到 2028 年的半导体键合市场预测和全球分析——按类型（芯片键合机、晶圆键合机、倒装芯片键合机）、技术（RF 设备、MEMS 和传感器、LED、CMOS 图像传感器、3D NAND）
Semiconductor Bonding Market Forecast to 2028 - COVID-19 Impact and Global Analysis - by Type (Die Bonder, Wafer Bonder, and Flip Chip Bonder) and Technology (RF Devices, MEMS and Sensors, LED, CMOS Image Sensors, and 3D NAND)
内存、图形处理单元、5G 芯片组等在超大手机、PC、平板电脑、5G 服务等中的使用推动了半导体行业的增长。然而，在 2020 年，由于 COVID-19 大流行的爆发，工业和汽车电子行业的半导体需求下降。根据半导体行业协会 (SIA) 的数据，全球半导体销售额从 2000 年的 2044 亿美元增加到 2020 年的 4404 亿美元，在过去 20 年中几乎翻了一番。市场增长受到存储芯片和其他芯片价格下跌、智能手机、服务器和个人电脑需求下降以及中美贸易摩擦等因素的阻碍。此外，出于国家安全考虑，美国对中国公司实施了一些限制。例如，美国对中国公司Huawei的製裁是该公司半导体业务的直接结果。据 SIA 称，因此，中国在半导体行业的份额已从 2020 年的 6.7% 下降到 2021 年的 6.5%。
一些半导体结厂商正在采用各种有机和无机战略来获得竞争优势。例如，2021 年 4 月，ASM Pacific Technology 宣布了三个新的製造系统，可通过 X-Celeprint 的微转移印刷和 ASM AMICRA 的精密贴片技术实现超薄芯片的大规模异构集成。。
北美半导体公司在满足消费者需求的同时应对不断增加的成本、交货时间和供应短缺。据美国商务部统计，美国占全球半导体生产市场份额的50%。由于 COVID-19 的出现，北美对关键半导体元器件的需求大幅下降。例如，2020 年全球半导体行业与 2019 年相比面临 5-15% 的下滑。COVID-19 大流行也对美国半导体公司产生了负面影响。在大流行来袭之前，美国半导体行业也严重依赖从中国外包原材料和劳动力。此外，墨西哥将看到电信和汽车行业的增长，预计这将为半导体键合市场的参与者提供有利可图的机会。中国的边境关闭导致工厂关闭和生产限制，运输成本增加和产能互补限制。结果，国内产量增加，推高了整体成本，同时让美国控制了整个供应链。此外，2020 年 8 月，美国政府禁止向中国跨国公司华为出售半导体芯片。这些努力有望振兴美国半导体产业，扩大半导体键合市场规模。
北美地区分为美国、加拿大和墨西哥。美国将在 2021 年拥有最大的半导体键合市场份额，加拿大预计将以最高的复合年增长率增长。政府当局采取了许多举措来促进半导体行业，导致对该行业的投资越来越多。北美对 3D 半导体组装和封装解决方案有着巨大的需求。越来越多的公司正在引入物联网和人工智能等先进技术，主要集中在汽车领域。Robert Bosch GmbH、Allegro MicroSystems, Inc、Texas Instruments Incorporated、Qualcomm Technologies, Inc、InvenSense 和 Honeywell International Inc. 是半导体键合市场的主要参与者。该地区对 MEMS 和传感器不断增长的需求为参与製造芯片键合机、晶圆键合机和倒装芯片键合机的市场领导者提供了许多机会。
半导体结用于消费电子、汽车、医疗设备和其他各种应用，对它们的需求正在显着增加，推动了美国半导体结市场的增长。此外，美国汽车的高销量影响了对该国 2021 年整体半导体键合市场的分析。主要汽车製造商宣布对电动汽车和自动驾驶汽车投资数十亿美元。GM宣布到 2025 年将投资 350 亿美元。2022年9月，美国政府宣布投资500亿美元建立美国半导体产业，旨在通过这一投资计划降低中国对半导体的依赖。此外，2022 年 8 月，亚利桑那州政府访问了台湾，重点关注用于日常电子产品的半导体。因此，增加政府对半导体行业的投资将推动对半导体键合的需求。
由于加拿大人口增长，从单户住宅到高层公寓的住房需求将会增加。因此，对消费电子产品的需求将推动该国对半导体的需求。此外，智能手机、平板设备、电视和个人电脑正变得越来越流行。加拿大对消费电子产品不断增长的需求正在推动半导体键合市场的增长。加拿大还为半导体芯片製造商提供 15 项自由贸易协定，拥有 15 亿消费者和 49.3 万亿美元的国内生产总值。此外，该国还是TSMC、Samsung Electronics、AMD、Qualcomm, Intel等各种半导体公司的所在地。因此，加拿大政府对智能电子产品日益增长的需求和举措正在推动该国半导体键合市场的增长。
Palomar Technologies、Panasonic Corporation、Toray Industries, Inc.、Kulicke & Soffa Industries, Inc、HUTEM、DIAS Automation (HK) Ltd、ASMPT Ltd（原 ASM Pacific Technology Ltd）、EV Group、Yamaha Robotics Holdings、WestBond, Inc. 是一些在半导体粘合剂市场经营的知名公司。
The semiconductor bonding market size is expected to reach US$ 1,076.82 million by 2028; it is estimated to grow at a CAGR of 8.2% from 2022 to 2028.
