市场调查报告书
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全球薄晶圆市场规模、份额、行业趋势分析报告:按晶圆尺寸(300毫米、200毫米、125毫米)、技术(切割、抛光、研磨)、应用、区域展望、预测2022-2028Global Thin Wafer Market Size, Share & Industry Trends Analysis Report By Wafer Size (300 mm, 200 mm and 125 mm), By Technology (Dicing, Polishing and Grinding), By Application, By Regional Outlook and Forecast, 2022 - 2028 |
全球薄晶圆市场规模预计将在 2028 年达到 222 亿美元,预测期内復合年增长率为 13.0%。
晶圆由极其纯净、几乎无缺陷的材料製成,纯度为 99.9999999 个百分点 (9N) 或更高。生产结晶晶片的方法之一是由波兰化学家 Jan Czochralski 开发的“Czochralski 方法”。通过从熔体中提取晶种,可以生产出硅或锗等高纯度单晶半导体的柱状“晶锭”。在硅的情况下,可以以精确的比例添加硼或磷等杂质原子,以形成 n 型或 p 型外部半导体。
此晶锭用晶圆锯(一种线锯)切割成晶圆,进行机加工以提高平整度,化学擦除以去除机加工造成的晶体损伤,并抛光完成。太阳能电池晶圆为 100 至 200 平方毫米,厚度为 100 至 500 毫米,电子元件晶圆的直径为 100 至 450 毫米。最大的晶圆直径为450mm,但尚未普及。
COVID-19 影响分析
薄晶圆行业包括製造设施遍布多个国家/地区的 1 级和 2 级製造商。这些公司为电子、汽车和医疗等各种终端市场生产薄晶圆。 COVID-19 不仅影响了上述行业的公司,也影响了晶圆製造商的运营。汽车和电子设备领域的MEMS产品市场预计也将萎缩。 COVID-19 大流行严重打击了晶圆加工和切割设备市场,主要工业基地的生产活动暂时停止,并迫使产量大幅下降。
市场增长因素
采用 5G 技术实现电子设备的小型化正在取得进展
世界各地的企业都在转向 5G 连接,以提高运营效率并增加交易量。此外,5G网络可以显着提高通信速度并减少下载时间,使其适用于汽车和智慧城市发展等领域。基于 GaN 的薄晶圆有可能实现 50% 或更高的功率附加效率 (PAE),并有望得到广泛应用。此外,5G技术有望在人工智能、无人驾驶、增强现实等领域得到广泛应用。此外,荷兰芯片製造商恩智浦在亚利桑那州开设了一家 GaN 5G 芯片製造工厂,旨在提升其 5G 电信设备。这是市场扩张的原动力。
扩大物联网和人工智能在汽车领域的应用
汽车行业引入工业4.0、物联网和人工智能等新技术,将对薄晶圆市场的扩张产生重大影响。对汽车连接性不断增长的需求将刺激新的工业进步。此外,无触摸人机界面等当前趋势正在改变汽车行业,导致联网车辆的相关性增加。物联网连接未来增长的主要驱动力之一是物联网在汽车安全和通信技术中的整合。自适应巡航控制、智能停车辅助系统和高级驾驶员辅助系统 (ADAS) 等新技术的出现将进一步刺激市场扩张。
市场约束
窄晶圆效率维持是关键问题
随着薄晶圆的引入,效率已成为一个主要问题。特别是厚度在50m以下的窄晶圆吸收长波长光的能力低,要完全吸收长波长光必须大幅度移动晶圆。薄晶圆的主要目的是让芯片製造商能够利用高性能、低功耗和缩小芯片面积的所有优势。性能可能是公司在引入薄晶圆时面临的最大挑战。特别是厚度在50m以下的薄晶片的长波吸收能力低。薄晶圆的高效维护阻碍了薄晶圆市场的增长和渗透。
晶圆尺寸展望
根据晶圆尺寸,薄晶圆市场分为 125 毫米、200 毫米和 300 毫米。 300 毫米细分市场在 2021 年占据了薄晶圆市场的最高收入份额。 300mm晶圆由于良率高,越来越多地用于LED等应用,这正在推动薄晶圆市场的扩张。 300 毫米晶圆可提供 LED 製造商所需的规模经济和更高的盈利能力。使用此晶圆,您可以一次製作许多产品。
技术展望
薄晶圆市场按技术细分为研磨、抛光和切割。 2021 年,研磨部分在薄晶圆市场中占据了很大的收入份额。为了实现集成电路的堆迭和高密度安装,在称为晶圆背景(wafer background,IC)的半导体器件製造过程中晶圆厚度被减小。 IC 形成在经过多个处理步骤的薄晶圆上。
应用展望
薄晶圆市场按应用细分为 MEMS、CIS、存储器、RF 设备、LED、中介层、逻辑等。到 2021 年,薄晶圆市场将在内存领域占据最高的收入份额。内存在很大程度上依赖于刀片和激光切割的混合来分离复杂的堆栈。由于高金属浓度,仅顶层的刀片切割会导致分层问题。然而,安全地模拟薄至 50m 的晶圆是很困难的。
区域展望
按地区划分,在北美、欧洲、亚太地区和 LAMEA 进行了分析。亚太地区将在 2021 年占据薄晶圆市场的最高收入份额。随着中国和日本在智能手錶和智能家居小工具等高端消费品的使用方面经历了爆炸式增长。由于有利的经济条件和对消费电子产品的需求增加,预计亚太地区的半导体市场将出现显着增长。
The Global Thin Wafer Market size is expected to reach $22.2 billion by 2028, rising at a market growth of 13.0% CAGR during the forecast period.
