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全球先进微电子/奈米电子市场（2024-2035）
市场调查报告书
商品编码
1488302

全球先进微电子/奈米电子市场（2024-2035）

The Global Market for Advanced Micro- and Nanoelectronics 2024-2035
出版日期: | 出版商: Future Markets, Inc. | 英文 1,065 Pages, 223 Tables, 268 Figures | 订单完成后即时交付

价格

先进微电子/奈米电子学是指在微米级和奈米级层级上研究、设计和製造先进电子装置和系统。这些领域涵盖广泛的技术和应用，并在这些规模层面上利用材料和结构的独特性能和行为。微电子学涉及从几微米（10^-6米）到几毫米的电子装置和组件的开发。这包括积体电路 (IC)、微处理器、微控制器和其他微型电子设备的设计和製造。奈米电子学专注于奈米级（通常为 1 至 100 奈米（10^-9 公尺））材料、设备和系统的操纵和利用。该领域探索奈米尺度上出现的独特物理、化学和电气特性，从而能够创建具有改进性能、效率和功能的新电子设备和系统。不断的小型化和性能的提高、功能的增加以及新材料的整合相结合，创造出全新的设备概念和新应用，并不断突破技术界限。因此，微电子学和奈米电子学是生活各个领域技术创新的关键和使能技术。人工智慧和虚拟宇宙等大趋势，以及发电厂和通讯网路等关键基础设施，都严重依赖微/奈米电子学。

本报告审视了全球先进微电子/奈米电子市场，并对市场规模、新兴趋势、关键驱动因素和机会、竞争格局和未来前景进行了全面分析。

公司简介中包含的公司

  • 3DSEMI
  • Ambarella
  • AMD (Advanced Micro Devices)
  • Aspinity
  • Atantares
  • BeFC
  • C3 Nano
  • Canatu
  • Cellid
  • CHASM
  • ChipMOS
  • Chiral Nano
  • Diamfab
  • Efficient Computer
  • Electroninks
  • Elephantech
  • Eliyan Corporation
  • e-peas Semiconductors
  • Esperanto Technologies
  • Floadia Corporation
  • FononTech
  • Heraeus Epurio
  • Gaianixx
  • Genomika
  • Inkron Oy (Nagase)
  • Innatera Nanosystems
  • Inuchip
  • Lotus Microsystems
  • Lumotive
  • Lux Semiconductors
  • MICLEDI Microdisplays
  • Myrias Optics
  • Nanopower Semiconductor
  • NeoLogic
  • NEO Semiconductor
  • Neuroph
  • Numem
  • Ookuma Diamond Device
  • Oriole Networks
  • Panmnesia
  • Point2 Technology
  • Pragmatic Semiconductor
  • Printoptix
  • PseudolithIC
  • PVNanoCell
  • Quinas Technology
  • Quintessent
  • RAAAM Memory Technologies
  • Rapidus
  • SiFive
  • SiPearl
  • Silicon Box
  • SK hynix
  • Swave Photonics
  • SynSense
  • tacterion GmbH
  • Tactotek
  • Taiwan Semiconductor Manufacturing Company (TSMC)
  • TopoLogic
  • TracXon
  • Voltera
  • VoxelSensors
  • WeeBit Nano
  • Wise Integration
  • Xymox Technologies, Inc.
  • Ynvisible
  • ZeroPoint Technologies AB

目录

第1章 研究方法论

第2章 简介

  • 先进微电子/奈米电子学的定义
  • 电子的演化
  • 世界各国政府的半导体融资和举措
  • 细分市场
    • 消费类电子产品
    • 运算、资料存储
    • 沟通
    • 汽车电子
    • 航空航太、国防
    • 医学、生物医学
    • 能量，功率
    • 工业自动化
    • 物联网
    • 光电子学
  • 设备技术
    • 电晶体
    • 积体电路（IC）
    • 微机电系统
    • 奈米电子学
    • 光电子学
    • 能量储存与转换
  • 电子电路、建筑
    • 类比电路
    • 数位电路
    • 混合讯号电路
    • 微处理器, 微控制器
    • 现场可编程门阵列 (FPGA)
    • 专用集成电路 (ASIC)
    • 片上系统 (SoC)
    • 记忆体架构
    • 互连、封装

第3章 技术分析

  • 设备技术
    • 电晶体
    • 微电子系统（MEMS）
    • 奈米电子学
    • 光电设备
    • 储能及转换设备
  • 电子电路、建筑
    • 积体电路（IC）
    • 微处理器, 微控制器
    • 记忆体架构
    • 互连、封装
  • 系统设计、应用
    • 嵌入式系统
    • 物联网系统
    • 穿戴式、植入式系统
  • 其他技术
    • 自旋电子学
    • 分子电子学
    • 神经形态计算
    • 3D列印电子产品

第4章 市场分析

  • 工业4.0、智慧製造
  • 与人工智慧整合
  • 物联网、连接设备
  • 消费类电子产品
  • 运算、资料存储
  • 通讯（5G、6G）
  • 汽车电子
  • 航空航太、国防
  • 医学、生物医学
  • 能量，功率
  • 工业自动化
  • 物联网
  • 光电子学
  • 绿色、永续电子产品
  • 智慧包装电子

第5章 公司概况（967家公司概况）

第6章参考资料

Advanced micro- and nanoelectronics refer to the study, design, and fabrication of advanced electronic devices and systems at the micro- and nanoscale levels. These fields encompass a wide range of technologies and applications, leveraging the unique properties and behaviours of materials and structures at these scale levels. Microelectronics deals with the development of electronic devices and components with dimensions ranging from a few micrometers (10^-6 meters) to a few millimeters. It includes the design and manufacture of integrated circuits (ICs), microprocessors, microcontrollers, and other microscale electronic devices. Nanoelectronics focuses on the manipulation and exploitation of materials, devices, and systems at the nanoscale level, typically ranging from 1 to 100 nanometers (10-9 meters). This field explores the unique physical, chemical, and electrical properties that emerge at the nanoscale, enabling the creation of novel electronic devices and systems with enhanced performance, efficiency, and functionality. Ongoing miniaturization combined with performance improvements and increasing functionality as well as the integration of novel materials, radically new device concepts and new applications are pushing technological limits further and further. As such, micro- and nanoelectronics is the key and enabling technology for innovation in all areas of life. Megatrends such as artificial intelligence or the metaverse as well as critical infrastructures such as power plants or telecommunications networks, are heavily dependent on micro- and nanoelectronics.

Advanced micro- and nanoelectronics are driving innovations across industries, from consumer electronics and computing to healthcare, energy, and advanced manufacturing. This in-depth market report provides a comprehensive analysis of the global advanced micro- and nanoelectronics landscape, including market sizing, emerging trends, key drivers and opportunities, competitive landscape, and future outlook.

The report includes a detailed introduction to advanced micro- and nanoelectronics, covering definitions, importance, applications, and major market segments such as consumer electronics, computing, communications, automotive, aerospace and defense, healthcare, energy, industrial automation, Internet of Things (IoT), and optoelectronics.

A core focus is on the device technology driving micro- and nanoelectronics innovations, including transistors (FinFETs, Gate-All-Around FETs, Tunnel FETs, Carbon Nanotube FETs), integrated circuits, MEMS devices, nanoelectronic structures (carbon nanotubes, graphene, quantum dots), optoelectronic devices (LEDs, lasers, photodetectors), and energy storage/conversion devices. Market sizing and forecasts are provided for each device type through 2035.

