CPO（联合封装光学）市场：2023-2028

本报告探讨了 CPO（共封装光学器件）市场，总结了 NPO（近封装光学器件）和 CPO 技术演进、市场影响因素分析、6 年预测、供应商和影响者概况等。

内容

执行摘要

第一章介绍

第 2 章 CPO（联合封装光学器件）：不断发展的技术

• 介绍
  • 800G 收发器演进中的 CPO
  • 关于 NPO（近封装光学）的注意事项
• OIF 和 CPO 的兴起
  • 3.2T CP模块
  • OIF-Co-Packaging-3.2T-Module-01.0
  • nx 100G CPO？
  • 中国的 CPO 标准化进程
• 收发器，换代，Broadcom
• 机架 800G
• 关于 800G/CPO/功耗的说明
• CPO 激光

第 3 章 CPO（联合封装光学器件）市场

• 增加自然流量：对原棕油需求的影响
  • 数据中心互连
• 新的延迟敏感服务对 CPO 市场的影响
  • 从视频革命中吸取的教训
  • AI/ML 服务和带宽需求
  • 物联网的特殊影响
  • CPO 和边缘数据中心
• 碎片化计算系统：CPO 的应用
• 高性能计算
• 传感器
• 竞争性 800G/1.6T 格式
  • IEEE 800G 标准：以太网
  • 800G 可插拔 MSA
  • 相干收发器应用

第 4 章 6 年 CPO 市场预测

• 预测方法和假设
• 定价说明
• 按收发器类型划分的下一代收发器市场预测
  • CPO：800G 市场中的 CPO

第 5 章简介：供应商和影响者

• Ayar Labs
• Broadcom
• Cisco
• Coherent
• Corning
• DuPont
• Furukawa Electric
• Google
• Hengtong Optic-Electric
• Hisense Broadband
• Huawei
• IBM
• Intel
• Kyocera
• Lightmatter
• Lumentum
• Marvell
• Meta/Facebook
• Microsoft
• Molex
• POET Technologies
• Quantifi
• Ranovus and AMD
• SENKO Advanced Components
• TE Connectivity
• SABIC
• Sumitomo Electric
• Teramount

关于作者

首字母缩写词/缩写词

In 2020 CIR became the first analysis firm to release a co-packaged optics market analysis that surveyed the opportunities flowing from the development and deployment of co-packaged optics . In 2022 we issued a new co-packaged optics market analysis and have updated our forecasts and technology and market analysis in this report.

The primary goals of this report are to update CIR's forecasts of the CPO space with breakouts by application, speed and network segment and provide an update on CPO strategy from the key influencers in the market. In terms of speed, we look at 800G and 1.6T. Another objective of our latest report include efforts to better understand the product roadmap for CPO in the near- to medium-term future and the report includes some analysis of important subsystems of CPO devices; notably the external lasers and the potential additional cooling for the CPO module. We also address silicon photonics and the impact of optical integration on the future of CPO.

In terms of coverage, we are concerned in this report with CPO and precursors to CPO; meaning primarily near-packaged optics (NPO). In terms of applications we cover all likely applications, but aside from organic traffic growth made up of voice, data and video traffic, the forecasts also reflect an expected boom for low-latency traffic and how the growth of AI (enterprise, SaaS and individual) is resetting the thinking. Less impactful applications for CPO including HPC, disaggregated compute application and sensors are also analyzed and forecast. Finally, the report considers the market impact of the emerging standards for CPO including the just-released OIF standard and the work on standards setting beginning in China.

