内存封装市场：按平台、按应用、按最终用户、按地区 - 规模、份额、展望、机会分析，2023-2030 年

内存封装是将小型半导体芯片组装成更坚固的形状的过程，以便它们可以轻鬆地集成到计算机系统中。 这可以通过多种方式来完成。 这些封装具有连接到主板的引脚，为内存模块和系统提供两条通信线路。 它提供 168、100 和 184 引脚配置。 也称为小型 DIMM (SO-DIMM)。 与 DIMM 类似，但具有不同的引脚排列。 这些通常用于笔记本电脑。 常用于中低端笔记本电脑。

市场动态：

随着业界寻求提高性能和功能，同时缩小占地面积，内存封装市场正在快速增长。 这种情况发生之际，移动设备和计算领域对存储芯片的需求正在不断增加。 全球内存封装市场预计将继续快速增长。 这一增长率背后的主要因素是消费电子设备的需求不断增加，预计未来将继续增长。

另一方面，与半导体组装和测试 (OSAT) 外包相关的挑战预计将阻碍市场增长。

本研究的主要特点

• 本报告对全球内存封装市场进行了深入分析，介绍了以 2022 年为基准年的预测期（2023-2030 年）的市场规模和復合年增长率 (CAGR%)。这里。
• 它揭示了各个细分市场的潜在收入机会，并概述了该市场有吸引力的投资主张矩阵。
• 它还提供了有关市场驱动因素、限制因素、机遇、新产品发布或批准、市场趋势、区域前景以及主要参与者采取的竞争策略的重要见解。
• 根据以下参数（包括公司亮点、产品组合、主要亮点、财务业绩和战略）介绍全球内存封装市场的主要参与者。
• 本次研究涵盖的主要公司包括天水华天科技有限公司、Hana Micron Inc.、菱森精密工业有限公司、台塑先进科技有限公司 (FATC)、日月光半导体工程有限公司 (ASE Inc.)、Amkor Technology Inc.、江苏长电科技有限公司、力成科技、金源电子股份有限公司、南茂科技股份有限公司、通富微电子股份有限公司和 Signetics Corporation。
• 该报告的见解将使营销人员和企业高管能够就未来的产品发布、类型升级、市场扩张和营销策略做出明智的决策。
• 本报告面向该行业的各个利益相关者，包括投资者、供应商、产品製造商、分销商、新进入者和财务分析师。
• 利益相关者可以通过用于分析全球内存封装市场的各种策略矩阵来促进决策。

内容

第 1 章目的和先决条件

• 调查目的
• 先决条件
• 缩写

第二章市场展望

• 报告摘要
  • 市场定义和范围
• 执行摘要
• 连贯的机会地图 (COM)

第三章市场动态、监管与趋势分析

• 市场动态
  • 智能手机需求不断增长以及技术进步
  • OSATS 行业的变化
  • 包装技术创新
• 影响分析
• 主要亮点
• 监管场景
• 产品发布/批准
• PEST分析
• 《PORTER》分析
• 合併/收购场景

第 4 章全球内存封装市场 - 冠状病毒 (COVID-19) 大流行的影响

• COVID-19 流行病学调查
• 供给侧和需求侧分析
• 经济影响

第 5 章 2017-2030 年全球内存封装市场（按平台）

• 倒装芯片
• 引线框架
• 晶圆级芯片级封装 (WLCSP)
• 硅通孔 (TSV)
• 引线键合

第 6 章全球存储器封装市场（按应用划分，2017-2030 年）

• NAND闪存封装
• NOR闪存封装
• DRAM 封装
• 其他用途

第 7 章全球内存封装市场（按最终用户划分，2017-2030 年）

• IT/电信
• 消费电子产品
• 嵌入式系统
• 汽车
• 其他最终用户

第 8 章全球内存封装市场（按地区），2017-2030

• 北美
• 欧洲
• 亚太地区
• 拉丁美洲
• 中东和非洲

第 9 章竞争格局

• Tianshui Huatian Technology Co Ltd
• Hana Micron Inc.
• lingsen precision industries Ltd
• Formosa Advanced Technologies Co. Ltd（FATC）
• Advanced Semiconductor Engineering Inc.（ASE Inc.）
• Amkor Technology Inc.
• Jiangsu Changjiang Electronics Technology Co. Ltd
• Powertech Technology
• King Yuan Electronics Corp. Ltd
• Others

第10章 

• 调查手法
• 出版社

Memory packaging is the process of assembling tiny semiconductor chips into a more durable form so that they can be easily integrated into computer systems. This can be done in a variety of ways. These packages have pins that connect to the motherboard and provide two communications lines for the memory module and the system. They are available in 168, 100, and 184 pin configurations. They are also known as small outline DIMMs (SO-DIMM). These are similar to DIMMs but use different pin settings. These are commonly used in laptop computers. They are often used in low-end and mid-range notebook computers.

