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市场调查报告书
商品编码
1681065

全球电气和电子黏合剂市场规模研究，按产品（导热、导电）、按应用（表面贴装设备）和区域预测 2022-2032

Global Electrical and Electronic Adhesive Market Size Study, by Product (Thermal Conductive, Electrically Conductive), by Application (Surface-Mount Devices) and Regional Forecasts 2022-2032
出版日期: | 出版商: Bizwit Research & Consulting LLP | 英文 285 Pages | 商品交期: 2-3个工作天内

价格
简介目录

2023 年全球电气和电子胶合剂市场价值约为 58.1 亿美元，预计在 2024-2032 年预测期内复合年增长率为 8.00%。电气和电子产业对先进黏合剂解决方案的采用日益增多，特别是在电路组装、半导体封装和元件黏合领域，正在推动市场扩张。这些黏合剂以其优异的导电性、机械稳定性和耐热性而闻名，正在日益取代传统的焊接技术，确保电子製造中性能的提高、成本效益的提高和环境合规性。

黏合剂配方的快速创新，加上对小型化和高性能电子设备的需求激增，增强了对导热和导电黏合剂的需求。在严格的RoHS和REACH法规的推动下，人们对无铅和环保材料的偏好日益增加，进一步加速了下一代导电胶的采用。然而，材料成本高和极端条件下的性能限制等挑战可能会抑制市场成长。儘管如此，正在进行的研发工作有望提高黏合剂的性能、可靠性和应用的多功能性，为持续扩张铺平道路。

从区域来看，北美在市场上占据主导地位，这得益于电子製造商的强大影响力、技术进步以及半导体领域的高研发投入。美国仍然是主要贡献者，利用其强大的电子製造生态系统并增加柔性印刷电路板（FPCB）中导电黏合剂的部署。同时，欧洲紧随其后，受益于对汽车电子、消费性电子和再生能源应用的日益重视。

受中国、日本、韩国和印度电子产业蓬勃发展的推动，亚太地区将在预测期内经历最快的成长。该地区不断扩大的半导体和消费性电子製造业，加上政府对 PCB 和微电子生产的支持力度不断加大，预计将推动庞大的市场需求。此外，在工业化进程不断扩大、基础设施发展和智慧电子解决方案需求不断增长的推动下，拉丁美洲、中东和非洲正在经历稳步增长。

本报告包括的主要市场参与者：

  • 3M 公司
  • 汉高股份公司
  • HB Fuller 公司
  • 陶氏公司
  • 巴斯夫
  • 艾利丹尼森公司
  • 洛德公司
  • Permabond 工程胶黏剂
  • 主邦德公司
  • Aremco 产品公司
  • Panacol-Elosol 有限公司
  • DELO 工业用黏合剂
  • 派克汉尼汾公司
  • 信越化学工业株式会社
  • 博斯蒂克公司

市场的详细细分和子细分解释如下：

目录

第 1 章：全球电气和电子胶合剂市场执行摘要

  • 全球电气及电子胶合剂市场规模及预测（2022-2032 年）
  • 区域概况
  • 节段概要
    • {按产品}
    • {按应用}
  • 主要趋势
  • 经济衰退的影响
  • 分析师建议与结论

第 2 章：全球电气和电子胶合剂市场定义和研究假设

  • 研究目标
  • 市场定义
  • 研究假设
    • 包容与排斥
    • 限制
    • 供给侧分析
      • 可用性
      • 基础设施
      • 监管环境
      • 市场竞争
      • 经济可行性（消费者的观点）
    • 需求面分析
      • 监理框架
      • 技术进步
      • 环境考虑
      • 消费者认知与接受度
  • 估算方法
  • 研究考虑的年份
  • 货币兑换率

第 3 章：全球电气和电子黏合剂市场动态

  • 市场驱动因素
    • 先进黏合剂解决方案的采用日益增多
    • 创新黏合剂配方和监管压力
    • 小型电子设备需求不断成长
  • 市场挑战
    • 材料成本高
    • 极端条件下的性能限制
  • 市场机会
    • 新兴市场的扩张
    • 转向无铅和环保黏合剂
    • 半导体封装和元件键结应用的成长

第四章：全球电气和电子胶合剂市场产业分析

  • 波特五力模型
    • 供应商的议价能力
    • 买家的议价能力
    • 新进入者的威胁
    • 替代品的威胁
    • 竞争对手
    • 波特五力模型的未来方法
    • 波特五力影响分析
  • PESTEL 分析
    • 政治的
    • 经济
    • 社会的
    • 科技
    • 环境的
    • 合法的
  • 最佳投资机会
  • 最佳获胜策略
  • 颠覆性趋势
  • 产业专家观点
  • 分析师建议与结论

