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市场调查报告书
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1730694

汽车系统级封装 (SiP) 市场，按封装技术、封装方法、最终用途、国家和地区 - 行业分析、市场规模、市场份额及 2024 年至 2032 年预测

Automotive System in Package (SiP) Market, By Packaging Technology, By Packaging Method, By End Use, By Country, and By Region - Industry Analysis, Market Size, Market Share & Forecast from 2024-2032
出版日期: | 出版商: AnalystView Market Insights | 英文 284 Pages | 商品交期: 2-3个工作天内

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简介目录

报告重点

2023 年汽车系统级封装 (SiP) 市场规模价值为 21.0342 亿美元，2024 年至 2032 年的复合年增长率为 10.20%。

汽车系统级封装 (SiP) 市场- 市场动态

电动车和 ADAS 需求的不断增长以及连网汽车的兴起预计将推动市场需求

由于技术创新、电动车的普及以及消费者期望的转变，汽车系统封装 (SiP) 市场正在经历强劲成长。 SiP技术，将多个晶片和组件整合到单一封装中。随着全球向电动车 (EV) 的转变，对电池管理、马达控制和充电系统的紧凑、高效的电子系统的需求日益增长。汽车 SiP 有助于减少空间，同时确保高热性能和电气性能。例如，电池管理系统 (BMS) 从 SiP 中受益匪浅，因为它们需要即时监控多个电池单元的电压、电流和温度。 SiP 还提高了可靠性并降低了组装复杂性，这对于空间和重量非常宝贵的电动车来说至关重要。

高级驾驶辅助系统（ADAS）是汽车电子领域成长最快的领域之一。自适应巡航控制、车道维持辅助、自动紧急煞车和 360 度摄影系统等功能需要强大且紧凑的电子控制单元 (ECU)。汽车 SiP 非常适合此类系统，因为它们可以在小体积内整合感测器、处理单元、记忆体和电源管理组件。这使得高速资料处理和最小讯号干扰成为可能，这对于 ADAS 中的即时决策至关重要。现代汽车的连网程度日益提高，提供无线 (OTA) 更新、即时交通资讯、车对车 (V2V) 通讯和丰富的资讯娱乐体验等功能。这些功能需要整合无线通讯模组（Wi-Fi、蓝牙、5G）、微控制器和多媒体处理器。消费者对沉浸式车载体验和持续连接的需求不断增长，这是 SiP 应用的强大驱动力。汽车 SiP 以经济高效且紧凑的形式实现了这种集成，支援无缝资料通讯和多媒体处理，从而推动市场成长。

汽车系统级封装 (SiP) 市场 - 关键洞察

根据我们的研究分析师的分析，预测期内（2024-2032 年）全球市场预计年复合成长率约为 10.20%

根据封装技术细分，预计 2.5D IC 封装领域将在 2023 年占据最大市场份额，这得益于其封装生产能力。

根据封装方法细分，倒装晶片由于尺寸减小且功能更多，成为 2023 年领先的封装方法。

根据最终用途细分，由于 ADAS 系统对半导体晶片和 IC 的需求增加，ADAS 领域成为 2023 年的主要最终用途。

从地区来看，由于高通、英特尔、Powertech 等顶级公司的存在，北美是 2023 年的主要收入来源。

汽车系统级封装（SiP）市场-細項分析：

全球汽车系统封装 (SiP) 市场根据封装技术、封装方法、最终用途和地区进行细分。

根据封装技术，市场分为三类：2D IC 封装、2.5D IC 封装和 3D IC 封装。 2.5D IC封装领域占据市场主导地位。高生产需求和便捷包装预计将推动该领域的成长。

根据封装方法，市场分为三类：引线键结、倒装晶片和扇出晶圆级封装。倒装晶片领域占据市场主导地位。预计扇出型晶圆级封装在预测期内将以最快的速度扩张。紧凑型包装（尤其是小型解决方案）的高需求正在补充细分市场的需求。