The semiconductor industry's growth is attributed to the use of memories, graphics processing units, and 5G chipsets in hyperscale mobile phones, PCs, tablets, and 5G services. However, in 2020, the industrial & automotive electronics industries experienced a decline in the demand for semiconductors due to the onset of the COVID-19 pandemic. According to the Semiconductor Industry Association (SIA), the global sales of semiconductors increased from US$ 204.4 billion in 2000 to US$ 440.4 billion in 2020, which approximately doubled in the last two decades. Low prices of various chip types, such as memory chips; decreasing demand for smartphones, servers, and PCs; and a trade dispute between the US and China are hampering the market growth. Moreover, the US has imposed several restrictions on Chinese businesses because of national security concerns. For instance, the direct result of US sanctions against Huawei, the Chinese company, has adversely affected the company's semiconductor business. As a result, China's share of the semiconductor industry dropped from 6.7% in 2020 to 6.5% in 2021, according to SIA.
Several semiconductor bonding players are adopting various organic and inorganic strategies to gain a competitive advantage. For instance, in April 2021, ASM Pacific Technology introduced three new manufacturing systems with X-Celeprint's Micro Transfer Printing and ASM AMICRA's high precision die bonding technology to allow high volume heterogeneous integration of ultra-thin dies.
Impact of COVID-19 Pandemic on North America Semiconductor Bonding Market Growth
Semiconductor companies in North America are adapting to increased costs, lead time, and a shortage of supplies while catering to consumer demand. According to the United States Department of Commerce, the US constitutes ~50% of the global market share of semiconductor production. The demand for major semiconductor components in North America witnessed a significant decline due to the emergence of the COVID-19 pandemic. For example, in 2020, the global semiconductor industry faced a decline of 5-15% compared to 2019. The COVID-19 pandemic has had a negative impact on semiconductor companies in the US. In addition, the US semiconductor industry relied heavily on outsourcing raw materials and labor from China before the onset of the pandemic. Further, In Mexico, growth is observed in telecom & automotive sectors which is also expected to offer lucrative opportunities for semiconductor bonding market players. The shutdown of China's border led to the shutdown of factories or limited production, an increase in shipping costs, and supplementary capacity constraints. As a result, domestic production increased, which increased overall costs while allowing the US to control the entire supply chain. Further, in August 2020, the US government banned the sale of semiconductor chips to Huawei, the Chinese multinational corporation. These initiatives are expected to boost the US semiconductor industry, which, in turn, is expected to boost the semiconductor bonding market size.
