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市场调查报告书
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1179879

全球电路材料市场2023-2030

Global Circuit Materials Market - 2023-2030
出版日期: | 出版商: DataM Intelligence | 英文 230 Pages | 商品交期: 约2个工作天内

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简介目录

市场概览

全球电路材料市场预计将出现显着增长。

在两层导电材料（通常由铜製成）之间放置一种坚固、高度绝缘的介电材料，例如玻璃纤维。 机械层是最外层。 玻璃纤维板作为印刷电路板的基础。 每面贴有导电铜板。 电路材料包括连接到电子电路并为电子电路提供机械支撑的元件，也称为电子产品中使用的电路板。 安装在印刷电路板上的电路材料使復杂电路的製造商和设计人员能够提供高性能的解决方案。 电路材料还具有更高的可靠性和更好的功能。 可以焊接和製造用于多层、单面、双面、柔性和刚性-柔性等应用的薄型高密度电线。 电路材料也广泛用于无源开关盒等电子元器件。

市场动态

电路材料通常是平面层压复合材料，其内表面或外表面隐藏有铜电路层，由非导电基材製成。 高密度应用范围从具有 1 或 2 个铜层的基本应用到具有 50 层或更多层的复杂应用。 随着电子行业的快速增长，印刷线路板材料市场有望实现健康增长。 预计物联网 (IoT) 等技术进步的兴起将在预测期内提振对印刷电路板的需求。

高性能材料提高柔性和刚性电路 PCB 的稳健性

薄膜、层压板、光刻胶、金属化等都是材料类型。 铜薄聚□亚胺层压板、环氧树脂溶液、丙烯酸和聚□胺基粘合剂、干膜光刻胶和丝网印刷油墨等材料被用作电路中的基材。 常用的PCB基材包括FR-1、G-10、PTFE、氧化铝和Kapton。 CTE、PTFE 和 CEM 等材料用于层压板。 如果高性能不是关键的 PCB 属性，轻质聚酯等材料可能是不错的选择。

电路材料在高温应用中的使用

为了满足消费电子和电信行业的小型化需求，PCB 需要具有更高的电路密度。 适当的材料选择可以提高产量并降低製造成本。 信号完整性对于 PCB 必须在高温和高压条件下可靠运行的汽车应用中的安全至关重要。 汽车中的基板和组件需要在更小的空间内集成更多功能，因此能够实现紧凑且极其可靠设计的材料变得越来越重要。 因此，用于高温应用的电路材料越来越多，市场不断扩大。

例如，对于石油、汽车、军事、航空航天和医疗保健领域使用的高温柔性电路，杜邦在高温材料方面的专业知识使其成为绝佳选择。 Cirexx 使用杜邦先进的机械、加工技术和高温材料来生产可在 250度C 以上的温度下运行的最先进的柔性电路。 杜邦的全聚□亚胺 Pyralux HT 材料系统提供所有柔性电路材料中最高的额定温度。

但电路材料市场受制于铜的获取难度大，替代品众多，市场拓展困难重重。 电路材料的采用也可能会减少，因为替代品很容易获得，而且消费者更愿意生产环保和节能的产品。 在预测期内，这些因素可能会在一定程度上限制市场增长。

COVID-19 影响分析

由于 COVID-19 的影响，全球许多国家实施了封锁措施，这对电路材料市场造成了衝击。 由于暂时关闭业务，对这些产品的需求受到了影响。 汽车行业的印刷电路板市场受停工影响最大，给电路材料市场造成了财务损失。 行动限制扰乱了铜等材料的供应链。 大流行期间也限制了进出口，因此很难获得材料。

内容

第 1 章全球电路材料市场-研究方法和范围

  • 调查方法
  • 调查目的和范围

第 2 章全球电路材料市场 - 市场定义和概述

第 3 章全球电路材料市场-执行摘要

  • 按材料类别细分的市场
  • 按基础材料划分的市场细分
  • 按外层细分的市场
  • 按应用划分的市场细分
  • 按地区划分的市场细分

第四章全球电路材料市场-市场动态

  • 市场影响因素
    • 司机
      • 在高温应用中使用电路材料
    • 约束因素
      • 铜供应短缺限制了市场增长
    • 商机
    • 影响分析

第5章全球电路材料市场-行业分析

  • 波特的五力分析
  • 供应链分析
  • 定价分析
  • 监管分析

第 6 章全球电路材料市场 - COVID-19 分析

  • COVID-19 市场分析
    • COVID-19 之前的市场情景
    • COVID-19 的当前市场情景
    • COVID-19 后或未来情景
  • COVID-19 期间的价格动态
  • 供需范围
  • 大流行期间与市场相关的政府举措
  • 製造商的战略举措
  • 总结

