查看购物车
  • Traditional Chinese
  • English
  • Japanese
  • Korean
封面
市场调查报告书
商品编码
1517445

全球键合线市场规模研究，依材料（金、铜、银、铝等）、应用（积体电路、电晶体、感测器等）及 2022-2032 年区域预测

Global Bonding Wires Market Size study, by Material (Gold, Copper, Silver, Aluminum, Others), by Application (Integrated Circuits, Transistors, Sensors, Others), and Regional Forecasts 2022-2032
出版日期: | 出版商: Bizwit Research & Consulting LLP | 英文 200 Pages | 商品交期: 2-3个工作天内

价格
简介目录

2023年全球键合线市场价值约为129.6亿美元，预计在2024-2032年预测期内将以超过3.7%的健康成长率成长。键合线是半导体封装中的关键元件，旨在在积体电路 (IC) 晶片与其外部引线或端子之间建立电气连接。这些电线通常由金、铝或铜组成，可确保半导体装置内电讯号的可靠传输，在热膨胀和收缩时维持装置功能方面发挥关键作用。它们在微电子组装中是不可或缺的，可确保电子设备和积体电路的性能和寿命。半导体产业的扩张是键合线市场的主要驱动力。随着消费性电子、汽车、电信和工业领域等应用对半导体晶片的需求不断增加，对键合线的需求也日益增加。智慧型手机、物联网设备、电动车和智慧家电的激增进一步推动了对先进半导体封装的需求，从而推动了键合线市场的发展。

此外，半导体封装技术的持续创新正在促进先进键合线解决方案的发展。製造商专注于製造更薄、更强、更可靠的键合线，以满足半导体装置不断变化的需求。铜键合线、细间距键合和先进引线键合技术等创新正在提高电子设备的性能、效率和可靠性，从而推动市场成长。然而，半导体装置的小型化给键合线製造商带来了重大的技术挑战。对更细线径和更紧密节距的需求需要高精度和先进的製造工艺，从而导致生产成本增加并可能降低良率。儘管存在这些挑战，电子设备小型化的趋势为键合线製造商提供了重要的机会来开发超细线，以在更小的半导体封装内容纳更密集的互连。

全球键合线市场研究考虑的关键区域包括北美、欧洲、亚太地区、拉丁美洲以及中东和非洲。由于亚太地区作为电子製造中心的角色以及对电子设备的需求不断增长，预计到 2023 年，亚太地区将主导键合线市场。中国、日本、韩国和台湾等国家的快速工业化和城市化进一步促进了键合线产业的成长。此外，预计北美地区的成长最快。该地区受益于对技术和创新的大量投资、强大的供应链基础设施以及促进工业成长的有利政府政策。

目录

第 1 章：全球键合线市场执行摘要

  • 全球键合线市场规模及预测（2022-2032）
  • 区域概要
  • 分部摘要
    • 按材质
    • 按申请
  • 主要趋势
  • 经济衰退的影响
  • 分析师推荐与结论

第 2 章：全球键合线市场定义与研究假设

  • 研究目的
  • 市场定义
  • 研究假设
    • 包容与排除
    • 限制
    • 供给侧分析
      • 可用性
      • 基础设施
      • 监管环境
      • 市场竞争
      • 经济可行性（消费者的角度）
    • 需求面分析
      • 监理框架
      • 技术进步
      • 环境考虑
      • 消费者意识和接受度
  • 估算方法
  • 研究考虑的年份
  • 货币兑换率

第 3 章：全球键合线市场动态

  • 市场驱动因素
    • 对半导体晶片的需求不断增长
    • 半导体封装技术的创新
  • 市场挑战
    • 小型化的技术挑战
    • 生产成本增加
  • 市场机会
    • 超细接合线的开发
    • 电子工业的发展

第 4 章：全球键合线市场产业分析

  • 波特的五力模型
    • 供应商的议价能力
    • 买家的议价能力
    • 新进入者的威胁
    • 替代品的威胁
    • 竞争竞争
    • 波特五力模型的未来方法
    • 波特的 5 力影响分析
  • PESTEL分析
    • 政治的
    • 经济
    • 社会的
    • 技术性
    • 环境的
    • 合法的
  • 顶级投资机会
  • 最佳制胜策略
  • 颠覆性趋势
  • 产业专家视角
  • 分析师推荐与结论

第 5 章：2022-2032 年全球键结线市场规模及材料预测

  • 细分仪表板
  • 全球键合线市场：2022 年和 2032 年材料收入趋势分析
    • 金子
    • 铜
    • 银
    • 铝
    • 其他的