While creating integrated circuits, a thin wafer is a slice of semiconductor material. One of the main drivers of a thin wafer market's expansion is the rising demand for semiconductor devices in sectors like telecommunications, consumer electronics, and automotive.
Wafer, also known as a slice or a substrate, is a thin semiconductor slice used in electronics for the production of solar cells and integrated circuits made of crystalline silicon (c-Si). The wafer, which serves as the foundation for those devices, is built inside of and on top. It undergoes numerous microfabrication techniques, such as photolithographic patterning, electrodeposition, doping, etching, and thin-film deposition of various materials. The individual microcircuits are separated by wafer dicing, and they are subsequently assembled into an integrated circuit.
Wafers are made of material that is extremely pure, almost defect-free and has a purity of 99.9999999percentage points (9N) or higher. The C zochralski method, developed by Polish chemist Jan Czochralski, is one method for producing crystalline wafers. Pulling a seed crystal from a melt creates a boule, a cylindrical ingot of a high-purity monocrystalline semiconductor like silicon or germanium. The molten intrinsic material can be doped to create an extrinsic semiconductor of the n-type or p-type by adding donor impurity atoms in exact proportions, such as boron or phosphorus in the case of silicon.
The boule is then cut into wafer-shaped pieces using a wafer saw (a sort of wire saw), machined to increase flatness, chemically erased to remove machining-related crystal damage, and polished to finish. Photovoltaic wafers range in size from 100 to 200 mm square and range in thickness from 100 to 500 m. Electronics employ wafers with diameters ranging from 100 to 450 mm. The largest manufactured wafers are 450 mm in diameter, although they are not yet in widespread use.
COVID-19 Impact Analysis
The thin wafer industry includes producers of Tier 1 and Tier 2 with manufacturing facilities dispersed across numerous nations. These companies produce thin wafers that are utilized in a variety of end markets, including electronics, automobiles, medical, and a few more. Covid-19 had an impact on both enterprises in the aforementioned sectors as well as thin wafer industry players' operations. The market for MEMS products from the automotive and electronic goods sectors is also anticipated to decrease. The present COVID-19 pandemic has harmed the market for thin wafer processing and dicing equipment, causing a sizable output slowdown as manufacturing activities are momentarily suspended throughout key industrial centers.
Market Growth Factors
Smaller Electrical Device Sizes High 5g Technology Adoption
Companies all around the world are switching to 5G connectivity to boost operational effectiveness and increase transaction volumes. Additionally, 5G networks can give substantially faster speeds and shorter download times, making them suitable for use in sectors like automotive and smart city development. GaN-based thin wafers, which have the potential to achieve power-added efficiencies (PAE) of 50% or more, are expected to gain popularity. Additionally, it is projected that 5G technology would be widely used in fields like AI, driverless vehicles, and augmented reality. Additionally, the Dutch chipmaker NXP opened a GaN 5G chip manufacturing facility in Arizona intending to enhance 5G communications equipment. This is propelling market expansion.
Increasing IoT And AI Usage In The Automotive Sector
The introduction of Industry 4.0 and new technologies like IoT and AI in the automobile industry will have a big impact on the expansion of the thin wafer market. The rising need for car connectivity will spur new industry advancements. Additionally, the relevance of linked cars is expanding as a result of current trends like touch-free human-machine interfaces, which are transforming the automotive industry. One of the main drivers of future IoT connection growth is the integration of IoT in vehicle safety and communication technologies. The advent of new technologies including adaptive cruise control, intelligent parking assistance systems, and advanced driver assistance systems (ADAS) will further spur market expansion.
Market Restraining Factors
The Maintenance Of Narrow Wafer Efficiency Is A Critical Issue
Efficiency is the major problem businesses are currently having while implementing thin wafers. A narrow wafer has poor capability for long-wavelength light absorption, especially if its thickness is less than 50 m. In the case of long wavelengths, the light must travel a great distance before it can be entirely absorbed by the wafer. The main goal in creating a thin wafer was to provide chip makers access to all of its advantages, including high performance, low power consumption, and a smaller die area. Performance is perhaps the biggest challenge that businesses are encountering when deploying thin wafers. The thin wafer has a poor ability for long wavelength absorption, especially if its thickness is less than 50 m. The efficient maintenance of the thin wafers hampers the growth and adoption of the thin wafer market.
