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全球异质整合市场 - 2024-2031

Global Heterogeneous Integration Market - 2024-2031

出版日期: 2024年06月05日 | 出版商:

DataM Intelligence | 英文 180 Pages | 商品交期: 最快1-2个工作天内

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简介目录

概述

全球异质整合市场将于2023年达到9亿美元，预计2031年将达到102亿美元，2024-2031年预测期间复合年增长率为35.7%。

资料中心、科学研究和模拟等应用程式对高效能运算解决方案的需求不断增长，推动了异质整合的需求。结合 CPU、GPU 和记忆体组件的整合解决方案可为要求苛刻的运算工作负载提供能源效率、卓越的效能和可扩展性。半导体技术的不断进步，包括摩尔定律缩放、3D 整合、先进封装技术和新材料，推动了异质整合的创新。半导体製造商和代工厂投资研发，开发先进製程、封装解决方案和整合方法，推动市场成长。

消费者对异质整合不断增长的需求有助于推动预测期内的市场成长。例如，2023 年 7 月 13 日，Camtek Ltd 收到了来自一级製造商的 42 个系统订单，用于异构整合、HBM 和扇出应用。大部分订单用于高频宽记忆体（HBM）和异质整合晶片组模组的製造。晶片组模组是提升运算能力的重要组件。

由于异质整合各产业的研发支出不断成长，北美成为市场的主导地区。电子、航空航太、资讯科技、製造和医疗保健等广泛技术产业的研发支出被大量吸引到北美。研发专案集中在提高整合能力和开发异质整合的封装方法。

动力学

半导体技术的快速进步

半导体技术的进步允许更高的整合密度，并使更多的元件能够整合到更小的空间中。这对于异质整合尤其重要，其中不同类型的元件需要整合到单一套件或系统中。更高的整合密度可提高整合解决方案的整体效能、功能和效率。半导体的进步有助于元件的小型化，从而可以创建紧凑的设备。这对于需要便携式和节省空间的解决方案的应用非常有利，例如行动装置和汽车电子产品。异质整合利用这些小型化趋势来创建更小但更强大的整合系统。

主要参与者在新产品发布中的倡议不断增加有助于推动预测期内的市场成长。例如，2023年5月16日，iDEAL Semiconductor在市场上推出了SuperQ技术。它有助于减少太阳能电池板、资料中心、电动车和马达驱动等各种应用中的功率损耗。其效率的提高有助于减少碳足迹。

不断发展的智慧製造和工业 4.0 计划

智慧製造和工业 4.0 专案推动了整合工业物联网解决方案的日益普及。感测器、执行器、控制器、通讯模组和资料处理单元必须经常整合到一个连贯的系统中以实施这些解决方案。异质整合使得工业领域的组件无缝整合、预测性维护和流程优化成为可能。

工业4.0非常强调整个生产过程的资料整合。透过异质集成，分析驱动的决策和不同系统的整合变得更加容易。整合系统可以收集多个来源的资料并对其采取行动，从而提高智慧工厂的效率和生产力。根据半导体产业协会的资料，到 2025 年，全球将安装超过 750 亿台物联网设备。全球物联网半导体元件市场预计将以 19% 的复合年增长率成长，到 2025 年将达到 800 亿美元。

整合的复杂性

将不同组件与不同技术、外形尺寸和功能整合的复杂性通常会导致更高的开发成本。投资异质整合解决方案的公司可能会产生与专业设计工具、整合技术专业知识、原型设计、测试、验证和设计迭代相关的费用。较高的开发成本可能会阻止一些公司采用异质集成，特别是那些研发预算有限或对成本敏感的应用程式的公司。

异质整合的复杂性可能会导致整合解决方案的开发週期和上市时间更长。设计、测试、最佳化和验证复杂的整合系统需要精心规划、跨职能团队之间的协作以及迭代设计迭代。开发时间的延迟可能会影响市场竞争力、错失机会以及在快速发展的行业中缓慢采用异质整合解决方案。

将组件与不同的介面、协定、工作电压和热曲线整合带来了技术挑战。确保整合组件的兼容性、讯号完整性、供电、热管理和可靠性需要全面的工程专业知识和创新的解决方案。克服整合挑战会增加开发过程的复杂性，并可能需要定製或解决方法，进一步增加开发时间和成本。

The growing need for high-performance computing solutions in applications such as data centers, scientific research and simulation drives the demand for heterogeneous integration. Integrated solutions combining CPUs, GPUs and memory components offer energy efficiency, superior performance and scalability for demanding computing workloads. Growing advancements in semiconductor technologies, including Moore's Law scaling, 3D integration, advanced packaging techniques and new materials, fuel innovation in heterogeneous integration. Semiconductor manufacturers and foundries invest in R&D to develop advanced processes, packaging solutions and integration methodologies, driving market growth.