第 6 章：2022-2032 年全球键结线市场规模及应用预测

  • 细分仪表板
  • 全球键合线市场：2022 年和 2032 年应用收入趋势分析
    • 积体电路
    • 电晶体
    • 感应器
    • 其他的

第 7 章：2022-2032 年全球键结线市场规模及按地区预测

  • 北美键合线市场
    • 美国键合线市场
      • 2022-2032 年材料细分尺寸与预测
      • 2022-2032 年应用细分规模与预测
    • 加拿大键合线市场
  • 欧洲键合线市场
    • 英国键合线市场
    • 德国键合线市场
    • 法国键合线市场
    • 西班牙键合线市场
    • 义大利键合线市场
    • 欧洲其他地区键合线市场
  • 亚太键合线市场
    • 中国键合线市场
    • 印度键合线市场
    • 日本键合线市场
    • 澳洲键合线市场
    • 韩国键合线市场
    • 亚太地区其他键合线市场
  • 拉丁美洲键合线市场
    • 巴西键合线市场
    • 墨西哥键合线市场
    • 拉丁美洲其他地区键合线市场
  • 中东和非洲键合线市场
    • 沙乌地阿拉伯键合线市场
    • 南非键合线市场
    • 中东和非洲其他地区键合线市场

第 8 章：竞争情报

  • 重点企业SWOT分析
  • 顶级市场策略
  • 公司简介
    • Tanaka Holdings Co., Ltd.
      • 关键讯息
      • 概述
      • 财务（视数据可用性而定）
      • 产品概要
      • 市场策略
    • Heraeus Holding GmbH
    • TATSUTA Electric Wire & Cable Co., Ltd.
    • Sumitomo Metal Mining Co., Ltd.
    • MK Electron Co., Ltd.
    • Yantai Zhaojin Kanfort Precision Machinery Co., Ltd.
    • Shinkawa Electric Co., Ltd.
    • AMETEK Electronic Components and Packaging
    • TANAKA Denshi Kogyo KK
    • NIPPON STEEL Chemical & Material Co., Ltd.
    • Palomar Technologies
    • California Fine Wire Company
    • Shinkawa Ltd.
    • Custom Chip Connectors, LLC
    • Kulicke & Soffa Industries, Inc.

第 9 章：研究过程

  • 研究过程
    • 资料探勘
    • 分析
    • 市场预测
    • 验证
    • 出版
  • 研究属性
简介目录

The Global Bonding Wires Market is valued at approximately USD 12.96 billion in 2023 and is anticipated to grow with a healthy growth rate of more than 3.7% over the forecast period 2024-2032. Bonding wires are crucial elements in semiconductor packaging, designed to establish electrical connections between the integrated circuit (IC) chip and its external leads or terminals. Typically composed of gold, aluminum, or copper, these wires ensure the reliable transmission of electrical signals within semiconductor devices, playing a critical role in maintaining device functionality amidst thermal expansions and contractions. They are indispensable in microelectronics assembly, ensuring the performance and longevity of electronic devices and integrated circuits. The semiconductor industry's expansion is the primary driver of the bonding wires market. With the escalating demand for semiconductor chips across applications such as consumer electronics, automotive, telecommunications, and industrial sectors, the necessity for bonding wires intensifies. The surge in smartphones, IoT devices, electric vehicles, and smart appliances further propels the demand for advanced semiconductor packages, thus boosting the bonding wires market.

Moreover, Continuous innovations in semiconductor packaging technologies are fostering the development of advanced bonding wire solutions. Manufacturers are focusing on creating thinner, stronger, and more reliable bonding wires to meet the evolving needs of semiconductor devices. Innovations such as copper bonding wires, fine pitch bonding, and advanced wire bonding techniques are enhancing the performance, efficiency, and reliability of electronic devices, thereby driving market growth. However, the miniaturization of semiconductor devices presents significant technological challenges for bonding wire manufacturers. The demand for finer wire diameters and tighter pitch spacing requires high precision and advanced manufacturing processes, leading to increased production costs and potentially reduced yield rates. Despite these challenges, the trend towards the miniaturization of electronic devices offers significant opportunities for bonding wire manufacturers to develop ultra-fine wires that accommodate denser interconnects within smaller semiconductor packages.

Key regions considered in the Global Bonding Wires Market study include North America, Europe, Asia Pacific, Latin America, and the Middle East & Africa. The Asia-Pacific region is expected to dominate the bonding wires market, in year 2023, driven by its role as a hub for electronics manufacturing and the rising demand for electronic devices. Rapid industrialization and urbanization in countries such as China, Japan, South Korea, and Taiwan further contribute to the growth of the bonding wires industry. Moreover, North America is projected to have fastest growth. The region benefits from substantial investments in technology and innovation, a strong supply chain infrastructure, and favorable government policies promoting industrial growth.