The report also covers the electronic circuits and architectures powering today's systems, examining analog and mixed-signal circuits, microprocessors/microcontrollers, FPGAs, ASICs, System-on-Chip designs, memory architectures (DRAM, SRAM, emerging non-volatile), and advanced interconnects/packaging technologies like 3D ICs, chiplets, fan-outs, and silicon interposers. Emerging technologies like spintronics, molecular electronics, neuromorphic computing, and 3D printed electronics are analyzed regarding their current status, applications, key players, and future potential.

The market analysis section covers key trends, applications, and market forecasts across industries:

  • Consumer Electronics (smartphones, wearables, home appliances)
  • Computing and Data Storage
  • Communications
  • Automotive Electronics (ADAS, displays, sensors)
  • Aerospace & Defense
  • Healthcare and Biomedical (imaging, biosensors, wearables, implantables)
  • Energy and Power (solar cells, energy harvesting, power management)
  • Industrial Automation
  • IoT (smart home, cities, sensor networks)
  • Optoelectronics (displays, lighting, photonics)
  • Sustainable Electronics
  • Smart Packaging Electronics

Over 1,000 company profiles are included, covering start-ups to industry leaders across devices, circuits, packaging, end-use applications, and enabling technologies. Companies profiled include 3DSEMI, Ambarella, MD (Advanced Micro Devices), Aspinity, Atantares, BeFC, C3 Nano, Canatu, Cellid, CHASM, ChipMOS, Chiral Nano, Diamfab, Efficient Computer, Electroninks, Elephantech, Eliyan Corporation, e-peas Semiconductors, Esperanto Technologies, Floadia Corporation, FononTech, Heraeus Epurio, Gaianixx, Genomika, Inkron Oy (Nagase), Innatera Nanosystems, Inuchip, Lotus Microsystems, Lumotive, Lux Semiconductors, MICLEDI Microdisplays, Myrias Optics, Nanopower Semiconductor, NeoLogic, NEO Semiconductor, Neuroph, Numem, Ookuma Diamond Device, Oriole Networks, Panmnesia, Point2 Technology, Pragmatic Semiconductor, Printoptix, PseudolithIC, PVNanoCell, Quinas Technology, Quintessent, RAAAM Memory Technologies, Rapidus, SiFive, SiPearl , Silicon Box, SK hynix, Swave Photonics, SynSense, tacterion GmbH, Tactotek, Taiwan Semiconductor Manufacturing Company (TSMC), TopoLogic, TracXon, Voltera, VoxelSensors, WeeBit Nano, Wise Integration, Xymox Technologies, Inc., Ynvisible and ZeroPoint Technologies AB.

With insights into the latest market developments, disruptive technologies, competitive strategies, and opportunities across applications, this report is an invaluable resource for companies, investors, and professionals navigating the dynamic micro- and nanoelectronics space.

TABLE OF CONTENTS

1. RESEARCH METHODOLOGY

2. INTRODUCTION

  • 2.1. Definition of Advanced Micro- and Nanoelectronics
  • 2.2. The evolution of electronics
  • 2.3. Global government semiconductors funding and initiatives
  • 2.4. Market segments
    • 2.4.1. Consumer Electronics
    • 2.4.2. Computing and Data Storage
    • 2.4.3. Communications
    • 2.4.4. Automotive Electronics
    • 2.4.5. Aerospace and Defense
    • 2.4.6. Healthcare and Biomedical
    • 2.4.7. Energy and Power
    • 2.4.8. Industrial Automation
    • 2.4.9. Internet of Things (IoT)
    • 2.4.10. Optoelectronics
  • 2.5. Device Technology
    • 2.5.1. Transistors
    • 2.5.2. Integrated Circuits (ICs)
    • 2.5.3. Micro-Electro-Mechanical Systems (MEMS)
    • 2.5.4. Nanoelectronics
    • 2.5.5. Optoelectronics
    • 2.5.6. Energy Storage and Conversion
  • 2.6. Electronic Circuits and Architectures
    • 2.6.1. Analog Circuits
    • 2.6.2. Digital circuits
    • 2.6.3. Mixed-Signal Circuits
    • 2.6.4. Microprocessors and Microcontrollers
    • 2.6.5. Field-Programmable Gate Arrays (FPGAs)
    • 2.6.6. Application-Specific Integrated Circuits (ASICs)
    • 2.6.7. System-on-Chip (SoC)
    • 2.6.8. Memory Architectures
    • 2.6.9. Interconnects and Packaging

