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全球记忆体晶片市场 - 2023-2030Global Memory Chip Market - 2023-2030 |
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全球记忆体晶片市场2022年达到1,785亿美元,预估至2030年将达4,559亿美元,2023-2030年预测期间CAGR为12.5%。
由于下一代连网汽车和汽车安全系统对记忆体和储存设备的需求不断增长,记忆体晶片市场正在经历显着增长。该系统依靠半导体记忆体来储存数位资料,使半导体记忆体成为具有处理器或控制器的装置的组成部分。
此外,全球资料中心的不断建置以及各企业的储存需求正在推动对基于半导体的储存设备的需求。託管和超大规模资料中心,尤其是在已开发国家,正在推动对半导体记忆体的需求,以管理和储存大量企业资料。
由于消费性电子产业强劲且专注于高阶电子设备,亚太地区在记忆体晶片市场中占据最大份额。该地区努力确保到2024年5G手机出货量在国内市场占据主导地位,主要电脑、通讯和电子设备製造商的稳定成长有助于其市场领先地位。此外,中国对消费性电子设备出口和扩大跨境电子商务业务的重视进一步巩固了其在记忆体晶片市场的地位。
储存晶片市场预计将随着储存晶片的不断进步以及更小、更高效和更高容量的储存晶片的发展而受到推动。小型化和创新製造技术使得储存晶片的生产能够增加储存容量和增强效能。较小的晶片适用于从智慧型手机到资料中心的各种设备,从而促进了市场的成长。此外,3D 堆迭和新兴非挥发性储存技术等进步正在进一步塑造储存晶片格局
例如,SK海力士开发了PIM,这是一种下一代记忆体晶片,其运算能力挑战了记忆体和处理器的传统角色。这一发展为以记忆体为中心的计算铺平了道路,其中半导体记忆体发挥核心作用。 SK海力士的GDDR6-AiM为GDDR6记忆体晶片增加了运算功能,与CPU或GPU结合时,资料处理速度可提高16倍,适用于机器学习、高效能运算和巨量资料任务。
新兴技术和对记忆体密集应用不断增长的需求推动了记忆体晶片市场的全球成长。尤其是汽车产业,由于先进的储存晶片技术,正在经历重大转型。确保断电期间资料完整性并提高车辆性能的非挥发性记忆体晶片已变得至关重要。高密度记忆体晶片使连网和自动驾驶车辆能够在实体空间有限的情况下有效管理大量资料。
全球最大的记忆体晶片製造商三星电子宣布,计划在 2027 年开发下一代 5 奈米製程汽车记忆体晶片,称为 eMRAM。eMRAM 技术对于汽车应用至关重要,即使在高温下也能稳定运行,读写速度快。三星正在积极开发 14 nm eMRAM,并计划在 2024 年推出。
记忆体晶片市场面临巨大的限制,库存晶片供应过剩,客户订单减少,产品价格大幅下跌。这些挑战使这段时期成为记忆体晶片产业历史上要求最高的时期之一。
此外,市场还面临通货膨胀和利率上升等外部经济压力,导致消费者和企业推迟对电脑和智慧型手机等记忆体密集型设备的大量投资。结果,主要记忆体晶片製造商遭受了重大财务损失,加剧了库存过剩问题,并凸显了市场需求的明显不足。这些综合因素为记忆体晶片产业带来了复杂且充满挑战的格局,影响了其整体稳定性和获利能力。
Global Memory Chip Market reached US$ 178.5 billion in 2022 and is expected to reach US$ 455.9 billion by 2030, growing with a CAGR of 12.5% during the forecast period 2023-2030.
The memory chip market is experiencing significant growth due to the rising demand for memory and storage devices in next-generation connected cars and automotive safety systems. The systems rely on semiconductor memory for digital data storage, making semiconductor memory an integral part of devices with processors or controllers.
Moreover, the increasing construction of data centers globally and the storage requirements of various enterprises are boosting the demand for semiconductor-based memory devices. Colocation and hyperscale data centers, especially in developed nations, are driving the need for semiconductor memory to manage and store vast amounts of corporate data.
Asia-Pacific holds the largest share in the memory chip market due to its robust consumer electronics industry and a focus on high-end electronic devices. The region's efforts to ensure 5G mobile phone shipments dominate the domestic market by 2024 and the stable growth of major computer, communications and electronic device manufacturers contribute to its market leadership. Also, China's emphasis on exporting consumer electronic devices and expanding cross-border e-commerce businesses further solidifies its position in the memory chip market.
The memory chip market is expected to driven with the growing advancement and also the development of smaller, more efficient and higher-capacity memory chips. Miniaturization and innovative manufacturing techniques allow for the production of memory chips with increased storage capacity and enhanced performance. The smaller chips find applications in various devices, from smartphones to data centers, contributing to the market's growth. Also, advancements like 3D stacking and emerging non-volatile memory technologies are further shaping the memory chip landscape
SK hynix, for instance, developed PIM, a next-generation memory chip with computing capabilities that challenge traditional roles of memory and processors. The development paves the way for memory-centric computing, where semiconductor memory plays a central role. SK hynix's GDDR6-AiM adds computational functions to GDDR6 memory chips and accelerates data processing speeds by 16 times when it combined with a CPU or GPU, making it suitable for machine learning, high-performance computing and big data tasks.