第 5 章：全球电气和电子胶合剂市场规模和预测：按产品 - 2022-2032 年

  • 细分仪表板
  • 全球电气和电子黏合剂市场：{产品} 收入趋势分析，2022 年和 2032 年（百万美元/十亿美元）
    • 热传导
    • 导电

第 6 章：全球电气和电子胶合剂市场规模和预测：按应用 - 2022-2032 年

  • 细分仪表板
  • 全球电气和电子黏合剂市场：{应用} 收入趋势分析，2022 年和 2032 年（百万美元/十亿美元）
    • 表面贴装元件

第 7 章：全球电气和电子胶合剂市场规模和预测：按地区 - 2022-2032 年

  • 北美洲
    • 我们
    • 加拿大
  • 欧洲
    • 英国
    • 德国
    • 法国
    • 西班牙
    • 义大利
    • 欧洲其他地区
  • 亚太地区
    • 中国
    • 印度
    • 日本
    • 澳洲
    • 韩国
    • 亚太其他地区
  • 拉丁美洲
    • 巴西
    • 墨西哥
    • 拉丁美洲其他地区
  • 中东和非洲
    • 沙乌地阿拉伯
    • 南非
    • 中东和非洲其他地区

第 8 章：竞争情报

  • 重点公司 SWOT 分析
    • 3M Company
    • Henkel AG & Co. KGaA
    • HB Fuller Company
  • 顶级市场策略
  • 公司简介
    • 3M Company
      • 关键讯息
      • 概述
      • 财务（取决于数据可用性）
      • 产品概述
      • 市场策略
    • Dow Inc.
    • BASF SE
    • Avery Dennison Corporation
    • Lord Corporation
    • Permabond Engineering Adhesives
    • Master Bond Inc.
    • Aremco Products Inc.
    • Panacol-Elosol GmbH
    • DELO Industrial Adhesives
    • Parker Hannifin Corporation
    • Shin-Etsu Chemical Co., Ltd.
    • Bostik SA

第九章：研究过程

  • 研究进程
    • 资料探勘
    • 分析
    • 市场评估
    • 验证
    • 出版
  • 研究属性
简介目录

The Global Electrical and Electronic Adhesive Market was valued at approximately USD 5.81 billion in 2023 and is anticipated to grow at a CAGR of 8.00% over the forecast period 2024-2032. The escalating adoption of advanced adhesive solutions in the electrical and electronics industry, particularly for circuit assembly, semiconductor packaging, and component bonding, is fueling market expansion. These adhesives, known for their superior conductivity, mechanical stability, and thermal resistance, are increasingly replacing traditional soldering techniques, ensuring enhanced performance, cost-effectiveness, and environmental compliance in electronic manufacturing.

Rapid innovations in adhesive formulations, coupled with the surging demand for miniaturized and high-performance electronic devices, are reinforcing the need for thermally conductive and electrically conductive adhesives. The increasing preference for lead-free and environmentally friendly materials, driven by stringent RoHS and REACH regulations, has further accelerated the adoption of next-generation conductive adhesives. However, challenges such as high material costs and performance limitations in extreme conditions may restrain market growth. Nonetheless, ongoing R&D efforts are poised to enhance adhesive properties, reliability, and application versatility, paving the way for sustained expansion.

Regionally, North America holds a dominant position in the market, driven by the strong presence of electronics manufacturers, technological advancements, and high R&D investments in the semiconductor sector. The United States remains a key contributor, leveraging its robust electronic manufacturing ecosystem and increasing deployment of electrically conductive adhesives in flexible printed circuit boards (FPCBs). Meanwhile, Europe follows closely, benefitting from the rising emphasis on automotive electronics, consumer electronics, and renewable energy applications.

The Asia-Pacific region is set to experience the fastest growth over the forecast period, fueled by the booming electronics industry in China, Japan, South Korea, and India. The region's expanding semiconductor and consumer electronics manufacturing sector, coupled with increasing government support for PCB and microelectronics production, is expected to drive substantial market demand. Additionally, Latin America and the Middle East & Africa are witnessing steady growth, supported by expanding industrialization, infrastructure development, and growing demand for smart electronic solutions.

