

  • 智能手机、平板电脑
    • 市场趋势
    • 市场预测
  • 计算机
    • 市场趋势
    • 市场预测
  • 电信/数据通信
    • 市场趋势
    • 市场预测
  • 消费类电子产品
    • 市场趋势
    • 市场预测
  • 汽车
    • 市场趋势
    • 市场预测
  • 其他
    • 市场趋势
    • 市场预测

第 8 章按区域划分的市场细分

  • 北美
    • 美国
      • 市场趋势
      • 市场预测
    • 加拿大
      • 市场趋势
      • 市场展望
  • 亚太地区
    • 中国
      • 市场趋势
      • 市场展望
    • 日本
      • 市场趋势
      • 市场预测
    • 印度
      • 市场趋势
      • 市场展望
    • 韩国市场
      • 市场趋势
      • 市场展望
    • 澳大利亚
      • 市场趋势
      • 市场展望
    • 印度尼西亚
      • 市场趋势
      • 市场展望
    • 其他
      • 市场趋势
      • 市场预测
  • 欧洲
    • 德国
      • 市场趋势
      • 市场展望
    • 法国
      • 市场趋势
      • 市场预测
    • 英国
      • 市场趋势
      • 市场预测
    • 意大利
      • 市场趋势
      • 市场展望
    • 西班牙
      • 市场趋势
      • 市场展望
    • 俄罗斯
      • 市场趋势
      • 市场展望
    • 其他
      • 市场趋势
      • 市场预测
  • 拉丁美洲
    • 巴西
      • 市场趋势
      • 市场展望
    • 墨西哥
      • 市场趋势
      • 市场展望
    • 其他
      • 市场趋势
      • 市场预测
  • 中东和非洲
    • 市场趋势
    • 按国家/地区划分的市场细分
    • 市场展望

第9章SWOT分析

  • 概览
  • 强度
  • 弱点
  • 机会
  • 威胁

第 10 章价值链分析

第11章波特五力分析

  • 概览
  • 买家的议价能力
  • 供应商的议价能力
  • 竞争程度
  • 新进入者的威胁
  • 替代品的威胁

第 12 章：价格分析

第13章竞争格局

  • 市场结构
  • 主要公司
  • 主要公司简介
    • AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
    • Bittele Electronics Inc.
    • Fineline Ltd.
    • Meiko Electronics Co. Ltd.
    • Millennium Circuits Limited
    • Mistral Solutions Pvt. Ltd.
    • Shenzhen Kinwong Electronic Co. Ltd.
    • Sierra Circuits
    • TTM Technologies Inc.
    • Unimicron Technology Corporation（United Microelectronics Corporation）
    • Unitech Printed Circuit Board Corp.
    • Wurth Elektronik GmbH & Co. KG
Product Code: SR1423A251_Report

Market Overview:

  • The global high-density interconnect (HDI) PCB market size reached US$ 8.2 Billion in 2022. Looking forward, IMARC Group expects the market to reach US$ 11.5 Billion by 2028, exhibiting a growth rate (CAGR) of 5.5% during 2023-2028.
  • Interconnecting printed circuit boards (PCBs) with high-density interconnects (HDIs) are circuit boards having a better wiring density per unit than conventional circuit boards. With blind and buried vias, it contains micro-vias that are smaller in diameter and have a relatively greater pad density than conventional circuit boards while having a higher circuitry density than traditional counterparts. High-density PCB technology has allowed engineers an enhanced design freedom and flexibility, thus allowing them to place smaller and closer components, which reduces signal loss and crossing delays. An interconnect PCB with high density gives designers more surface area to work with. As a result, high-density interconnect PCBs deliver better signal quality and faster signal transmission.