根据最终用途，市场分为三类：资讯娱乐和远端资讯处理模组、ADAS 和其他。 ADAS 领域在市场中占据主导地位，预计在预测期内仍将保持其较高的主导地位。预计电动车需求的不断增长以及具有安全意识的 ADAS 系统的趋势将促进市场成长。

汽车系统级封装 (SiP) 市场- 地理洞察

在全球范围内，汽车系统封装 (SiP) 市场广泛分布于北美、拉丁美洲、欧洲、亚太地区以及中东和非洲地区。亚太地区是汽车 SiP 规模最大且成长最快的市场。中国引领全球电动车的生产和普及，全球超过 50% 的电动车在中国销售。日本和韩国拥有瑞萨、东芝、三星、SK海力士等主要半导体巨头，以及日月光集团等封装领军企业。根据美国汽车资料，美国占全球ADAS部署的25-30％左右，严重依赖小型化SiP解决方案。此外，预计到 2030 年电动车 (EV) 将占全球汽车销量的 40% 左右，这将极大地推动对先进 SiP 的需求。

汽车系统级封装 (SiP) 市场-竞争格局：

汽车 SiP 市场竞争激烈且发展迅速。半导体和汽车电子领域的主要参与者正在大力投资加强其产品组合，以创新 3D 封装技术。例如，Amkor Technology Inc. 在葡萄牙和越南开设了专门用于汽车半导体封装的新工厂，并与顶级OEM半导体供应商合作进行异构 SiP 开发。市场参与者正在开发整合 MEMS 感测器和控制器的 SiP 解决方案，用于轮胎压力监测系统 (TPMS) 和 ADAS。该公司还专注于扩展 SiP 功能，专门针对具有更好散热性的高可靠性汽车封装。

最新动态：

2024 年，英飞凌科技推出了 AURIX SiP 微控制器，主要针对自动驾驶等安全关键型应用。

2024年，恩智浦半导体宣布大力投资S32汽车平台，结合SiP概念实现跨车辆领域的可扩展性，这是其关键策略的一部分。

目录

第一章：汽车系统级封装 (SiP) 市场概览

  • 研究范围
  • 市场估计年限

第二章：执行摘要

  • 市场片段
    • 汽车系统级封装 (SiP) 市场片段（依封装技术）
    • 汽车系统级封装 (SiP) 市场片段（按封装方法）
    • 汽车系统级封装 (SiP) 市场片段（依最终用途）
    • 汽车系统级封装 (SiP) 市场（按国家/地区划分）
    • 汽车系统级封装 (SiP) 市场区域分布
  • 竞争洞察

第三章：汽车系统级封装 (SiP) 主要市场趋势

  • 汽车系统级封装 (SiP) 市场驱动因素
    • 市场驱动因素的影响分析
  • 汽车系统级封装 (SiP) 市场限制
    • 市场限制的影响分析
  • 汽车系统级封装 (SiP) 市场机会
  • 汽车系统级封装（SiP）市场未来趋势

第四章：汽车系统级封装 (SiP) 产业研究

  • PEST分析
  • 波特五力分析
  • 成长前景图
  • 规范架构分析

第五章：汽车系统级封装 (SiP) 市场：COVID-19 影响分析

  • COVID-19 之前的影响分析
  • 新冠疫情后影响分析
    • 表现最佳的市场区隔
    • 边际成长细分市场
    • 最鬆散的细分市场
    • 边际损失部分

