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市场调查报告书
商品编码
1403112

半导体封装:市场占有率分析、产业趋势与统计、2024-2029 年成长预测

Semiconductor Packaging - Market Share Analysis, Industry Trends & Statistics, Growth Forecasts 2024 - 2029

出版日期: | 出版商: Mordor Intelligence | 英文 180 Pages | 商品交期: 2-3个工作天内

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简介目录

预计2024年半导体封装市场规模为472.2亿美元,预计2029年将达793.7亿美元,在预测期内(2024-2029年)复合年增长率为10.95%。

半导体封装-市场-IMG1

先进封装可以透过将多个晶片整合到一个封装中来提高效能。使用穿透硅通孔、内插器、桥樑和简单电线等因素连接这些晶片可以提高讯号速度并减少驱动这些讯号所需的能量。此外,先进的封装允许混合在不同製程节点开发的组件。

主要亮点

  • 先进封装 (AP) 产业目前正处于重大发展的令人兴奋的时刻。随着摩尔定律的放缓以及 2nm 节点以下元件的进步吸引了台积电、英特尔和三星等行业领导者的大量研发投资,先进封装已成为提高产品价值的宝贵工具。
  • 开发电子硬体需要获得高效能、高速、高频宽、低延迟和低功耗的运算能力。此外,硬体必须能够提供广泛的功能、在系统级整合并且具有成本效益。先进封装技术非常适合满足这些多样化的效能需求和复杂的异质整合要求,使企业有机会利用高效能运算、人工智慧和 5G 不断变化的需求。
  • 由于对高效能运算、物联网和 5G 设备的需求增加,主要半导体封装供应商的销售成长强劲。例如,Amkor 的计算部门(包括资料中心、基础设施、PC/笔记型电脑和储存)占总销售额的 20%,高于 2022 年季度的 18%。世界各国政府实施鼓励排放和永续交通的政策,正加速向车辆电动的转变。
  • 设计、开发和安装半导体封装设备以满足各种行业的要求,包括汽车、消费性电子、医疗、IT/通讯和航太/国防,需要大量的初始投资。这可能会限制半导体封装市场的成长。
  • COVID-19大流行迫使製造业重新评估传统生产流程,主要推动跨生产线的数位转型和智慧製造实践。根据半导体产业协会预测,2023年全球半导体销售额预计将达到5,151亿美元。半导体是电子设备的重要零件,产业竞争激烈。 2023年年与前一年同期比较率为10.3%,但预计2024年将快速復苏。着名的半导体晶片製造商包括英特尔和三星电子,2022年英特尔的半导体收益为584亿美元,三星为656亿美元,是半导体产业收益最大的公司之一。

半导体封装市场趋势

超高密度扇出先进封装领域占主要市场占有率

  • 超高密度扇出 (UHD FO) 每平方毫米有超过 18 个输入/输出 (I/O),线路重布(RDL) 中的线距 (L/S) 尺寸为 5 m2,即 5 m。它可以被认为是高密度 (HD) FO 的升级版本,L/S 适用于网路和资料中心伺服器等 HPC 应用的更广泛的封装尺寸。
  • 与 2.5D硅穿孔电极(TSV) 中介层封装相比,这些 UHD FO 是一种经济高效的解决方案,并且有利于低端/中端 2.5D 应用,例如 HPC 和伺服器网路。超高密度扇出封装提供高密度互连、卓越的电气性能以及将多个不同晶粒整合到经济高效的薄型半导体封装中的能力。未来,UHD FO 将透过创新的 FO-on- 基板和 FO 整合桥接解决方案取代 Si 中介层。
  • 随着互联网的发展和人工智慧产业的兴起,高性能半导体积体电路已成为半导体产业的必备品。具有超密集 I/O 的 2.5D IC 封装是最早应用于 GPU 等高效能运算 (HPC) 的结构之一。
  • 超高密度 FOWLP 可实现更小的二维连接,从而在更大的区域上重新分配晶粒的功率,从而在现代设备中实现高 I/O 密度、高频宽和高性能。
  • 半导体 IC 的品质是自动驾驶和安全监控等关键任务、低延迟 5G 服务成功的基本要素。根据GSMA预测,5G全球市场普及预计将从2022年的13%增加到2030年的64%。随着美国、中国、印度、英国和加拿大等国家 5G 使用量的增加,我们预计使用 5G 连线的行动用户将大幅增加。预计这将增加对 IC 超高密度扇出实施的需求。
半导体封装-市场-IMG2