3. TECHNOLOGY ANALYSIS

  • 3.1. DEVICE TECHNOLOGY
    • 3.1.1. Transistors
      • 3.1.1.1. FinFET (Fin Field-Effect Transistor)
      • 3.1.1.2. Gate-All-Around FET
      • 3.1.1.3. Tunnel FET (TFET)
      • 3.1.1.4. Carbon Nanotube FET (CNTFET)
      • 3.1.1.5. Graphene FET
      • 3.1.1.6. Negative Capacitance FET (NC-FET)
      • 3.1.1.7. Spin FET
      • 3.1.1.8. Global market size
    • 3.1.2. Micro-Electro-Mechanical Systems (MEMS)
      • 3.1.2.1. Inertial Sensors
      • 3.1.2.2. Pressure Sensors
      • 3.1.2.3. Microfluidics
      • 3.1.2.4. RF MEMS
      • 3.1.2.5. Optical MEMS
      • 3.1.2.6. Energy Harvesting MEMS
      • 3.1.2.7. Global market size
    • 3.1.3. Nanoelectronics
      • 3.1.3.1. Carbon Nanotubes (CNTs)
        • 3.1.3.1.1. Wearable technologies and flexible displays
          • 3.1.3.1.1.1. Applications
          • 3.1.3.1.1.2. Companies
        • 3.1.3.1.2. Transistors and ICs
          • 3.1.3.1.2.1. Applications
          • 3.1.3.1.2.2. Companies
        • 3.1.3.1.3. Memory
          • 3.1.3.1.3.1. Applications
          • 3.1.3.1.3.2. Companies
      • 3.1.3.2. Graphene
        • 3.1.3.2.1. Transparent conductive films
          • 3.1.3.2.1.1. Applications
          • 3.1.3.2.1.2. Companies
        • 3.1.3.2.2. Transistors and ICs
          • 3.1.3.2.2.1. Applications
          • 3.1.3.2.2.2. Companies
        • 3.1.3.2.3. Thermal management
          • 3.1.3.2.3.1. Applications
          • 3.1.3.2.3.2. Market players
        • 3.1.3.2.4. Memory
          • 3.1.3.2.4.1. Applications
          • 3.1.3.2.4.2. Companies
      • 3.1.3.3. Molybdenum disulfide
      • 3.1.3.4. Quantum Dots
      • 3.1.3.5. Nanowires
      • 3.1.3.6. Topological Insulators
      • 3.1.3.7. Spintronic Devices
      • 3.1.3.8. Memristors
      • 3.1.3.9. Ferroelectric FETs
      • 3.1.3.10. Global market size
    • 3.1.4. Optoelectronics devices
      • 3.1.4.1. Light-Emitting Diodes (LEDs)
      • 3.1.4.2. Laser Diodes
      • 3.1.4.3. Photodetectors
      • 3.1.4.4. Optical Modulators
      • 3.1.4.5. Optical Waveguides
      • 3.1.4.6. Optoelectronic Integrated Circuits (OEICs)
      • 3.1.4.7. Quantum Dot Optoelectronics
      • 3.1.4.8. Quantum Cascade Lasers (QCLs)
      • 3.1.4.9. Photonic Integrated Circuits (PICs)
      • 3.1.4.10. Micro-LEDs
      • 3.1.4.11. Mini-LEDs
      • 3.1.4.12. Global market size
    • 3.1.5. Energy Storage and Conversion Devices
      • 3.1.5.1. Lithium-Ion Batteries
      • 3.1.5.2. Supercapacitors
      • 3.1.5.3. Thin-Film Batteries
      • 3.1.5.4. Microbatteries
      • 3.1.5.5. Microfluidic Fuel Cells
      • 3.1.5.6. Piezoelectric Energy Harvesters
      • 3.1.5.7. Thermoelectric Energy Harvesters
      • 3.1.5.8. Hybrid Energy Storage Systems
      • 3.1.5.9. Photovoltaic (PV) Cells
      • 3.1.5.10. Printed Batteries
      • 3.1.5.11. Flexible Batteries
      • 3.1.5.12. Global market size
  • 3.2. ELECTRONIC CIRCUITS AND ARCHITECTURES
    • 3.2.1. Integrated Circuits (ICs)
      • 3.2.1.1. System-on-Chip (SoC)
      • 3.2.1.2. 3D Integrated Circuits
      • 3.2.1.3. Neuromorphic Circuits
      • 3.2.1.4. Quantum Integrated Circuits
      • 3.2.1.5. Heterogeneous Integration
      • 3.2.1.6. Monolithic 3D Integration
      • 3.2.1.7. Global market size
    • 3.2.2. Microprocessors and Microcontrollers
      • 3.2.2.1. Types
      • 3.2.2.2. Global market size
    • 3.2.3. Memory Architectures
      • 3.2.3.1. Dynamic RAM (DRAM)
        • 3.2.3.1.1. High Bandwidth Memory (HBM)
        • 3.2.3.1.2. 4F2 DRAM
        • 3.2.3.1.3. Monolithic 3D DRAM
        • 3.2.3.1.4. DDR4-to-DDR5
      • 3.2.3.2. Hybrid Memory Cube (HMC
      • 3.2.3.3. Static RAM (SRAM)
      • 3.2.3.4. Flash Memory
      • 3.2.3.5. Resistive RAM (ReRAM)
      • 3.2.3.6. Phase-Change Memory (PCM)
      • 3.2.3.7. Ferroelectric RAM (FeRAM)
      • 3.2.3.8. Magnetoresistive RAM (MRAM)
      • 3.2.3.9. Global market size
    • 3.2.4. Interconnects and Packaging
      • 3.2.4.1. Wafer Level Packaging
        • 3.2.4.1.1. Wafer Level Fan-Out Packaging
          • 3.2.4.1.1.1. Overview
          • 3.2.4.1.1.2. Advantages
          • 3.2.4.1.1.3. Applications
        • 3.2.4.1.2. Wafer Level Fan-In Packaging
          • 3.2.4.1.2.1. Overview
          • 3.2.4.1.2.2. Advantages
          • 3.2.4.1.2.3. Applications
        • 3.2.4.1.3. Other Types of WLP
          • 3.2.4.1.3.1. Cu-Pillar Flip Chip
          • 3.2.4.1.3.2. Embedded Wafer Level BGA (eWLB)
          • 3.2.4.1.3.3. Chip-last FO-WLP
          • 3.2.4.1.3.4. Wafer-on-Wafer (WoW)
      • 3.2.4.2. Flip-Chip Packaging
      • 3.2.4.3. Chiplets
        • 3.2.4.3.1. AMD EPYC and Ryzen processor families
        • 3.2.4.3.2. Disaggregation Needs
      • 3.2.4.4. Advanced Substrates
      • 3.2.4.5. 2.5D packaging
        • 3.2.4.5.1. Silicon Interposer 2.5D
          • 3.2.4.5.1.1. Through Si Via (TSV)
          • 3.2.4.5.1.2. (SiO2) based redistribution layers (RDLs)
        • 3.2.4.5.2. 2.5D Organic-based packaging
          • 3.2.4.5.2.1. Chip-first and chip-last fan-out packaging
          • 3.2.4.5.2.2. Organic substrates
          • 3.2.4.5.2.3. Organic RDL
        • 3.2.4.5.3. 2.5D glass-based packaging
          • 3.2.4.5.3.1. Benefits
          • 3.2.4.5.3.2. Glass Si interposers in advanced packaging
          • 3.2.4.5.3.3. Glass material properties
          • 3.2.4.5.3.4. 2/2 micrometer-m line/space metal pitch on glass substrates
          • 3.2.4.5.3.5. 3D Glass Panel Embedding (GPE) packaging
          • 3.2.4.5.3.6. Thermal management
          • 3.2.4.5.3.7. Polymer dielectric films
        • 3.2.4.5.4. 2.5D vs. 3D Packaging
          • 3.2.4.5.4.1. Benefits
          • 3.2.4.5.4.2. Challenges
          • 3.2.4.5.4.3. Trends
          • 3.2.4.5.4.4. Market players
        • 3.2.4.6. 3D packaging
          • 3.2.4.6.1. Conventional 3D packaging
          • 3.2.4.6.2. Advanced 3D Packaging with through-silicon vias (TSVs)
          • 3.2.4.6.3. Three-dimensional (3D) hybrid bonding
            • 3.2.4.6.3.1. Devices using hybrid bonding
          • 3.2.4.6.4. 3D Microbump technology
            • 3.2.4.6.4.1. Technologies
            • 3.2.4.6.4.2. Challenges
            • 3.2.4.6.4.3. Bumpless copper-to-copper (Cu-Cu) hybrid bonding
          • 3.2.4.6.5. Trends
        • 3.2.4.7. Monolithic 3D
          • 3.2.4.7.1. Transitioning from 2D Systems
          • 3.2.4.7.2. Motivation for developing monolithic 3D manufacturing
          • 3.2.4.7.3. Improved M3D Interconnect Density
          • 3.2.4.7.4. Heterogenous 3D vs Monolithic 3D
          • 3.2.4.7.5. 2D Materials
      • 3.2.4.8. Global market size
  • 3.3. SYSTEM DESIGN AND APPLICATION
    • 3.3.1. Embedded Systems
    • 3.3.2. Internet of Things (IoT) Systems
    • 3.3.3. Wearable and Implantable Systems
  • 3.4. OTHER TECHNOLOGIES
    • 3.4.1. Spintronics
      • 3.4.1.1. Overview
      • 3.4.1.2. Applications
      • 3.4.1.3. Companies
    • 3.4.2. Molecular Electronics
      • 3.4.2.1. Overview
      • 3.4.2.2. Applications
      • 3.4.2.3. Companies
    • 3.4.3. Neuromorphic Computing
      • 3.4.3.1. Overview
      • 3.4.3.2. Applications
      • 3.4.3.3. Companies
    • 3.4.4. 3D printed electronics
      • 3.4.4.1. Overview
      • 3.4.4.2. Applications
      • 3.4.4.3. Companies