Major Market Players Included in This Report:

  • 3M Company
  • Henkel AG & Co. KGaA
  • H.B. Fuller Company
  • Dow Inc.
  • BASF SE
  • Avery Dennison Corporation
  • Lord Corporation
  • Permabond Engineering Adhesives
  • Master Bond Inc.
  • Aremco Products Inc.
  • Panacol-Elosol GmbH
  • DELO Industrial Adhesives
  • Parker Hannifin Corporation
  • Shin-Etsu Chemical Co., Ltd.
  • Bostik SA

The Detailed Segments and Sub-Segments of the Market Are Explained Below:

By Product:

  • Thermal Conductive
  • Electrically Conductive

By Application:

  • Surface-Mount Devices

By Region:

North America:

  • U.S.
  • Canada

Europe:

  • UK
  • Germany
  • France
  • Spain
  • Italy
  • Rest of Europe

Asia Pacific:

  • China
  • India
  • Japan
  • Australia
  • South Korea
  • Rest of Asia Pacific

Latin America:

  • Brazil
  • Mexico
  • Rest of Latin America

Middle East & Africa:

  • Saudi Arabia
  • South Africa
  • Rest of Middle East & Africa

Years Considered for the Study:

  • Historical Year: 2022
  • Base Year: 2023
  • Forecast Period: 2024 to 2032

Key Takeaways:

  • Market estimates & forecasts for 10 years (2022-2032).
  • Annualized revenue breakdown and regional-level analysis for each market segment.
  • Detailed geographical assessment with country-level insights.
  • Competitive landscape overview with insights on major industry players.
  • Analysis of key business strategies and recommendations for future market expansion.
  • Evaluation of market structure and competition in the electrical and electronic adhesive sector.
  • Demand-side and supply-side dynamics analysis.

Table of Contents

Chapter 1. Global Electrical and Electronic Adhesive Market Executive Summary

  • 1.1. Global Electrical and Electronic Adhesive Market Size & Forecast (2022-2032)
  • 1.2. Regional Summary
  • 1.3. Segmental Summary
    • 1.3.1. {By Product}
    • 1.3.2. {By Application}
  • 1.4. Key Trends
  • 1.5. Recession Impact
  • 1.6. Analyst Recommendation & Conclusion

Chapter 2. Global Electrical and Electronic Adhesive Market Definition and Research Assumptions

  • 2.1. Research Objective
  • 2.2. Market Definition
  • 2.3. Research Assumptions
    • 2.3.1. Inclusion & Exclusion
    • 2.3.2. Limitations
    • 2.3.3. Supply Side Analysis
      • 2.3.3.1. Availability
      • 2.3.3.2. Infrastructure
      • 2.3.3.3. Regulatory Environment
      • 2.3.3.4. Market Competition
      • 2.3.3.5. Economic Viability (Consumer's Perspective)
    • 2.3.4. Demand Side Analysis
      • 2.3.4.1. Regulatory Frameworks
      • 2.3.4.2. Technological Advancements
      • 2.3.4.3. Environmental Considerations
      • 2.3.4.4. Consumer Awareness & Acceptance
  • 2.4. Estimation Methodology
  • 2.5. Years Considered for the Study
  • 2.6. Currency Conversion Rates

Chapter 3. Global Electrical and Electronic Adhesive Market Dynamics

  • 3.1. Market Drivers
    • 3.1.1. Escalating Adoption of Advanced Adhesive Solutions
    • 3.1.2. Innovative Adhesive Formulations and Regulatory Pressures
    • 3.1.3. Rising Demand for Miniaturized Electronic Devices
  • 3.2. Market Challenges
    • 3.2.1. High Material Costs
    • 3.2.2. Performance Limitations under Extreme Conditions
  • 3.3. Market Opportunities
    • 3.3.1. Expansion in Emerging Markets
    • 3.3.2. Shift towards Lead-Free and Environmentally Friendly Adhesives
    • 3.3.3. Growth in Semiconductor Packaging and Component Bonding Applications

Chapter 4. Global Electrical and Electronic Adhesive Market Industry Analysis

  • 4.1. Porter's 5 Force Model
    • 4.1.1. Bargaining Power of Suppliers
    • 4.1.2. Bargaining Power of Buyers
    • 4.1.3. Threat of New Entrants
    • 4.1.4. Threat of Substitutes
    • 4.1.5. Competitive Rivalry
    • 4.1.6. Futuristic Approach to Porter's 5 Force Model
    • 4.1.7. Porter's 5 Force Impact Analysis
  • 4.2. PESTEL Analysis
    • 4.2.1. Political
    • 4.2.2. Economical
    • 4.2.3. Social
    • 4.2.4. Technological
    • 4.2.5. Environmental
    • 4.2.6. Legal
  • 4.3. Top Investment Opportunity
  • 4.4. Top Winning Strategies
  • 4.5. Disruptive Trends
  • 4.6. Industry Expert Perspective
  • 4.7. Analyst Recommendation & Conclusion