亚太地区预计将出现显着成长

  • 中国有一个非常雄心勃勃的半导体议程,并有 1500 亿美元的巨额资金支持。该国正在发展国内积体电路产业,以增加晶片产量。由香港、中国和台湾组成的大中华区是一个地缘政治热点。美国之间持续的贸易战进一步加剧了该地区的紧张局势,该地区是所有主要工艺技术的所在地,促使多家中国公司投资半导体产业。
  • 例如,2023年9月,中国宣布计划推出一个新的国有投资基金,为半导体产业筹集约400亿美元。 2022年12月,中国宣布承诺提供超过1兆元(1,430亿美元)支持半导体产业。该倡议是实现晶片生产自给自足的重要一步,也是对美国旨在阻碍中国技术进步的行动的回应。预计在预测期内,对包装服务的需求将大幅增加。
  • 日本在半导体和电子产业也占有重要地位,因为它是主要积体电路晶片组製造商的所在地。根据WSTS预测,2022年日本半导体产业销售额将成长14.2%,并有望在未来几年进一步成长。日本封装需求不断增长的一个关键原因是日本在半导体和整合晶片业务方面的显着进步。日本正在透过向市场主要参与者提供大量资金和财务支援来快速重振其晶片製造基地,以确保汽车製造商和 IT 公司不会耗尽必要的零件。
  • 例如,2023年2月,台积电宣布计画斥资70亿美元在九州建造一座晶片工厂,并计画于2024年开始生产12奈米和16奈米晶片。为了支持这项投资,日本政府提供了4,760亿日圆的补贴,相当于工厂建设成本的一半左右。此外,Rapidus也宣布将与IBM合作开发生产尖端2奈米晶片,目标是在2025年推出原型生产线。
  • 台湾半导体产业依赖外包半导体组装和测试(OSAT)的公司。日月光科技控股是致力于传统和先进封装及先进测试的行业领导者。除了代工服务外,台湾在半导体价值链的晶片封装和无晶圆厂领域也取得了重大进展。根据SEMI 2022年6月发布的最新季度全球晶圆厂预测,预计2022年台湾半导体製造设备支出将领先全球,成长52%至340亿美元。这些令人印象深刻的功能将推动对包装服务的需求,并鼓励供应商增强其产品。

半导体封装产业概况

半导体封装市场正朝向半固体发展,主要企业包括日月光科技控股公司、Amkor Technology Inc.、英特尔公司、台湾半导体製造有限公司和长电科技集团。市场参与企业正在采取联盟和收购等策略来增强其产品供应并获得永续的竞争优势。

  • 2023 年 10 月 - 日月光科技控股公司宣布推出整合设计生态系统,以提高晶片封装设计的效率,将週期时间缩短一半。整合设计生态系统 (IDE) 是一个经过最佳化的协同设计工具集,可係统地增强整个 VIPackTM 平台的先进封装架构。
  • 2023 年 8 月 - Amkor Technology Inc. 宣布扩大先进封装产能。 2.5D封装的月产量预计将从2023年初的3,000片晶圆增加到2024年上半年的5,000片晶圆。

其他福利:

  • Excel 格式的市场预测 (ME) 表
  • 3 个月分析师支持

目录

第一章简介

  • 研究假设和市场定义
  • 调查范围

第二章调查方法

第三章执行摘要

第四章市场洞察

  • 市场概况
  • 产业吸引力-波特五力分析
    • 供应商的议价能力
    • 买方议价能力
    • 新进入者的威胁
    • 替代品的威胁
    • 竞争公司之间的敌对关係
  • 产业价值链分析
  • 评估 COVID-19 和宏观经济因素对市场的影响

