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市场调查报告书
商品编码
1890581

全球晶圆切割液市场规模研究与预测，依产品类型（水溶性和水不溶性）、应用（半导体、太阳能晶圆、其他）及区域预测（2025-2035年）

Global Wafer Cutting Fluids Market Size Study & Forecast, by Product Type (Water-Soluble and Water-Insoluble) and Application (Semiconductor, Solar Wafer, Others) and Regional Forecasts 2025-2035
出版日期: | 出版商: Bizwit Research & Consulting LLP | 英文 285 Pages | 商品交期: 2-3个工作天内

价格
简介目录

2024年全球晶圆切割液市场规模约为18.7602亿美元，预计在2025年至2035年的预测期内将以4.87%的复合年增长率成长。晶圆切割液通常经过特殊设计，旨在减少摩擦、控制热量并确保超洁净的切割效果，已成为半导体和光伏製造生产线中不可或缺的组成部分。这些切割液旨在保持高压切割条件下的稳定性，防止微裂纹的产生，并提高用于以极高精度切割硅锭的线锯的效率。随着全球对微晶片、太阳能组件和电子元件的需求加速成长，製造商越来越依赖先进的切割液来实现更严格的製程公差和更高的良率。同时，太阳能晶圆生产技术的进步，包括更薄的晶圆设计和更高产能的生产线，进一步刺激了对能够优化性能和永续性的切割液的需求。

消费性电子、汽车电子、电信和工业自动化等领域半导体装置需求的激增，进一步推高了对高品质晶圆切割解决方案的需求。这些切割液能够直接实现晶圆表面的平滑处理、减少切缝损耗并延长设备寿命，使其成为大批量生产设施中不可或缺的工具。同样，随着各国大力推广再生能源并扩大光电发电规模，太阳能晶圆的生产也持续成长。这种转变反过来又加剧了对能够适应不断变化的晶圆尺寸和快速发展的切割技术的专用切割液的需求。然而，原材料价格波动和严格的环境合规要求等因素限制市场的发展，迫使製造商不断改进配方，以符合永续发展标准。

目录

第一章：全球晶圆切割液市场报告范围与方法

  • 研究目标
  • 研究方法
    • 预测模型
    • 案头研究
    • 自上而下和自下而上的方法
  • 研究属性
  • 研究范围
    • 市场定义
    • 市场区隔
  • 研究假设
    • 包容与排斥
    • 限制
    • 纳入研究的年份

第二章：执行概要

  • CEO/CXO 的立场
  • 战略洞察
  • ESG分析
  • 主要发现

第三章：全球晶圆切割液市场驱动因素分析

  • 影响全球晶圆切割液市场的市场力量（2024-2035）
  • 司机
    • 太阳能晶片生产技术进步
    • 包括更薄的晶圆设计和更高产能的生产线
  • 约束
    • 原物料价格波动
  • 机会
    • 开发专用切削液

第四章：全球晶圆切割液产业分析

  • 波特五力模型
    • 买方的议价能力
    • 供应商的议价能力
    • 新进入者的威胁
    • 替代品的威胁
    • 竞争关係
  • 波特五力预测模型（2024-2035）
  • PESTEL 分析
    • 政治的
    • 经济
    • 社会的
    • 科技
    • 环境的
    • 合法的
  • 最佳投资机会
  • 2025 年最佳胜利策略
  • 市占率分析（2024-2025）
  • 2025年全球定价分析与趋势
  • 分析师建议及结论

第五章：全球晶圆切割液市场规模及预测：依产品类型划分（2025-2035年）

  • 市场概览
  • 全球晶圆切割液市场表现－潜力分析（2025 年）
  • 水溶性
  • 不溶于水

第六章：全球晶圆切割液市场规模及预测：依应用领域划分（2025-2035年）

  • 市场概览
  • 全球晶圆切割液市场表现－潜力分析（2025 年）
  • 半导体
  • 太阳能晶片
  • 其他的

第七章：全球晶圆切割液市场规模及预测：按地区划分（2025-2035年）

  • 成长区域市场概览
  • 领先国家和新兴国家
  • 北美洲
    • 我们
    • 加拿大
  • 欧洲
    • 英国
    • 德国
    • 法国
    • 西班牙
    • 义大利
    • 欧洲其他地区
  • 亚太地区
    • 中国
    • 印度
    • 日本
    • 澳洲
    • 韩国
    • 亚太其他地区
  • 拉丁美洲
    • 巴西
    • 墨西哥
  • 中东和非洲
    • 阿联酋
    • 沙乌地阿拉伯（KSA）
    • 南非