第六章：汽车系统级封装 (SiP) 市场格局

  • 2024年汽车系统级封装（SiP）市占率分析
  • 按主要製造商分類的细分数据
    • 成熟玩家分析
    • 新兴企业分析

第七章：汽车系统级封装 (SiP) 市场 - 依封装技术

  • 概述
    • 按封装技术分類的细分市场份额分析
    • 二维积体电路封装
    • 2.5D IC封装
    • 3D IC封装

第八章：汽车系统级封装 (SiP) 市场 - 依封装方法

  • 概述
    • 按包装方式分類的细分市场份额分析
    • 引线键合
    • 倒装晶片
    • 扇出型晶圆级封装

第九章：汽车系统级封装 (SiP) 市场 - 依最终用途

  • 概述
    • 按最终用途分類的细分市场份额分析
    • 资讯娱乐和远端资讯处理模组
    • 高级驾驶辅助系统
    • 其他的

第 10 章：汽车系统级封装 (SiP) 市场 - 按地区

  • 介绍
    • 按地区分類的细分市场占有率分析
  • 北美洲
    • 概述
    • 北美汽车系统级封装 (SiP) 主要製造商
    • 北美市场规模及预测（按国家/地区）
    • 北美市场规模及预测（依封装技术）
    • 北美市场规模及预测（以包装方式）
    • 北美市场规模和预测，按最终用途
    • 我们
    • 加拿大
  • 欧洲
    • 概述
    • 欧洲汽车系统级封装 (SiP) 主要製造商
    • 欧洲市场规模及预测（按国家/地区）
    • 欧洲市场规模及预测（依包装技术）
    • 欧洲市场规模及预测（以包装方式）
    • 欧洲市场规模和预测，按最终用途
    • 德国
    • 义大利
    • 英国
    • 法国
    • 俄罗斯
    • 荷兰
    • 瑞典
    • 波兰
    • 欧洲其他地区
  • 亚太地区 (APAC)
    • 概述
    • 亚太地区汽车系统级封装 (SiP) 主要製造商
    • 亚太市场规模及预测（按国家/地区）
    • 亚太市场规模及预测（依包装技术）
    • 亚太市场规模及预测（以包装方式）
    • 亚太市场规模及预测（依最终用途）
    • 印度
    • 中国
    • 日本
    • 韩国
    • 澳洲
    • 泰国
    • 印尼
    • 菲律宾
    • 亚太地区其他地区
  • 拉丁美洲
    • 概述
    • 拉丁美洲汽车系统级封装 (SiP) 主要製造商
    • 拉丁美洲市场规模及预测（按国家/地区）
    • 拉丁美洲市场规模及预测（按包装技术）
    • 拉丁美洲市场规模及预测（以包装方式）
    • 拉丁美洲市场规模和预测（按最终用途）
    • 巴西
    • 墨西哥
    • 阿根廷
    • 哥伦比亚
    • 拉丁美洲其他地区
  • 中东和非洲
    • 概述
    • 中东和非洲汽车系统封装 (SiP) 主要製造商
    • 中东和非洲市场规模及预测（按国家/地区）
    • 中东和非洲市场规模及预测（按包装技术）
    • 中东和非洲市场规模及预测（以包装方式）
    • 中东和非洲市场规模和预测（按最终用途）
    • 沙乌地阿拉伯
    • 阿拉伯聯合大公国
    • 以色列
    • 土耳其
    • 阿尔及利亚
    • 埃及
    • MEA 其余地区

第 11 章：主要供应商分析-汽车系统级封装 (SiP) 产业

  • 竞争仪錶板
  • 公司简介
    • NXP Semiconductors
    • Infineon Technologies
    • STMicroelectronics
    • Texas Instruments
    • Qualcomm Technologies, Inc.
    • Amkor Technology
    • ASE Group
    • Renesas Electronics Corporation
    • Samsung Electronics
    • TSMC (Taiwan Semiconductor Manufacturing Company)
    • Intel Corporation
    • ROHM Semiconductor
    • Murata Manufacturing Co., Ltd.
    • Skyworks Solutions, Inc.
    • Analog Devices, Inc.
    • Others

第 12 章：360 度分析师视角

第 13 章：附录

  • 研究方法
  • 参考
  • 缩写
  • 免责声明
  • 联络我们
简介目录
Product Code: ANV5076

REPORT HIGHLIGHT

Automotive System in Package (SiP) Market size was valued at USD 2,103.42 Million in 2023, expanding at a CAGR of 10.20% from 2024 to 2032.

Automotive System-in-Package (SiP) is an advanced packaging method where multiple integrated circuits (ICs) and passive components like resistors, capacitors, and inductors are combined into a single compact package to perform a specific function, optimized for automotive applications.

