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半导体生产设备

市场调查报告书

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1171574

Logic半导体的全球市场预测(2022年～2027年)

Logic Semiconductor Market - Forecasts from 2022 to 2027

出版日期: 2022年11月25日 | 出版商:

Knowledge Sourcing Intelligence | 英文 132 Pages | 商品交期: 最快1-2个工作天内

价格

简介目录

全球Logic半导体的市场规模在2020年估算为1,184亿800万美金，以年复合成长率9.97％的速度成长，到2027年达到2,302亿3,600万美元。市场成长的主要因素有智慧型手机功能的增加、製造商在提高通信速度的同时注重降低电池消耗，以及由于可支配收入的增加，对可穿戴和连接设备的需求增加等。

本报告提供全球Logic半导体市场相关调查，提供市场规模和预测，COVID-19影响，市场促进因素及课题，市场趋势，各市场区隔的市场分析，竞争情形，主要企业的简介等系统性资讯。

The expanding functionality of smartphones, as well as the manufacturers' increased emphasis on reducing battery consumption while boosting communication speed, are creating major demand for logic devices. Furthermore, rising disposable income is expected to increase demand for wearable and connected devices, which is expected to fuel market expansion.

Market Overview

Digital technologies have also propelled the growth of the logic semiconductor sector. Furthermore, recent breakthroughs in the logical semiconductors industry, such as AI and IoT, are projected to present significant growth possibilities for the logic semiconductors market. Furthermore, the growing need for logic semiconductors in the automotive and industrial equipment sectors has greatly boosted market demand. The growing desire for electric cars might serve as a growth driver for the worldwide semiconductors industry.

By processing digital data, logic semiconductors govern the functioning of electronic systems. Globally, technological advancements that result in increased consumption raised the demand for consumer electronic devices, and benefits such as added convenience, higher productivity, lower power consumption, and higher quality and reliability are the main growth drivers of the global logic semiconductors market. Furthermore, the rising usage of logic semiconductors for data transmission and broadband-enabled devices, as well as growing economies such as China, India, and others, will open up new prospects for the worldwide logic semiconductors market. However, increasing product modification costs and the growth of System-in-Package (SiP) packaging are major barriers for the worldwide logic semiconductors industry.

Asia Pacific region and North America are anticipated to hold a significant number of shares in the logic semiconductors market.

The presence of high-tech companies and the initiative taken by them have majorly influenced the region to generate market demand along with market expansion. For instance, the System LSI Business, Samsung Electronics fabless IC design house, presently offers over 900 products, including SoC (System on Chip), imaging systems, modems, display driver IC (DDI), power control IC (PMIC), and security solutions. The System LSI Business not only produces outstanding individual products, but it is also a whole solution provider capable of integrating diverse logic technologies into a single platform in order to provide clients with optimum solutions. Moreover, in October 2022, at the Tech Day exhibit, Samsung Electronics debuted a variety of innovative logic chip technologies for the first time, including the Exynos Auto V920, 5G Exynos Modem 5300, and QD OLED DDI, which are critical components in sectors such as mobile, home appliances, and automotive.

Furthermore, in November 2021, Samsung stated it will invest $17 billion in a new semiconductor manufacturing plant in Taylor, Texas, including buildings, land upgrades, machinery, and equipment. This is Samsung's largest-ever investment in the United States. This will contribute to an increase in the manufacture of sophisticated logic semiconductor solutions, which power next-generation breakthroughs and technology. Therefore, all these developments will add value to the logic semiconductors market growth in the coming years.

Product Offerings

Taiwan Semiconductor Manufacturing Co. Ltd (TSMC) is introducing its newest advancements in advanced logic technology with the N5A. This logic semiconductor is designed to meet the increased demand for computational capacity in newer and more demanding automotive industries such as AI-enabled driver aids and vehicle cockpit digitalization. N5A applies the latest supercomputer technology to automobiles, delivering the performance, power economy, and logic density of N5 while satisfying the high quality and reliability criteria of AEC-Q100 Grade 2 as well as other vehicle safety and quality standards. The TSMC N5A is backed by the thriving TSMC car design enablement platform.

MIPS Technologies, Inc. and Virage Logic Corp. have developed a streamlined licensing approach that allows System-on-Chip (SoC) designers to license MIPS Technologies' 32-bit CPU cores alongside Virage Logic's semiconductor intellectual property (IP) under a single MIPS Technologies license. The MIPS32 4KEc is the first MIPS Technologies core to be licensed under the new arrangement. It provides startups, fabless semiconductor businesses, and system OEMs with a straightforward, cost-effective, low-risk design route for swiftly deploying a wide range of 32-bit embedded consumer technology applications.