第八章：竞争情报

  • 顶级市场策略
  • Dow Chemical Company
    • 公司概况
    • 主要高阶主管
    • 公司概况
    • 财务绩效（视数据可用性而定）
    • 产品/服务端口
    • 最新进展
    • 市场策略
    • SWOT分析
  • BASF SE
  • ExxonMobil Chemical
  • TotalEnergies SE
  • Daikin Industries
  • Evonik Industries AG
  • Shell Plc
  • Fuchs Petrolub SE
  • Idemitsu Kosan Co., Ltd.
  • Sinopec Corporation
  • Lubrizol Corporation
  • Huntsman International LLC
  • Wacker Chemie AG
  • Sumitomo Chemical Co., Ltd.
  • Kao Corporation
简介目录

The Global Wafer Cutting Fluids Market is valued at approximately USD 1876.02 million in 2024 and is projected to expand at a CAGR of 4.87% throughout the forecast period of 2025-2035. Wafer cutting fluids-often engineered to reduce friction, manage heat, and ensure ultra-clean slicing-have become vital across semiconductor and photovoltaic fabrication lines. These fluids are designed to maintain stability under high-pressure slicing conditions, prevent microcracks, and enhance the efficiency of wire saws used to cut silicon ingots with immaculate precision. As global demand for microchips, solar modules, and electronic components accelerates, manufacturers increasingly rely on advanced cutting fluids to achieve tighter process tolerances and higher yields. Simultaneously, technological advancements in solar wafer production, including thinner wafer designs and higher throughput lines, are further stimulating the need for cutting fluids that can optimize both performance and sustainability.

The surging consumption of semiconductor devices across consumer electronics, automotive electronics, telecommunications, and industrial automation has reinforced demand for high-quality wafer slicing solutions. These fluids contribute directly to smooth wafer surfaces, reduced kerf loss, and extended equipment life-making them indispensable in high-volume fabrication facilities. Similarly, solar wafer production continues to expand as nations push for renewable energy adoption and scale up photovoltaic installations. This shift has, in turn, amplified the need for specialized cutting fluids that can support evolving wafer sizes and rapidly advancing cutting technologies. However, the market faces constraints stemming from fluctuating raw material prices and strict environmental compliance requirements, which compel manufacturers to constantly refine formulations to align with sustainability benchmarks.

The detailed segments and sub-segments included in the report are:

By Product Type:

  • Water-Soluble
  • Water-Insoluble

By Application:

  • Semiconductor
  • Solar Wafer
  • Others

By Region:

North America

  • U.S.
  • Canada

Europe

  • UK
  • Germany
  • France
  • Spain
  • Italy
  • ROE

Asia Pacific

  • China
  • India
  • Japan
  • Australia
  • South Korea
  • RoAPAC

Latin America

  • Brazil
  • Mexico

Middle East & Africa

  • UAE
  • Saudi Arabia
  • South Africa
  • Rest of Middle East & Africa

Water-soluble wafer cutting fluids are projected to dominate the market during the forecast period, largely due to their superior cooling performance, easier waste management, and compatibility with the latest semiconductor wafer slicing techniques. Their ability to disperse heat efficiently and reduce debris build-up has made them the preferred choice in advanced chip fabrication plants. Meanwhile, the semiconductor application segment continues to lead the overall market, holding the largest revenue share owing to the exponential rise in chip production fueled by AI, 5G, IoT, and electric vehicle technologies. Solar wafer applications, however, are poised to become the fastest-growing segment as renewable energy projects surge globally, driving demand for high-precision slicing fluids that can support next-generation photovoltaic manufacturing.