Automotive System in Package (SiP) Market- Market Dynamics

Increasing demand for EVs & ADAS and the rising trend of connected cars are expected to propel market demand

The Automotive System in Package (SiP) market is witnessing robust growth due to a convergence of technological innovations, adoption EVs, and shifting consumer expectations. SiP technology, which integrates multiple chips and components into a single package. With the global shift toward electric vehicles (EVs), there is a growing need for compact and efficient electronic systems for battery management, motor control, and charging systems. Automotive SiPs help reduce space while ensuring high thermal and electrical performance. Battery Management Systems (BMS), for example, benefit greatly from SiPs because they require real-time monitoring of voltage, current, and temperature across multiple battery cells. SiPs also enhance reliability and reduce assembly complexity, which is crucial in EVs where space and weight are at a premium.

Advanced Driver Assistance System (ADAS) is one of the fastest-growing sectors in automotive electronics. Features such as adaptive cruise control, lane-keeping assistance, automatic emergency braking, and 360-degree camera systems require powerful yet compact electronic control units (ECUs). Automotive SiPs are ideal for such systems as they can integrate sensors, processing units, memory, and power management components in a small footprint. This enables high-speed data processing and minimal signal interference, which are critical for real-time decision-making in ADAS. Modern vehicles are increasingly connected, offering features like over-the-air (OTA) updates, real-time traffic information, vehicle-to-vehicle (V2V) communication, and rich infotainment experiences. These functions require integration of wireless communication modules (Wi-Fi, Bluetooth, 5G), microcontrollers, and multimedia processors. The growing consumer demand for immersive in-car experiences and continuous connectivity is a strong driver for SiP adoption. Automotive SiPs enable this integration in a cost-effective and compact form, supporting seamless data communication and multimedia processing, fueling market growth.

Automotive System in Package (SiP) Market- Key Insights

As per the analysis shared by our research analyst, the global market is estimated to grow annually at a CAGR of around 10.20% over the forecast period (2024-2032)

Based on Packaging Technology segmentation, 2.5D IC packaging segment was predicted to show maximum market share in the year 2023, owing to its production capacity in packaging.

Based on Packaging Method segmentation, flip chip segment was the leading Packaging Method in 2023, due to its reduced size and more functionalities.

Based on End Use segmentation, ADAS segment was the leading End Use in 2023, due to increased demand for semiconductor chips & ICs in ADAS system.

On the basis of the region, North America was the leading revenue generator in 2023, owing to the presence of top companies like Qualcomm, Intel, Powertech, etc.

Automotive System in Package (SiP) Market- Segmentation Analysis:

The Global Automotive System in Package (SiP) Market is segmented on the basis of Packaging Technology, Packaging Method, End Use, and Region.

The market is divided into three categories based on Packaging Technology: 2D IC packaging, 2.5D IC packaging, and 3D IC packaging. The 2.5D IC packaging segment dominates the market. High production demand and easy packaging is expected to fuel segment growth.

The market is divided into three categories based on the Packaging Method: wire bond, flip chip, and fan-out wafer level packaging. The flip-chip segment dominates the market. The fan-out wafer-level packaging is expected to expand at the fastest rate over the forecast period. The high demand from compact packaging, especially small factor solutions, is supplementing segment demand.

The market is divided into three categories based on End Use: infotainment & telematics modules, ADAS, and others. The ADAS segment dominates the market and is expected to maintain its high dominance during the forecast period. Growing demand for EVs and trend of ADAS system with safety awareness is anticipated to foster market growth.

Automotive System in Package (SiP) Market- Geographical Insights

Worldwide, the Automotive System in Package (SiP) market is widespread in the regions of North America, Latin America, Europe, Asia Pacific, and the Middle East and Africa. Asia-Pacific is the largest and fastest-growing market for automotive SiPs. China leads global EV production and adoption with over 50% of the world's EVs being sold in China. Japan and South Korea house major semiconductor giants like Renesas, Toshiba, Samsung, SK Hynix, and packaging leaders like ASE Group. According to the U.S. automotive data, the U.S. accounts for around 25-30% of global ADAS deployments, heavily reliant on miniaturized SiP solutions. In addition, Electric vehicles (EVs) are expected to represent about 40% of global car sales by 2030, heavily pushing demand for advanced SiPs.

