半导体製造研究回顾：2024 年

预计到 2029年终全球小晶片市场规模将从 2023 年的 53 亿美元成长至 428 亿美元，预测期间的复合年增长率为 41.9%。

全球薄膜和超薄膜市场规模预计将从 2023 年的 206 亿美元成长到 2028年终的 388 亿美元，复合年增长率为 13.5%。

预计到 2028年终全球物联网晶片市场规模将达到 3,755 亿美元，从 2022 年的 1,861 亿美元成长至 14.3% 的复合年增长率。

本研究评论包括BCC Research在2024年发布的有关晶片、薄膜和超薄膜、物联网晶片、高速资料转换器和印刷基板的报告的亮点和摘录，并提供了每个市场的全面概述、市场影响因素和市场机会的分析、法律制度、新兴技术和技术发展趋势、市场规模趋势和预测，以及各个细分市场和地区的详细分析。

目录

第 1 章 简介

• 研究审查范围

2. 全球小晶片市场（SMC137A）

• 小晶片
• 市场展望
• 研究范围
• 市场摘要
• 市场动态
• 新兴技术
• 細項分析
• 区域分析
• 结论
• Chiplet市场概览
• 市场推动要素
• 高效能运算
• 市场限制/挑战
• 技术纯熟劳工短缺
• 市场机会
• 持续投资半导体产业
• 监管状态
• 北美洲
• 新兴技术
• 异质集成
• 按处理器分類的 Chiplet 市场
• CPU
• 图形处理单元
• 现场可程式闸阵列
• AI-ASIC 协处理器
• 申请处理单位
• Chiplet 市场按区域细分
• 北美洲
• 欧洲
• 亚太地区
• 世界其他地区

3. 世界薄膜及超薄膜市场、技术及材料（SMC057D）

• 薄膜和超薄膜
• 市场展望
• 研究范围
• 市场摘要
• 技术进步与应用
• 市场动态与成长要素
• 未来趋势和发展
• 細項分析
• 区域见解和新兴市场
• 结论
• 薄膜和超薄膜市场概况
• 市场推动要素
• 全球製造业资本投资增加
• 市场限制
• 薄膜污染的影响
• 市场机会
• 技术进步和新产品开发
• 主要新兴技术和市场趋势
• 基于雷射的定向能量沉积
• 薄膜和超薄膜市场按材料细分
• 金属
• 电介质
• 化合物
• 其他的
• 薄膜和超薄膜市场按区域划分
• 北美洲
• 欧洲
• 亚太地区
• 世界其他地区
• 薄膜和超薄膜产业的永续性：ESG 视角
• 薄膜和超薄膜市场的关键 ESG 议题
• ESG绩效分析
• ESG 在薄膜和超薄膜市场的现状
• 全球薄膜和超薄膜市场的 ESG 实践
• BCC的结语

第四章 全球物联网晶片市场（SMC135A）

• 物联网晶片
• 市场展望
• 研究范围
• 市场摘要
• 物联网晶片市场概览
• 市场推动要素
• 对基于物联网的车辆的需求不断增加
• 市场限制
• 安全和隐私问题
• 市场机会
• 引进新兴技术
• 物联网晶片市场按最终用户产业细分
• 卫生保健
• 消费性电子产品
• 车
• 建筑自动化
• 产业
• 其他的
• 物联网晶片市场区域分布
• 北美洲
• 欧洲
• 亚太地区
• 世界其他地区
• 物联网晶片产业的永续性：ESG 视角
• 物联网晶片市场的 ESG 议题
• 物联网晶片：ESG 效能分析
• BCC的结语

第 5 章 高速资料转换器：世界市场及成长预测（SMC136A）

• 高速资料转换器
• 市场展望
• 市场摘要
• 技术进步与应用
• 高速资料转换器的市场动态与成长要素
• 細項分析
• 区域见解和新兴市场
• 结论
• 技术概述
• 高速资料转换器的当前和未来市场概述
• 市场推动要素
• 医学影像应用的兴起
• 市场挑战
• 低功耗、高速资料转换器的开发
• 市场机会
• 自动驾驶汽车的兴起
• 新兴技术和发展
• 半导体技术的微型化与不断改进
• 高速资料转换器市场按类型细分
• 类比数位转换器 (ADC)
• 数位类比转换器 (DAC)
• 高速资料转换器市场按地区细分
• 北美洲
• 欧洲
• 亚太地区
• 世界其他地区
• 高速资料转换器产业的永续性：ESG 视角
• ESG绩效分析
• 全球市场 ESG 现状
• 高速资料转换器市场的 ESG 实践
• BCC的结语