Chapter 5. Global Electrical and Electronic Adhesive Market Size & Forecasts by Product 2022-2032

  • 5.1. Segment Dashboard
  • 5.2. Global Electrical and Electronic Adhesive Market: {Product} Revenue Trend Analysis, 2022 & 2032 (USD Million/Billion)
    • 5.2.1. Thermal Conductive
    • 5.2.2. Electrically Conductive

Chapter 6. Global Electrical and Electronic Adhesive Market Size & Forecasts by Application 2022-2032

  • 6.1. Segment Dashboard
  • 6.2. Global Electrical and Electronic Adhesive Market: {Application} Revenue Trend Analysis, 2022 & 2032 (USD Million/Billion)
    • 6.2.1. Surface-Mount Devices

Chapter 7. Global Electrical and Electronic Adhesive Market Size & Forecasts by Region 2022-2032

  • 7.1. North America Electrical and Electronic Adhesive Market
    • 7.1.1. U.S. Electrical and Electronic Adhesive Market
      • 7.1.1.1. {Product} Breakdown Size & Forecasts, 2022-2032
      • 7.1.1.2. {Application} Breakdown Size & Forecasts, 2022-2032
    • 7.1.2. Canada Electrical and Electronic Adhesive Market
  • 7.2. Europe Electrical and Electronic Adhesive Market
    • 7.2.1. UK Electrical and Electronic Adhesive Market
    • 7.2.2. Germany Electrical and Electronic Adhesive Market
    • 7.2.3. France Electrical and Electronic Adhesive Market
    • 7.2.4. Spain Electrical and Electronic Adhesive Market
    • 7.2.5. Italy Electrical and Electronic Adhesive Market
    • 7.2.6. Rest of Europe Electrical and Electronic Adhesive Market
  • 7.3. Asia Pacific Electrical and Electronic Adhesive Market
    • 7.3.1. China Electrical and Electronic Adhesive Market
    • 7.3.2. India Electrical and Electronic Adhesive Market
    • 7.3.3. Japan Electrical and Electronic Adhesive Market
    • 7.3.4. Australia Electrical and Electronic Adhesive Market
    • 7.3.5. South Korea Electrical and Electronic Adhesive Market
    • 7.3.6. Rest of Asia Pacific Electrical and Electronic Adhesive Market
  • 7.4. Latin America Electrical and Electronic Adhesive Market
    • 7.4.1. Brazil Electrical and Electronic Adhesive Market
    • 7.4.2. Mexico Electrical and Electronic Adhesive Market
    • 7.4.3. Rest of Latin America Electrical and Electronic Adhesive Market
  • 7.5. Middle East & Africa Electrical and Electronic Adhesive Market
    • 7.5.1. Saudi Arabia Electrical and Electronic Adhesive Market
    • 7.5.2. South Africa Electrical and Electronic Adhesive Market
    • 7.5.3. Rest of Middle East & Africa Electrical and Electronic Adhesive Market

Chapter 8. Competitive Intelligence

  • 8.1. Key Company SWOT Analysis
    • 8.1.1. 3M Company
    • 8.1.2. Henkel AG & Co. KGaA
    • 8.1.3. H.B. Fuller Company
  • 8.2. Top Market Strategies
  • 8.3. Company Profiles
    • 8.3.1. 3M Company
      • 8.3.1.1. Key Information
      • 8.3.1.2. Overview
      • 8.3.1.3. Financial (Subject to Data Availability)
      • 8.3.1.4. Product Summary
      • 8.3.1.5. Market Strategies
    • 8.3.2. Dow Inc.
    • 8.3.3. BASF SE
    • 8.3.4. Avery Dennison Corporation
    • 8.3.5. Lord Corporation
    • 8.3.6. Permabond Engineering Adhesives
    • 8.3.7. Master Bond Inc.
    • 8.3.8. Aremco Products Inc.
    • 8.3.9. Panacol-Elosol GmbH
    • 8.3.10. DELO Industrial Adhesives
    • 8.3.11. Parker Hannifin Corporation
    • 8.3.12. Shin-Etsu Chemical Co., Ltd.
    • 8.3.13. Bostik SA

Chapter 9. Research Process

  • 9.1. Research Process
    • 9.1.1. Data Mining
    • 9.1.2. Analysis
    • 9.1.3. Market Estimation
    • 9.1.4. Validation
    • 9.1.5. Publishing
  • 9.2. Research Attributes