Automotive System in Package (SiP) Market- Competitive Landscape:

The Automotive SiP market is highly competitive and rapidly evolving. Major players in semiconductors and automotive electronics are investing heavily to strengthen their product portfolios, innovating 3D packaging technologies. For example, Amkor Technology Inc. Opened new factories dedicated to automotive semiconductor packaging in Portugal and Vietnam and partnering with top OEM semiconductor suppliers for heterogeneous SiP development. Market participants are developing SiP solutions integrating MEMS sensors and controllers for tire pressure monitoring systems (TPMS) and ADAS. Companies also focus on expansion of SiP capabilities specifically targeted at high-reliability automotive packages with better thermal dissipation.

Recent Developments:

In 2024, Infineon Technologies introduced AURIX SiP microcontrollers targeting safety-critical applications like autonomous driving.

In 2024, NXP Semiconductors announced heavy investment in S32 Automotive Platform combining SiP concepts for scalability across vehicle domains as a part of their key strategy.

SCOPE OF THE REPORT

The scope of this report covers the market by its major segments, which include as follows:

GLOBAL AUTOMOTIVE SYSTEM IN PACKAGE (SIP) MARKET KEY PLAYERS

  • NXP Semiconductors
  • Infineon Technologies
  • STMicroelectronics
  • Texas Instruments
  • Qualcomm Technologies, Inc.
  • Amkor Technology
  • ASE Group
  • Renesas Electronics Corporation
  • Samsung Electronics
  • TSMC (Taiwan Semiconductor Manufacturing Company)
  • Intel Corporation
  • ROHM Semiconductor
  • Murata Manufacturing Co., Ltd.
  • Skyworks Solutions, Inc.
  • Analog Devices, Inc.
  • Others

GLOBAL AUTOMOTIVE SYSTEM IN PACKAGE (SIP) MARKET, BY PACKAGING TECHNOLOGY- MARKET ANALYSIS, 2019-2032

  • 2D IC packaging
  • 2.5D IC packaging
  • 3D IC packaging

GLOBAL AUTOMOTIVE SYSTEM IN PACKAGE (SIP) MARKET, BY PACKAGING METHOD- MARKET ANALYSIS, 2019-2032

  • Wire bond
  • Flip chip
  • Fan-out wafer level packaging

GLOBAL AUTOMOTIVE SYSTEM IN PACKAGE (SIP) MARKET, BY END USE- MARKET ANALYSIS, 2019-2032

  • Infotainment & Telematics Modules
  • ADAS
  • Others

GLOBAL AUTOMOTIVE SYSTEM IN PACKAGE (SIP) MARKET, BY REGION- MARKET ANALYSIS, 2019-2032

  • North America
  • The U.S.
  • Canada
  • Europe
  • Germany
  • France
  • Italy
  • Spain
  • United Kingdom
  • Russia
  • Netherlands
  • Sweden
  • Poland
  • Rest of Europe
  • Asia Pacific
  • India
  • China
  • South Korea
  • Japan
  • Australia
  • Thailand
  • Indonesia
  • Philippines
  • Rest of APAC
  • Latin America
  • Brazil
  • Mexico
  • Argentina
  • Colombia
  • Rest of LATAM
  • The Middle East and Africa
  • Saudi Arabia
  • United Arab Emirates
  • Israel
  • Turkey
  • Algeria
  • Egypt
  • Rest of MEA

Table of Contents

1. Automotive System in Package (SiP) Market Overview

  • 1.1. Study Scope
  • 1.2. Market Estimation Years

2. Executive Summary

  • 2.1. Market Snippet
    • 2.1.1. Automotive System in Package (SiP) Market Snippet by Packaging Technology
    • 2.1.2. Automotive System in Package (SiP) Market Snippet by Packaging Method
    • 2.1.3. Automotive System in Package (SiP) Market Snippet by End Use
    • 2.1.4. Automotive System in Package (SiP) Market Snippet by Country
    • 2.1.5. Automotive System in Package (SiP) Market Snippet by Region
  • 2.2. Competitive Insights

