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蜂巢式/LPWA IoT设备的生态系统 - 第9版
市场调查报告书
商品编码
1747990

蜂巢式/LPWA IoT设备的生态系统 - 第9版

Cellular and LPWA IoT Device Ecosystems - 9th Edition
出版日期: | 出版商: Berg Insight | 英文 130 Pages | 商品交期: 最快1-2个工作天内

价格

全球对物联网广域网路技术的需求正处于成长阶段。到 2024 年底，将有约 43 亿台装置连接到基于蜂巢或 LPWA 技术的广域网路。预计蜂巢/非 3GPP LPWA 物联网模组的年出货量将从 2024 年的 6.03 亿台成长到 2029 年的 10.4 亿台，复合年增长率为 11.6%。

本报告概述了物联网设备市场，包括 NB-IoT、LTE-M、LoRa 和 Sigfox 等 LPWA 技术的采用趋势、主要物联网晶片组/模组供应商的概况，并提供了到 2029 年的市场预测。

目录

图表清单

摘要整理

第1章 IoT广域网

  • 怎样的东西被广域网连接
    • 公共事业仪表
    • 汽车
    • 建筑物
    • 资产追踪、供应链可视性
    • 打造更智慧、更安全城市的机遇
    • 物联网与人工智慧的融合
  • 技术选择
    • 网路部署模式
    • 授权和非授权频段
    • 蜂窝技术与低功耗广域网路 (LPWA) 技术的成本比较
  • 主要的技术生态係有哪些？

第2章 3GPP生态系统

  • 技术特性
    • 3GPP Release 13 - LTE-M 和 NB-IoT 部署
    • 3GPP Release 14 - 物联网增强功能与 C-V2X
    • 3GPP Release 15 - 5G 规范第一阶段
    • 3GPP Release 16 - URLLC 增强功能、IIoT 功能、5G NR C-V2X
    • 3GPP Release 17 - RedCap 与非地面网路通信
    • 3GPP Release 18 - 首个 5G-Advanced 规范和 eRedCap
    • 网路足迹
    • 2G/3G行动网路
    • 4G行动网路
    • 4G/5G行动IoT网路(LTE-M，NB-IoT)
    • 5G行动网路
  • 半导体供应商
    • ASR Microelectronics
    • Eigencomm
    • MediaTek
    • MLINK
    • Qualcomm
    • Samsung Electronics
    • Sequans Communications
    • Sony
    • UNISOC
    • Xinyi Information Technology
    • 其他的半导体供应商
  • 模组供应商
    • Cavli Wireless
    • China Mobile IoT
    • Fibocom
    • Kontron
    • MeiG Smart Technology
    • Murata
    • Neoway
    • Nordic Semiconductor
    • Quectel
    • Rolling Wireless
    • Semtech
    • Sunsea AIoT (SIMCom & Longsung)
    • Telit Cinterion
    • Trasna
    • 其他的蜂巢式IoT模组供应商

第3章 LoRa/LoRaWAN生态系统

  • 技术特性
  • 网路足迹
    • 欧洲
    • 亚太地区
    • 南北美洲
    • 中东·非洲
  • 半导体/模组供应商
    • Semtech
    • 其他的半导体供应商
    • LoRa模组供应商

第4章 Sigfox生态系统

  • 技术特性
  • 网路足迹
    • 欧洲
    • 南北美洲
    • 亚太地区
    • 中东·非洲
    • UnaBiz与LoRaWAN生态系统协作
    • Sigfox的主要的使用案例
  • 半导体/模组供应商
    • 半导体供应商
    • Sigfox模组供应商

第5章 新LPWA生态系统

  • IEEE 802.15.4
    • 802.15.4为基础连接性堆迭
    • 网路足迹
  • Wirepas Mesh
  • DECT-2020 NR(NR+)
  • Mioty
  • 晶片组/模组供应商