Growing consumer demand for heterogeneous integration helps to boost market growth over the forecast period. For instance, on July 13, 2023, Camtek Ltd, received an order of 42 Systems from Tier-1 Manufacturers for Heterogeneous Integration, HBM and Fan-out Applications. Most of the orders are for High Bandwidth Memory (HBM) and the manufacture of chipset modules for heterogeneous integration. The chipset module is an important component in enhancing computing power.

North America is a dominating region in the market due to the growing research and development expenditure by various industries of heterogeneous integration. Research and development expenditures across a wide range of technological industries such as electronics, aerospace, IT, manufacturing and healthcare are heavily attracted to North America. Research and development projects concentrate on improving integration capabilities and developing packaging methods for heterogeneous integration.

Dynamics

Rapid Advancements in Semiconductor Technologies

Technological Advancements in semiconductors allow for higher integration densities and enable more Component to be integrated into smaller spaces. The is particularly important for heterogeneous integration, where different types of Component need to be integrated into a single package or system. Higher integration densities improve the overall performance, functionality and efficiency of integrated solutions. Semiconductor advancements contribute to the miniaturization of Component, making it possible to create compact devices. The is beneficial for applications that require portable and space-efficient solutions like mobile devices and automotive electronics. Heterogeneous integration leverages these miniaturization trends to create smaller yet powerful integrated systems.

Growing major key player's initiatives in the new product launches helps to boost market growth over the forecast period. For instance, on May 16, 2023, iDEAL Semiconductor launched SuperQ Technology in the market. It helps to reduce power loss in various applications such as solar panels, data centers, electric vehicles and motor drives. Its elevated efficiency helps to reduce carbon footprint.

Growing Smart Manufacturing and Industry 4.0 Initiatives

The growing adoption of integrated industrial IoT solutions is boosted by smart manufacturing and Industry 4.0 projects. Sensors, actuators, controllers, communication modules and data processing units must frequently be integrated into a coherent system to implement these solutions. Heterogeneous integration makes it possible for Component to be seamlessly integrated, predictive maintenance and process optimization in industry.

Industry 4.0 places a strong emphasis on data integration throughout the production process. Analytics-driven decision-making and the integration of diverse systems are made easier by heterogeneous integration. Integrated systems can gather and act upon data from multiple sources, leading to improved efficiency and productivity in smart factories. According to the Semiconductor Industry Association data, by 2025, over 75 billion installed IoT devices globally. The global IoT semiconductor component market is slated to grow at a CAGR of 19% to US$80 billion in 2025.

Complexity of Integration

The complexity of integrating diverse Component with varying technologies, form factors and functionalities often leads to higher development costs. Companies investing in heterogeneous integration solutions may incur expenses related to specialized design tools, expertise in integration techniques, prototyping, testing, validation and iteration of designs. The higher development costs can deter some companies from adopting heterogeneous integration, particularly those with limited R&D budgets or cost-sensitive applications.

The intricate nature of heterogeneous integration can result in longer development cycles and time-to-market for integrated solutions. Designing, testing, optimizing and validating complex integrated systems require meticulous planning, collaboration among cross-functional teams and iterative design iterations. Delays in development timelines can impact market competitiveness, missed opportunities and slower adoption of heterogeneous integration solutions in rapidly evolving industries.

Integrating Component with different interfaces, protocols, operating voltages and thermal profiles presents technical challenges. Ensuring compatibility, signal integrity, power delivery, thermal management and reliability across integrated Component requires thorough engineering expertise and innovative solutions. Overcoming integration challenges adds complexity to the development process and may require customizations or workarounds, further contributing to development time and costs.

Segment Analysis

The global heterogeneous integration market is segmented based on component, design, end-user and region.

Advanced Manufacturing & Multi-Chip Integration Component is Dominating in the Market

Based on the component, the heterogeneous integration market is segmented into advanced manufacturing & multi chip integration, integrated photonics, integrated power electronics, mems and sensor integration, 5g and rf and analog mixed signal.