Wafer Size Outlook
Based on the Wafer Size, the Thin Wafer Market is segmented into 125 mm, 200 mm, and 300 mm. The 300 mm segment acquired the highest revenue share in the thin wafer market in 2021. Due to their higher yield, 300 mm wafers are increasingly being used in applications like LED, which is boosting the thin wafer market's expansion. These wafers provide the scale economies and increased profitability that LED makers now find to be necessary. With the help of these wafers, producers may create a large number of products in a single batch.
Technology Outlook
By Technology, the Thin Wafer Market is classified into Grinding, Polishing, and Dicing. The grinding segment recorded a substantial revenue share in the thin wafer market in 2021. To enable stacking and high-density packing of integrated circuits, the wafer thickness is decreased during the semiconductor device manufacture process known as wafer backgrounding (IC). On thin wafers that undergo several processing processes, ICs are created.
Application Outlook
Based on the Application, the Thin Wafer Market is bifurcated into MEMS, CIS, Memory, RF Devices, LED, Interposer, Logic, and Others. The memory segment garnered the highest revenue share in the thin wafer market in 2021. Memory has relied mainly on a mixture of blades and laser dicing to separate complicated stacks. The high metal concentration causes delamination problems when just blade dicing is used on top layers. However, it is challenging to simulate 50 m thin wafers safely.
Regional Outlook
Region-wise, the Thin Wafer Market is analyzed across North America, Europe, Asia Pacific, and LAMEA.The Asia Pacific segment acquired the highest revenue share in the thin wafer market in 2021. Due to China's and Japan's explosive growth in the use of high-end consumer goods, including smartwatches and smart home gadgets. Due to good economic conditions and rising consumer electronics demand, the Asia Pacific region is predicted to experience significant growth in the semiconductor market.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Shin-Etsu Chemical Co., Ltd., SUMCO Corporation, GlobalWafers Co., Ltd., Siltronic AG, SK Siltron Co., Ltd., SUSS MicroTec SE, Soitec, DISCO Corporation, 3M Company, and Applied Materials, Inc.
Strategies deployed in Thin Wafer Market
May-2022: Soitec launched a 200 mm silicon carbide SmartSiC wafer. With this launch, Soitec would broaden its SiC product offering a further 150 mm, take the production of its SmartSiC wafers to the next grade, and meet the increasing demand of the automotive industry.
Mar-2022: Wafer supplier Soitec expanded its geographical footprint by establishing a fabrication facility at its headquarters in Bernin, France. This expansion would fulfill the need for silicon carbide for electric vehicles and industrial purposes, with wafers produced utilizing the SmartSiC production procedure. Moreover, it would sustain the production of 300mm diameter silicon-on-insulator (SOI) wafers.
Nov-2021: Soitec completed the acquisition of NOVASiC, an advanced technology business specializing in polishing and reclaiming wafers on silicon carbide. With this acquisition, Soitec would propel the growth of semiconductors for power supply systems in industrial and electromobility applications.
Sep-2019: SK Siltron completed the acquisition of DuPont's wafer business, which manufactures a broad array of industrial chemicals, and synthetic fibers. With this acquisition, DuPont's SiC unit would provide SK Siltron with a sturdy wafer supply and develop synergy within the group.
May-2019: Soitec took over EpiGaN, a foremost European supplier of GaN epitaxial wafer (epi-wafer) materials. Under this acquisition, EpiGaN would develop new supplementary growth possibilities within Soitec's living Power-SOI products given GaN's benefit in power transistor structures.
Mar-2019: Soitec joined hands with Agency for Science, Technology and Research's (A*STAR) Institute of Microelectronics. Together, the companies aimed to design and incorporate a new layer transfer process within developed wafer-level multi-chip packaging techniques. Additionally, IME's Fan-Out Wafer Level Packaging (FOWLP) and 2.5D Through Silicon Interposer (TSI) technologies along with Soitec's Smart Cut(TM) technology, the latest cost-competitive approach delivers energy efficiency, higher commission, and improved product output.
Feb-2019: SUSS MicroOptics expanded its geographical footprint by establishing an excellence center in Neuchatel Switzerland for manufacturing wafer-level optics. This expansion aimed to satisfy the need for precision optics applications.
Dec-2018: DISCO Corporation introduced DFG8640, a new completely automatic grinder consistent with 8-inch wafers and capable to grind a broad variety of materials, such as silicon, LiNbO3, LiTaO3, and SiC. The new DFG8640 contains high accuracy grinding; optimizing the processing point layout decreases consistency variation for both separate wafers and between wafers; a new spindle with high stability, lower vibration, and minor rotation speed change.
Market Segments covered in the Report:
By Wafer Size
By Technology
By Application
By Geography
Companies Profiled
Unique Offerings from KBV Research
List of Figures