With the debut of their GWU2X and GWU2U USB interface bridging devices, GOWIN Semiconductor Corp., the world's fastest-growing programmable logic firm, introduces the GoBridge ASSP product line. The GWU2X ASSP transforms USB (Universal Serial Bus) devices to four peripheral interfaces: SPI, I2C, JTAG, and GPIO, whereas the GWU2U ASSP translates USB devices to UART. The GoBridge ASSP product family from GOWIN reduces typical interface bridging difficulties in consumer, automobile, industrial, and communication applications.

Key Market Developments

In September 2022, GOWIN Semiconductor Corporation, the world's fastest-growing FPGA company, revealed the availability of its new generation Arora V high-performance FPGA family, which incorporates 270Mbps-12.5Gbps high-speed SerDes interfaces, PCIe 2.1 hardcore with assistance for PCIe x1, x2, and x8 modes, MIPI hardcore single lane device at up to 2.5Gbps, and DDR3 interfacing at speeds up to 1333 Mbps. The first device in the family, the GW5AT-138FC676, has 138K LUT logic resources, 6.4MB block RAM, 1.1MB distributed SRAM, sophisticated DSP blocks, and an integrated ADC. Future devices in the series will include 25K (non-Serdes) and 60K LUT devices.

In July 2022, Samsung plans to expand its semiconductor campus. The new semiconductor campus will cost $17 billion, according to Samsung. It will produce sophisticated logic semiconductor products with 5nm or lower dimensions there. In one of its South Korean plants, the business has already launched the mass manufacture of 3nm chips. When the Taylor factory is fully operating, it may be able to create 2nm solutions. The Korean powerhouse plans to release 2nm semiconductors in 2025.

In August 2022, SK Group, South Korea's second-largest conglomerate, announced the new facility as part of a $22 billion US investment program in semiconductors, renewable energy, and bioscience projects. The White House said that $15 billion will be provided to the semiconductor sector including research and development projects, materials, and the establishment of an enhanced packaging and manufacturing facility. In addition to logic chips created by other US businesses for artificial intelligence and machine learning applications, R&D expenditures will entail the establishment of a countrywide network of R&D collaborations and facilities.

Segmentation

By Type

Special Purpose Logic

Display Drivers

General Purpose Logic

Application Specific Integrated Circuit

Programmable Logic Devices

By Industry Vertical

Communication

Consumer Electronics

Automotive

Manufacturing

By Geography

Americas

USA

Others

Europe Middle East and Africa

Germany

France

Others

Asia Pacific

China

Japan

South Korea

Taiwan

Others

1. INTRODUCTION

1.1. Market Overview
1.2. COVID-19 Scenario
1.3. Market Definition
1.4. Market Segmentation

2. RESEARCH METHODOLOGY

2.1. Research Data
2.2. Assumptions

3. EXECUTIVE SUMMARY

3.1. Research Highlights

4. MARKET DYNAMICS

4.1. Market Drivers
4.2. Market Restraints
4.3. Porter's Five Force Analysis
- 4.3.1. Bargaining Power of Suppliers
- 4.3.2. Bargaining Power of Buyers
- 4.3.3. Threat of New Entrants
- 4.3.4. Threat of Substitutes
- 4.3.5. Competitive Rivalry in the Industry
4.4. Industry Value Chain Analysis

5. LOGIC SEMICONDUCTOR MARKET, BY TYPE

5.1. Introduction
5.2. Special Purpose Logic
5.3. Display Drivers
5.4. General Purpose Logic
5.5. Application-Specific Integrated Circuit
5.6. Programmable Logic Devices

6. LOGIC SEMICONDUCTOR MARKET, BY INDUSTRY VERTICAL

6.1. Introduction
6.2. Communication
6.3. Consumer Electronics
6.4. Automotive
6.5. Manufacturing

7. LOGIC SEMICONDUCTOR MARKET, BY GEOGRAPHY

7.1. Introduction
7.2. Americas
- 7.2.1. USA
- 7.2.2. Others
7.3. Europe Middle East and Africa
- 7.3.1. Germany
- 7.3.2. France
- 7.3.3. Others
7.4. Asia Pacific
- 7.4.1. China
- 7.4.2. Japan
- 7.4.3. South Korea
- 7.4.4. Taiwan
- 7.4.5. Others