第五章市场动态

  • 市场驱动因素
    • 各行业半导体元件消费扩大
    • 政府政策及新兴国家政策利多
  • 市场抑制因素
    • 半导体IC设计初始投资高且复杂

第六章市场区隔

  • 按封装平台
    • 先进封装
      • 倒装晶片
      • SIP
      • 2.5D/3D
      • 嵌入式晶粒
      • 扇入式晶圆级封装 (FI-WLP)
      • 扇出晶圆级封装 (FO-WLP)
    • 传统包装
  • 按最终用户产业
    • 消费性电子产品
    • 航太/国防
    • 医疗设备
    • 通讯/电讯
    • 汽车产业
    • 能源/照明
  • 按地区
    • 北美洲
    • 欧洲
    • 亚太地区

第七章竞争形势

  • 公司简介
    • ASE Group
    • Amkor Technology
    • JCET/STATS ChipPAC
    • Siliconware Precision Industries Co. Ltd(SPIL)
    • Powertech Technology Inc.
    • Tianshui Huatian Technology Co. Ltd
    • Fujitsu Semiconductor Ltd
    • UTAC Group
    • Chipmos Technologies Inc.
    • Chipbond Technology Corporation
    • Intel Corporation
    • Samsung Electronics Co. Ltd
    • Unisem(M)Berhad
    • Interconnect Systems Inc.(ISI)

第八章投资分析

第9章市场的未来

简介目录
Product Code: 49165
Semiconductor Packaging - Market - IMG1

The Semiconductor Packaging Market size is estimated at USD 47.22 billion in 2024, and is expected to reach USD 79.37 billion by 2029, growing at a CAGR of 10.95% during the forecast period (2024-2029).

Advanced packaging can help achieve performance gains by integrating multiple chips in a package. By connecting these chips using fatter, such as through-silicon vias, interposers, bridges, or simple wires, the speed of signals can be increased, and the amount of energy required to drive those signals can be reduced. Additionally, advanced packaging allows for mixing components developed at different process nodes.

Key Highlights

  • The advanced packaging (AP) industry is currently going through a fascinating phase of significant progress. As Moore's Law slows down and the advancement of devices under 2nm nodes gains significant research and development investments from industry leaders such as TSMC, Intel, and Samsung, advanced packaging has become a valuable tool for enhancing product value.
  • The development of electronic hardware necessitates the utilization of computing power that is capable of delivering high performance, high speed, and high bandwidth, as well as low latency and power consumption. Additionally, the hardware must be able to provide a wide range of functionalities, as well as be able to integrate at the system level, and must be cost-effective. Advance packaging technologies are ideally suited to meet these diverse performance demands and the intricate heterogeneous integration requirements, thus providing businesses with the opportunity to capitalize on the changing demands of high-performance computing, artificial intelligence, and 5G.
  • Major semiconductor packaging vendors are experiencing significant growth in sales owing to increasing demand for high-performance computing, IoT, and 5G devices. For instance, Amkor's computing segment, which includes data center, infrastructure, PC/laptop, and storage, registered a 20% share in the total revenue, up from 18% in Q2 2022. The shift toward vehicle electrification is being accelerated by the implementation of policies by governments around the world to reduce emissions and encourage sustainable transportation.
  • A significantly high initial investment is required in the designing, developing, and setting up of semiconductor packaging units as per the requirements of different industries such as automotive, consumer electronics, healthcare, IT & telecommunication, and aerospace and defense. This can restrict the growth of the semiconductor packaging market.
  • The COVID-19 pandemic forced manufacturing industries to re-evaluate their traditional production processes, primarily driving digital transformation and smart manufacturing practices across the production lines. According to the Semiconductor Industry Association, in 2023, semiconductor sales were expected to reach USD 515.1 billion worldwide. Semiconductors are crucial components of electronic devices, and the industry is highly competitive. The year-on-year decline rate in 2023 was 10.3%, although a swift recovery is expected in 2024. Notable semiconductor chip makers include Intel and Samsung Electronics, with Intel generating USD 58.4 billion and Samsung generating USD 65.6 billion in semiconductor revenue in 2022, placing them among the largest companies in terms of semiconductor industry revenues.

