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全球热管理材料与系统市场（2025-2035）
市场调查报告书
商品编码
1567374

全球热管理材料与系统市场（2025-2035）

The Global Market for Thermal Management Materials and Systems 2025-2035
出版日期: | 出版商: Future Markets, Inc. | 英文 399 Pages, 161 Tables, 102 Figures | 订单完成后即时交付

价格

热管理材料和系统市场在多个细分领域的推动下呈现强劲成长。主要细分市场包括消费性电子、电动车、资料中心、ADAS 感测器、EMI 屏蔽、5G/6G 通讯、航空航太和能源系统。这个市场包括各种材料，包括热界面材料（TIM），例如油脂、凝胶、糊剂、相变材料（PCM）、导热垫、间隙填充物、黏合剂、碳基材料和金属溶液。

电动车是一个特别活跃的领域，对电池、电力电子设备和电动马达的先进热管理解决方案的需求不断增加。 800V 架构和高功率充电系统的转变正在推动冷却技术的创新。资料中心也是一个重要的市场，其不断增加的功率密度需要更有效的冷却解决方案。浸入式冷却和混合系统的趋势反映了业界对更有效率的热管理方法的需求。 5G/6G基础设施的出现带来了新的热课题，尤其是在天线系统和基地台方面。同样，随着感测器功能的扩展，ADAS 感测器市场对越来越先进的热解决方案的需求。展望2035年，市场各领域展现强劲的成长潜力，尤其强调：

  • 高导热率先进材料 整合冷却系统
  • 永续且环保的解决方案
  • 具有 AI/ML 功能的智慧热管理系统
  • 浸入式冷却和相变材料等新方法

本报告研究了全球热管理材料和系统市场，并提供了全面的分析，包括对快速发展的行业、2035 年的市场预测、技术发展和竞争格局的详细见解。

目录

第 1 章简介

  • 热管理
  • 热管理系统
  • 主要类型的热管理材料和技术

第 2 章 导热材料

  • 什么是热界面材料 (TIM)？
  • TIM 的比较特性
  • 按类型划分的 TIM 优点和缺点
  • 价格
  • 导热硅脂、导热膏
  • 导热垫
  • 热间隙填充物
  • 导热胶、灌封材料
  • 金属基 TIM
  • 碳基TIM
  • 超材料
  • 自修復热界面材料
  • 相变热界面材料 (PCTIM)
  • 全球市场预测（2020-2035）

第 3 章 散热器与散热片

  • 设计
  • 材料
  • 课题
  • 市场预测

第 4 章 液体冷却系统

  • 设计
  • 型
  • 液体冷却系统的组件
  • 资料中心冷却
  • 优点
  • 课题
  • 市场预测

第 5 章 空气冷却

  • 简介
  • 空气冷却方式
  • 商业范例
  • 优化水电消耗
  • 用途
  • 市场预测

第 6 章 冷却板

  • 概述
  • 设计
  • 强化方法
  • 用途
  • 市场预测

第 7 章 喷雾冷却

  • 概述
  • 传热机制
  • 喷雾式冷却剂
  • 用途
  • 市场预测

第 8 章浸入式冷却

  • 概述
  • 常见的浸没液
  • 优点
  • 单相浸入式冷却
  • 两相浸入式冷却
  • 商业范例
  • 成本
  • 课题
  • 市场预测

第 9 章 热电冷却器

  • 热电模组
  • 绩效因素
  • 电子冷却

第 10 章 冷却液

  • 概述
  • 电动车
  • 浸入式冷却的采用率不断提高
  • 市场预测

第 11 章 相变材料

  • 相变材料（PCM）的特性
  • 型
  • 热能储存 (TES)
  • 电池热管理
  • 市场预测

第 12 章热管理材料与系统市场

  • 消费性电子产品
      市场概况
    • 市场推动因素
    • 用途
    • 全球市场收入（2020-2035 年）
  • 电动车 (EV)
    • 概述
    • 电动汽车热系统架构与组件
    • 商用车热管理系统
    • 市场推动因素
    • 电动车冷却
    • 电动机
    • 电力电子
    • 充电站
    • 全球市场收入（2020-2035 年）
  • 资料中心
      市场概况
    • 市场推动因素
    • 资料中心热管理要求
    • 资料中心冷却
    • 用途
    • 全球市场收入（2020-2035 年）
  • ADAS 感测器
      市场概况
    • 市场推动因素
    • 用途
    • 全球市场收入（2020-2035 年）
  • EMI 屏蔽
      市场概况
    • 市场推动因素
    • 用途
    • 全球市场收入（2020-2035 年）
    5G/6G
      市场概况
    • 市场推动因素
    • 用途
    • 全球市场收入（2020-2035 年）
    航太
      市场概况
    • 市场推动因素
    • 用途
    • 全球市场收入（2020-2035 年）
  • 能源系统
      市场概况
    • 市场推动因素
    • 用途
    • 全球市场收入（2020-2035 年）
  • 其他市场
    • 先进机器人

