晶圆载体材料的全球市场2024年

晶圆载体材料市场正经历显着成长，预计将从 2022 年的 5 亿美元成长到 2030 年的 8 亿美元以上，复合年增长率约为 6%。半导体技术的不断进步、消费性电子产品的使用不断增加以及电子产品小型化的持续趋势都促进了对晶圆处理组件的需求。

本报告提供晶圆搬送零件材料市场详细评估，并深入探讨以下几点:

产品概要

主要晶圆搬送零件的功能主要的使用材料定义

• 晶圆pod
• 晶圆盒式录音带
• 晶圆船艇等

晶圆搬送零件的全球市场概要

全球晶圆传输组件市场的当前（2022 年）和预测（2030 年）见解，包括影响市场成长和材料选择的主要趋势和驱动因素分析

各材料类型的全球市场市场区隔

聚合物，金属，陶瓷，复合材料等，所使用的主要各材料的全球市场市场区隔

化学惰性，刚性，含导电性等的参数相关之客户迴响，材料选择的主要选择标准或性能参数

竞争概要:

主要的竞争企业的简介和Entegris, Epak, Shin Etsu, Miraial, Gudeng Precision Industrial等15公司以上的竞争形势分析。

专利概要:

过去4～5年主要的专利转让处的主要专利系列分析。还有专利的研究焦点，讨论中的材料，相关应用相关洞察也包含。

市场展望:

在广泛的二次和初步研究验证的支持下，本报告还提供了对市场前景及其影响因素的权威看法。

目录

第1章 简介

• 报告概要
• 产品焦点
• 调查手法

第2章 流程概要

• 薄膜成型
• 光刻
• 蚀刻
• 掺杂
• CMP
• 切割
• 引线接合法
• 包装

第3章 价值链概要

第4章 市场概要

第5章 详细市场评估

• 晶圆载体

第5章 专利概要

第6章 市场展望

第7章 市场展望附录

The Wafer Carrying Component materials market is poised for remarkable growth, projected to surpass USD 800 million by 2030, with a CAGR of approximately 6% from a value of USD 500 million in 2022. The continuous progress of semiconductor technology, the increase in consumer electronics usage, and the ongoing trend of electronics miniaturization are all contributing to the demand for wafer-carrying components.

This report provides a deep-dive into the following points in this detailed assessment of the wafer-carrying component materials market

Product Overview

Defining the functions and the key materials used for major wafer-carrying components

• Wafers Pod
• Wafers Cassette
• Wafers Boat, etc.

Global Wafer Carrying Component Materials Market Overview

Insight into the current (2022) and forecasted (2030) global market for Wafer Carrying Component Materials including an analysis of the key trends and drivers impacting market growth and choice of materials.

Global market segmentation by material type

Global market segmentation by key materials used – Polymers, Metals, Ceramics, Composites, etc.

Key Selection criteria or Performance Parameters for material selection including voice of customer on parameters such as chemical inertness, stiffness, conductivity, etc.

Competition overview:

Key competitor profiles and analyzing the competitor landscape of 15+ companies including Entegris, Epak, Shin Etsu, Miraial, Gudeng Precision Industrial, etc.

Patent overview:

Analyzing key patent families by major assignees in the last 4-5 years. The report also includes insights on the research focus of the patents, materials under consideration, and the associated applications.

Market Outlook:

Backed by extensive secondary research and validation through primary research, this report also presents a reliable view of the market outlook and factors influencing the same.

Table of Contents

1. Introduction

• 1.1 Report Overview
• 1.2 Product Focus
• 1.3 Methodology

2. Process Overview

• 2.1 Thin Film Molding
• 2.2 Photolithography
• 2.3 Etching
• 2.4 Doping
• 2.5 CMP
• 2.6 Dicing
• 2.7 Wire Bonding
• 2.8 Packaging

3. Value Chain Overview

4. Market Overview

5. Detailed Market Assessment

• 5.1 Wafer Carrier

5. Patent Overview

6. Market Outlook

7. Annexure

List of Tables

• Table 4.1: Global Semiconductor Materials Market - By Material Type
• Table 4.2: Global Semiconductor Materials Market - Key Competitors
• Table 5.1.1: Global Wafer Carrier Materials Market - By Material Type
• Table 5.1.2: Manufacturers v/s Component and Material Used - Wafer Carrier
• Table 6.1: Patent Publications by Geography - Wafer Carrier
• Table 6.2: Patent Listing - Wafer Carrier

List of Figures

• Chart 4.1: Global Semiconductor Materials Market
• Chart 4.2: Global Semiconductor Materials Market - By Material Type
• Chart 4.3: Global Semiconductor Materials Market - By Component
• Chart 5.1.1: Global Wafer Carrier Materials Market
• Chart 5.1.2: Global Wafer Carrier Materials Market, By Material
• Chart 6.1: Patent Publication Trend - Wafer Carrier