The globally growth of the memory chip market is driven by emerging technologies and increasing demand for memory-intensive applications. The automotive industry, in particular, is undergoing significant transformation due to advanced memory chip technologies. Non-volatile memory chips, ensuring data integrity during power failures and enhancing vehicle performance, have become pivotal. High-density memory chips are enabling connected and autonomous vehicles to efficiently manage large volumes of data despite physical space constraints.
Samsung Electronics, the world's largest memory chipmaker, has announced its plans to develop a next-generation 5-nanometer-processed automotive memory chip, called eMRAM, by 2027. The eMRAM technology is vital for automotive applications, operating stably even at high temperatures with fast read and write speeds. Samsung is actively working on a 14 nm eMRAM and aims to unveil it by 2024.
The memory chip market faces formidable restraints characterized by an excessive supply of chips stockpiled in warehouses, dwindling customer orders and a substantial drop in product prices. The challenges have rendered this period one of the most demanding in the history of the memory chip industry.
Furthermore, the market contends with external economic pressures, including inflation and rising interest rates, leading consumers and businesses to defer substantial investments in memory-intensive devices such as computers and smartphones. Consequently, major memory chip manufacturers have suffered significant financial losses, exacerbating the issue of surplus inventory and highlighting a conspicuous dearth of demand in the market. The combined factors create a complex and challenging landscape for the memory chip industry, impacting its overall stability and profitability.
The global memory chip market is segmented based on type, application and region.
Dynamic Random Access Memory (DRAM) holds the largest share in the memory chip market due to its indispensable role in modern computing. DRAM provides fast, volatile storage vital for various applications. As technology advances and demands for higher performance and memory density increase, DRAM manufacturers face challenges in scaling down to and beyond the 10 nm process. The primary issue is reducing cell capacitance without compromising data retention or memory density.
Manufacturers employ advanced materials, including high-k dielectrics, to enhance individual cell capacitance. Three-dimensional (3D) integration is a critical development, as it involves vertically stacking multiple layers of memory cells, bypassing lateral scaling limitations. Advanced lithography techniques such as extreme ultraviolet (EUV) lithography enable finer dimensions, enhancing DRAM cell performance.
Major players in the DRAM industry, like Samsung, are driving innovation. Samsung introduced a 16 GB, 12 nm DDR5 DRAM featuring refined circuitry, optimized cell structures and reduced power consumption while increasing wafer productivity. Samsung also unveiled the industry's first Compute Express Link (CXL) DRAM, aiming to bridge memory and high-performance computing. Other manufacturers, such as Micron, are embracing EUV lithography to advance their DRAM portfolios.
Micron is planning to introduce EUV lithography in Japan for its next-generation DRAM, the 1-gamma (1γ) node, to achieve faster, more power-efficient and higher-performance memory products. Meanwhile, startups like NEO Semiconductor are making strides with innovative approaches like 3D X-DRAM, which leverages 3D integration to overcome conventional DRAM limitations.
Asia-Pacific commands the largest share in the memory chip market due to its prominent electronics manufacturing hubs, including China, South Korea and Taiwan. The countries are major producers of smartphones, computers and various electronic devices which is simultaneously driving significant demand for memory chips in the region.
According to Invest India, India is rapidly emerging as a global electronics manufacturing hub with the industry projected to reach US$ 300 billion by 2025 and 2026. The growth is driven by government initiatives promoting domestic electronics manufacturing, such as the Production Linked Incentive scheme. India's domestic demand for consumer electronics is on the surge and the country have become home to the world's second-largest smartphone market.
The major global players in the market include: Samsung Electronics, SK hynix, Micron Technology, Kioxia, Western Digital, HP Inc., Qualcomm, Broadcom, Texas Instruments, Renesas Electronics.
COVID-19 pandemic had a significant impact on the memory chip market. Initially, the market experienced disruptions in the supply chain, particularly from Asia, which is a major hub for semiconductor manufacturing. Lockdowns and restrictions led to factory closures and labor shortages, affecting production.
Amidst a surge in remote work and increased online activities, the demand for memory-intensive devices such as laptops, tablets and smartphones witnessed a notable upswing. The resulted in a temporary spike in demand; however, manufacturers faced challenges in meeting this heightened need due to disruptions in the supply chain. As the pandemic persisted, economic uncertainties and a decrease in consumer spending exerted a detrimental influence on the market. Numerous industries and consumers opted to defer or reduce their purchases of electronic devices, subsequently affecting the stability and profitability of the memory chip market.
The Russia-Ukraine war had a significant impact on the memory chip market due to the interconnectedness of global supply chains and geopolitical tensions. Ukraine is a major producer of neon gas, a critical component used in the manufacturing of memory chips. The conflict disrupted the supply of neon gas, leading to shortages and price increases in the semiconductor industry.
Furthermore, the war caused uncertainty in global markets, leading to fluctuations in currency exchange rates and increased production costs for memory chip manufacturers. The, in turn, affected pricing and profit margins in the memory chip market.
The global memory chip market report would provide approximately 53 tables, 47 figures and 192 Pages.
LIST NOT EXHAUSTIVE