3. Automotive System in Package (SiP) Key Market Trends

  • 3.1. Automotive System in Package (SiP) Market Drivers
    • 3.1.1. Impact Analysis of Market Drivers
  • 3.2. Automotive System in Package (SiP) Market Restraints
    • 3.2.1. Impact Analysis of Market Restraints
  • 3.3. Automotive System in Package (SiP) Market Opportunities
  • 3.4. Automotive System in Package (SiP) Market Future Trends

4. Automotive System in Package (SiP) Industry Study

  • 4.1. PEST Analysis
  • 4.2. Porter's Five Forces Analysis
  • 4.3. Growth Prospect Mapping
  • 4.4. Regulatory Framework Analysis

5. Automotive System in Package (SiP) Market: COVID-19 Impact Analysis

  • 5.1. Pre-COVID-19 Impact Analysis
  • 5.2. Post-COVID-19 Impact Analysis
    • 5.2.1. Top Performing Segments
    • 5.2.2. Marginal Growth Segments
    • 5.2.3. Top Looser Segments
    • 5.2.4. Marginal Loss Segments

6. Automotive System in Package (SiP) Market Landscape

  • 6.1. Automotive System in Package (SiP) Market Share Analysis, 2024
  • 6.2. Breakdown Data, by Key Manufacturer
    • 6.2.1. Established Players' Analysis
    • 6.2.2. Emerging Players' Analysis

7. Automotive System in Package (SiP) Market - By Packaging Technology

  • 7.1. Overview
    • 7.1.1. Segment Share Analysis, By Packaging Technology, 2024 & 2032 (%)
    • 7.1.2. 2D IC packaging
    • 7.1.3. 2.5D IC packaging
    • 7.1.4. 3D IC packaging

8. Automotive System in Package (SiP) Market - By Packaging Method

  • 8.1. Overview
    • 8.1.1. Segment Share Analysis, By Packaging Method, 2024 & 2032 (%)
    • 8.1.2. Wire bond
    • 8.1.3. Flip chip
    • 8.1.4. Fan-out wafer level packaging

9. Automotive System in Package (SiP) Market - By End Use

  • 9.1. Overview
    • 9.1.1. Segment Share Analysis, By End Use, 2024 & 2032 (%)
    • 9.1.2. Infotainment & Telematics Modules
    • 9.1.3. ADAS
    • 9.1.4. Others