第 7 章全球电路材料市场 - 按材料类别分类

  • 基材
  • 导电材料
  • 外层

第 8 章全球电路材料市场 - 按基础材料分类

  • 玻璃纤维-环氧树脂
  • 纸苯酚
  • CEM
  • 聚□亚胺
  • 其他

第 9 章全球电路材料市场 - 按外层分类

  • 液态墨水光固化阻焊膜 (LIPSM)
  • 干胶片照片图像
  • 其他

第 10 章全球电路材料市场 - 按应用

  • 通讯领域
  • 工业电子
  • 汽车
  • 航空航天与国防
  • 其他

第 11 章全球电路材料市场-按地区

  • 北美
    • 美国
    • 加拿大
    • 墨西哥
  • 欧洲
    • 德国
    • 英国
    • 法国
    • 意大利
    • 俄罗斯
    • 其他欧洲
  • 南美洲
    • 巴西
    • 阿根廷
    • 其他南美洲
  • 亚太地区
    • 中国
    • 印度
    • 日本
    • 澳大利亚
    • 其他亚太地区
  • 中东和非洲

第 12 章全球电路材料市场-竞争格局

  • 竞争场景
  • 市场情况/份额分析
  • 併购分析

第 13 章全球电路材料市场-公司概况

  • 生益科技有限公司
    • 公司简介
    • 产品组合和说明
    • 主要亮点
    • 财务摘要
  • Kingboard Laminates Holdings
  • ITEQ Corporation
  • Dowdupont
  • Jinan Guoji Technology Co., Ltd.
  • Eternal Materials Co., Ltd.
  • Rogers Corporation
  • Taiflex Scientific Co., Ltd.
  • Isola Group
  • Nikkan Induatries Co., Ltd.

第 14 章全球电路材料市场 - 关键考虑因素

第15章全球电路材料市场-DataM

简介目录
Product Code: DMMA6112

Market Overview

The global circuit materials market reached US$ XX million in 2022 and is projected to record significant growth by reaching up to US$ XX million by 2030, growing at a CAGR of XX% during the forecast period (2023-2030).

A strong, insulating dielectric material like fiberglass is between two layers of conductive material typically made of copper. The mechanical layer is the outermost layer. A fiberglass sheet serves as the foundation for printed circuit boards. Each side has conductive copper sheets attached to it. Circuit materials include components connected to an electronic circuit, also known as a circuit board, used in electric appliances to provide mechanical support. Circuit materials mounted on the printed circuit board allow producers and designers of complex circuits to offer high-performance solutions. In addition, circuit materials offer higher reliability and better functional performance. They make it possible to fabricate thin, higher-density electric interconnects soldered for use in multilayered, single- and double-sided, flexible and rigid-flexible applications. Products like passive switch boxes made of electronics frequently use circuit materials.

Market Dynamics

Typically, circuit materials are flat laminated composites with layers of copper circuitry concealed internally or on external surfaces, made of non-conductive substrate materials. In high-density applications, they can be as basic as one or two copper layers or as complex as 50 layers or more. Due to the electronics industry's rapid growth, it is anticipated that the market for printed circuit board materials will grow at a healthy rate. It is anticipated that increased technological advancements, such as the Internet of Things (IoT), will increase PCB demand during the forecast period.

High-performance materials to improve the robustness of PCBs for flexible and rigid circuits

Films, laminates, photoresists and metallization are types of materials. Electric circuits use thin copper polyimide laminates, epoxy solutions, acrylic and polyamide-based adhesives and other materials like dry film photoresist and screen-printed inks as substrates. Substrates for PCBs are frequently made of FR-1, G-10, PTFE, alumina and Kapton, among other materials. CTE, PTFE and CEM, among other materials, are used to create laminates. A material like lightweight polyester is probably a good option when high performance is not a crucial PCB characteristic.

Use of circuit materials in high-temperature applications

To meet the demands of the consumer electronics and telecom industries' drive toward miniaturization, PCBs must have a higher circuit density. The right material selection increases yield while reducing manufacturing costs. Signal integrity is crucial for safety in automotive applications, where PCBs must operate dependably under conditions of high temperature and high voltage. The need for more functionality to fit into a smaller space as boards and components in vehicles raises the significance of materials that enable small, extremely reliable designs. Because of this, the market is growing as more circuit materials are used in high-temperature applications.