Modern manufacturing methods enable electrical components to be made smaller while maintaining their functionality. By combining several chips or components into a single package, multichip integration (MCI) approaches can reduce package size and increase efficiency. The complexity of electronic devices is making it increasingly necessary to integrate many functionalities into constrained spaces. Processors, memory, sensors and other components combined more easily because of advanced manufacturing and MCI, resulting in highly integrated systems with better functionality and performance.

Improved heat management in electronic systems is supported by MCI techniques and advanced production procedures. The technologies help address thermal issues in high-performance electronics by incorporating cooling solutions, heat dissipation structures and thermal interfaces right into the package. Long-term cost savings can result from advanced manufacturing and MCI techniques, despite the initial infrastructure and R&D costs. Through component reduction, assembly process simplification and increased dependability, these technologies help lower the total cost of electronic systems.

Geographical Penetration

North America is Dominating the Heterogeneous Integration Market

Having a high concentration of top semiconductor businesses, producers of electronic Component, academic institutions and technical inventors, North America has a strong technological ecosystem. The creation of cutting-edge heterogeneous integration solutions is encouraged by this environment, along with innovation and collaboration. The region is home of some of the largest semiconductor manufacturers. The creation of heterogeneous integration solutions depends on the semiconductor integration techniques and technologies that these companies invented.

Growing Government funding for heterogeneous integration helps to boost regional market growth over the forecast period. For instance, on May 17, 2022, UCLA and SEMI announced that they won a US$ 300,000 grant from U.S. Department of Commerce's National Institute of Standards and Technology for the production of a roadmap for advanced packaging technologies.

Competitive Landscape

The major global players in the market include ASE TECHNOLOGY HOLDING, Intel, Etron Technology, EV Group, Taiwan Semiconductor Manufacturing Company Limited, Applied Materials, Inc., Semi, Micross, Skywater Technology and Silicon Austria Labs GmbH.

COVID-19 Impact Analysis

As global shortage of raw materials, the pandemic caused disruptions in globally supply chains. The complex supply chain of electronic Component and materials is necessary for heterogeneous integration. Many manufacturing facilities and production lines were temporarily shut down or operated at reduced capacity due to restrictions, lockdowns and safety protocols. The led to production slowdowns and challenges in meeting demand for heterogeneous integration solutions, impacting market growth and delivery schedules.

The pandemic-induced changes in consumer behavior, remote working trends, digitalization initiatives and healthcare requirements influenced the demand for heterogeneous integration solutions. Increased demand for telecommunication equipment, data centers, IoT devices, healthcare electronics and e-commerce platforms led to shifts in demand patterns within the heterogeneous integration market. The shift to remote work and virtual collaboration posed challenges for companies involved in heterogeneous integration, particularly in terms of project management, engineering collaboration, prototyping and testing. Remote work setups impacted productivity, innovation cycles and the development of new integrated solutions, requiring adjustments and digital transformation efforts.

Russia-Ukraine War Impact Analysis

Global supply chains are disrupted by geopolitical tensions between the countries which have an impact on the distribution and travel of raw materials and Component. The availability and cost of vital Component used in integrated systems are impacted in the case of the heterogeneous integration market by disruptions in the semiconductor supply chain and logistics brought on by the conflict between Russia and Ukraine. Market turbulence and uncertainty are frequently caused by geopolitical tensions as investors and companies respond to geopolitical risks and incidents. In the heterogeneous integration market and close industries, uncertainty affects decisions regarding investments and causes volatility in market trends, demand and investment patterns.

Geopolitical events influence currency exchange rates. Currency fluctuations affect import/export costs, international trade, pricing strategies and profitability for companies operating in the global heterogeneous integration market, especially those with exposure to affected currencies. Geopolitical tensions result in regulatory changes, trade restrictions, sanctions or export policies that impacted the operations and business environment for companies in the heterogeneous integration market. Changes in trade policies or regulatory frameworks can affect market access, trade relationships, compliance requirements and business continuity planning for industry players.