High-Density Interconnect (HDI) PCB Market Trends:

  • The global market is primarily driven by the escalating product demand in numerous end-use industries, including telecommunication, consumer electronics, and automotive. This can be attributed to the rapid product utilization in various electronic devices like touch-screen devices, mobile phones, laptop computers, and digital cameras. In addition to this, the rising trend of electronic device miniaturization and the increasing demand for high-performance gadgets are also providing an impetus to the market. Besides this, the expanding medical expenditure resulting in a higher uptake of medical devices and equipment is also creating a positive outlook for the market. Furthermore, the augmenting production rates of electronic aircraft parts and components are acting as a significant growth-inducing factor for the market. Some of the other factors contributing to the market growth include the widespread adoption of sophisticated safety systems, the rising trend of autonomous driving, escalating sales of smart devices and gaming consoles, inflating disposable income levels and extensive research and development (R&D) activities.

Key Market Segmentation:

  • IMARC Group provides an analysis of the key trends in each sub-segment of the global high-density interconnect (HDI) PCB market report, along with forecasts at the global, regional and country level from 2023-2028. Our report has categorized the market based on number of HDI layer and end use industry.

Breakup by Number of HDI Layer:

  • 4-6 Layers HDI PCBs
  • 8-10 Layer HDI PCBs
  • 10+ Layer HDI PCBs

Breakup by End Use Industry:

  • Smartphones and Tablets
  • Computers
  • Telecom/Datacom
  • Consumer Electronics
  • Automotive
  • Others

Breakup by Region:

  • North America
  • United States
  • Canada
  • Asia-Pacific
  • China
  • Japan
  • India
  • South Korea
  • Australia
  • Indonesia
  • Others
  • Europe
  • Germany
  • France
  • United Kingdom
  • Italy
  • Spain
  • Russia
  • Others
  • Latin America
  • Brazil
  • Mexico
  • Others
  • Middle East and Africa

Competitive Landscape:

  • The competitive landscape of the industry has also been examined along with the profiles of the key players being AT & S Austria Technologie & Systemtechnik Aktiengesellschaft, Bittele Electronics Inc., Fineline Ltd., Meiko Electronics Co. Ltd., Millennium Circuits Limited, Mistral Solutions Pvt. Ltd., Shenzhen Kinwong Electronic Co. Ltd., Sierra Circuits, TTM Technologies Inc., Unimicron Technology Corporation (United Microelectronics Corporation), Unitech Printed Circuit Board Corp. and Wurth Elektronik GmbH & Co. KG.

Key Questions Answered in This Report:

  • How has the global high-density interconnect (HDI) PCB market performed so far and how will it perform in the coming years?
  • What has been the impact of COVID-19 on the global high-density interconnect (HDI) PCB market?
  • What are the key regional markets?
  • What is the breakup of the market based on the number of HDI layer?
  • What is the breakup of the market based on the end use industry?
  • What are the various stages in the value chain of the industry?
  • What are the key driving factors and challenges in the industry?
  • What is the structure of the global high-density interconnect (HDI) PCB market and who are the key players?
  • What is the degree of competition in the industry?

Table of Contents

1 Preface

2 Scope and Methodology

  • 2.1 Objectives of the Study
  • 2.2 Stakeholders
  • 2.3 Data Sources
    • 2.3.1 Primary Sources
    • 2.3.2 Secondary Sources
  • 2.4 Market Estimation
    • 2.4.1 Bottom-Up Approach
    • 2.4.2 Top-Down Approach
  • 2.5 Forecasting Methodology

3 Executive Summary

4 Introduction

  • 4.1 Overview
  • 4.2 Key Industry Trends

5 Global High-Density Interconnect (HDI) PCB Market

  • 5.1 Market Overview
  • 5.2 Market Performance
  • 5.3 Impact of COVID-19
  • 5.4 Market Forecast

6 Market Breakup by Number of HDI Layer

  • 6.1 4-6 Layers HDI PCBs
    • 6.1.1 Market Trends
    • 6.1.2 Market Forecast
  • 6.2 8-10 Layer HDI PCBs
    • 6.2.1 Market Trends
    • 6.2.2 Market Forecast
  • 6.3 10+ Layer HDI PCBs
    • 6.3.1 Market Trends
    • 6.3.2 Market Forecast