Regional analysis highlights Asia Pacific as the dominant force in the global wafer cutting fluids market. Countries such as China, South Korea, Japan, and Taiwan house some of the world's most advanced semiconductor clusters and mega-scale photovoltaic production lines, making the region a hub for high-performance cutting fluid consumption. North America, driven by strategic semiconductor reshoring initiatives, strong R&D capabilities, and growing solar energy deployment, continues to hold a significant market share. Europe also remains a key participant, supported by its strong automotive electronics industry, rising photovoltaic adoption, and steady investment in semiconductor innovation.

Major market players included in this report are:

  • Dow Chemical Company
  • BASF SE
  • ExxonMobil Chemical
  • TotalEnergies SE
  • Daikin Industries
  • Evonik Industries AG
  • Shell Plc
  • Fuchs Petrolub SE
  • Idemitsu Kosan Co., Ltd.
  • Sinopec Corporation
  • Lubrizol Corporation
  • Huntsman International LLC
  • Wacker Chemie AG
  • Sumitomo Chemical Co., Ltd.
  • Kao Corporation

Global Wafer Cutting Fluids Market Report Scope:

  • Historical Data - 2023, 2024
  • Base Year for Estimation - 2024
  • Forecast period - 2025-2035
  • Report Coverage - Revenue forecast, Company Ranking, Competitive Landscape, Growth Factors, and Trends
  • Regional Scope - North America; Europe; Asia Pacific; Latin America; Middle East & Africa
  • Customization Scope - Free report customization (equivalent to up to 8 analysts' working hours) with purchase. Addition or alteration to country, regional & segment scope*

The objective of the study is to define market sizes of different segments and countries in recent years and to forecast the values for the upcoming years. The report incorporates both qualitative and quantitative dimensions of the industry within the countries covered. It also provides detailed insights into crucial factors such as market drivers, restraints, and challenges shaping future growth trajectories. Moreover, it highlights potential opportunities in micro-markets where stakeholders can strategically invest, along with a comprehensive analysis of the competitive ecosystem and product offerings of leading companies. The detailed segments and sub-segments of the market are explained above.

Key Takeaways:

  • Market estimates & forecast for 10 years from 2025 to 2035.
  • Annualized revenues and regional-level analysis for each market segment.
  • Detailed analysis of the geographical landscape with country-level insights.
  • Competitive landscape with information on major players in the market.
  • Evaluation of key business strategies and recommendations for future market approaches.
  • Assessment of the competitive structure of the market.
  • Demand-side and supply-side analysis of the market.

Table of Contents

Chapter 1. Global Wafer Cutting Fluids Market Report Scope & Methodology

  • 1.1. Research Objective
  • 1.2. Research Methodology
    • 1.2.1. Forecast Model
    • 1.2.2. Desk Research
    • 1.2.3. Top Down and Bottom-Up Approach
  • 1.3. Research Attributes
  • 1.4. Scope of the Study
    • 1.4.1. Market Definition
    • 1.4.2. Market Segmentation
  • 1.5. Research Assumption
    • 1.5.1. Inclusion & Exclusion
    • 1.5.2. Limitations
    • 1.5.3. Years Considered for the Study

Chapter 2. Executive Summary

  • 2.1. CEO/CXO Standpoint
  • 2.2. Strategic Insights
  • 2.3. ESG Analysis
  • 2.4. key Findings

Chapter 3. Global Wafer Cutting Fluids Market Forces Analysis

  • 3.1. Market Forces Shaping The Global Wafer Cutting Fluids Market (2024-2035)
  • 3.2. Drivers
    • 3.2.1. technological advancements in solar wafer production
    • 3.2.2. including thinner wafer designs and higher throughput lines
  • 3.3. Restraints
    • 3.3.1. fluctuating raw material prices
  • 3.4. Opportunities
    • 3.4.1. Growing specialized cutting fluids