第 6 章 印刷电路基板：技术与全球市场（SMC103D）

• 印刷基板
• 市场展望
• 研究范围
• 市场摘要
• 技术进步与应用
• 印刷基板市场动态
• 細項分析
• 区域见解和新兴市场
• 结论
• 当前和未来的市场
• 市场推动要素
• 扩大自动驾驶汽车 (AV) 和电动车的使用
• 市场挑战
• 技术复杂性不断增加，持续创新的压力不断增加
• 市场机会
• 柔性和穿戴式电子产品的进步
• 新兴科技和趋势
• 3D 列印
• 基板市场细分：按类型
• 单层
• 双层
• 多层
• 高密度互连 (HDI)
• 基板市场区域分布
• 北美洲
• 欧洲
• 亚太地区
• 世界其他地区
• PCB 产业永续性：ESG 视角
• PCB行业ESG现状
• PCB 产业的 ESG 实践
• BCC的结语

第七章 附录

The global market for chiplets was valued at $5.3 billion in 2023 and is expected to reach $42.8 billion by the end of 2029, at a compound annual growth rate (CAGR) 41.9% from 2024 through 2029.

The global market for thin and ultrathin films is expected to grow from $20.6 billion in 2023 to $38.8 billion by the end of 2028, at a compound annual growth (CAGR) of 13.5% from 2023 to 2028.

The global market for Internet of Things (IoT) chips was valued at $186.1 billion in 2022 and is expected to reach $375.5 billion by the end of 2028, at a compound annual growth (CAGR) of 14.3% from 2023 to 2028.

Research Review Scope

This review report comprehensively analyzes key market trends, technological advancements, and emerging opportunities across various semiconductor segments. It covers the role of chiplets, high-speed data converters, Internet of Things (IoT) chips, printed circuit boards (PCBs), and thin/ultrathin films in next-generation electronics, emphasizing their impact on artificial intelligence (AI), high-performance computing (HPC), 5G technology, automotive applications including electric vehicles (EVs) and autonomous vehicles (AVs), and industrial automation.

Additionally, the review examines market drivers, challenges, growth forecasts, supply chain dynamics, geopolitical influences, and investment trends affecting semiconductor industry. It highlights the increasing demand for modular chiplet integration, IoT connectivity, high-speed data processing, and advanced PCB technologies while addressing regulatory, security, and sustainability challenges. This structured analysis offers valuable insights into the evolving semiconductor landscape and the critical factors driving its transformation .

Research Reviews from BCC Research provide market professionals with concise market coverage within a specific research category. This 2024 Semiconductor Manufacturing Research Review provides a sampling of the type of quantitative market information, analysis, and guidance that BCC Research has been developing since its inception in 1971 to help its customers make informed business decisions. This Research Review includes highlights and excerpts from the following reports published by BCC Research in 2024:

• SMC137A Global Chiplets Market
• SMC057D Global Markets, Technologies and Materials for Thin and Ultrathin Films
• SMC135A Global IoT Chips Market
• SMC136A High-speed Data Converters: Global Markets and Growth Forecast
• SMC103D Printed Circuit Boards: Technologies and Global Markets

After you survey the excerpts in this Research Review, we encourage you to follow up on these topics by checking out the full market research reports associated with each topic. BCC Research looks forward to serving your market intelligence needs in the future.

Table of Contents

Chapter 1 Foreword

• Research Review Scope

Chapter 2 Global Chiplets Market (SMC137A)

• Chiplets
• Market Outlook
• Scope of the Report
• Market Summary
• Market Dynamics
• Emerging Technologies
• Segmental Analysis
• Regional Analysis
• Conclusion
• Market Overview of Chiplets
• Market Driver
• High-Performance Computing
• Market Restraint/Challenge
• Shortage of Skilled Labor
• Market Opportunity
• Continuing Investment in the Semiconductor Industry
• Regulatory Landscape
• North America
• Emerging Technologies
• Heterogeneous Integration
• Market Breakdown of Chiplets by Processor
• CPUs
• Graphics Processing Units
• Field-Programmable Gate Arrays
• AI-ASIC Coprocessors
• Application Processing Units
• Market Breakdown of Chiplets by Region
• North America
• Europe
• Asia-Pacific
• Rest of the World