7 Market Breakup by End Use Industry

  • 7.1 Smartphones and Tablets
    • 7.1.1 Market Trends
    • 7.1.2 Market Forecast
  • 7.2 Computers
    • 7.2.1 Market Trends
    • 7.2.2 Market Forecast
  • 7.3 Telecom/Datacom
    • 7.3.1 Market Trends
    • 7.3.2 Market Forecast
  • 7.4 Consumer Electronics
    • 7.4.1 Market Trends
    • 7.4.2 Market Forecast
  • 7.5 Automotive
    • 7.5.1 Market Trends
    • 7.5.2 Market Forecast
  • 7.6 Others
    • 7.6.1 Market Trends
    • 7.6.2 Market Forecast

8 Market Breakup by Region

  • 8.1 North America
    • 8.1.1 United States
      • 8.1.1.1 Market Trends
      • 8.1.1.2 Market Forecast
    • 8.1.2 Canada
      • 8.1.2.1 Market Trends
      • 8.1.2.2 Market Forecast
  • 8.2 Asia-Pacific
    • 8.2.1 China
      • 8.2.1.1 Market Trends
      • 8.2.1.2 Market Forecast
    • 8.2.2 Japan
      • 8.2.2.1 Market Trends
      • 8.2.2.2 Market Forecast
    • 8.2.3 India
      • 8.2.3.1 Market Trends
      • 8.2.3.2 Market Forecast
    • 8.2.4 South Korea
      • 8.2.4.1 Market Trends
      • 8.2.4.2 Market Forecast
    • 8.2.5 Australia
      • 8.2.5.1 Market Trends
      • 8.2.5.2 Market Forecast
    • 8.2.6 Indonesia
      • 8.2.6.1 Market Trends
      • 8.2.6.2 Market Forecast
    • 8.2.7 Others
      • 8.2.7.1 Market Trends
      • 8.2.7.2 Market Forecast
  • 8.3 Europe
    • 8.3.1 Germany
      • 8.3.1.1 Market Trends
      • 8.3.1.2 Market Forecast
    • 8.3.2 France
      • 8.3.2.1 Market Trends
      • 8.3.2.2 Market Forecast
    • 8.3.3 United Kingdom
      • 8.3.3.1 Market Trends
      • 8.3.3.2 Market Forecast
    • 8.3.4 Italy
      • 8.3.4.1 Market Trends
      • 8.3.4.2 Market Forecast
    • 8.3.5 Spain
      • 8.3.5.1 Market Trends
      • 8.3.5.2 Market Forecast
    • 8.3.6 Russia
      • 8.3.6.1 Market Trends
      • 8.3.6.2 Market Forecast
    • 8.3.7 Others
      • 8.3.7.1 Market Trends
      • 8.3.7.2 Market Forecast
  • 8.4 Latin America
    • 8.4.1 Brazil
      • 8.4.1.1 Market Trends
      • 8.4.1.2 Market Forecast
    • 8.4.2 Mexico
      • 8.4.2.1 Market Trends
      • 8.4.2.2 Market Forecast
    • 8.4.3 Others
      • 8.4.3.1 Market Trends
      • 8.4.3.2 Market Forecast
  • 8.5 Middle East and Africa
    • 8.5.1 Market Trends
    • 8.5.2 Market Breakup by Country
    • 8.5.3 Market Forecast

9 SWOT Analysis

  • 9.1 Overview
  • 9.2 Strengths
  • 9.3 Weaknesses
  • 9.4 Opportunities
  • 9.5 Threats

10 Value Chain Analysis

11 Porters Five Forces Analysis

  • 11.1 Overview
  • 11.2 Bargaining Power of Buyers
  • 11.3 Bargaining Power of Suppliers
  • 11.4 Degree of Competition
  • 11.5 Threat of New Entrants
  • 11.6 Threat of Substitutes