Chapter 4. Global Wafer Cutting Fluids Industry Analysis

  • 4.1. Porter's 5 Forces Model
    • 4.1.1. Bargaining Power of Buyer
    • 4.1.2. Bargaining Power of Supplier
    • 4.1.3. Threat of New Entrants
    • 4.1.4. Threat of Substitutes
    • 4.1.5. Competitive Rivalry
  • 4.2. Porter's 5 Force Forecast Model (2024-2035)
  • 4.3. PESTEL Analysis
    • 4.3.1. Political
    • 4.3.2. Economical
    • 4.3.3. Social
    • 4.3.4. Technological
    • 4.3.5. Environmental
    • 4.3.6. Legal
  • 4.4. Top Investment Opportunities
  • 4.5. Top Winning Strategies (2025)
  • 4.6. Market Share Analysis (2024-2025)
  • 4.7. Global Pricing Analysis And Trends 2025
  • 4.8. Analyst Recommendation & Conclusion

Chapter 5. Global Wafer Cutting Fluids Market Size & Forecasts by Product Product Type 2025-2035

  • 5.1. Market Overview
  • 5.2. Global Wafer Cutting Fluids Market Performance - Potential Analysis (2025)
  • 5.3. Water-Soluble
    • 5.3.1. Top Countries Breakdown Estimates & Forecasts, 2024-2035
    • 5.3.2. Market size analysis, by region, 2025-2035
  • 5.4. Water-Insoluble
    • 5.4.1. Top Countries Breakdown Estimates & Forecasts, 2024-2035
    • 5.4.2. Market size analysis, by region, 2025-2035

Chapter 6. Global Wafer Cutting Fluids Market Size & Forecasts by Application 2025-2035

  • 6.1. Market Overview
  • 6.2. Global Wafer Cutting Fluids Market Performance - Potential Analysis (2025)
  • 6.3. Semiconductor
    • 6.3.1. Top Countries Breakdown Estimates & Forecasts, 2024-2035
    • 6.3.2. Market size analysis, by region, 2025-2035
  • 6.4. Solar Wafer
    • 6.4.1. Top Countries Breakdown Estimates & Forecasts, 2024-2035
    • 6.4.2. Market size analysis, by region, 2025-2035
  • 6.5. Others
    • 6.5.1. Top Countries Breakdown Estimates & Forecasts, 2024-2035
    • 6.5.2. Market size analysis, by region, 2025-2035

Chapter 7. Global Wafer Cutting Fluids Market Size & Forecasts by Region 2025-2035