For Instance, Due to its expertise in high-temperature materials, DuPont is the best choice for high-temperature flex circuits, which are usually utilized in the oil, automotive, military, aerospace and healthcare sectors. Cirexx creates state-of-art flex circuits that can function in temperatures higher than 250°C (482°F) using advanced machinery, fabrication techniques and high-temperature materials from DuPont. The DuPont all-polyimide Pyralux HT material system provides any flex circuit material's highest temperature operating rating.

However, the market for circuit materials will be constrained by the less availability of copper, whereas a plethora of substitutes will make market expansion difficult. The market's availability of alternatives and consumers' preference for producing eco-friendly and energy-efficient goods can also reduce the adoption of circuit materials. During the foreseeable period, these factors may, to some extent, limit the market growth.

COVID-19 Impact Analysis

The lockdown imposed in numerous nations around the world has harmed the market for circuit material as a result of COVID-19. Due to temporary business closures, the demand for these products has been impacted. The printed board market in the automotive industry had been most negatively impacted by the shutdown, with financial losses to the circuit material market. The movement restrictions disrupted the copper and other material supply chain. During the pandemic, imports and exports were also restricted, which led to the less availability of materials.

Segment Analysis

The global circuit materials market is segmented based on material class, substrate, outer layer, application and region.

Growing sales of electric vehicles generate excellent growth prospects for PCBs and bolster the demand for circuit materials

With an emphasis on autonomous and electric vehicles, the PCB industry in the automotive sector will experience rapid growth. The identical sensors and other components needed for an automobile's reliable operation are held together by printed circuit boards. Electronic components and circuit boards are being created with more and more circuit materials. Automobiles, communication, smart and aerospace electronics all use circuit materials. Global EV sales increased by 108% from 2020 to 6,75 million units in 2021. Compared to 2020, the global share of EVs (BEV & PHEV) in light vehicle sales was 8,3%. Sales of all EVs were 71% BEVs and 29% PHEVs. Only 4,7% more cars were sold globally in 2020 than during the crisis year. The remarkable growth in EV sales generates a tremendous demand for circuit materials globally.

Geographical Analysis

The global circuit materials market is segmented based on material class, substrate, outer layer, application and region.

Growing usage of IOTs, high powerboards and other electronic appliances in the region help to expand the circuit materials market in Asia-Pacific

The "Make in India" initiative has boosted India's consumer electronics manufacturing sector and increased the production of electronic components for various uses. The demand for electronics is expected to rise in the coming years, driving the growth of the electronic manufacturing industries in developing nations. Due to the highly developed electronics industries in China, Japan and South Korea, as well as ongoing investments made in the region to advance automotive technology and electronic manufacturing, Asia-Pacific is predicted to dominate the global market. India exported electronic goods worth $11.7 billion in FY21. In May 2021, exports of electronic goods totaled USD 950.17 million.

Competitive Landscape

Leading companies are focusing on technological advancements in the electronics industry. The primary focus areas include product launches, collaborations, strategic mergers and acquisitions. The major players in the market are Shengyi Technology Co., Ltd., Kingboard Laminates Holdings, ITEQ Corporation, Dowdupont, Jinan Guoji Technology Co., Ltd., Eternal Materials Co., Ltd., Rogers Corporation, Taiflex Scientific Co., Ltd., Isola Group and Nikkan Industries Co., Ltd.

Dowdupont

Overview: DuPont is headquartered in U.S. with a total of 109 manufacturing facilities across 31 nations and employs about 36,500 people globally. The company operates in all regions, including the Americas, Europe, Asia-Pacific and Middle East & Africa. Its portfolio includes specialty chemicals and downstream goods for the water management, electronics and communication, construction, automotive and safety and protection sectors.

Product Portfolio:

  • Polyimide Film: DuPontTM Kapton B polyimide film demonstrates an excellent balance of physical, chemical and electrical properties with superior dimensional stability over a broad temperature range. In industrial motor and generator applications, Kapton CRC is typically used as magnet wire, turn-to-turn strand, coil, slot liner and ground insulation materials.

Key Development: On January 21, 2022, The expansion project at DuPont Interconnect Solutions' manufacturing facility in Circleville, Ohio, was completed. With the $ 250 million investment, Kapton polyimide film and Pyralux flexible circuit materials production would be increased, ensuring a dedicated supply to meet the rising global demand in DuPont's target markets of the automotive, consumer electronics, specialized industrial and defense.