By Component

Advanced Manufacturing & Multi Chip Integration
Integrated Photonics
Integrated Power Electronics
MEMS and Sensor Integration
5G, RF and Analog Mixed Signal

By Design

Co-Design
Modeling & Simulation

By End-User

Semiconductor and Electronics
IT and Telecommunications
Automotive and Transportation
Healthcare and Life Sciences
Manufacturing and Industrial
Aerospace and Defense
Others

By Region

North America
- U.S.
- Canada
- Mexico
Europe
- Germany
- UK
- France
- Italy
- Spain
- Rest of Europe
South America
- Brazil
- Argentina
- Rest of South America
Asia-Pacific
- China
- India
- Japan
- Australia
- Rest of Asia-Pacific
Middle East and Africa

Key Developments

On February 21, 2024, Intel Foundry and Cadence collaborated to enable Heterogeneous Integration with EMIB Packaging Technology to address the growing complexity in heterogeneously integrated multi-chip(let) architectures.
On September 20, 2023, ITRI led a global semiconductor collaboration for heterogeneous integration to pioneer pilot production solutions. Leading semiconductor companies from Taiwan and throughout the globe are brought together by Alliance to offer a wide range of services, including package design, testing and verification, as well as pilot production.
On July 10, 2023, Applied Materials, Inc. advanced heterogeneous chip integration with new technologies for hybrid bonding and through-silicon vias. It helps chipmakers integrate chipsets into advanced 2.5D and 3D packages using hybrid bonding and through-silicon vias (TSVs).

Why Purchase the Report?

To visualize the global heterogeneous integration market segmentation based on component, design, end-user and region, as well as understand key commercial assets and players.
Identify commercial opportunities by analyzing trends and co-development.
Excel data sheet with numerous data points of heterogeneous integration market-level with all segments.
PDF report consists of a comprehensive analysis after exhaustive qualitative interviews and an in-depth study.
Product mapping available as excel consisting of key products of all the major players.

The global heterogeneous integration market report would provide approximately 62 tables, 57 figures and 180 Pages.

Target Audience 2024

Manufacturers/ Buyers
Industry Investors/Investment Bankers
Research Professionals
Emerging Companies

1.Methodology and Scope

1.1.Research Methodology
1.2.Research Objective and Scope of the Report

2.Definition and Overview

3.Executive Summary

3.1.Snippet by Component
3.2.Snippet by Design
3.3.Snippet by End-User
3.4.Snippet by Region

4.Dynamics

4.1.Impacting Factors
- 4.1.1.Drivers
  - 4.1.1.1.Rapid Advancements in Semiconductor Technologies
  - 4.1.1.2.Growing Smart Manufacturing and Industry 4.0 Initiatives
- 4.1.2.Restraints
  - 4.1.2.1.Complexity of Integration
- 4.1.3.Opportunity
- 4.1.4.Impact Analysis

5.Industry Analysis

5.1.Porter's Five Force Analysis
5.2.Supply Chain Analysis
5.3.Pricing Analysis
5.4.Regulatory Analysis
5.5.Russia-Ukraine War Impact Analysis
5.6.DMI Opinion

6.COVID-19 Analysis

6.1.Analysis of COVID-19
- 6.1.1.Scenario Before COVID-19
- 6.1.2.Scenario During COVID-19
- 6.1.3.Scenario Post COVID-19
6.2.Pricing Dynamics Amid COVID-19
6.3.Demand-Supply Spectrum
6.4.Government Initiatives Related to the Market During Pandemic
6.5.Manufacturers Strategic Initiatives
6.6.Conclusion

7.By Component

7.1.Introduction
- 7.1.1.Market Size Analysis and Y-o-Y Growth Analysis (%), By Component
- 7.1.2.Market Attractiveness Index, By Component
7.2.Advanced Manufacturing & Multi Chip Integration*
- 7.2.1.Introduction
- 7.2.2.Market Size Analysis and Y-o-Y Growth Analysis (%)
7.3.Integrated Photonics
7.4.Integrated Power Electronics
7.5.MEMS and Sensor Integration
7.6.5G, RF and Analog Mixed Signal Embedded Bridge

8.By Design

8.1.Introduction
- 8.1.1.Market Size Analysis and Y-o-Y Growth Analysis (%), By Design
- 8.1.2.Market Attractiveness Index, By Design
8.2.Co-Design *
- 8.2.1.Introduction
- 8.2.2.Market Size Analysis and Y-o-Y Growth Analysis (%)
8.3.Modeling & Simulation