4. MARKET ANALYSIS

  • 4.1. Industry 4.0 and Smart Manufacturing
  • 4.2. Integration with Artificial Intelligence (AI)
  • 4.3. Internet of Things (IoT) and Connected Devices
  • 4.4. Consumer Electronics
    • 4.4.1. Trends
    • 4.4.2. Markets and applications
      • 4.4.2.1. Smartphones
      • 4.4.2.2. Tablets and laptops
      • 4.4.2.3. Wearables
        • 4.4.2.3.1. Wrist-worn wearables
          • 4.4.2.3.1.1. Sensing
          • 4.4.2.3.1.2. Actuating
        • 4.4.2.3.2. Health monitoring
        • 4.4.2.3.3. Sports and fitness
          • 4.4.2.3.3.1. Wearable devices and apparel
          • 4.4.2.3.3.2. Skin patches
          • 4.4.2.3.3.3. Products
        • 4.4.2.3.4. Hearables
          • 4.4.2.3.4.1. Assistive Hearables
          • 4.4.2.3.4.2. Biometric Monitoring
          • 4.4.2.3.4.3. Health & Fitness Hearables
          • 4.4.2.3.4.4. Multimedia Hearables
          • 4.4.2.3.4.5. Artificial Intelligence (AI)
          • 4.4.2.3.4.6. Companies and products
        • 4.4.2.3.5. Sleep trackers and wearable monitors
          • 4.4.2.3.5.1. Built in function in smart watches and fitness trackers
          • 4.4.2.3.5.2. Smart rings
          • 4.4.2.3.5.3. Headbands
          • 4.4.2.3.5.4. Sleep monitoring devices
          • 4.4.2.3.5.5. Companies and products
        • 4.4.2.3.6. VR and AR headsets
        • 4.4.2.3.7. Companies
      • 4.4.2.4. E-Textiles
        • 4.4.2.4.1. Embedded e-textiles
        • 4.4.2.4.2. Laminated e-textiles
      • 4.4.2.5. Home appliances
    • 4.4.3. Global market size
  • 4.5. Computing and Data Storage
    • 4.5.1. Microprocessors
      • 4.5.1.1. Trends
      • 4.5.1.2. Markets and applications
      • 4.5.1.3. Companies
    • 4.5.2. Memory devices
      • 4.5.2.1. NAND flash and DRAM memory
      • 4.5.2.2. Solid-State Drive (SSD) and Memory Module
      • 4.5.2.3. Hybrid bonding
      • 4.5.2.4. Monolithic 3D DRAM
      • 4.5.2.5. Stand-Alone NOR Flash
      • 4.5.2.6. Emerging Non-Volatile Memory Technologies
      • 4.5.2.7. Other Memory Technologies
      • 4.5.2.8. Markets and applications
      • 4.5.2.9. Companies
    • 4.5.3. Global market size
  • 4.6. Communications (5G and 6G)
    • 4.6.1. Trends
    • 4.6.2. Markets and applications
      • 4.6.2.1. Wireless communication systems
      • 4.6.2.2. Networking devices
      • 4.6.2.3. Optical communications
      • 4.6.2.4. 5G and Beyond
      • 4.6.2.5. Photonic Integrated Circuits (PICs)
      • 4.6.2.6. Quantum Communication
      • 4.6.2.7. Energy Harvesting
    • 4.6.3. Global market size
  • 4.7. Automotive Electronics
    • 4.7.1. Trends
    • 4.7.2. Markets and applications
      • 4.7.2.1. Advanced driver assistance systems (ADAS)
      • 4.7.2.2. Displays
        • 4.7.2.2.1. Infotainment systems
        • 4.7.2.2.2. Instrument cluster displays
        • 4.7.2.2.3. Head-Up Displays (HUD)
        • 4.7.2.2.4. Flexible and curved displays
        • 4.7.2.2.5. Smart mirrors and pillar displays
        • 4.7.2.2.6. 3D displays
        • 4.7.2.2.7. Transparent displays
        • 4.7.2.2.8. Micro and MiniLED displays
      • 4.7.2.3. Sensors
    • 4.7.3. Global market size
  • 4.8. Aerospace and Defense
    • 4.8.1. Trends
    • 4.8.2. Markets and applications
      • 4.8.2.1. Avionics
      • 4.8.2.2. Navigation Systems
      • 4.8.2.3. Radar Systems
      • 4.8.2.4. Satellite Communication
    • 4.8.3. Global market size
  • 4.9. Healthcare and Biomedical
    • 4.9.1. Trends
    • 4.9.2. Markets and applications
      • 4.9.2.1. Medical Imaging
      • 4.9.2.2. Biosensors
      • 4.9.2.3. Medical Wearables
        • 4.9.2.3.1. Wearable and health monitoring and rehabilitation
          • 4.9.2.3.1.1. Companies and products
        • 4.9.2.3.2. Electronic skin patches
        • 4.9.2.3.3. Temperature and respiratory rate monitoring
          • 4.9.2.3.3.1. Companies and products
        • 4.9.2.3.4. Continuous glucose monitoring (CGM)
        • 4.9.2.3.5. Minimally-invasive CGM sensors
        • 4.9.2.3.6. Non-invasive CGM sensors
          • 4.9.2.3.6.1. Commercial devices
          • 4.9.2.3.6.2. Companies and products
        • 4.9.2.3.7. Cardiovascular monitoring
          • 4.9.2.3.7.1. ECG sensors
          • 4.9.2.3.7.2. Companies and products
          • 4.9.2.3.7.3. PPG sensors
            • 4.9.2.3.7.3.1. Companies and products
        • 4.9.2.3.8. Pregnancy and newborn monitoring
          • 4.9.2.3.8.1. Companies and products
        • 4.9.2.3.9. Hydration sensors
          • 4.9.2.3.9.1. Companies and products
        • 4.9.2.3.10. Wearable sweat sensors (medical and sports)
          • 4.9.2.3.10.1. Companies and products
        • 4.9.2.3.11. Wearable drug delivery
          • 4.9.2.3.11.1. Companies and products
      • 4.9.2.4. Implantable Devices
    • 4.9.3. Global market size
  • 4.10. Energy and Power
    • 4.10.1. Trends
    • 4.10.2. Markets and applications
      • 4.10.2.1. Solar Cells
      • 4.10.2.2. Energy Harvesting Devices
      • 4.10.2.3. Power Management Systems
    • 4.10.3. Global market size
  • 4.11. Industrial Automation
    • 4.11.1. Trends
    • 4.11.2. Markets and applications
      • 4.11.2.1. Industrial Control Systems
      • 4.11.2.2. Robotics
      • 4.11.2.3. Automation Equipment
    • 4.11.3. Global market size
  • 4.12. Internet of Things (IoT)
    • 4.12.1. Trends
    • 4.12.2. Markets and applications
      • 4.12.2.1. Smart homes
      • 4.12.2.2. Smart cities
      • 4.12.2.3. Connected devices
      • 4.12.2.4. Sensor networks
    • 4.12.3. Global market size
  • 4.13. Optoelectronics
    • 4.13.1. Trends
    • 4.13.2. Markets and applications
      • 4.13.2.1. Displays
        • 4.13.2.1.1. Organic LCDs (OLCDs)
        • 4.13.2.1.2. Flexible AMOLEDs
        • 4.13.2.1.3. Perovskite OLEDs
        • 4.13.2.1.4. Flexible PMOLED (Passive Matrix OLED)
        • 4.13.2.1.5. Flexible and foldable microLED
        • 4.13.2.1.6. Quantum dots
        • 4.13.2.1.7. Metamaterials
        • 4.13.2.1.8. Global market size
      • 4.13.2.2. Lighting
        • 4.13.2.2.1. Overview
        • 4.13.2.2.2. Global market size
      • 4.13.2.3. Photonics
        • 4.13.2.3.1. Overview
        • 4.13.2.3.2. Global market size
      • 4.13.2.4. Optical interconnects
        • 4.13.2.4.1. Overview
        • 4.13.2.4.2. Global market size
  • 4.14. Green and Sustainable Electronics
    • 4.14.1. Trends
    • 4.14.2. Markets and applications
    • 4.14.3. Global market size
      • 4.14.3.1. Sustainable PCBs
      • 4.14.3.2. Sustainable ICs
  • 4.15. Smart Packaging Electronics
    • 4.15.1. Trends
    • 4.15.2. Markets and applications
    • 4.15.3. Global market size