Chapter 3 Global Markets, Technologies and Materials for Thin and Ultrathin Films (SMC057D)

• Thin and Ultrathin Films
• Market Outlook
• Scope of Report
• Market Summary
• Technological Advancements and Applications
• Market Dynamics and Growth Factors
• Future Trends and Developments
• Segmental Analysis
• Regional Insights and Emerging Markets
• Conclusion
• Market Overview of Thin and Ultrathin Films
• Market Driver
• Growing Global Fabrication Equipment Spending
• Market Restraint
• Implications of Thin-Film Contamination
• Market Opportunity
• Technological Advancements and New Product Development
• Key Emerging Technology and Market Trend
• Laser-Based Directed Energy Deposition
• Market Breakdown of Thin and Ultrathin Films by Material
• Metal
• Dielectric
• Compounds
• Others
• Market Breakdown of Thin and Ultrathin Films by Region
• North America
• Europe
• Asia-Pacific
• Rest of the World
• Sustainability in Thin and Ultrathin Films Industry: An ESG Perspective
• Key ESG Issues in Thin and Ultrathin Films Market
• ESG Performance Analysis
• Current Status of ESG in the Thin and Ultrathin Films Market
• ESG Practices in the Global Thin and Ultrathin Films Market
• Concluding Remarks from BCC Research

Chapter 4 Global IoT Chips Market (SMC135A)

• IoT Chips
• Market Outlook
• Scope of Report
• Market Summary
• Market Overview of IoT Chips
• Market Driver
• Growing Demand for IoT-based Vehicles
• Market Restraint
• Security and Privacy Concerns
• Market Opportunity
• Implementation of Emerging Technologies
• Market Breakdown of IoT Chips by End-use Industry
• Healthcare
• Consumer Electronics
• Automotive
• Building Automation
• Industrial
• Others
• Market Breakdown of IoT Chips by Region
• North America
• Europe
• Asia-Pacific
• Rest of the World
• Sustainability in IoT Chips Industry: An ESG Perspective
• ESG Issues in the IoT Chip Market
• IoT Chip ESG Performance Analysis
• Concluding Remarks from BCC Research

Chapter 5 High-speed Data Converters: Global Markets and Growth Forecast (SMC136A)

• High-speed Data Converters
• Market Outlook
• Market Summary
• Technological Advancements and Applications
• Market Dynamics and Growth Factors of High-speed Data Converters
• Segmental Analysis
• Regional Insights and Emerging Markets
• Conclusion
• Technology Overview
• Current and Future Market Overview of High-speed Data Converters
• Market Driver
• Widespread Adoption of Medical Imaging Applications
• Market Challenge
• Developing Low-Power High-Speed Data Converters
• Market Opportunity
• Rise of Autonomous Vehicles
• Emerging Technologies and Developments
• Miniaturization and Continuous Improvements in Semiconductor Technologies
• Market Breakdown of High-Speed Data Converters by Type
• A/D Converters (ADC)
• D/A Converters (DAC)
• Market Breakdown of High-Speed Data Converters by Region
• North America
• Europe
• Asia-Pacific
• Rest of the World
• Sustainability in High-Speed Data Converters Industry: An ESG Perspective
• ESG Performance Analysis
• Current Status of ESG in the Global Market
• ESG Practices in the High-Speed Data Converters Market
• Concluding Remarks from BCC Research

Chapter 6 Printed Circuit Boards: Technologies and Global Markets (SMC103D)

• Printed Circuit Boards
• Market Outlook
• Scope of Report
• Market Summary
• Technological Advances and Applications
• Market Dynamics of Printed Circuit Boards
• Segmental Analysis
• Regional Insights and Emerging Markets
• Conclusion
• Current and Future Market
• Market Driver
• Growing Use of Autonomous Vehicles (AVs) and EVs
• Market Challenge
• Increasing Technological Complexity and Pressure to Continuously Innovate
• Market Opportunity
• Advancements in Flexible and Wearable Electronics
• Emerging Technologies and Trends
• 3D Printing
• Market Breakdown of Printed Circuit Boards by PCB Type
• Single-layer
• Double-layer
• Multilayer
• High-density Interconnect (HDI)
• Market Breakdown of Printed Circuit Boards by Region
• North America
• Europe
• Asia-Pacific
• Rest of the World
• Sustainability in the PCB Industry: An ESG Perspective
• Status of ESG in the PCB Industry
• ESG Practices in the PCB Industry
• Concluding Remarks from BCC Research