12 Price Analysis

13 Competitive Landscape

  • 13.1 Market Structure
  • 13.2 Key Players
  • 13.3 Profiles of Key Players
    • 13.3.1 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
      • 13.3.1.1 Company Overview
      • 13.3.1.2 Product Portfolio
      • 13.3.1.3 Financials
    • 13.3.2 Bittele Electronics Inc.
      • 13.3.2.1 Company Overview
      • 13.3.2.2 Product Portfolio
    • 13.3.3 Fineline Ltd.
      • 13.3.3.1 Company Overview
      • 13.3.3.2 Product Portfolio
    • 13.3.4 Meiko Electronics Co. Ltd.
      • 13.3.4.1 Company Overview
      • 13.3.4.2 Product Portfolio
      • 13.3.4.3 Financials
    • 13.3.5 Millennium Circuits Limited
      • 13.3.5.1 Company Overview
      • 13.3.5.2 Product Portfolio
    • 13.3.6 Mistral Solutions Pvt. Ltd.
      • 13.3.6.1 Company Overview
      • 13.3.6.2 Product Portfolio
    • 13.3.7 Shenzhen Kinwong Electronic Co. Ltd.
      • 13.3.7.1 Company Overview
      • 13.3.7.2 Product Portfolio
      • 13.3.7.3 Financials
    • 13.3.8 Sierra Circuits
      • 13.3.8.1 Company Overview
      • 13.3.8.2 Product Portfolio
    • 13.3.9 TTM Technologies Inc.
      • 13.3.9.1 Company Overview
      • 13.3.9.2 Product Portfolio
      • 13.3.9.3 Financials
      • 13.3.9.4 SWOT Analysis
    • 13.3.10 Unimicron Technology Corporation (United Microelectronics Corporation)
      • 13.3.10.1 Company Overview
      • 13.3.10.2 Product Portfolio
      • 13.3.10.3 Financials
    • 13.3.11 Unitech Printed Circuit Board Corp.
      • 13.3.11.1 Company Overview
      • 13.3.11.2 Product Portfolio
      • 13.3.11.3 Financials
    • 13.3.12 Wurth Elektronik GmbH & Co. KG
      • 13.3.12.1 Company Overview
      • 13.3.12.2 Product Portfolio