第6章 市场预测和趋势

  • 市场摘要
  • 蜂巢式IoT设备市场
    • 欧洲
    • 北美
    • 南美
    • 中国
    • 其他的亚太地区
    • 中东·非洲
  • LoRa设备市场
  • Sigfox设备市场
  • 新的LPWA技术
  • 缩写和简称清单

Global demand for IoT wide area networking technology is in a growth phase. By the end of 2024, about 4.3 billion devices were connected to wide area networks based on cellular or LPWA technologies. The market is highly diverse and divided into multiple ecosystems. Berg Insight forecasts that annual shipments of cellular and non-3GPP LPWA IoT modules will grow at a compound annual growth rate (CAGR) of 11.6 percent from 603 million units in 2024 to 1.04 billion units in 2029. Get up to date with the latest trends from all main regions and vertical markets with this unique 130-page report.

Highlights from the report:

  • 360-degree overview of the main IoT wide area networking ecosystems.
  • Comparison of technologies and standards.
  • Updated profiles of the main suppliers of IoT chipsets and modules.
  • Cellular IoT module market data for 2024.
  • Adoption trends for LPWA technologies including NB-IoT, LTE-M, LoRa and Sigfox.
  • Cellular and non-3GPP LPWA IoT device market forecasts until 2029.

Table of Contents

Table of Contents

List of Figures

Executive Summary

1. Wide Area Networks for the Internet of Things

  • 1.1. Which things will be connected to wide area networks?
    • 1.1.1. Utility meters
    • 1.1.2. Motor vehicles
    • 1.1.3. Buildings
    • 1.1.4. Asset tracking and supply chain visibility
    • 1.1.5. The opportunity to create smarter and safer cities
    • 1.1.6. The convergence of IoT and AI
  • 1.2. What are the technology options?
    • 1.2.1. Network deployment models
    • 1.2.2. Licensed and unlicensed frequency bands
    • 1.2.3. Cost comparison for cellular and LPWA technologies
  • 1.3. Which are the leading technology ecosystems?

2. 3GPP Ecosystem

  • 2.1. Technology characteristics
    • 2.1.1. 3GPP Release 13-Introducing LTE-M and NB-IoT
    • 2.1.2. 3GPP Release 14-IoT enhancements and C-V2X
    • 2.1.3. 3GPP Release 15-The first phase of 5G specifications
    • 2.1.4. 3GPP Release 16-URLLC enhancements, IIoT features and 5G NR C-V2X
    • 2.1.5. 3GPP Release 17-RedCap and non-terrestrial network communications
    • 2.1.6. 3GPP Release 18-The first 5G-Advanced specifications and eRedCap
    • 2.1.7. Network footprint
    • 2.1.8. 2G/3G mobile networks
    • 2.1.9. 4G mobile networks
    • 2.1.10. 4G/5G mobile IoT networks (LTE-M and NB-IoT)
    • 2.1.11. 5G mobile networks
  • 2.2. Semiconductor vendors
    • 2.2.1. ASR Microelectronics
    • 2.2.2. Eigencomm
    • 2.2.3. MediaTek
    • 2.2.4. MLINK
    • 2.2.5. Qualcomm
    • 2.2.6. Samsung Electronics
    • 2.2.7. Sequans Communications
    • 2.2.8. Sony
    • 2.2.9. UNISOC
    • 2.2.10. Xinyi Information Technology
    • 2.2.11. Other semiconductor vendors
  • 2.3. Module vendors
    • 2.3.1. Cavli Wireless
    • 2.3.2. China Mobile IoT
    • 2.3.3. Fibocom
    • 2.3.4. Kontron
    • 2.3.5. MeiG Smart Technology
    • 2.3.6. Murata
    • 2.3.7. Neoway
    • 2.3.8. Nordic Semiconductor
    • 2.3.9. Quectel
    • 2.3.10. Rolling Wireless
    • 2.3.11. Semtech
    • 2.3.12. Sunsea AIoT (SIMCom & Longsung)
    • 2.3.13. Telit Cinterion
    • 2.3.14. Trasna
    • 2.3.15. Other cellular IoT module vendors