Market Dynamics:

The memory packaging market is growing rapidly as the industry seeks to increase its performance and capabilities while shrinking its footprint. This is happening at a time when demand for memory chips in mobile devices and computing is increasing. The global market for memory packaging is expected to continue grow at a rapid pace. These growth rates are primarily driven by increasing demand from consumer electronics, which is expected to continue increasing in the future.

On the other hand, challenges associated with the outsourced semiconductor assembly and test (OSAT) industry is expected to hinder the market growth.

Key features of the study:

• This report provides in-depth analysis of the global memory packaging market, and provides market size (US$ Billion) and compound annual growth rate (CAGR%) for the forecast period (2023-2030), considering 2022 as the base year
• It elucidates potential revenue opportunities across different segments and explains attractive investment proposition matrices for this market
• This study also provides key insights about market drivers, restraints, opportunities, new product launches or approval, market trends, regional outlook, and competitive strategies adopted by key players
• It profiles key players in the global memory packaging market based on the following parameters - company highlights, products portfolio, key highlights, financial performance, and strategies
• Key companies covered as a part of this study include Tianshui Huatian Technology Co Ltd, Hana Micron Inc., lingsen precision industries Ltd, Formosa Advanced Technologies Co. Ltd (FATC), Advanced Semiconductor Engineering Inc. (ASE Inc.), Amkor Technology Inc., Jiangsu Changjiang Electronics Technology Co. Ltd, Powertech Technology, King Yuan Electronics Corp. Ltd, ChipMOS Technologies Inc., TongFu Microelectronics Co., and Signetics Corporation
• Insights from this report would allow marketers and the management authorities of the companies to make informed decisions regarding their future product launches, type up-gradation, market expansion, and marketing tactics
• The global memory packaging market report caters to various stakeholders in this industry including investors, suppliers, product manufacturers, distributors, new entrants, and financial analysts
• Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the global memory packaging market

Detailed Segmentation:

• Global Memory Packaging Market, By Platform
  • Flip-chip
  • Lead-frame
  • Wafer-level Chip-scale Packaging (WLCSP)
  • Through-Silicon Via (TSV)
  • Wire-bond
  • Application
  • NAND Flash Packaging
  • NOR Flash Packaging
  • DRAM Packaging
  • Other Applications
• Global Memory Packaging Market, By End User
  • IT and Telecom
  • Consumer Electronics
  • Embedded Systems
  • Automotive
  • Other End Users
• Global Memory Packaging Market, By Region
  • North America
  • Europe
  • Asia Pacific
  • Latin America
  • Middle East & Africa
• Company Profiles
  • Tianshui Huatian Technology Co Ltd
  • Hana Micron Inc.
  • lingsen precision industries Ltd
  • Formosa Advanced Technologies Co. Ltd (FATC)
  • Advanced Semiconductor Engineering Inc. (ASE Inc.)
  • Amkor Technology Inc.
  • Jiangsu Changjiang Electronics Technology Co. Ltd
  • Powertech Technology
  • King Yuan Electronics Corp. Ltd
  • ChipMOS Technologies Inc.
  • TongFu Microelectronics Co.
  • Signetics Corporation

Table of Contents

1. Research Objectives and Assumptions

• Research Objectives
• Assumptions
• Abbreviations

2. Market Purview

• Report Description
  • Market Definition and Scope
• Executive Summary
  • Market Snapshot, By Platform
  • Market Snapshot, By Application
  • Market Snapshot, By End User
  • Market Snapshot, By Region
• Coherent Opportunity Map (COM)

3. Market Dynamics, Regulations, and Trends Analysis

• Market Dynamics
  • Growing demand for smartphone and advancement in technology
  • Changing landscape of the OSATS sector
  • Innovation in packaging technology
• Impact Analysis
• Key Highlights
• Regulatory Scenario
• Product launch/Approvals
• PEST Analysis
• PORTER's Analysis
• Merger and Acquisition Scenario

4. Global Memory Packaging Market - Impact of Coronavirus (COVID-19) Pandemic

• COVID-19 Epidemiology
• Supply Side and Demand Side Analysis
• Economic Impact

5. Global Memory Packaging Market , By Platform, 2017-2030, (US$ Bn)

• Introduction
  • Market Share Analysis, 2023 and 2030 (%)
  • Y-o-Y Growth Analysis, 2017 - 2030
  • Segment Trends
• Flip-chip
  • Introduction
  • Market Size and Forecast, and Y-o-Y Growth, 2017-2030,(US$ Bn)
• Lead-frame
  • Introduction
  • Market Size and Forecast, and Y-o-Y Growth, 2017-2030,(US$ Bn)
• Wafer-level Chip-scale Packaging (WLCSP)
  • Introduction
  • Market Size and Forecast, and Y-o-Y Growth, 2017-2030,(US$ Bn)
• Through-Silicon Via (TSV)
  • Introduction
  • Market Size and Forecast, and Y-o-Y Growth, 2017-2030,(US$ Bn)
• Wire-bond
  • Introduction
  • Market Size and Forecast, and Y-o-Y Growth, 2017-2030,(US$ Bn)