Major market player included in this report are:

  • Tanaka Holdings Co., Ltd.
  • Heraeus Holding GmbH
  • TATSUTA Electric Wire & Cable Co., Ltd.
  • Sumitomo Metal Mining Co., Ltd.
  • MK Electron Co., Ltd.
  • Yantai Zhaojin Kanfort Precision Machinery Co., Ltd.
  • Shinkawa Electric Co., Ltd.
  • AMETEK Electronic Components and Packaging
  • TANAKA Denshi Kogyo K.K.
  • NIPPON STEEL Chemical & Material Co., Ltd.
  • Palomar Technologies
  • California Fine Wire Company
  • Shinkawa Ltd.
  • Custom Chip Connectors, LLC
  • Kulicke & Soffa Industries, Inc.

The detailed segments and sub-segment of the market are explained below:

By Material:

  • Gold
  • Copper
  • Silver
  • Aluminum
  • Others

By Application:

  • Integrated Circuits
  • Transistors
  • Sensors
  • Others

By Region:

  • North America
  • U.S.
  • Canada
  • Europe
  • Germany
  • UK
  • France
  • Spain
  • Italy
  • Rest of Europe
  • Asia-Pacific
  • China
  • India
  • Japan
  • South Korea
  • Australia
  • Rest of Asia-Pacific
  • Latin America
  • Brazil
  • Mexico
  • Rest of Latin America
  • Middle East and Africa
  • Saudi Arabia
  • South Africa
  • Rest of LAMEA

Years considered for the study are as follows:

  • Historical year - 2022
  • Base year - 2023
  • Forecast period - 2024 to 2032

Key Takeaways:

  • Market Estimates & Forecast for 10 years from 2022 to 2032.
  • Annualized revenues and regional level analysis for each market segment.
  • Detailed analysis of geographical landscape with Country level analysis of major regions.
  • Competitive landscape with information on major players in the market.
  • Analysis of key business strategies and recommendations on future market approach.
  • Analysis of competitive structure of the market.
  • Demand side and supply side analysis of the market.

Table of Contents

Chapter 1. Global Bonding Wires Market Executive Summary

  • 1.1. Global Bonding Wires Market Size & Forecast (2022-2032)
  • 1.2. Regional Summary
  • 1.3. Segmental Summary
    • 1.3.1. By Material
    • 1.3.2. By Application
  • 1.4. Key Trends
  • 1.5. Recession Impact
  • 1.6. Analyst Recommendation & Conclusion

Chapter 2. Global Bonding Wires Market Definition and Research Assumptions

  • 2.1. Research Objective
  • 2.2. Market Definition
  • 2.3. Research Assumptions
    • 2.3.1. Inclusion & Exclusion
    • 2.3.2. Limitations
    • 2.3.3. Supply Side Analysis
      • 2.3.3.1. Availability
      • 2.3.3.2. Infrastructure
      • 2.3.3.3. Regulatory Environment
      • 2.3.3.4. Market Competition
      • 2.3.3.5. Economic Viability (Consumer's Perspective)
    • 2.3.4. Demand Side Analysis
      • 2.3.4.1. Regulatory frameworks
      • 2.3.4.2. Technological Advancements
      • 2.3.4.3. Environmental Considerations
      • 2.3.4.4. Consumer Awareness & Acceptance
  • 2.4. Estimation Methodology
  • 2.5. Years Considered for the Study
  • 2.6. Currency Conversion Rates

Chapter 3. Global Bonding Wires Market Dynamics

  • 3.1. Market Drivers
    • 3.1.1. Rising Demand for Semiconductor Chips
    • 3.1.2. Innovations in Semiconductor Packaging Technologies
  • 3.2. Market Challenges
    • 3.2.1. Technological Challenges of Miniaturization
    • 3.2.2. Increased Production Costs
  • 3.3. Market Opportunities
    • 3.3.1. Development of Ultra-Fine Bonding Wires
    • 3.3.2. Growth of the Electronics Industry

Chapter 4. Global Bonding Wires Market Industry Analysis

  • 4.1. Porter's 5 Force Model
    • 4.1.1. Bargaining Power of Suppliers
    • 4.1.2. Bargaining Power of Buyers
    • 4.1.3. Threat of New Entrants
    • 4.1.4. Threat of Substitutes
    • 4.1.5. Competitive Rivalry
    • 4.1.6. Futuristic Approach to Porter's 5 Force Model
    • 4.1.7. Porter's 5 Force Impact Analysis
  • 4.2. PESTEL Analysis
    • 4.2.1. Political
    • 4.2.2. Economical
    • 4.2.3. Social
    • 4.2.4. Technological
    • 4.2.5. Environmental
    • 4.2.6. Legal
  • 4.3. Top investment opportunity
  • 4.4. Top winning strategies
  • 4.5. Disruptive Trends
  • 4.6. Industry Expert Perspective
  • 4.7. Analyst Recommendation & Conclusion