  • 7.1. Growth Wafer Cutting Fluids Market, Regional Market Snapshot
  • 7.2. Top Leading & Emerging Countries
  • 7.3. North America Wafer Cutting Fluids Market
    • 7.3.1. U.S. Wafer Cutting Fluids Market
      • 7.3.1.1. Product Type breakdown size & forecasts, 2025-2035
      • 7.3.1.2. Application breakdown size & forecasts, 2025-2035
    • 7.3.2. Canada Wafer Cutting Fluids Market
      • 7.3.2.1. Product Type breakdown size & forecasts, 2025-2035
      • 7.3.2.2. Application breakdown size & forecasts, 2025-2035
  • 7.4. Europe Wafer Cutting Fluids Market
    • 7.4.1. UK Wafer Cutting Fluids Market
      • 7.4.1.1. Product Type breakdown size & forecasts, 2025-2035
      • 7.4.1.2. Application breakdown size & forecasts, 2025-2035
    • 7.4.2. Germany Wafer Cutting Fluids Market
      • 7.4.2.1. Product Type breakdown size & forecasts, 2025-2035
      • 7.4.2.2. Application breakdown size & forecasts, 2025-2035
    • 7.4.3. France Wafer Cutting Fluids Market
      • 7.4.3.1. Product Type breakdown size & forecasts, 2025-2035
      • 7.4.3.2. Application breakdown size & forecasts, 2025-2035
    • 7.4.4. Spain Wafer Cutting Fluids Market
      • 7.4.4.1. Product Type breakdown size & forecasts, 2025-2035
      • 7.4.4.2. Application breakdown size & forecasts, 2025-2035
    • 7.4.5. Italy Wafer Cutting Fluids Market
      • 7.4.5.1. Product Type breakdown size & forecasts, 2025-2035
      • 7.4.5.2. Application breakdown size & forecasts, 2025-2035
    • 7.4.6. Rest of Europe Wafer Cutting Fluids Market
      • 7.4.6.1. Product Type breakdown size & forecasts, 2025-2035
      • 7.4.6.2. Application breakdown size & forecasts, 2025-2035
  • 7.5. Asia Pacific Wafer Cutting Fluids Market
    • 7.5.1. China Wafer Cutting Fluids Market
      • 7.5.1.1. Product Type breakdown size & forecasts, 2025-2035
      • 7.5.1.2. Application breakdown size & forecasts, 2025-2035
    • 7.5.2. India Wafer Cutting Fluids Market
      • 7.5.2.1. Product Type breakdown size & forecasts, 2025-2035
      • 7.5.2.2. Application breakdown size & forecasts, 2025-2035
    • 7.5.3. Japan Wafer Cutting Fluids Market
      • 7.5.3.1. Product Type breakdown size & forecasts, 2025-2035
      • 7.5.3.2. Application breakdown size & forecasts, 2025-2035
    • 7.5.4. Australia Wafer Cutting Fluids Market
      • 7.5.4.1. Product Type breakdown size & forecasts, 2025-2035
      • 7.5.4.2. Application breakdown size & forecasts, 2025-2035
    • 7.5.5. South Korea Wafer Cutting Fluids Market
      • 7.5.5.1. Product Type breakdown size & forecasts, 2025-2035
      • 7.5.5.2. Application breakdown size & forecasts, 2025-2035
    • 7.5.6. Rest of APAC Wafer Cutting Fluids Market
      • 7.5.6.1. Product Type breakdown size & forecasts, 2025-2035
      • 7.5.6.2. Application breakdown size & forecasts, 2025-2035
  • 7.6. Latin America Wafer Cutting Fluids Market
    • 7.6.1. Brazil Wafer Cutting Fluids Market
      • 7.6.1.1. Product Type breakdown size & forecasts, 2025-2035
      • 7.6.1.2. Application breakdown size & forecasts, 2025-2035
    • 7.6.2. Mexico Wafer Cutting Fluids Market
      • 7.6.2.1. Product Type breakdown size & forecasts, 2025-2035
      • 7.6.2.2. Application breakdown size & forecasts, 2025-2035
  • 7.7. Middle East and Africa Wafer Cutting Fluids Market
    • 7.7.1. UAE Wafer Cutting Fluids Market
      • 7.7.1.1. Product Type breakdown size & forecasts, 2025-2035
      • 7.7.1.2. Application breakdown size & forecasts, 2025-2035
    • 7.7.2. Saudi Arabia (KSA) Wafer Cutting Fluids Market
      • 7.7.2.1. Product Type breakdown size & forecasts, 2025-2035
      • 7.7.2.2. Application breakdown size & forecasts, 2025-2035
    • 7.7.3. South Africa Wafer Cutting Fluids Market
      • 7.7.3.1. Product Type breakdown size & forecasts, 2025-2035
      • 7.7.3.2. Application breakdown size & forecasts, 2025-2035

Chapter 8. Competitive Intelligence

  • 8.1. Top Market Strategies
  • 8.2. Dow Chemical Company
    • 8.2.1. Company Overview
    • 8.2.2. Key Executives
    • 8.2.3. Company Snapshot
    • 8.2.4. Financial Performance (Subject to Data Availability)
    • 8.2.5. Product/Services Port
    • 8.2.6. Recent Development
    • 8.2.7. Market Strategies
    • 8.2.8. SWOT Analysis
  • 8.3. BASF SE
  • 8.4. ExxonMobil Chemical
  • 8.5. TotalEnergies SE
  • 8.6. Daikin Industries
  • 8.7. Evonik Industries AG
  • 8.8. Shell Plc
  • 8.9. Fuchs Petrolub SE
  • 8.10. Idemitsu Kosan Co., Ltd.
  • 8.11. Sinopec Corporation
  • 8.12. Lubrizol Corporation
  • 8.13. Huntsman International LLC
  • 8.14. Wacker Chemie AG
  • 8.15. Sumitomo Chemical Co., Ltd.
  • 8.16. Kao Corporation