设备到云端:物联网设备管理安全
市场调查报告书
商品编码
1423914

设备到云端:物联网设备管理安全

Device to Cloud: Security for IoT Device Management

出版日期: | 出版商: ABI Research | 英文 27 Pages | 商品交期: 最快1-2个工作天内

价格
简介目录

本报告调查了物联网和云端生态系统的安全趋势,包括市场背景、市场影响因素和趋势、安全技术及其在硬体、软体、网路和云端中的整合、物联网连接数量及相关内容。它总结了物联网和云生态系统的规模和规模。技术市场预测、主要厂商概况等。

实际好处

  • 确定物联网和云端生态系统的主要趋势和组成部分,以进行市场推广和规划
  • 您可以在三个核心领域制定安全策略:物联网设备安全、通讯网路安全和云端安全。
  • 深入了解物联网市场规模以及按支出类型和地区划分的相关技术收入

关键问题的答案:

  • 企业如何保护其 IoT 设备、网路以及与云端环境的连线?
  • 量子运算如何威胁目前的物联网网路安全策略?
  • 物联网网路安全解决方案的技术市场是什么?
  • 硬体安全模组 (HSM)、可信任平台模组 (TPM) 和可信任执行环境 (TEE) 在物联网网路安全中的作用和市场规模有哪些?
  • 物联网法规将如何影响物联网网路安全支出?

研究亮点:

  • 以网路安全技术形式划分的物联网连线数量和支出
  • 晶片到云端安全服务的环境和市场趋势,包括关键基础设施物联网和 OT 网路安全支出
  • 物联网到云端安全技术的外型:概述

目录

执行摘要

策略建议

简介/背景

物联网到云端安全技术:从安全连接到安全晶片

  • 设备到云端的通讯和安全协议
  • 硬体安全模组及其在物联网安全中的作用
  • 可信任平台模组在物联网网路安全中的重要性
  • 可信赖的执行环境
  • 物联网设备的实体功能不可复製
  • 安全元素

将安全性整合到物联网:硬体、软体、网路、云端

  • 超越 HSM 和 TPM 策略的硬体安全性
  • 安装正确的设备
  • 云端服务、资料管理、物联网网路安全
  • 网路安全

监理措施与物联网安全

市场影响因素及趋势

  • 亮点/趋势
  • 连线数量爆炸性成长,物联网安全市场不断扩大
  • 市场趋势:晶片到云端安全服务
  • 市场趋势:物联网与 OT 网路安全支出

供应商环境与概况

  • Arm
  • Data I/O Corporation
  • DigiCert
  • Enea
  • Infineon
  • Nordic Semiconductor
  • NXP
  • Palo Alto Networks
  • STMicroelectronics vGlobalLogic
  • Ayla Networks
  • WithSecure
简介目录
Product Code: AN-5589

Actionable Benefits:

  • Identify key trends and components in the Internet of Things (IoT) and cloud ecosystem, enabling market outreach and planning.
  • Devising security strategy in three core areas: the security of the IoT device, the security of the communication network, and the security of the cloud.
  • Obtain a general understanding of IoT market size and related technology revenue by spending type and region.

Critical Questions Answered:

  • How can organizations secure their IoT devices, networks, and connections to the cloud environment?
  • How can quantum computing threaten current IoT cybersecurity strategies?
  • What are some of the technology markets for IoT cybersecurity solutions?
  • What is the role of Hardware Security Modules (HSMs), Trusted Platform Modules (TPMs), and Trusted Execution Environments (TEEs) in IoT cybersecurity, and what is their market size?
  • How does IoT regulation impact IoT cybersecurity spending?

Research Highlights:

  • IoT connection numbers and cybersecurity technology form factor spending.
  • Chip-to-cloud security services environment and market trends, including critical infrastructure IoT and Operational Technology (OT) cybersecurity spending.
  • Introduction to IoT-to-cloud security technology form factors.

Who Should Read This?

  • Vendors who want to grasp IoT-related security market growth and cloud technologies.
  • Sales and marketing strategists looking to understand future growth in IoT-related security technologies.
  • IoT cybersecurity customers deliberating which IoT security technology better fits their use case needs.

Table of Contents

Executive Summary

Strategic Recommendations

Introduction and Background

IoT-to-Cloud Security Technology: From Secure Connections to Secure Chips

  • Device-to-Cloud Communication and Security Protocols
  • Hardware Security Modules and Their Role in IoT Security
  • The Significance of Trusted Platform Modules in IoT Cybersecurity
  • Trusted Execution Environments
  • Physical Unclonable Functions for IoT Devices
  • Secure Elements

Security Integration in the IoT: Hardware, Software, Network, and Cloud

  • Hardware Security beyond HSM and TPM Strategies
  • Proper Device Onboarding
  • Cloud Services, Data Management, and IoT Cybersecurity
  • Network Security

Regulatory Measures and IoT Security

Market Forces and Trends

  • Highlights and Trends
  • An Explosion in Connections, Expanding the IoT Security Market
  • Market Trends: Chip-to-Cloud Security Services
  • Market Trends: IoT and OT Cybersecurity Spending

Vendor Environment & Profiles

  • Arm
  • Data I/O Corporation
  • DigiCert
  • Enea
  • Infineon
  • Nordic Semiconductor
  • NXP
  • Palo Alto Networks
  • STMicroelectronics
  • GlobalLogic
  • Ayla Networks
  • WithSecure