Table of Contents

Executive Summary

• E.1 CPO Now: Supply Side Analysis
• E.2 The Supply Chain Side of CPO
• E.3 Summary of Market Forecasts

Chapter One: Introduction

• 1.1 Background to this Report
• 1.2 Goals and Scope of this Report
• 1.3 Plan of this Report

Chapter Two: Co-Packaged Optics: Evolving Technology

• 2.1 Introduction
  • 2.1.1 CPO in the Evolution of 800G Transceivers
  • 2.1.2 A Note on Near-Packaged Optics
• 2.2 OIF and the Emergence of Co-Packaged Optics
  • 2.2.1 The 3.2T Co-Packaged Module
  • 2.2.2 OIF-Co-Packaging-3.2T-Module-01.0
  • 2.2.3 CPO at n x 100G?
  • 2.2.4 The CPO Standards Process in China
• 2.3 Transceivers, Switching Generations and Broadcom
• 2.4 800G on the Rack
• 2.5 A Note on 800G, CPO and Power Consumption
• 2.6 Lasers for CPO

Chapter Three: Markets for Co-Packaged Optics

• 3.1 Organic Traffic Growth: Impact on the Demand for Co-packaged Optics
  • 3.1.1 Data Center Interconnection
• 3.2 Impact of New Latency-Sensitive Services on Co-Packaged Optics Markets
  • 3.2.1 Lessons Learned from the Video Revolution
  • 3.2.2 AI/ML Services and Bandwidth Demand
  • 3.2.3 Special Impact of IoT
  • 3.2.4 CPO and Edge Data Centers
• 3.3 Disaggregated Compute Systems: Applications for CPO
• 3.4 High-Performance Computing
• 3.5 Sensors
• 3.6 Competing 800G/1.6T Formats
  • 3.6.1 IEEE 800G Standards: Ethernet
  • 3.6.2 The 800G Pluggable MSA
  • 2.6.3 Applications for Coherent Transceivers

Chapter Four: Six-Year Forecasts for CPO Markets

• 4.1 Forecasting Methodology and Assumptions
• 4.2 A Note on Pricing
• 4.3 Forecast of Next-generation Transceiver Market by Type of Transceivers
  • 4.3.1 CPO: CPO in the 800G Market

Chapter Five: Profiles: Suppliers and Influencers

• 5.1 Ayar Labs (United States)
• 5.2 Broadcom (United States)
• 5.3 Cisco (United States)
• 5.4 Coherent (United States)
• 5.5 Corning (United States)
• 5.6 DuPont (United States)
• 5.7 Furukawa Electric (Japan)
• 5.8 Google (United States)
• 5.9 Hengtong Optic-Electric (China)
• 5.10 Hisense Broadband (China)
• 5.11 Huawei (China)
• 5.12 IBM (United States)
• 5.13 Intel (United States)
• 5.14 Kyocera (Japan)
• 5.15 Lightmatter (United States)
• 5.16 Lumentum (United States)
• 5.17 Marvell (United States)
• 5.18 Meta/Facebook (United States)
• 5.19 Microsoft (United States)
• 5.20 Molex (United States)
• 5.21 POET Technologies (Canada)
• 5.22 Quantifi (New Zealand)
• 5.23 Ranovus and AMD
• 5.24 SENKO Advanced Components (Japan)
• 5.25 TE Connectivity
• 5.26 SABIC (Saudi Arabia)
• 5.27 Sumitomo Electric (Japan)
• 5.28 Teramount (Israel)

About the Author

Acronyms and Abbreviations Used in this Report

List of Exhibits

• Exhibit E-1: What It Means to be a Next-Generation Transceiver: The Role of CPO
• Exhibit E-2: Likely Evolution of the Co-Packaged Optics Market
• Exhibit E-3: Summary of CPO Markets by Type of Module ($ Millions)
• Exhibit 2-1: OIF Co-Packaging Framework Project: Scope
• Exhibit 2-2: Specs for the Co-Packaged Optics Optical Module
• Exhibit 2-3: Switching Generations for the Broadcom Tomahawk 5 Switch
• Exhibit 2-4: ELSFP: Possible Project Range
• Exhibit 3-1: Required Latencies by Selected Type of Traffic
• Exhibit 4-1: CPO in the 800G Transceiver Markets ($ Million)
• Exhibit 4-2: Summary of 800G CPO Markets, by Network Location and User Type