5. COMPANY PROFILES (967 company profiles)

6. REFERENCES

List of Tables

  • Table 1. Global government semiconductors funding and initiatives
  • Table 2. Market Segments and Applications of Advanced Micro- and Nanoelectronics
  • Table 3. Advanced Micro- and Nanoelectronics Device Technology by Type
  • Table 4. Types of Integrated Circuits (ICs)
  • Table 5. Types of Micro-Electro-Mechanical Systems (MEMS) devices
  • Table 6. Devices and structures in nanoelectronics
  • Table 7. Types of optoelectronics devices
  • Table 8. Electronic Circuits and Architectures by Type
  • Table 9. Types of Transistors in Advanced Micro-and Nanoelectronics
  • Table 10. Global market revenues for transistors by type, 2020-2035 (billions USD)
  • Table 11. Types of Micro-Electro-Mechanical Systems (MEMS) in Advanced Micro- and Nanoelectronics
  • Table 12. Global market revenues for MEMS devices by type, 2020-2035 (billions USD)
  • Table 13. Devices and Structures in Nanoelectronics
  • Table 14. Market and applications for carbon nanotubes in wearable & flexible electronics and displays
  • Table 15. Comparison of ITO replacements
  • Table 16. Product developers in carbon nanotubes for wearable tech and electronics
  • Table 17. Market and applications for carbon nanotubes in transistors and integrated circuits
  • Table 18. Companies developing carbon nanotubes in transistors and integrated circuits
  • Table 19. Market and applications for carbon nanotubes in memory devices
  • Table 20. Product developers in carbon nanotubes for memory devices
  • Table 21. Market outlook for graphene in transparent conductive films
  • Table 22. Market and applications for graphene in transparent conductive films
  • Table 23. Market players in graphene transparent conductive films
  • Table 24. Market outlook for graphene in transistors
  • Table 25. Market and applications for graphene transistors
  • Table 26. Market players in graphene transistors and integrated circuits
  • Table 27. Market and applications for thermal management
  • Table 28. Market players in graphene thermal management
  • Table 29. Market outlook for graphene in memory devices
  • Table 30. Market and applications for graphene in memory devices
  • Table 31. Market players in graphene memory devices
  • Table 32. Global market revenues for nanoelectronics by type, 2020-2035 (billions USD)
  • Table 33. Types of Optoelectronic Devices in Advanced Micro- and Nanoelectronics
  • Table 34. Market supply chain for quantum dots in displays
  • Table 35: Typical approaches for integrating QDs into displays
  • Table 36. Global market revenues for Optoelectronic Devices by type, 2020-2035 (billions USD)
  • Table 37. Types of Energy Storage and Conversion Devices in Advanced Micro- and Nanoelectronics
  • Table 38. Global market revenues for Energy Storage and Conversion Devices by type, 2020-2035 (billions USD)
  • Table 39. Types of Integrated Circuits in Advanced Micro- and Nanoelectronics
  • Table 40. Types of System-on-Chip (SoC) in Advanced Micro- and Nanoelectronics
  • Table 41. Global market revenues for Integrated Circuits by type, 2020-2035 (billions USD)
  • Table 42. Types of Microprocessors and Microcontrollers in Advanced Micro- and Nanoelectronics
  • Table 43. Global market revenues for Microprocessors and Microcontrollers, 2020-2035 (billions USD)
  • Table 44. Types of Memory Architectures in Advanced Micro- and Nanoelectronics
  • Table 45. Global market revenues for Memory Architectures by type, 2020-2035 (billions USD)
  • Table 46. Types of Interconnects and Packaging in Advanced Micro- and Nanoelectronics
  • Table 47. Use cases and benefits of using chiplets in semiconductor design
  • Table 48. Fan-out packaging process overview
  • Table 49. Comparison between mainstream silicon dioxide (SiO2) and leading organic dielectrics for electronic interconnect substrates
  • Table 50. Benefits of glass in 2.5D glass-based packaging
  • Table 51. Comparison between key properties of glass and polymer molding compounds commonly used in semiconductor packaging applications
  • Table 52. 2.5D vs. 3D packaging
  • Table 53. 2.5D packaging challenges
  • Table 54. Market players in 2.5D packaging
  • Table 55. Advantages and disadvantages of 3D packaging
  • Table 56. Comparison between 2.5D, 3D micro bump, and 3D hybrid bonding
  • Table 57. Challenges in 3D Hybrid Bonding
  • Table 58. Challenges in scaling bumps
  • Table 59. Key methods for enabling copper-to-copper (Cu-Cu) hybrid bonding in advanced semiconductor packaging:
  • Table 60. Micro bumps vs Cu-Cu bumpless hybrid bonding
  • Table 61. Comparison between heterogeneous 3D integration and monolithic 3D integration
  • Table 62. Key 2D materials in monolithic 3D integrated circuits
  • Table 63. Global market revenues for Interconnects and Packaging by type, 2020-2035 (billions USD)
  • Table 64. Types of system design and applicaiton
  • Table 65. Spintronics applications
  • Table 66. Spintronics companies
  • Table 67. Types of Molecular Electronics
  • Table 68. Molecular electronics applications
  • Table 69. Molecular electronics companies
  • Table 70. Types of Neuromorphic Computing
  • Table 71. Neuromorphic Computing applications
  • Table 72. Neuromorphic Computing companies
  • Table 73. 3D Printed Electronics Synthesis methods
  • Table 74. 3D printed electronics applications
  • Table 75. 3D printed electronics companies
  • Table 76. Advanced Micro- and Nanoelectronics in Industry 4.0 and smart manufacturing
  • Table 77. Integration of Advanced Micro- and Nanoelectronics with AI
  • Table 78. Advanced Micro- and Nanoelectronics in Internet of Things (IoT) and Connected Devices
  • Table 79. Trends in consumer electronics
  • Table 80. Markets and applications in consumer electronics
  • Table 81. Advanced Micro- and Nanoelectronics in smartphones
  • Table 82. Advanced Micro- and Nanoelectronics in tablets and laptops
  • Table 83. Advanced Micro- and Nanoelectronics in wrist-worn wearables
  • Table 84. Different sensing modalities that can be incorporated into wrist-worn wearable device
  • Table 85. Overview of actuating at the wrist
  • Table 86. Sports-watches, smart-watches and fitness trackers producers and products
  • Table 87. Advanced Micro- and Nanoelectronics in health monitoring
  • Table 88. Wearable health monitors
  • Table 89. Advanced Micro- and Nanoelectronics in sports and fitness wearables
  • Table 90. Wearable sensors for sports performance
  • Table 91. Wearable sensor products for monitoring sport performance
  • Table 92. Product types in the hearing assistance technology market
  • Table 93. Advanced Micro- and Nanoelectronics in hearables
  • Table 94. Companies in hearables
  • Table 95. Sensing options in the ear
  • Table 96. Companies and products in hearables
  • Table 97. Example wearable sleep tracker products and prices
  • Table 98. Advanced Micro- and Nanoelectronics in sleep trackers and wearable monitors
  • Table 99. Smart ring products
  • Table 100. Sleep headband products
  • Table 101. Sleep monitoring products
  • Table 102. Advanced Micro- and Nanoelectronics in virtual reality (VR) and augmented reality (AR) headsets
  • Table 103. Companies in wearables
  • Table 104. Advanced Micro- and Nanoelectronics in E-textiles
  • Table 105. Commercially available smart clothing products
  • Table 106. Advanced Micro- and Nanoelectronics in home appliances
  • Table 107. Applications of printed and flexible electronics in consumer electronics
  • Table 108. Global market for consumer electronics, by application, 2020-2035 (billions USD)
  • Table 109. Microprocessor trends
  • Table 110. Processor Advanced Packaging Technology Trends
  • Table 111. Markets and applications in computing and data storage
  • Table 112. Processor companies
  • Table 113. NAND and DRAM Market Trends
  • Table 114. Advanced Micro- and Nanoelectronics in memory devices