Chapter 7 Appendix

• Methodology
• Analyst's Credentials

List of Tables

• Table 1 : Global Market for Chiplets, by Region, Through 2029
• Table 2 : Global Market for Chiplets, by Processor, Through 2029
• Table 3 : Global Market for Chiplets, by Region, Through 2029
• Table 4 : Global Market for Thin and Ultrathin Films, by Material, Through 2028
• Table 5 : Global Market for Thin and Ultrathin Films, by Material, Through 2028
• Table 6 : Global Market for Thin and Ultrathin Films, by Region, Through 2028
• Table 7 : Environmental Impact
• Table 8 : Social Impact
• Table 9 : Governance Impact
• Table 10 : Global Thin and Ultrathin Films Market, ESG Risk Ratings Metric, 2022
• Table 11 : Global Market for IoT Chips, by End-use Industry, Through 2028
• Table 12 : Global Market for IoT Chips, by End-use Industry, Through 2028
• Table 13 : Global Market for IoT Chips, by Region, Through 2028
• Table 14 : Environmental Metrics for the IoT Chip Market
• Table 15 : Social Metrics for the IoT Chip Market
• Table 16 : Governance Metrics for the IoT Chip Market
• Table 17 : Global Market for High-Speed Data Converters, by Type, Through 2029
• Table 18 : Global Market for High-Speed Data Converters, by Type, Through 2029
• Table 19 : Global Market Volume for High-Speed Data Converters, by Type, Through 2029
• Table 20 : Global Market for High-Speed Data Converters, by Region, Through 2029
• Table 21 : Global Market Volume for High-Speed Data Converters, by Region, Through 2029
• Table 22 : Environmental Metrics for the High-Speed Data Converters Market
• Table 23 : Social Metrics for the High-Speed Data Converters Market
• Table 24 : Governance Metrics for the High-Speed Data Converters Market
• Table 25 : ESG Risk Ratings Metric, by Company, 2022
• Table 26 : Global Market for Printed Circuit Boards, by PCB Type, Through 2029
• Table 27 : Global Market for PCBs, by PCB Type, Through 2029
• Table 28 : Global Market for PCBs, by Region, Through 2029
• Table 29 : ESG Risk Ratings, by Company, 2023

List of Figures

• Figure 1 : Global Market Shares of Chiplets, by Region, 2023
• Figure 2 : Emerging Chiplet Technologies
• Figure 3 : Global Market Shares of Chiplets, by Processor, 2023
• Figure 4 : Global Market Shares of Chiplets, by Region, 2023
• Figure 5 : Global Market Shares of Thin and Ultrathin Films, by Material, 2022
• Figure 6 : Front-End Fabrication Equipment Spending, 2020-2024
• Figure 7 : Global Market Shares of Thin and Ultrathin Films, by Material, 2022
• Figure 8 : Global Market Shares of Thin and Ultrathin Films, by Region, 2022
• Figure 9 : Global Market Shares of IoT Chips, by End-use Industry, 2022
• Figure 10 : Global Market Shares of IoT Chips, by End-use Industry, 2022
• Figure 11 : Global Market Shares of IoT Chips, by Region, 2022
• Figure 12 : Global Market Shares of High-Speed Data Converters, by Type, 2023
• Figure 13 : Global Market Shares of High-Speed Data Converters, by Type, 2023
• Figure 14 : Global Market Volume Shares of High-Speed Data Converters, by Type, 2022
• Figure 15 : Global Market Shares of High-Speed Data Converters, by Region, 2023
• Figure 16 : Global Market Volume Shares of High-Speed Data Converters, by Region, 2023
• Figure 17 : Global Market Shares of Printed Circuit Boards, by PCB Type, 2023
• Figure 18 : Global Market Shares of PCBs, by PCB Type, 2023
• Figure 19 : Global Market Shares of PCBs, by Region, 2023