3. LoRa and LoRaWAN Ecosystem

  • 3.1. Technology characteristics
  • 3.2. Network footprint
    • 3.2.1. Europe
    • 3.2.2. Asia-Pacific
    • 3.2.3. The Americas
    • 3.2.4. Middle East & Africa
  • 3.3. Semiconductor and module vendors
    • 3.3.1. Semtech
    • 3.3.2. Other semiconductor vendors
    • 3.3.3. LoRa module vendors

4. Sigfox Ecosystem

  • 4.1. Technology characteristics
  • 4.2. Network footprint
    • 4.2.1. Europe
    • 4.2.2. The Americas
    • 4.2.3. Asia-Pacific
    • 4.2.4. Middle East & Africa
    • 4.2.5. UnaBiz partners with the LoRaWAN ecosystem
    • 4.2.6. Examples of major Sigfox use cases
  • 4.3. Semiconductor and module vendors
    • 4.3.1. Semiconductor vendors
    • 4.3.2. Sigfox module vendors

5. Emerging LPWA Ecosystems

  • 5.1. IEEE 802.15.4
    • 5.1.1. Connectivity stacks based on 802.15.4
    • 5.1.2. Network footprint
  • 5.2. Wirepas Mesh
  • 5.3. DECT-2020 NR (NR+)
  • 5.4. Mioty
  • 5.5. Chipset and module vendors

6. Market Forecasts and Trends

  • 6.1. Market summary
  • 6.2. The cellular IoT device market
    • 6.2.1. Europe
    • 6.2.2. North America
    • 6.2.3. Latin America
    • 6.2.4. China
    • 6.2.5. Rest of Asia-Pacific
    • 6.2.6. Middle East & Africa
  • 6.3. The LoRa device market
  • 6.4. The Sigfox device market
  • 6.5. Emerging LPWA technologies
  • List of Acronyms and Abbreviations