Chapter 5. Global Bonding Wires Market Size & Forecasts by Material 2022-2032

  • 5.1. Segment Dashboard
  • 5.2. Global Bonding Wires Market: Material Revenue Trend Analysis, 2022 & 2032 (USD Billion)
    • 5.2.1. Gold
    • 5.2.2. Copper
    • 5.2.3. Silver
    • 5.2.4. Aluminum
    • 5.2.5. Others

Chapter 6. Global Bonding Wires Market Size & Forecasts by Application 2022-2032

  • 6.1. Segment Dashboard
  • 6.2. Global Bonding Wires Market: Application Revenue Trend Analysis, 2022 & 2032 (USD Billion)
    • 6.2.1. Integrated Circuits
    • 6.2.2. Transistors
    • 6.2.3. Sensors
    • 6.2.4. Others

Chapter 7. Global Bonding Wires Market Size & Forecasts by Region 2022-2032

  • 7.1. North America Bonding Wires Market
    • 7.1.1. U.S. Bonding Wires Market
      • 7.1.1.1. Material breakdown size & forecasts, 2022-2032
      • 7.1.1.2. Application breakdown size & forecasts, 2022-2032
    • 7.1.2. Canada Bonding Wires Market
  • 7.2. Europe Bonding Wires Market
    • 7.2.1. U.K. Bonding Wires Market
    • 7.2.2. Germany Bonding Wires Market
    • 7.2.3. France Bonding Wires Market
    • 7.2.4. Spain Bonding Wires Market
    • 7.2.5. Italy Bonding Wires Market
    • 7.2.6. Rest of Europe Bonding Wires Market
  • 7.3. Asia-Pacific Bonding Wires Market
    • 7.3.1. China Bonding Wires Market
    • 7.3.2. India Bonding Wires Market
    • 7.3.3. Japan Bonding Wires Market
    • 7.3.4. Australia Bonding Wires Market
    • 7.3.5. South Korea Bonding Wires Market
    • 7.3.6. Rest of Asia Pacific Bonding Wires Market
  • 7.4. Latin America Bonding Wires Market
    • 7.4.1. Brazil Bonding Wires Market
    • 7.4.2. Mexico Bonding Wires Market
    • 7.4.3. Rest of Latin America Bonding Wires Market
  • 7.5. Middle East & Africa Bonding Wires Market
    • 7.5.1. Saudi Arabia Bonding Wires Market
    • 7.5.2. South Africa Bonding Wires Market
    • 7.5.3. Rest of Middle East & Africa Bonding Wires Market

Chapter 8. Competitive Intelligence

  • 8.1. Key Company SWOT Analysis
  • 8.2. Top Market Strategies
  • 8.3. Company Profiles
    • 8.3.1. Tanaka Holdings Co., Ltd.
      • 8.3.1.1. Key Information
      • 8.3.1.2. Overview
      • 8.3.1.3. Financial (Subject to Data Availability)
      • 8.3.1.4. Product Summary
      • 8.3.1.5. Market Strategies
    • 8.3.2. Heraeus Holding GmbH
    • 8.3.3. TATSUTA Electric Wire & Cable Co., Ltd.
    • 8.3.4. Sumitomo Metal Mining Co., Ltd.
    • 8.3.5. MK Electron Co., Ltd.
    • 8.3.6. Yantai Zhaojin Kanfort Precision Machinery Co., Ltd.
    • 8.3.7. Shinkawa Electric Co., Ltd.
    • 8.3.8. AMETEK Electronic Components and Packaging
    • 8.3.9. TANAKA Denshi Kogyo K.K.
    • 8.3.10. NIPPON STEEL Chemical & Material Co., Ltd.
    • 8.3.11. Palomar Technologies
    • 8.3.12. California Fine Wire Company
    • 8.3.13. Shinkawa Ltd.
    • 8.3.14. Custom Chip Connectors, LLC
    • 8.3.15. Kulicke & Soffa Industries, Inc.

Chapter 9. Research Process

  • 9.1. Research Process
    • 9.1.1. Data Mining
    • 9.1.2. Analysis
    • 9.1.3. Market Estimation
    • 9.1.4. Validation
    • 9.1.5. Publishing
  • 9.2. Research Attributes