Why Purchase the Report?

  • To visualize the global circuit materials market segmentation based on material class, substrate, outer layer, application and region, as well as understand key commercial assets and players.
  • Identify commercial opportunities in the global circuit materials market by analyzing trends and co-development.
  • Excel data sheet with numerous data points of circuit materials market-level with all segments.
  • PDF report consisting of cogently put together market analysis after exhaustive qualitative interviews and in-depth market study.
  • Product mapping available as excel consisting of key products of all the major market players.

The global circuit materials market report would provide approximately 69 tables, 71 figures and 230 Pages.

Target Audience 2023

  • Manufacturers/ Buyers
  • Industry Investors/Investment Bankers
  • Research Professionals
  • Emerging Companies

Table of Contents

1. Global Circuit Materials Market - Methodology and Scope

  • 1.1. Research Methodology
  • 1.2. Research Objective and Scope of the Report

2. Global Circuit Materials Market - Market Definition and Overview

3. Global Circuit Materials Market - Executive Summary

  • 3.1. Market Snippet by Material Class
  • 3.2. Market Snippet by Substrate
  • 3.3. Market Snippet by Outer Layer
  • 3.4. Market Snippet by Application
  • 3.5. Market Snippet by Region

4. Global Circuit Materials Market-Market Dynamics

  • 4.1. Market Impacting Factors
    • 4.1.1. Drivers
      • 4.1.1.1. Use of circuit materials in high-temperature applications
      • 4.1.1.2. XX
    • 4.1.2. Restraints
      • 4.1.2.1. Less Supply of copper will limit the market growth
      • 4.1.2.2. XX
    • 4.1.3. Opportunity
      • 4.1.3.1. XX
    • 4.1.4. Impact Analysis

5. Global Circuit Materials Market - Industry Analysis

  • 5.1. Porter's Five Forces Analysis
  • 5.2. Supply Chain Analysis
  • 5.3. Pricing Analysis
  • 5.4. Regulatory Analysis

6. Global Circuit Materials Market - COVID-19 Analysis

  • 6.1. Analysis of COVID-19 on the Market
    • 6.1.1. Before COVID-19 Market Scenario
    • 6.1.2. Present COVID-19 Market Scenario
    • 6.1.3. After COVID-19 or Future Scenario
  • 6.2. Pricing Dynamics Amid COVID-19
  • 6.3. Demand-Supply Spectrum
  • 6.4. Government Initiatives Related to the Market During Pandemic
  • 6.5. Manufacturers Strategic Initiatives
  • 6.6. Conclusion

7. Global Circuit Materials Market - By Material Class

  • 7.1. Introduction
    • 7.1.1. Market Size Analysis and Y-o-Y Growth Analysis (%), By Material Class
    • 7.1.2. Market Attractiveness Index, By Material Class
  • 7.2. Substrate*
    • 7.2.1. Introduction
    • 7.2.2. Market Size Analysis and Y-o-Y Growth Analysis (%)
  • 7.3. Conducting Material
  • 7.4. Outer Layer

8. Global Circuit Materials Market - By Substrate

  • 8.1. Introduction
    • 8.1.1. Market Size Analysis and Y-o-Y Growth Analysis (%), By Substrate
    • 8.1.2. Market Attractiveness Index, By Substrate
  • 8.2. Fiberglass-Epoxy*
    • 8.2.1. Introduction
    • 8.2.2. Market Size Analysis and Y-o-Y Growth Analysis (%)
  • 8.3. Paper-Phenolic
  • 8.4. CEM
  • 8.5. Polyimide
  • 8.6. Others

9. Global Circuit Materials Market - By Outer Layer

  • 9.1. Introduction
    • 9.1.1. Market Size Analysis and Y-o-Y Growth Analysis (%), By Outer Layer
    • 9.1.2. Market Attractiveness Index, By Outer Layer
  • 9.2. Liquid Ink Photoimageable Solder Mask (LIPSM)*
    • 9.2.1. Introduction
    • 9.2.2. Market Size Analysis and Y-o-Y Growth Analysis (%)
  • 9.3. Dry Film Photoimageable
  • 9.4. Others

10. Global Circuit Materials Market - By Application

  • 10.1. Introduction
    • 10.1.1. Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
    • 10.1.2. Market Attractiveness Index, By Application
  • 10.2. Communications*
    • 10.2.1. Introduction
    • 10.2.2. Market Size Analysis and Y-o-Y Growth Analysis (%)
  • 10.3. Industrial Electronics
  • 10.4. Automotive
  • 10.5. Aerospace & Defense
  • 10.6. Others