10. Automotive System in Package (SiP) Market- By Geography

  • 10.1. Introduction
    • 10.1.1. Segment Share Analysis, By Geography, 2024 & 2032 (%)
  • 10.2. North America
    • 10.2.1. Overview
    • 10.2.2. Automotive System in Package (SiP) Key Manufacturers in North America
    • 10.2.3. North America Market Size and Forecast, By Country, 2019 - 2032 (US$ Million)
    • 10.2.4. North America Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
    • 10.2.5. North America Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
    • 10.2.6. North America Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 10.2.7. U.S.
      • 10.2.7.1. Overview
      • 10.2.7.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.2.7.3. U.S. Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 10.2.7.4. U.S. Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
      • 10.2.7.5. U.S. Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 10.2.8. Canada
      • 10.2.8.1. Overview
      • 10.2.8.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.2.8.3. Canada Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 10.2.8.4. Canada Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
      • 10.2.8.5. Canada Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
  • 10.3. Europe
    • 10.3.1. Overview
    • 10.3.2. Automotive System in Package (SiP) Key Manufacturers in Europe
    • 10.3.3. Europe Market Size and Forecast, By Country, 2019 - 2032 (US$ Million)
    • 10.3.4. Europe Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
    • 10.3.5. Europe Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
    • 10.3.6. Europe Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 10.3.7. Germany
      • 10.3.7.1. Overview
      • 10.3.7.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.3.7.3. Germany Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 10.3.7.4. Germany Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
      • 10.3.7.5. Germany Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 10.3.8. Italy
      • 10.3.8.1. Overview
      • 10.3.8.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.3.8.3. Italy Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 10.3.8.4. Italy Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
      • 10.3.8.5. Italy Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 10.3.9. United Kingdom
      • 10.3.9.1. Overview
      • 10.3.9.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.3.9.3. United Kingdom Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 10.3.9.4. United Kingdom Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
      • 10.3.9.5. United Kingdom Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 10.3.10. France
      • 10.3.10.1. Overview
      • 10.3.10.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.3.10.3. France Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 10.3.10.4. France Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
      • 10.3.10.5. France Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 10.3.11. Russia
      • 10.3.11.1. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.3.11.2. Russia Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 10.3.11.3. Russia Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
      • 10.3.11.4. Russia Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 10.3.12. Netherlands
      • 10.3.12.1. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.3.12.2. Netherlands Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 10.3.12.3. Netherlands Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
      • 10.3.12.4. Netherlands Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 10.3.13. Sweden
      • 10.3.13.1. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.3.13.2. Sweden Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 10.3.13.3. Sweden Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
      • 10.3.13.4. Sweden Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 10.3.14. Poland
      • 10.3.14.1. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.3.14.2. Poland Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 10.3.14.3. Poland Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
      • 10.3.14.4. Poland Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 10.3.15. Rest of Europe
      • 10.3.15.1. Overview
      • 10.3.15.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.3.15.3. Rest of the Europe Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 10.3.15.4. Rest of the Europe Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
      • 10.3.15.5. Rest of the Europe Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
  • 10.4. Asia Pacific (APAC)
    • 10.4.1. Overview
    • 10.4.2. Automotive System in Package (SiP) Key Manufacturers in Asia Pacific
    • 10.4.3. Asia Pacific Market Size and Forecast, By Country, 2019 - 2032 (US$ Million)
    • 10.4.4. Asia Pacific Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
    • 10.4.5. Asia Pacific Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
    • 10.4.6. Asia Pacific Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 10.4.7. India
      • 10.4.7.1. Overview
      • 10.4.7.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.4.7.3. India Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 10.4.7.4. India Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
      • 10.4.7.5. India Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 10.4.8. China
      • 10.4.8.1. Overview
      • 10.4.8.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.4.8.3. China Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 10.4.8.4. China Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
      • 10.4.8.5. China Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 10.4.9. Japan
      • 10.4.9.1. Overview
      • 10.4.9.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.4.9.3. Japan Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 10.4.9.4. Japan Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
      • 10.4.9.5. Japan Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 10.4.10. South Korea
      • 10.4.10.1. Overview
      • 10.4.10.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.4.10.3. South Korea Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 10.4.10.4. South Korea Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
      • 10.4.10.5. South Korea Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 10.4.11. Australia
      • 10.4.11.1. Overview
      • 10.4.11.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.4.11.3. Australia Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 10.4.11.4. Australia Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
      • 10.4.11.5. Australia Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 10.4.12. Thailand
      • 10.4.12.1. Overview
      • 10.4.12.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.4.12.3. Thailand Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 10.4.12.4. Thailand Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