Semiconductor Packaging Market Trends

Ultra High-density Fan-Out Advanced Packaging Segment to Hold Significant Market Share

  • The ultra-high-density fan-out (UHD FO) has more than 18 inputs and outputs (I/O) per square millimeter and line and spacing (L/S) measurements in the redistribution layer (RDL) of 5µm and 5µm. It can be considered an upgraded version of High Density (HD) FO where the L/S suits a more extensive package size for HPC applications like networking and data center servers.
  • These UHD FO are beneficial for low/mid-end 2.5D applications with cost-effective solutions such as HPC or server networks compared to 2.5D silicon Through Silicon Via (TSV) interposer packaging. The ultra-high-density fan-out packaging offers dense interconnection, better electrical performance, and the ability to integrate multiple heterogeneous dies in a cost-effective, low-profile semiconductor package. UHD FO will replace Si Interposers in the future through innovative FO-on-substrate and FO-embedded bridge solutions.
  • With the development of the internet and the rise of the artificial intelligence industry, high-performance semiconductor integrated circuits have become critical in the semiconductor industry. The 2.5D IC package with ultra-high-density I/O is one of the first structures applied to high-performance computing (HPC) like GPU.
  • Ultra-high-density FOWLP enables manufacturers to make smaller two-dimensional connections that redistribute the output of the silicon die to a greater area, enabling higher I/O density, higher bandwidth, and higher performance for modern devices.
  • A semiconductor IC quality is a fundamental component contributing to the success of mission-critical, low-latency 5G services such as autonomous driving and security monitoring. According to GSMA, 5G is forecasted to increase from a global market penetration of 13 percent in 2022 to 64 percent in 2030. The increasing number of 5G applications across countries like the United States, China, India, the United Kingdom, Canada, etc., is expected to significantly increase the number of mobile subscribers that use 5G connectivity. This is expected to increase the demand for ultra-high-density fan-out packaging for ICs.
Semiconductor Packaging - Market - IMG2

Asia-Pacific Expected to Witness Major Growth

  • China has a highly ambitious semiconductor agenda, supported by a substantial funding of USD 150 billion. The nation is developing its domestic IC industry to increase its chip production. The Greater China region, comprising Hong Kong, China, and Taiwan, is a significant geopolitical hotspot. The ongoing US-China trade war has further intensified tensions in this area, which houses all the leading process technology, prompting several Chinese firms to invest in their semiconductor industry.
  • For instance, in September 2023, China announced its plans to launch a new state-backed investment fund to raise about USD 40 billion for its semiconductor sector. In December 2022, China announced its commitment to a support package exceeding YUAN 1 trillion (USD 143 billion) for its semiconductor industry. This initiative is a crucial step towards achieving self-sufficiency in chip production and is a response to U.S. actions aimed at hindering China's technological progress. The demand for packaging services is anticipated to rise considerably over the forecasted period, owing to the country's intensified efforts to enhance domestic chip manufacturing.
  • Japan also holds a significant position in the semiconductor and electronics industries as it is home to some of the essential integrated circuits chipset manufacturers. According to WSTS, the semiconductor industry revenue in Japan grew by 14.2% in 2022, and it is expected to grow further over the coming years. The nation's packaging demand is expanding primarily due to the country's significant advancements in the semiconductor and integrated chip businesses. Japan is quickly reviving its chip manufacturing base to ensure that its automakers and IT firms do not run out of essential components by providing significant funding and financial support to major players active in the market.
  • For instance, in February 2023, Taiwan Semiconductor Manufacturing Co (TSMC) announced a plan to build a USD 7 billion chip plant on Kyushu island, with 12 and 16-nanometre chips slated to begin in 2024. To support this investment, the Japanese government has offered a JPY 476 billion subsidy, or about half the expected cost of the factory. Further, Rapidus announced entering a tie-up with IBM for developing and producing cutting-edge 2nm chips, aiming to launch a prototype line in 2025.
  • Taiwan's semiconductor industry depends on companies outsourcing semiconductor assembly and testing (OSAT). ASE Technology Holding is the industry leader with its efforts in traditional and sophisticated packaging and advanced testing. Taiwan has made significant strides in the chip packaging and fabless segments of the semiconductor value chain, in addition to its foundry services. According to the latest quarterly World Fab Forecast by SEMI, published in June 2022, Taiwan is expected to lead the world in semiconductor manufacturing equipment expenditure in 2022, with a 52% increase to USD 34 billion. These impressive capabilities are expected to drive demand for packaging services, prompting vendors to enhance their offerings.