9.By End-User

9.1.Introduction
- 9.1.1.Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
- 9.1.2.Market Attractiveness Index, By End-User
9.2.Semiconductor and Electronics*
- 9.2.1.Introduction
- 9.2.2.Market Size Analysis and Y-o-Y Growth Analysis (%)
9.3.IT and Telecommunications
9.4.Automotive and Transportation
9.5.Healthcare and Life Sciences
9.6.Manufacturing and Industrial
9.7.Aerospace and Defense
9.8.Others

10.By Region

10.1.Introduction
- 10.1.1.Market Size Analysis and Y-o-Y Growth Analysis (%), By Region
- 10.1.2.Market Attractiveness Index, By Region
10.2.North America
- 10.2.1.Introduction
- 10.2.2.Key Region-Specific Dynamics
- 10.2.3.Market Size Analysis and Y-o-Y Growth Analysis (%), By Component
- 10.2.4.Market Size Analysis and Y-o-Y Growth Analysis (%), By Design
- 10.2.5.Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
- 10.2.6.Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
  - 10.2.6.1.U.S.
  - 10.2.6.2.Canada
  - 10.2.6.3.Mexico
10.3.Europe
- 10.3.1.Introduction
- 10.3.2.Key Region-Specific Dynamics
- 10.3.3.Market Size Analysis and Y-o-Y Growth Analysis (%), By Component
- 10.3.4.Market Size Analysis and Y-o-Y Growth Analysis (%), By Design
- 10.3.5.Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
- 10.3.6.Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
  - 10.3.6.1.Germany
  - 10.3.6.2.UK
  - 10.3.6.3.France
  - 10.3.6.4.Italy
  - 10.3.6.5.Spain
  - 10.3.6.6.Rest of Europe
10.4.South America
- 10.4.1.Introduction
- 10.4.2.Key Region-Specific Dynamics
- 10.4.3.Market Size Analysis and Y-o-Y Growth Analysis (%), By Component
- 10.4.4.Market Size Analysis and Y-o-Y Growth Analysis (%), By Design
- 10.4.5.Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
- 10.4.6.Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
  - 10.4.6.1.Brazil
  - 10.4.6.2.Argentina
  - 10.4.6.3.Rest of South America
10.5.Asia-Pacific
- 10.5.1.Introduction
- 10.5.2.Key Region-Specific Dynamics
- 10.5.3.Market Size Analysis and Y-o-Y Growth Analysis (%), By Component
- 10.5.4.Market Size Analysis and Y-o-Y Growth Analysis (%), By Design
- 10.5.5.Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
- 10.5.6.Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
  - 10.5.6.1.China
  - 10.5.6.2.India
  - 10.5.6.3.Japan
  - 10.5.6.4.Australia
  - 10.5.6.5.Rest of Asia-Pacific
10.6.Middle East and Africa
- 10.6.1.Introduction
- 10.6.2.Key Region-Specific Dynamics
- 10.6.3.Market Size Analysis and Y-o-Y Growth Analysis (%), By Component
- 10.6.4.Market Size Analysis and Y-o-Y Growth Analysis (%), By Design
- 10.6.5.Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User

11.Competitive Landscape

11.1.Competitive Scenario
11.2.Market Positioning/Share Analysis
11.3.Mergers and Acquisitions Analysis

12.Company Profiles

12.1.ASE TECHNOLOGY HOLDING*
- 12.1.1.Company Overview
- 12.1.2.Product Portfolio and Description
- 12.1.3.Financial Overview
- 12.1.4.Key Developments
12.2.Intel
12.3.Etron Technology
12.4.EV Group
12.5.Taiwan Semiconductor Manufacturing Company Limited
12.6.Applied Materials, Inc.
12.7.Semi
12.8.Micross
12.9.Skywater Technology
12.10.Silicon Austria Labs GmbH

LIST NOT EXHAUSTIVE

13.Appendix

13.1.About Us and Services
13.2.Contact Us

02-2729-4219

+886-2-2729-4219

License/价格

全球异质整合市场 - 2024-2031

Global Heterogeneous Integration Market - 2024-2031

目录

第 1 章：方法与范围

第 2 章：定义与概述

第 3 章：执行摘要

第 4 章：动力学

第 5 章：产业分析

第 6 章：COVID-19 分析

第 7 章：按组件

第 8 章：设计

第 9 章：最终用户

第 10 章：按地区

第 11 章：竞争格局

第 12 章：公司简介

第 13 章：附录