      • 10.4.12.5. Thailand Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 10.4.13. Indonesia
      • 10.4.13.1. Overview
      • 10.4.13.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.4.13.3. Indonesia Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 10.4.13.4. Indonesia Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
      • 10.4.13.5. Indonesia Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 10.4.14. Philippines
      • 10.4.14.1. Overview
      • 10.4.14.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.4.14.3. Philippines Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 10.4.14.4. Philippines Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
      • 10.4.14.5. Philippines Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 10.4.15. Rest of APAC
      • 10.4.15.1. Overview
      • 10.4.15.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.4.15.3. Rest of APAC Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 10.4.15.4. Rest of APAC Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
      • 10.4.15.5. Rest of APAC Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
  • 10.5. Latin America
    • 10.5.1. Overview
    • 10.5.2. Automotive System in Package (SiP) Key Manufacturers in Latin America
    • 10.5.3. Latin America Market Size and Forecast, By Country, 2019 - 2032 (US$ Million)
    • 10.5.4. Latin America Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
    • 10.5.5. Latin America Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
    • 10.5.6. Latin America Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 10.5.7. Brazil
      • 10.5.7.1. Overview
      • 10.5.7.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.5.7.3. Brazil Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 10.5.7.4. Brazil Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
      • 10.5.7.5. Brazil Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 10.5.8. Mexico
      • 10.5.8.1. Overview
      • 10.5.8.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.5.8.3. Mexico Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 10.5.8.4. Mexico Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
      • 10.5.8.5. Mexico Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 10.5.9. Argentina
      • 10.5.9.1. Overview
      • 10.5.9.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.5.9.3. Argentina Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 10.5.9.4. Argentina Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
      • 10.5.9.5. Argentina Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 10.5.10. Colombia
      • 10.5.10.1. Overview
      • 10.5.10.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.5.10.3. Colombia Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 10.5.10.4. Colombia Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
      • 10.5.10.5. Colombia Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 10.5.11. Rest of LATAM
      • 10.5.11.1. Overview
      • 10.5.11.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.5.11.3. Rest of LATAM Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 10.5.11.4. Rest of LATAM Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
      • 10.5.11.5. Rest of LATAM Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
  • 10.6. Middle East and Africa
    • 10.6.1. Overview
    • 10.6.2. Automotive System in Package (SiP) Key Manufacturers in Middle East and Africa
    • 10.6.3. Middle East and Africa Market Size and Forecast, By Country, 2019 - 2032 (US$ Million)
    • 10.6.4. Middle East and Africa Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
    • 10.6.5. Middle East and Africa Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
    • 10.6.6. Middle East and Africa Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 10.6.7. Saudi Arabia
      • 10.6.7.1. Overview
      • 10.6.7.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.6.7.3. Saudi Arabia Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 10.6.7.4. Saudi Arabia Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
      • 10.6.7.5. Saudi Arabia Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 10.6.8. United Arab Emirates
      • 10.6.8.1. Overview
      • 10.6.8.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.6.8.3. United Arab Emirates Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 10.6.8.4. United Arab Emirates Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
      • 10.6.8.5. United Arab Emirates Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 10.6.9. Israel
      • 10.6.9.1. Overview
      • 10.6.9.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.6.9.3. Israel Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 10.6.9.4. Israel Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
      • 10.6.9.5. Israel Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 10.6.10. Turkey
      • 10.6.10.1. Overview
      • 10.6.10.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.6.10.3. Turkey Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 10.6.10.4. Turkey Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
      • 10.6.10.5. Turkey Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 10.6.11. Algeria
      • 10.6.11.1. Overview
      • 10.6.11.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.6.11.3. Algeria Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 10.6.11.4. Algeria Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
      • 10.6.11.5. Algeria Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 10.6.12. Egypt
      • 10.6.12.1. Overview
      • 10.6.12.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.6.12.3. Egypt Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 10.6.12.4. Egypt Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
      • 10.6.12.5. Egypt Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 10.6.13. Rest of MEA
      • 10.6.13.1. Overview
      • 10.6.13.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.6.13.3. Rest of MEA Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 10.6.13.4. Rest of MEA Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
      • 10.6.13.5. Rest of MEA Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)

11. Key Vendor Analysis- Automotive System in Package (SiP) Industry

  • 11.1. Competitive Dashboard
  • 11.2. Company Profiles
    • 11.2.1. NXP Semiconductors
    • 11.2.2. Infineon Technologies
    • 11.2.3. STMicroelectronics
    • 11.2.4. Texas Instruments
    • 11.2.5. Qualcomm Technologies, Inc.
    • 11.2.6. Amkor Technology
    • 11.2.7. ASE Group
    • 11.2.8. Renesas Electronics Corporation
    • 11.2.9. Samsung Electronics
    • 11.2.10. TSMC (Taiwan Semiconductor Manufacturing Company)
    • 11.2.11. Intel Corporation
    • 11.2.12. ROHM Semiconductor
    • 11.2.13. Murata Manufacturing Co., Ltd.
    • 11.2.14. Skyworks Solutions, Inc.
    • 11.2.15. Analog Devices, Inc.
    • 11.2.16. Others

12. 360 Degree Analyst View

13. Appendix

  • 13.1. Research Methodology
  • 13.2. References
  • 13.3. Abbreviations
  • 13.4. Disclaimer
  • 13.5. Contact Us