  • Table 115. Advanced Micro- and Nanoelectronics in Solid-state drives (SSDs)
  • Table 116. Memory device companies
  • Table 117. Global market for computing and data storage, by application, 2020-2035 (billions USD)
  • Table 118. Trends in communications
  • Table 119. Advanced Micro- and Nanoelectronics in wireless communication systems
  • Table 120. Advanced Micro- and Nanoelectronics in networking devices
  • Table 121. Advanced Micro- and Nanoelectronics in optical communications
  • Table 122. Advanced Micro- and Nanoelectronics in 5G and beyond
  • Table 123. Advanced Micro- and Nanoelectronics in Photonic Integrated Circuits (PICs)
  • Table 124. Applications, product examples, and advantages of quantum communications
  • Table 125. Energy harvesting in communications
  • Table 126. Global market for electronics in communications, by application, 2020-2035 (billions USD)
  • Table 127. Trends in automotive electronics
  • Table 128. Markets and applications in automotive electronics
  • Table 129. Applications of printed and flexible electronics in automotive
  • Table 130. Companies developing automotive electronics components
  • Table 131. Advanced Micro- and Nanoelectronics in ADAS
  • Table 132. Types of automotive display technologies
  • Table 133. Advanced Micro- and Nanoelectronics in infotainment systems
  • Table 134. Advanced Micro- and Nanoelectronics in instrument cluster displays
  • Table 135. Advanced Micro- and Nanoelectronics in HUD
  • Table 136. Companies developing head-up display (HUD) technologies for the automotive industry, categorized by technology type
  • Table 137. Advanced Micro- and Nanoelectronics in flexible and curved displays
  • Table 138. Companies developing flexible and curved automotive displays
  • Table 139. Smart mirrors and pillar displays in automotive
  • Table 140. Companies developing display technologies for smart mirrors and displays in automotive applications
  • Table 141. Advanced Micro- and Nanoelectronics in 3D displays for automotive
  • Table 142. Companies developing 3D display technology for automobiles
  • Table 143. Advanced Micro- and Nanoelectronics in transparent displays for automotive
  • Table 144. Companies developing transparent display products
  • Table 145. Advanced Micro- and Nanoelectronics in Micro and Mini LED displays for automotive
  • Table 146. Companies developing Mini-LEDs for automotive applications
  • Table 147. Companies developing Micro-LEDs for automotive applications
  • Table 148. Advanced Micro- and Nanoelectronics in automotive sensors
  • Table 149. Global market for automotive electronics, by application, 2020-2035 (billions USD)
  • Table 150. Trends in aerospace and defence electronics
  • Table 151. Markets and applications in aerospace and defences electronics
  • Table 152. Advanced Micro- and Nanoelectronics in avionics
  • Table 153. Advanced Micro- and Nanoelectronics in navigation systems for aerospace
  • Table 154. Advanced Micro- and Nanoelectronics in radar systems for aerospace
  • Table 155. Advanced Micro- and Nanoelectronics in satellite communication for aerospace
  • Table 156. Other applications in aerospace
  • Table 157. Global market for aerospace & defence electronics, by application, 2020-2035 (billions USD)
  • Table 158. Trends in healthcare and biomedical electronics
  • Table 159. Markets and applications in healthcare and biomedical electronics
  • Table 160. Applications of printed and flexible electronics in healthcare & wellness
  • Table 161. Advanced Micro- and Nanoelectronics in medical imaging
  • Table 162. Micro and nanoelectronic biosensors:
  • Table 163. Advanced Micro- and Nanoelectronics in medical wearables
  • Table 164. Electronic skin patch manufacturing value chain
  • Table 165. Medical wearable companies applying products to temperate and respiratory monitoring and analysis
  • Table 166. Technologies for minimally-invasive and non-invasive glucose detection-advantages and disadvantages
  • Table 167. Commercial devices for non-invasive glucose monitoring not released or withdrawn from market
  • Table 168. Minimally-invasive and non-invasive glucose monitoring products
  • Table 169. Companies developing wearable swear sensors
  • Table 170. Wearable drug delivery companies and products
  • Table 171. Advanced Micro- and Nanoelectronics in implantable devices
  • Table 172. Global market for healthcare and biomedical electronics, by application, 2020-2035 (billions USD)
  • Table 173. Trends in energy and power electronics
  • Table 174. Markets and applications in energy and power electronics
  • Table 175. Applications of printed and flexible electronics in energy storage and harvesting
  • Table 176. Advanced Micro- and Nanoelectronics in solar cells
  • Table 177. Micro and nanoelectronic energy harvesting devices
  • Table 178. Micro and nanoelectronic power management systems
  • Table 179. Global market for energy and power electronics, by application, 2020-2035 (billions USD)
  • Table 180. Trends in industrial automation electronics
  • Table 181. Markets and applications in industrial automation electronics
  • Table 182. Advanced Micro- and Nanoelectronics in industrial control systems
  • Table 183. Advanced Micro- and Nanoelectronics in robotics
  • Table 184. Advanced Micro- and Nanoelectronics in automation equipment
  • Table 185. Global market for electronics in industrial automation, by application, 2020-2035 (billions USD)
  • Table 186. Trends in Internet of Things (IoT)
  • Table 187. Semiconductor Components of IoT Devices
  • Table 188. Advanced Micro- and Nanoelectronics applications in smart homes
  • Table 189. Advanced Micro- and Nanoelectronics applications in smart cities
  • Table 190. Advanced Micro- and Nanoelectronics applications in connected devices
  • Table 191. Advanced Micro- and Nanoelectronics applications in sensor networks
  • Table 192. Global market for IoT, by application, 2020-2035 (billions USD)
  • Table 193. Trends in optoelectronics
  • Table 194. Markets and applications in optoelectronics
  • Table 195. Organic LCDs applications
  • Table 196. Flexible AMOLEDs applications
  • Table 197. Flexible PMOLEDs applications
  • Table 198. Flexible and foldable microLED applications
  • Table 199. Applications of quantum dots in displays
  • Table 200. Applications of metamaterials in displays
  • Table 201. Global market for electronic displays, by application, 2020-2035 (billions USD)
  • Table 202. Types of Advanced Micro- and Nanoelectronics in lighting
  • Table 203. Global market for electronic lighting, by application, 2020-2035 (billions USD)
  • Table 204. Types of Advanced Micro- and Nanoelectronics in photonics
  • Table 205. Global market for photonics, by application, 2020-2035 (billions USD)
  • Table 206. Types of Advanced Micro- and Nanoelectronics in optical interconnects
  • Table 207. Global market for optical interconnects, by application, 2020-2035 (billions USD)
  • Table 208. Trends in green and sustainable electronics
  • Table 209. Markets and applications in green and sustainable electronics
  • Table 210. Global sustainable PCB revenues 2018-2035, by type (millions USD)
  • Table 211. Global sustainable ICs revenues 2018-2035, by type (millions USD)
  • Table 212. Trends in smart packaging electronics
  • Table 213. Markets and applications in smart packaging electronics
  • Table 214. Applications of printed and flexible electronics in smart packaging and logistics
  • Table 215. Global market for smart packaging electronics, by application, 2020-2035 (billions USD)
  • Table 216. AMD AI chip range
  • Table 217. Applications of CV3-AD685 in autonomous driving
  • Table 218. Intel's products that adopt 3D FOVEROS
  • Table 219. LG mini QNED range
  • Table 220. Samsung Neo QLED TV range
  • Table 221. Samsung QD-TV product list
  • Table 222. San'an Mini and MicroLED Production annual target
  • Table 223. NPQDTM vs Traditional QD based MicroLEDs

