封面
市场调查报告书
商品编码
1459583

掺杂材料的全球市场2024

Global Dopant Materials Market 2024

出版日期: | 出版商: Aranca | 英文 75 Pages | 订单完成后即时交付

价格

掺杂材料市场经历了显着成长,预计将从 2022 年的 7 亿美元增长到 2030 年的超过 10 亿美元,复合年增长率约为 6%。半导体技术的不断进步、消费性电子产品的使用不断增加以及电子产品小型化趋势的不断增强,都增加了对掺杂材料的需求。

本报告提供掺杂材料市场详细评估,并深入探讨以下几点:

产品概要

主要的掺杂材料所使用的功能定义

  • P类型
  • N类型

掺杂材料的全球市场概要

掺杂材料的现在(2022年)与预测(2030年)的全球市场相关洞察。包括对影响市场成长和材料选择的主要趋势和驱动因素的分析。

各材料类型的全球市场市场区隔

使用掺杂剂的全球市场市场区隔-P型,N型

扩散简介,掺杂剂适合性,含掺杂剂活性化能源等的参数相关之客户迴响,材料选择的主要选择标准或性能参数

竞争概要:

主要的竞争企业的简介和American Elements, Honeywell, Filmtronics, Stanford Advanced Materials, Yamanaka Advanced Materials等的主要企业的竞争形势的分析。

专利概要:

过去4-5年主要的专利转让处的主要专利系列的分析。还有专利的研究焦点,也包含讨论中的材料,相关用途相关洞察。

市场展望

在广泛的二次和初步研究验证的支持下,本报告还提供了对市场前景及其影响因素的权威看法。

目录

第1章 简介

  • 报告概要
  • 产品焦点
  • 调查手法

第2章 流程概要

  • 薄膜成型
  • 光刻
  • 蚀刻
  • 掺杂
  • CMP
  • 切割
  • 引线接合法
  • 包装

第3章 价值链概要

第4章 市场概要

第5章 详细市场评估

  • 掺杂剂

第5章 专利概要

第6章 市场展望

第7章 市场展望附录

Product Code: ARA08

The Dopant Materials market is poised for remarkable growth, projected to surpass USD 1 billion by 2030, with a compelling CAGR of approximately 6% from a value of USD 0.7 billion in 2022. The continuous progress of semiconductor technology, the increase in consumer electronics usage, and the ongoing trend of electronics miniaturization are all contributing to the demand for dopant materials.

This report provides a deep-dive into the following points in this detailed assessment of the dopant materials market:

Product Overview

Defining the functions used for major dopant materials:

  • P-Type
  • N-Type

Global Dopant materials Market overview

Insight on current (2022) and forecasted (2030) global market for dopant materials including an analysis of the key trends and drivers impacting market growth and choice of materials.

Global market segmentation by material type

Global market segmentation by dopants used – P-type, and N-type

Key Selection criteria or Performance Parameters for material selection including the voice of the customer on parameters such as Diffusion Profile, Dopant Compatibility, Dopant Activation Energy, etc.

Competition overview:

Key competitor profiles and analyzing the competitor landscape of major companies including American Elements, Honeywell, Filmtronics, Stanford Advanced Materials, Yamanaka Advanced Materials, etc.

Patent overview:

Analyzing key patent families by major assignees in the last 4-5 years. The report also includes insights on the research focus of the patents, materials under consideration and the associated applications.

Market Outlook

Backed by extensive secondary research and validation through primary research, this report also presents a reliable view of the market outlook and factors influencing the same.

Table of Contents

1. Introduction

  • 1.1 Report Overview
  • 1.2 Product Focus
  • 1.3 Methodology

2. Process Overview

  • 2.1 Thin Film Molding
  • 2.2 Photolithography
  • 2.3 Etching
  • 2.4 Doping
  • 2.5 CMP
  • 2.6 Dicing
  • 2.7 Wire Bonding
  • 2.8 Packaging

3. Value Chain Overview

4. Market Overview

5. Detailed Market Assessment

  • 5.1 Dopants

5. Patent Overview

6. Market Outlook

7. Annexure

List of Tables

  • Table 4.1: Global Semiconductor Materials Market - By Material Type
  • Table 4.2: Global Semiconductor Materials Market - Key Competitors
  • Table 5.1.1: Global Dopant Materials Market - By Material Type
  • Table 5.1.2: Manufacturers v/s Component and Material Used - Dopant
  • Table 6.1: Patent Publications by Geography - Dopant
  • Table 6.2: Patent Listing - Dopant

List of Figures

  • Chart 4.1: Global Semiconductor Materials Market
  • Chart 4.2: Global Semiconductor Materials Market - By Material Type
  • Chart 4.3: Global Semiconductor Materials Market - By Component
  • Chart 5.1.1: Global Dopant Materials Market
  • Chart 5.1.2: Global Dopant Materials Market, By Material
  • Chart 6.1: Patent Publication Trend - Dopant