11. Global Circuit Materials Market - By Region

  • 11.1. Introduction
    • 11.1.1. Market Size Analysis and Y-o-Y Growth Analysis (%), By Region
    • 11.1.2. Market Attractiveness Index, By Region
  • 11.2. North America
    • 11.2.1. Introduction
    • 11.2.2. Key Region-Specific Dynamics
    • 11.2.3. Market Size Analysis and Y-o-Y Growth Analysis (%), By Material Class
    • 11.2.4. Market Size Analysis and Y-o-Y Growth Analysis (%), By Substrate
    • 11.2.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By Outer Layer
    • 11.2.6. Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
    • 11.2.7. Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
      • 11.2.7.1. U.S.
      • 11.2.7.2. Canada
      • 11.2.7.3. Mexico
  • 11.3. Europe
    • 11.3.1. Introduction
    • 11.3.2. Key Region-Specific Dynamics
    • 11.3.3. Market Size Analysis and Y-o-Y Growth Analysis (%), By Material Class
    • 11.3.4. Market Size Analysis and Y-o-Y Growth Analysis (%), By Substrate
    • 11.3.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By Outer Layer
    • 11.3.6. Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
    • 11.3.7. Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
      • 11.3.7.1. Germany
      • 11.3.7.2. UK
      • 11.3.7.3. France
      • 11.3.7.4. Italy
      • 11.3.7.5. Russia
      • 11.3.7.6. Rest of Europe
  • 11.4. South America
    • 11.4.1. Introduction
    • 11.4.2. Key Region-Specific Dynamics
    • 11.4.3. Market Size Analysis and Y-o-Y Growth Analysis (%), By Material Class
    • 11.4.4. Market Size Analysis and Y-o-Y Growth Analysis (%), By Substrate
    • 11.4.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By Outer Layer
    • 11.4.6. Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
    • 11.4.7. Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
      • 11.4.7.1. Brazil
      • 11.4.7.2. Argentina
      • 11.4.7.3. Rest of South America
  • 11.5. Asia-Pacific
    • 11.5.1. Introduction
    • 11.5.2. Key Region-Specific Dynamics
    • 11.5.3. Market Size Analysis and Y-o-Y Growth Analysis (%), By Material Class
    • 11.5.4. Market Size Analysis and Y-o-Y Growth Analysis (%), By Substrate
    • 11.5.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By Outer Layer
    • 11.5.6. Market Size Analysis and Y-o-Y Growth Analysis (%) By Application
    • 11.5.7. Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
      • 11.5.7.1. China
      • 11.5.7.2. India
      • 11.5.7.3. Japan
      • 11.5.7.4. Australia
      • 11.5.7.5. Rest of Asia-Pacific
  • 11.6. Middle East and Africa
    • 11.6.1. Introduction
    • 11.6.2. Key Region-Specific Dynamics
    • 11.6.3. Market Size Analysis and Y-o-Y Growth Analysis (%), By Material Class
    • 11.6.4. Market Size Analysis and Y-o-Y Growth Analysis (%), By Substrate
    • 11.6.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By Outer Layer
    • 11.6.6. Market Size Analysis and Y-o-Y Growth Analysis (%), By Application

12. Global Circuit Materials Market - Competitive Landscape

  • 12.1. Competitive Scenario
  • 12.2. Market Positioning/Share Analysis
  • 12.3. Mergers and Acquisitions Analysis

13. Global Circuit Materials Market- Company Profiles

  • 13.1. Shengyi Technology Co., Ltd.*
    • 13.1.1. Company Overview
    • 13.1.2. Product Portfolio and Description
    • 13.1.3. Key Highlights
    • 13.1.4. Financial Overview
  • 13.2. Kingboard Laminates Holdings
  • 13.3. ITEQ Corporation
  • 13.4. Dowdupont
  • 13.5. Jinan Guoji Technology Co., Ltd.
  • 13.6. Eternal Materials Co., Ltd.
  • 13.7. Rogers Corporation
  • 13.8. Taiflex Scientific Co., Ltd.
  • 13.9. Isola Group
  • 13.10. Nikkan Induatries Co., Ltd.

LIST NOT EXHAUSTIVE

14. Global Circuit Materials Market- Premium Insights

15. Global Circuit Materials Market- DataM

  • 15.1. Appendix
  • 15.2. About Us and Services
  • 15.3. Contact Us