List of Figures

  • Figure 1. Evolution of electronics
  • Figure 2. Global market revenues for transistors by type, 2020-2035 (billions USD)
  • Figure 3. Global market revenues for MEMS devices by type, 2020-2035 (billions USD)
  • Figure 4. Thin film transistor incorporating CNTs
  • Figure 5. Carbon nanotubes NRAM chip
  • Figure 6. Strategic Elements' transparent glass demonstrator
  • Figure 7. Applications roadmap to 2035 for graphene in transparent conductive films and displays
  • Figure 8. Moxi flexible film developed for smartphone application
  • Figure 9. Applications roadmap to 2035 for graphene transistors
  • Figure 10. Graphene IC in wafer tester
  • Figure 11. Schematic cross-section of a graphene based transistor (GBT, left) and a graphene field-effect transistor (GFET, right)
  • Figure 12. Applications roadmap to 2035 for graphene in thermal management
  • Figure 13. Applications roadmap to 2035 for graphene in memory devices
  • Figure 14. Layered structure of tantalum oxide, multilayer graphene and platinum used for resistive random-access memory (RRAM)
  • Figure 15. Global market revenues for nanoelectronics by type, 2020-2035 (billions USD)
  • Figure 16: Quantum dot LED backlighting schematic
  • Figure 17. Global market revenues for Optoelectronic Devices by type, 2020-2035 (billions USD)
  • Figure 18. Global market revenues for Energy Storage and Conversion Devices by type, 2020-2035 (billions USD)
  • Figure 19. Global market revenues for Integrated Circuits by type, 2020-2035 (billions USD)
  • Figure 20. Global market revenues for Microprocessors and Microcontrollers by type, 2020-2035 (billions USD)
  • Figure 21. Global market revenues for Memory Architectures by type, 2020-2035 (billions USD)
  • Figure 22. Typical FOWLP structure
  • Figure 23. Chiplet design
  • Figure 24. Chiplet SoC
  • Figure 25. 2D chip packaging
  • Figure 26. Typical structure of 2.5D IC package utilizing interposer
  • Figure 27. Fan-out chip-first process flow and Fan-out chip-last process flow
  • Figure 28. Manufacturing process for glass interposers
  • Figure 29. 3D Glass Panel Embedding (GPE) package
  • Figure 30. Global market revenues for Interconnects and Packaging by type, 2020-2035 (billions USD)
  • Figure 31. EmeTerm nausea relief wearable
  • Figure 32. Embr Wave for cooling and warming
  • Figure 33. dpl Wrist Wrap Light THerapy pain relief
  • Figure 34. FitBit Sense Watch
  • Figure 35. Wearable bio-fluid monitoring system for monitoring of hydration
  • Figure 36. HP Hearing PRO OTC Hearing Aid
  • Figure 37. Beddr SleepTuner
  • Figure 38. H-Tee by H-Cube
  • Figure 39. Global market for consumer electronics, by application, 2020-2035 (billions USD)
  • Figure 40. Global market for computing and data storage, by application, 2020-2035 (billions USD)
  • Figure 41. Global market for electronics in communications, by application, 2020-2035 (billions USD)
  • Figure 42. In-Vehicle Infortainment (IVI) System
  • Figure 43. Continental 3D automotive display
  • Figure 44. Global market for automotive electronics, by application, 2020-2035 (billions USD)
  • Figure 45. Global market for aerospace & defence electronics, by application, 2020-2035 (billions USD)
  • Figure 46. Companies and products in wearable health monitoring and rehabilitation devices and products
  • Figure 47. Enfucell wearable temperature tag
  • Figure 48. TempTraQ wearable wireless thermometer
  • Figure 49. Technologies for minimally-invasive and non-invasive glucose detection
  • Figure 50. Schematic of non-invasive CGM sensor
  • Figure 51. Adhesive wearable CGM sensor
  • Figure 52. VitalPatch
  • Figure 53. Wearable ECG-textile
  • Figure 54. Wearable ECG recorder
  • Figure 55. Nexkin(TM)
  • Figure 56. Bloomlife
  • Figure 57. Nanowire skin hydration patch
  • Figure 58. NIX sensors
  • Figure 59. Wearable sweat sensor
  • Figure 60. Wearable graphene sweat sensor
  • Figure 61. Gatorade's GX Sweat Patch
  • Figure 62. Sweat sensor incorporated into face mask
  • Figure 63. D-mine Pump
  • Figure 64. Lab-on-Skin(TM)
  • Figure 65. Global market for healthcare and biomedical electronics, by application, 2020-2035 (billions USD)
  • Figure 66. Global market for energy and power electronics, by application, 2020-2035 (billions USD)
  • Figure 67. Global market for industrial automation, by application, 2020-2035 (billions USD)
  • Figure 68. Global market for IoT, by application, 2020-2035 (billions USD)
  • Figure 69. Global market for displays, by application, 2020-2035 (billions USD)
  • Figure 70. Global market for lighting, by application, 2020-2035 (billions USD)
  • Figure 71. Global market for photonics, by application, 2020-2035 (billions USD)
  • Figure 72. Global market for optical interconnects, by application, 2020-2035 (billions USD)
  • Figure 73. Global sustainable PCB revenues 2018-2035, by type (millions USD)
  • Figure 74. Global sustainable ICs revenues 2018-2035, by type (millions USD)
  • Figure 75. Global market for smart packaging electronics, by application, 2020-2035 (billions USD)
  • Figure 76. Libre 3
  • Figure 77. Libre Sense Glucose Sport Biowearable
  • Figure 78. Absolic glass substrate
  • Figure 79. Skinetic vest
  • Figure 80. AcuPebble SA100
  • Figure 81. AMD Radeon Instinct
  • Figure 82. AMD Ryzen 7040
  • Figure 83. Alveo V70
  • Figure 84. Versal Adaptive SOC
  • Figure 85. AMD's MI300 chip
  • Figure 86. Vitalgram-R
  • Figure 87. BioMan+
  • Figure 88. EXO Glove
  • Figure 89. WireLED in 12" Silicon Wafer
  • Figure 90. Alertgy NICGM wristband
  • Figure 91. ALLEVX
  • Figure 92. Gastric Alimetry
  • Figure 93. Typical GaN-on-Si LED structure
  • Figure 94. 300 mm GaN-on-silicon epiwafer
  • Figure 95. e-Tint-R cell in the (a) OFF and in the (b) ON states
  • Figure 96. Alva Health stroke monitor
  • Figure 97. Sigi(TM) Insulin Management System
  • Figure 98. amofit S
  • Figure 99. MIT and Amorepacific's chip-free skin sensor
  • Figure 100. The Apollo wearable device
  • Figure 101. Apos3
  • Figure 102. Piezotech-R FC
  • Figure 103. Artemis is smart clothing system
  • Figure 104. KneeStim
  • Figure 105. LED hooded jacket
  • Figure 106. Heated element module
  • Figure 107. 1.39-inch full-circle MicroLED display
  • Figure 108. 9.4" flexible MicroLED display
  • Figure 109. Cyclops HMD
  • Figure 110. 9.4" flexible MicroLED display
  • Figure 111. PaciBreath
  • Figure 112. Structure of Azalea Vision's smart contact lens
  • Figure 113. BeFC-R biofuel cell and digital platform
  • Figure 114. Belun-R Ring
  • Figure 115. Evo Patch
  • Figure 116. Neuronaute wearable