6. Global Memory Packaging Market , By Application, 2017-2030, (US$ Bn)

• Introduction
  • Market Share Analysis, 2023 and 2030 (%)
  • Y-o-Y Growth Analysis, 2017 - 2030
  • Segment Trends
• NAND Flash Packaging
  • Introduction
  • Market Size and Forecast, and Y-o-Y Growth, 2017-2030,(US$ Billion)
• NOR Flash Packaging
  • Introduction
  • Market Size and Forecast, and Y-o-Y Growth, 2017-2030,(US$ Billion)
• DRAM Packaging
  • Introduction
  • Market Size and Forecast, and Y-o-Y Growth, 2017-2030,(US$ Billion)
• Other Applications
  • Introduction
  • Market Size and Forecast, and Y-o-Y Growth, 2017-2030,(US$ Billion)

7. Global Memory Packaging Market , By End User, 2017-2030, (US$ Bn)

• Introduction
  • Market Share Analysis, 2023 and 2030 (%)
  • Y-o-Y Growth Analysis, 2017 - 2030
  • Segment Trends
• IT and Telecom
  • Introduction
  • Market Size and Forecast, and Y-o-Y Growth, 2017-2030,(US$ Billion)
• Consumer Electronics
  • Introduction
  • Market Size and Forecast, and Y-o-Y Growth, 2017-2030,(US$ Billion)
• Embedded Systems
  • Introduction
  • Market Size and Forecast, and Y-o-Y Growth, 2017-2030,(US$ Billion)
• Automotive
  • Introduction
  • Market Size and Forecast, and Y-o-Y Growth, 2017-2030,(US$ Billion)
• Other End Users
  • Introduction
  • Market Size and Forecast, and Y-o-Y Growth, 2017-2030,(US$ Billion)

8. Global Memory Packaging Market , By Region, 2017-2030, (US$ Bn)

• Introduction
  • Market Share Analysis, By Country, 2023 and 2030 (%)
  • Y-o-Y Growth Analysis, For Country 2017 -2030
  • Country Trends
• North America
  • Introduction
  • Market Size and Forecast, and Y-o-Y Growth, By Platform, 2017-2030,(US$ Bn)
  • Market Size and Forecast, and Y-o-Y Growth, By Application, 2017-2030,(US$ Bn)
  • Market Size and Forecast, and Y-o-Y Growth, By End User, 2017-2030,(US$ Bn)
• Europe
  • Introduction
  • Market Size and Forecast, and Y-o-Y Growth, By Platform, 2017-2030,(US$ Bn)
  • Market Size and Forecast, and Y-o-Y Growth, By Application, 2017-2030,(US$ Bn)
  • Market Size and Forecast, and Y-o-Y Growth, By End User, 2017-2030,(US$ Bn)
• Asia Pacific
  • Introduction
  • Market Size and Forecast, and Y-o-Y Growth, By Platform, 2017-2030,(US$ Bn)
  • Market Size and Forecast, and Y-o-Y Growth, By Application, 2017-2030,(US$ Bn)
  • Market Size and Forecast, and Y-o-Y Growth, By End User, 2017-2030,(US$ Bn)
• Latin America
  • Introduction
  • Market Size and Forecast, and Y-o-Y Growth, By Platform, 2017-2030,(US$ Bn)
  • Market Size and Forecast, and Y-o-Y Growth, By Application, 2017-2030,(US$ Bn)
  • Market Size and Forecast, and Y-o-Y Growth, By End User, 2017-2030,(US$ Bn)
• Middle East & Africa
  • Introduction
  • Market Size and Forecast, and Y-o-Y Growth, By Platform, 2017-2030,(US$ Bn)
  • Market Size and Forecast, and Y-o-Y Growth, By Application, 2017-2030,(US$ Bn)
  • Market Size and Forecast, and Y-o-Y Growth, By End User, 2017-2030,(US$ Bn)

9. Competitive Landscape

• Tianshui Huatian Technology Co Ltd
  • Company Highlights
  • Product Portfolio
  • Key Developments
  • Financial Performance
  • Strategies
• Hana Micron Inc.
• lingsen precision industries Ltd
• Formosa Advanced Technologies Co. Ltd (FATC)
• Advanced Semiconductor Engineering Inc. (ASE Inc.)
• Amkor Technology Inc.
• Jiangsu Changjiang Electronics Technology Co. Ltd
• Powertech Technology
• King Yuan Electronics Corp. Ltd
• Others
• Analyst Views

10. Section

• Research Methodology
• About us