消费性/物联网 eSIM 市场数据概览：2025 年第三季度

本报告深入分析了 eSIM 市场，包括对消费性设备和物联网应用中的设备和 IC 的预测、eSIM 在消费性/物联网应用中的普及率以及支援 RSP 的 eSIM 出货量。

关键问题解答

• 2024 年至 2030 年消费性/物联网市场 eSIM 总市场规模
• 消费市场区域区隔，考虑中国市场的普及率和消费性智慧型手机的发布情况，以及未来五年市场变化趋势
• IC 外型尺寸模式（独立式与三合一 eUICC、iUICC 渗透率）将如何演变？
• 目前设定檔下载量是多少？未来五年将如何成长？
• 消费者活化率将如何改变？物联网活化量在 GSMA 和 SGP 标准之间将如何分配？
• 主要 IC 供应商及其市场占有率

本产品建议与 "消费者与物联网市场的 eSIM" （MD-ESM-114）配合阅读。

目录

主要发现

最新资讯

研究方法

主要预测

按应用程式和装置类型划分的 eSIM 装置出货量

OEM 厂商在 eSIM 智慧型手机出货量的占有率

按地区划分的 eSIM 智慧型手机出货量

依应用程式划分的物联网 eSIM 出货量

依规范划分的 eSIM RSP 设定檔下载量

eSIM IC 供应商

Actionable Benefits:

• Track growth and identify the largest opportunities in the Embedded Subscriber Identity Module (eSIM) markets-across embedded Universal Integrated Circuit Card (eUICC) and integrated Universal Integrated Circuit Card (iUICC) form factors, consumer and Internet of Things (IoT) device types, and IoT applications (verticals).
• Revise and quantify expectations following the delayed commercial launch of SGP.32 and its impact on IoT applications.
• Understand regional complexities in the consumer market with smartphone Original Equipment Manufacturer (OEM) vendor breakdowns.

Critical Questions Answered:

• What is the total market size for eSIM in the consumer and IoT markets from 2024 to 2030?
• What is the regional breakdown of the consumer market, and how will this change over the coming 5 years, given the increasing penetration and consumer smartphone launch in China?
• How will the Integrated Circuit (IC) form factor (standalone versus 3-in-1 eUICC, iUICC penetration) landscape evolve?
• What is the current scale of profile downloads, and how will this progress in the coming 5 years?
• How will consumer activation rates change, and how will IoT activations split across GSMA SGP standards?
• Who are the leading IC suppliers, and what are their respective market shares?

Research Highlights:

• Device and IC forecasts across consumer devices and IoT applications with regional consumer splits across device types.
• eSIM penetration rates across consumer and IoT.
• Remote SIM Provisioning (RSP)-capable eSIM shipments by IoT application.
• Profile download forecasts across consumer and IoT, split by specification.
• eSIM smartphone shipments and penetration rates by region and vendor.
• eSIM IC vendor market shares.

Who Should Read This?

• Strategic and product design leads within smart card, secure IC, module, and device makers.
• Sales and marketing leads seeking to understand key trends and priorities.
• eSIM infrastructure players looking to quantify Total Addressable Market (TAM) size, identify key opportunities and prioritize technology support features.
• IoT strategists and module vendors identifying integration requirements and TAM.

TABLE OF CONTENTS

This product is meant to be read in conjunction with eSIM in the Consumer and IoT Markets MD-ESM-114

Key Findings

Whats New

Methodology

Significant Forecasts

eSIM Device Shipments by ApplicationDevice Type

eSIM Smartphone Shipments OEM Shares

eSIM Smartphone Shipments by Region

IoT eSIM Shipments by Application

eSIM RSP Profile Downloads by Specification

eSIM IC Vendors