  • Figure 117. biped.ai device
  • Figure 118. BMW in-car gaming on curved display
  • Figure 119. circul+ smart ring
  • Figure 120. Brelyon monitor
  • Figure 121. C2Sense sensors
  • Figure 122. Cala Trio
  • Figure 123. Transparent 3D touch control with LED lights and LED matrix
  • Figure 124. Schematic of TD HUD display in operation
  • Figure 125. Cionic Neural Sleeve
  • Figure 126. Carhartt X-1 Smart Heated Vest
  • Figure 127. Coachwhisperer device
  • Figure 128. Cognito's gamma stimulation device
  • Figure 129. Cogwear headgear
  • Figure 130. IntelliPix(TM) design for 0.26" 1080p microLED display
  • Figure 131. Continental's Scenic View Head-up Display (HUD)
  • Figure 132. Driver Identification Display
  • Figure 133. CardioWatch 287
  • Figure 134. C Seed 165-inch M1 MicroLED TV
  • Figure 135. N1 folding MicroLED TV
  • Figure 136. C Seed outdoor TV
  • Figure 137. Graphene dress. The dress changes colour in sync with the wearer's breathing
  • Figure 138. Dapeng DPVR P1 Pro 4k VR all-in-one VR glasses
  • Figure 139. Descante Solar Thermo insulated jacket
  • Figure 140. Illustration of how multiple qubits could be controlled using the new 'intrinsic spin-orbit EDSR' process discovered by Diraq
  • Figure 141. G+ Graphene Aero Jersey
  • Figure 142. Schematic of Magic Glass
  • Figure 143. Application of Magic Glass in office
  • Figure 144. Installation schematic of Magic Glass
  • Figure 145. First Relief
  • Figure 146. FRENZ(TM) Brainband
  • Figure 147. NightOwl Home Sleep Apnea Test Device
  • Figure 148. Jewel Patch Wearable Cardioverter Defibrillator
  • Figure 149. enFuse
  • Figure 150. Envisics HUD
  • Figure 151. EOPatch
  • Figure 152. Epilog
  • Figure 153. eQ02+LIfeMontor
  • Figure 154. HiFlex strain/pressure sensor
  • Figure 155. Cove wearable device
  • Figure 156. FloPatch
  • Figure 157. Focally Universe AR glasses
  • Figure 158. KiTT motion tracking knee sleeve
  • Figure 159. German bionic exoskeleton
  • Figure 160. UnlimitedHand
  • Figure 161. Healables app-controlled electrotherapy device
  • Figure 162. Apex Exosuit
  • Figure 163. Hinge Health wearable therapy devices
  • Figure 164. Hyundai Mobis rollable automotive display
  • Figure 165. Humanox Shin Guard
  • Figure 166. Airvida E1
  • Figure 167. Quantum dots tag on plastic bottle
  • Figure 168. Footrax
  • Figure 169. eMacula-R
  • Figure 170. Flexible microLED
  • Figure 171. G2 Pro
  • Figure 172. Atusa system
  • Figure 173. Jade Bird Display micro displays
  • Figure 174. JBD's 0.13-inch panel
  • Figure 175. 0.22" Monolithic full colour microLED panel and inset shows a conceptual monolithic polychrome projector with a waveguide
  • Figure 176. Soluboard immersed in water
  • Figure 177. Infineon PCB before and after immersion
  • Figure 178. Kenzen ECHO Smart Patch
  • Figure 179. The Kernel Flow headset
  • Figure 180. REFLEX
  • Figure 181. KnowU(TM)
  • Figure 182. APHAEA MicroLED watch
  • Figure 183. KONKA 59" tiled microLED TV prototype screen
  • Figure 184. Hyperfluorescence(TM) OLED display
  • Figure 185. Lextar 2021 micro LED and mini LED products
  • Figure 186. LSAB009 MicroLED display
  • Figure 187. LG MAGNIT 4K 136-inch TV
  • Figure 188. 12" 100 PPI full-colour stretchable microLED display
  • Figure 189. LifeSpan patch
  • Figure 190. LumeoLoop device
  • Figure 191. Ring ZERO
  • Figure 192. Marelli cockpit display
  • Figure 193. Mawi Heart Patch
  • Figure 194. WalkAid
  • Figure 195. Monarch(TM) Wireless Wearable Biosensor
  • Figure 196. MetaSCOPE
  • Figure 197. Schematic of Micro Nitride chip architecture
  • Figure 198. Modoo device
  • Figure 199. Munevo Drive
  • Figure 200. Electroskin integration schematic
  • Figure 201. Nationstar Mini LED IMD Package P0.5mm
  • Figure 202. Modius Sleep wearable device
  • Figure 203. Neuphony Headband
  • Figure 204. Nextiles' compression garments
  • Figure 205. Nextiles e-fabric
  • Figure 206. Nix Biosensors patch
  • Figure 207. Ayo wearable light therapy
  • Figure 208. Nowatch
  • Figure 209: Quantum dot sheet
  • Figure 210 .Nuada
  • Figure 211. OQmented technology for AR smart glasses
  • Figure 212. ORII smart ring
  • Figure 213. Otolith wearable device
  • Figure 214. Palarum PUP smart socks
  • Figure 215. Peerbridge Cor
  • Figure 216. Peugeot Inception Concept
  • Figure 217. 9.4" flexible MicroLED display
  • Figure 218. 7.56-inch transparent Micro LED display
  • Figure 219. 48 x 36 Passive Matrix MicroLED display
  • Figure 220. Point Fit Technology skin patch
  • Figure 221. MicroLED micro display based on a native red InGaN LED
  • Figure 222. Proxxi Voltage
  • Figure 223. Raontech microdisplays
  • Figure 224. Raythink AR-HUD
  • Figure 225. RealWear HMT-1
  • Figure 226. Sylvee 1.0
  • Figure 227. RootiRx
  • Figure 228. Micro-LED stretchable display
  • Figure 229. Sylvee 1.0
  • Figure 230. Samsung Display digital cockpit
  • Figure 231. The Wall
  • Figure 232. Samsung Neo QLED 8K
  • Figure 233. NPQD(TM) Technology for MicroLEDs
  • Figure 234. SenseGlove Nova
  • Figure 235. Wicop technology
  • Figure 236. MeganeX
  • Figure 237. Moonwalkers from Shift Robotics Inc
  • Figure 238. Silvertree Reach
  • Figure 239. 12-layer HBM3
  • Figure 240. Smardii smart diaper
  • Figure 241. SnowCookie device
  • Figure 242. Softmatter compression garment
  • Figure 243. Softmatter sports bra with a woven ECG sensor
  • Figure 244. B-Series and C-Series displays
  • Figure 245. Soter device
  • Figure 246. MoCap Pro Glove
  • Figure 247. Subcuject
  • Figure 248. A micro-display with a stacked-RGB pixel array, where each pixel is an RGB-emitting stacked MicroLED device (left). The micro-display showing a video of fireworks at night, demonstrating the full-colour capability (right). N.B. Areas around the display/
  • Figure 249. Synaptics' SmartBridge SB7900
  • Figure 250. TCL QLED TVs
  • Figure 251. T-FORCE CARDEA ZERO
  • Figure 252. Photo-polymer mass transfer process
  • Figure 253. Teslasuit
  • Figure 254. Nerivio
  • Figure 255. Feelzing Energy Patch
  • Figure 256. 7.56" Transparent Display
  • Figure 257. Ultrahuman wearable glucose monitor
  • Figure 258. Vaxxas patch
  • Figure 259. Lightscape Panoramic Display
  • Figure 260. VueReal Flipchip MicroLED (30x15 um2)
  • Figure 261. Vuzix uLED display engine
  • Figure 262. Holographic AR automotive display
  • Figure 263. S-Patch Ex
  • Figure 264. Wiliot tags
  • Figure 265. Xiaomi Smart Glasses
  • Figure 266. Zeit Medical Wearable Headband
  • Figure 267. ZOZOFIT wearable at-home 3D body scanner
  • Figure 268. YouCare smart shirt