数位身分验证与嵌入式安全：物联网网路安全市场资料概述（2024 年第 2 季）

本报告提供数位身分验证与嵌入式安全的市场调查，彙整主要的硬体设备为基础的编入保全技术的出货数·收益的预测，硬体设备类型·尺寸规格·地区等各种区分的详细分析等资料。

实用的优点:

• 确定最适合嵌入式身分验证技术的物联网应用
• 您可以根据可用的安全功能确定适合您的特定嵌入式系统的最佳外形尺寸
• 优化物联网产品开发中的硬体安全策略

关键问题的答案：

• 哪些产业利用硬体为基础的安全性？
• OEM 喜欢哪种身份验证形式？
• 哪种硬体安全技术将引领嵌入式系统？

研究亮点：

• 三种主要基于硬体的嵌入式安全技术的市场预测：可信任平台模组 (TPM)、可信任执行环境 (TEE) 和安全微控制器单元 (MCU)
• 详细细分：按硬体类型和应用程式用例
• 五个地区每种规格和终端市场的出货量和收入预测

目录

主要发现 - 高成长市场和低成长市场

新功能 - 预测与先前版本相比的变化

研究方法-预测模型详解

重要预测 - 全球出货量、收入、平均售价、区域分布

Actionable Benefits:

• Identify the optimal Internet of Things (IoT) applications for your embedded authentication technologies.
• Determine the best form factor for your specific embedded systems based on available security features.
• Optimize hardware security strategies in your IoT product development.

Critical Questions Answered:

• Which industries are going to be leveraging hardware-based security?
• Which authentication form factors are Original Equipment Manufacturers (OEMs) going to be favoring?
• Which hardware security technologies are likely to lead for embedded systems?

Research Highlights:

• Market forecasts for three primary hardware-based embedded security technologies: Trusted Platform Module (TPM), Trusted Execution Environment (TEE), and secure Microcontroller Unit (MCU).
• A detailed breakdown by hardware-type and application use case.
• Shipment and revenue forecasts for each form factor and end market across the five regions.

Who Should Read This?

• Semiconductor and silicon IP companies.
• Embedded systems OEMs.
• IoT service providers.

TABLE OF CONTENTS

Key Findings—High and Low Growth Markets

What's New—Forecast Changes from Last Iteration

Methodology—A Detailed Description on Forecast Model

Significant Forecasts—Global Shipments & Revenue, Average Selling Prices, and Regional Distribution