Semiconductor Packaging Industry Overview

The Semiconductor Packaging Market is semi-consolidated with the presence of major players like ASE Technology Holding Co., Ltd, Amkor Technology Inc., Intel Corporation, Taiwan, Semiconductor Manufacturing Company Limited, and JCET Group Co. Ltd. Players in the market are adopting strategies such as partnerships and acquisitions to enhance their product offerings and gain sustainable competitive advantage.

  • October 2023 - ASE Technology Holding Co., Ltd announced to launch of its Integrated Design Ecosystem to enable silicon package design efficiencies that reduce cycle time by half. Integrated Design Ecosystem (IDE) is a collaborative design toolset optimized to boost advanced package architecture across its VIPackTM platform systematically.
  • August 2023 - Amkor Technology Inc. announced the expansion of its advanced packaging production capacity. Monthly production of 2.5D packaging is expected to increase from 3,000 wafers in early 2023 and reach 5,000 wafers in the first half of 2024.

Additional Benefits:

  • The market estimate (ME) sheet in Excel format
  • 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

  • 1.1 Study Assumptions and Market Definition
  • 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET INSIGHTS

  • 4.1 Market Overview
  • 4.2 Industry Attractiveness - Porter's Five Forces Analysis
    • 4.2.1 Bargaining Power of Suppliers
    • 4.2.2 Bargaining Power of Buyers
    • 4.2.3 Threat of New Entrants
    • 4.2.4 Threat of Substitutes
    • 4.2.5 Intensity of Competitive Rivalry
  • 4.3 Industry Value Chain Analysis
  • 4.4 Assessment of the Impact of COVID-19 and Macroeconomic Factors on the Market

5 MARKET DYNAMICS

  • 5.1 Market Drivers
    • 5.1.1 Growing Consumption of Semiconductor Devices Across Industries
    • 5.1.2 Favorable Government Policies and Regulations in Developing Countries
  • 5.2 Market Restraints
    • 5.2.1 High Initial Investment and Increasing Complexity of Semiconductor IC Designs

6 MARKET SEGMENTATION

  • 6.1 By Packaging Platform
    • 6.1.1 Advanced Packaging
      • 6.1.1.1 Flip Chip
      • 6.1.1.2 SIP
      • 6.1.1.3 2.5D/3D
      • 6.1.1.4 Embedded Die
      • 6.1.1.5 Fan-in Wafer Level Packaging (FI-WLP)
      • 6.1.1.6 Fan-out Wafer Level Packaging (FO-WLP)
    • 6.1.2 Traditional Packaging
  • 6.2 By End-user Industry
    • 6.2.1 Consumer Electronics
    • 6.2.2 Aerospace and Defense
    • 6.2.3 Medical Devices
    • 6.2.4 Communications and Telecom
    • 6.2.5 Automotive Industry
    • 6.2.6 Energy and Lighting
  • 6.3 By Geography
    • 6.3.1 North America
    • 6.3.2 Europe
    • 6.3.3 Asia Pacific

7 COMPETITIVE LANDSCAPE

  • 7.1 Company Profiles
    • 7.1.1 ASE Group
    • 7.1.2 Amkor Technology
    • 7.1.3 JCET/STATS ChipPAC
    • 7.1.4 Siliconware Precision Industries Co. Ltd (SPIL)
    • 7.1.5 Powertech Technology Inc.
    • 7.1.6 Tianshui Huatian Technology Co. Ltd
    • 7.1.7 Fujitsu Semiconductor Ltd
    • 7.1.8 UTAC Group
    • 7.1.9 Chipmos Technologies Inc.
    • 7.1.10 Chipbond Technology Corporation
    • 7.1.11 Intel Corporation
    • 7.1.12 Samsung Electronics Co. Ltd
    • 7.1.13 Unisem (M) Berhad
    • 7.1.14 Interconnect Systems Inc. (ISI)

8 INVESTMENT ANALYSIS

9 FUTURE OF THE MARKET