List of Figures

  • Figure 1.1: Top wide area IoT target segments (2024)
  • Figure 1.2: Building stock by category (EU27+3/US 2024)
  • Figure 1.3: Unlicensed and reserved radio frequencies available for wireless IoT
  • Figure 1.4: Cost comparison for wireless modules (2025)
  • Figure 2.1: Comparison of LTE Cat-1, LTE Cat-1 bis, LTE-M and NB-IoT specifications
  • Figure 2.2: Comparison of RedCap and eRedCap specifications
  • Figure 2.3: Technology positioning of RedCap in relation to eMBB, URLLC and mMTC
  • Figure 2.4: IoT solution design options
  • Figure 2.5: Cost comparison between module and chipset designs
  • Figure 2.6: Routes to market for cellular IoT chipsets
  • Figure 2.7: Cellular IoT chipset vendor volume market shares (World 2024)
  • Figure 2.8: Business activities of key cellular chipset providers (Q2-2025)
  • Figure 2.9: ASR Microelectronics' cellular IoT chipsets (Q2-2025)
  • Figure 2.10: Eigencomm's cellular IoT chipsets (Q2-2025)
  • Figure 2.11: MediaTek's cellular IoT chipsets (Q2-2025)
  • Figure 2.12: MLINK's IoT chipsets (Q2-2025)
  • Figure 2.13: Qualcomm's IoT modem chipsets (Q2-2025)
  • Figure 2.14: QCT revenues by segment (2022-2024)
  • Figure 2.15: Samsung's automotive chip solutions
  • Figure 2.16: Sequans' revenues by product segment (2020-2024)
  • Figure 2.17: UNISOC's cellular IoT chipsets (Q2-2025)
  • Figure 2.18: Xinyi's cellular IoT chipsets (Q2-2025)
  • Figure 2.19: Business activities of other cellular chipset providers (Q2-2025)
  • Figure 2.20: Top cellular IoT module vendors, by revenues and shipments (World 2024)
  • Figure 2.21: Fibocom's embedded wireless IoT modules (Q2-2025)
  • Figure 2.22: Fibocom's AI-powered robot solution
  • Figure 2.23: MeiG's embedded cellular IoT modules (Q2-2025)
  • Figure 2.24: Neoway's revenue by segment (2021-2024)
  • Figure 2.25: Neoway's embedded cellular IoT modules (Q2-2025)
  • Figure 2.26: Nordic Semiconductor's revenues by segment (2020-2024)
  • Figure 2.27: Feature comparison of the nRF91 Series SiPs
  • Figure 2.28: Quectel's cellular IoT module series (Q2-2025)
  • Figure 2.29: Semtech's embedded cellular module series (Q2-2025)
  • Figure 2.30: Semtech's embedded cellular modules (Q2-2025)
  • Figure 2.31: Sunsea AIoT's revenue by segment (2021-2024)
  • Figure 2.32: Embedded cellular IoT modules from SIMCom and Longsung (Q2-2025)
  • Figure 2.33: Overview of the SIMCom AI stack
  • Figure 2.34: Telit Cinterion's embedded cellular IoT modules (Q2-2025)
  • Figure 2.35: Trasna's embedded cellular IoT modules (Q2-2025)
  • Figure 3.1: LoRaWAN network architecture
  • Figure 3.2: Public LoRaWAN network operators in Europe (Q1-2025)
  • Figure 3.3: Public LoRaWAN network operators in Asia-Pacific (Q1-2025)
  • Figure 3.4: Public LoRaWAN network operators in the Americas (Q1-2025)
  • Figure 3.5: Amazon Sidewalk network coverage (Q2-2025)
  • Figure 3.6: Public LoRaWAN network operators in Middle East & Africa (Q1-2025)
  • Figure 3.7: Semtech's LoRa business KPIs (FY-2022-FY-2025)
  • Figure 3.8: LoRa module vendors (Q2-2025)
  • Figure 4.1: Sigfox network architecture
  • Figure 4.2: Sigfox network partners in Europe (Q1-2025)
  • Figure 4.3: Sigfox networks in the Americas (Q1-2025)
  • Figure 4.4: Sigfox networks in Asia-Pacific and MEA (Q1-2025)
  • Figure 4.5: List of Sigfox module vendors by supported regions (Q1-2025)
  • Figure 5.1: Major 802.15.4 networking platforms for smart metering (Q1-2025)
  • Figure 5.2: Technology positioning for NR+ in relation to eMBB, URLLC and mMTC
  • Figure 5.3: The Mioty telegram splitting technology
  • Figure 5.4: Members of the Mioty Alliance (Q1-2025)
  • Figure 6.1: Cellular/non-3GPP LPWA IoT device shipments by region (World 2023-2029)
  • Figure 6.2: Cellular/non-3GPP LPWA IoT device shipments by technology (World 2024)
  • Figure 6.3: Cellular IoT module shipments by region and vertical (World 2023-2029)
  • Figure 6.4: Cellular IoT module shipment forecast by technology (World 2023-2029)
  • Figure 6.5: Cellular IoT module shipment forecast (Europe 2023-2029)
  • Figure 6.6: Cellular IoT module shipment forecast (North America 2023-2029)
  • Figure 6.7: Cellular IoT module shipment forecast (Latin America 2023-2029)
  • Figure 6.8: Cellular IoT module shipment forecast (China 2023-2029)
  • Figure 6.9: Cellular IoT module shipment forecast (Rest of Asia-Pacific 2023-2029)
  • Figure 6.10: Cellular IoT module shipment forecast (Middle East & Africa 2023-2029)
  • Figure 6.11: LoRa device shipments forecast (World 2023-2029)
  • Figure 6.12: Sigfox device shipments forecast (World 2023-2029)
  • Figure 6.13: 802.15.4 WAN device shipments forecast (World 2023-2029)