List of Figures

  • Figure 1: Global: High-Density Interconnect PCB Market: Major Drivers and Challenges
  • Figure 2: Global: High-Density Interconnect PCB Market: Sales Value (in Billion US$), 2017-2022
  • Figure 3: Global: High-Density Interconnect PCB Market Forecast: Sales Value (in Billion US$), 2023-2028
  • Figure 4: Global: High-Density Interconnect PCB Market: Breakup by Number of HDI Layer (in %), 2022
  • Figure 5: Global: High-Density Interconnect PCB Market: Breakup by End Use Industry (in %), 2022
  • Figure 6: Global: High-Density Interconnect PCB Market: Breakup by Region (in %), 2022
  • Figure 7: Global: High-Density Interconnect PCB (4-6 Layers HDI PCBs) Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 8: Global: High-Density Interconnect PCB (4-6 Layers HDI PCBs) Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 9: Global: High-Density Interconnect PCB (8-10 Layer HDI PCBs) Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 10: Global: High-Density Interconnect PCB (8-10 Layer HDI PCBs) Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 11: Global: High-Density Interconnect PCB (10+ Layer HDI PCBs) Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 12: Global: High-Density Interconnect PCB (10+ Layer HDI PCBs) Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 13: Global: High-Density Interconnect PCB (Smartphones and Tablets) Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 14: Global: High-Density Interconnect PCB (Smartphones and Tablets) Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 15: Global: High-Density Interconnect PCB (Computers) Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 16: Global: High-Density Interconnect PCB (Computers) Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 17: Global: High-Density Interconnect PCB (Telecom/Datacom) Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 18: Global: High-Density Interconnect PCB (Telecom/Datacom) Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 19: Global: High-Density Interconnect PCB (Consumer Electronics) Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 20: Global: High-Density Interconnect PCB (Consumer Electronics) Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 21: Global: High-Density Interconnect PCB (Automotive) Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 22: Global: High-Density Interconnect PCB (Automotive) Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 23: Global: High-Density Interconnect PCB (Other End Use Industries) Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 24: Global: High-Density Interconnect PCB (Other End Use Industries) Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 25: North America: High-Density Interconnect PCB Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 26: North America: High-Density Interconnect PCB Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 27: United States: High-Density Interconnect PCB Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 28: United States: High-Density Interconnect PCB Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 29: Canada: High-Density Interconnect PCB Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 30: Canada: High-Density Interconnect PCB Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 31: Asia-Pacific: High-Density Interconnect PCB Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 32: Asia-Pacific: High-Density Interconnect PCB Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 33: China: High-Density Interconnect PCB Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 34: China: High-Density Interconnect PCB Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 35: Japan: High-Density Interconnect PCB Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 36: Japan: High-Density Interconnect PCB Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 37: India: High-Density Interconnect PCB Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 38: India: High-Density Interconnect PCB Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 39: South Korea: High-Density Interconnect PCB Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 40: South Korea: High-Density Interconnect PCB Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 41: Australia: High-Density Interconnect PCB Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 42: Australia: High-Density Interconnect PCB Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 43: Indonesia: High-Density Interconnect PCB Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 44: Indonesia: High-Density Interconnect PCB Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 45: Others: High-Density Interconnect PCB Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 46: Others: High-Density Interconnect PCB Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 47: Europe: High-Density Interconnect PCB Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 48: Europe: High-Density Interconnect PCB Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 49: Germany: High-Density Interconnect PCB Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 50: Germany: High-Density Interconnect PCB Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 51: France: High-Density Interconnect PCB Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 52: France: High-Density Interconnect PCB Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 53: United Kingdom: High-Density Interconnect PCB Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 54: United Kingdom: High-Density Interconnect PCB Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 55: Italy: High-Density Interconnect PCB Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 56: Italy: High-Density Interconnect PCB Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 57: Spain: High-Density Interconnect PCB Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 58: Spain: High-Density Interconnect PCB Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 59: Russia: High-Density Interconnect PCB Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 60: Russia: High-Density Interconnect PCB Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 61: Others: High-Density Interconnect PCB Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 62: Others: High-Density Interconnect PCB Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 63: Latin America: High-Density Interconnect PCB Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 64: Latin America: High-Density Interconnect PCB Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 65: Brazil: High-Density Interconnect PCB Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 66: Brazil: High-Density Interconnect PCB Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 67: Mexico: High-Density Interconnect PCB Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 68: Mexico: High-Density Interconnect PCB Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 69: Others: High-Density Interconnect PCB Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 70: Others: High-Density Interconnect PCB Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 71: Middle East and Africa: High-Density Interconnect PCB Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 72: Middle East and Africa: High-Density Interconnect PCB Market: Breakup by Country (in %), 2022
  • Figure 73: Middle East and Africa: High-Density Interconnect PCB Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 74: Global: High-Density Interconnect PCB Industry: SWOT Analysis
  • Figure 75: Global: High-Density Interconnect PCB Industry: Value Chain Analysis
  • Figure 76: Global: High-Density Interconnect PCB Industry: Porter's Five Forces Analysis

List of Tables

  • Table 1: Global: High-Density Interconnect PCB Market: Key Industry Highlights, 2022 and 2028
  • Table 2: Global: High-Density Interconnect PCB Market Forecast: Breakup by Number of HDI Layer (in Million US$), 2023-2028
  • Table 3: Global: High-Density Interconnect PCB Market Forecast: Breakup by End Use Industry (in Million US$), 2023-2028
  • Table 4: Global: High-Density Interconnect PCB Market Forecast: Breakup by Region (in Million US$), 2023-2028
  • Table 5: Global: High-Density Interconnect PCB Market: Competitive Structure
  • Table 6: Global: High-Density Interconnect PCB Market: Key Players