The North America region is segmented into the US, Canada, and Mexico. The US held the largest semiconductor bonding market share in 2021, whereas Canada is projected to grow at the highest CAGR. Government authorities have taken many initiatives to promote the semiconductor industry, which has increased the number of investments in the industry. North America has a huge demand for 3D semiconductor assembly and packaging solutions. An increasing number of companies, majorly in the automotive sector, are adopting advanced technologies such as IoT and artificial intelligence. Robert Bosch GmbH; Allegro MicroSystems, Inc.; Texas Instruments Incorporated; Qualcomm Technologies, Inc.; InvenSense; and Honeywell International Inc. are a few of the prominent semiconductor bonding market players. The rising demand for MEMS and sensors in the region has provided many opportunities for market leaders engaged in the manufacturing of die bonders, wafer bonders, and flip-chip bonders.
Semiconductor bonding is used in manufacturing consumer electronic devices, automotive, medical devices, and various other applications, which is significantly increasing its demand, thereby driving the semiconductor bonding market growth in the US. Further, high automotive sales in the US impacted the country's overall semiconductor bonding market analysis in 2021. Major automakers announced multibillion-dollar investments in EVs and AVs. GM announced an investment of US$ 35 billion by 2025. In addition, in September 2022, the US government announced that they would be investing US$ 50 billion in the establishment of the US semiconductor industry; they are also aiming to lower the dependency on China for semiconductors through this investment plan. Moreover, in August 2022, the Arizona government visited Taiwan, focusing on semiconductors for everyday electronic devices. Thus, the growing government investment in the semiconductor industry will fuel the demand for semiconductor bonding.
A rise in the population in Canada will increase the demand for housing units, from single-family homes to high-rise condominiums. As a result, the demand for household electronic goods is fueling the need for semiconductors in the country. In addition, The use of smartphones, tablets, television, personal computers, and other devices is increasing tremendously. The rising demand for consumer electronic devices in Canada is boosting the semiconductor bonding market growth. Also, the country has provided semiconductor chip manufacturers access to 15 free trade agreements with 51 countries with ~1.5 billion consumers and a combined GDP of US$ 49.3 trillion. Furthermore, the country is home to various semiconductor companies such as TSMC, Samsung Electronics, AMD, Qualcomm, and Intel. Thus, the rising demand for smart electronic devices and the initiative by the Canadian government are propelling the growth of the semiconductor bonding market in the country.
Palomar Technologies; Panasonic Corporation; Toray Industries Inc; Kulicke & Soffa Industries, Inc.; HUTEM; DIAS Automation (HK) Ltd; ASMPT Ltd (formerly ASM Pacific Technology Ltd.); EV Group; Yamaha Motor Corporation (Yamaha Robotics Holdings); and WestBond, Inc. are a few of the prominent players operating in the semiconductor bonding market.
The overall semiconductor bonding market has been derived using both primary and secondary sources. To begin the semiconductor bonding market analysis, exhaustive secondary research has been conducted using internal and external sources to obtain qualitative and quantitative information related to the semiconductor bonding market. The process also serves the purpose of obtaining an overview and market forecast of the market growth with respect to all market segments. Also, multiple primary interviews with industry participants and commentators have been conducted to validate the data and gain more analytical insights about the topic. Participants of this process include industry experts such as VPs, business development managers, market intelligence managers, national sales managers, and external consultants-such as valuation experts, research analysts, and key opinion leaders-specializing in the semiconductor bonding market.
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The key findings and recommendations highlight crucial progressive industry trends in the semiconductor bonding market thereby allowing players across the value chain to develop effective long-term strategies
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Scrutinize in-depth global market trends and outlook coupled with the factors driving the market, as well as those hindering it
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