第 13 章 全球收入

  • 按类型划分的全球收入（2023 年）
  • 按材料划分的全球收入（2024-2035 年）
  • 按最终用途市场
  • 按地区

第14章 未来市场展望

第15章 公司简介 (169 家公司简介)

第 16 章 研究方法

第 17 章参考资料

The thermal management materials and systems market is experiencing significant growth driven by multiple sectors. Key market segments include consumer electronics, electric vehicles, data centers, ADAS sensors, EMI shielding, 5G/6G telecommunications, aerospace, and energy systems. The market features diverse materials including thermal interface materials (TIMs) such as greases, gels, pastes, phase change materials (PCMs), thermal pads, gap fillers, adhesives, carbon-based materials, and metallic solutions.

Electric vehicles represent a particularly dynamic segment, with increasing demand for sophisticated thermal management solutions for batteries, power electronics, and motors. The transition to 800V architectures and higher-power charging systems is driving innovation in cooling technologies. Data centers are another crucial market, with growing power densities necessitating more effective cooling solutions. The trend toward immersion cooling and hybrid systems reflects the industry's need for more efficient thermal management approaches. The emergence of 5G/6G infrastructure has created new thermal challenges, particularly in antenna systems and base stations. Similarly, the ADAS sensor market requires increasingly sophisticated thermal solutions as sensor capabilities expand. Looking toward 2035, the market shows strong growth potential across all segments, with particular emphasis on:

  • Advanced materials with higher thermal conductivity
  • Integrated cooling systems
  • Sustainable and environmentally friendly solutions
  • Smart thermal management systems with AI/ML capabilities
  • Novel approaches like immersion cooling and phase change materials

"The Global Thermal Management Materials and Systems 2025-2035" provides detailed insights into the rapidly evolving thermal management materials and systems industry, covering crucial applications across electric vehicles, data centers, consumer electronics, and emerging technologies. The comprehensive analysis includes market forecasts, technological developments, and competitive landscapes through 2035.

Report contents in:

  • In-depth analysis of thermal interface materials (TIMs), including greases, phase change materials, thermal pads, and advanced carbon-based solutions
  • Detailed examination of cooling technologies: liquid cooling, air cooling, immersion cooling, and hybrid systems
  • Comprehensive coverage of electric vehicle thermal management, including battery, power electronics, and motor cooling solutions
  • Analysis of data center cooling trends, from traditional air cooling to advanced immersion systems
  • Evaluation of emerging technologies in 5G/6G infrastructure cooling
  • Assessment of aerospace and defense thermal management applications
  • Market opportunities in ADAS sensors and EMI shielding
  • Market size and growth projections
  • Technology trends and innovation analysis
  • Competitive landscape and company profiles. Companies profiled include 3M, Accelsius, ADA Technologies, Adept Materials, Airthium, Aismalibar, AI Technology, Amphenol Advanced Sensors, Andores New Energy, AOK Technologies, AOS Thermal Compounds, Apheros, Arkema, Arieca, Arteco, Asahi Kasei, Aspen Aerogels, Asperitas, ATP Adhesive Systems, Axalta Coating Systems, Axiotherm, Azelio, Bando Chemical Industries, Beam Global, BNNano, BNNT LLC, Boyd Corporation, BYK, Cadenza Innovation, Calyos, Carrar, Carbice Corp, Carbon Waters, Carbodeon, Chilldyne, Climator Sweden, CondAlign, Croda Europe, Cryopak, Dana, Datum Phase Change, Detakta, Devan Chemicals, Dexerials, Dober, Dow Corning, Dupont (Laird Performance Materials), Dymax, ELANTAS Europe, Deyang Carbonene Technology, Elkem Silicones, e-Mersiv, Elkem, Enerdyne Thermal Solutions, Engineered Fluids, Epoxies Etc, Ewald Dorken AG, Exergyn, First Graphene, FUCHS, Fujipoly, Fujitsu Laboratories, GLPOLY, Global Graphene Group, Graphmatech, Green Revolution Cooling (GRC), GuangDong KingBali, HALA Contec, Hamamatsu Carbonics, Goodfellow, Hangzhou Ruhr New Material Technology, H.B. Fuller, HeatVentors, Henkel, Honeywell, Huber Martinswerk, HyMet Thermal Interfaces, Iceotope, Immersion4, Indium Corporation, Inkron, Inuteq, JetCool Technologies, JIOS Aerogel, Kerafol, Kitagawa, KULR Technology Group, Leader Tech, LiquidCool Solutions, LiquidStack, Liquid Wire, LiSAT, MAHLE, Materium Technologies and more.
  • Regional market analysis
  • Application-specific requirements and solutions
  • Material developments and emerging technologies
  • Regulatory framework and environmental considerations

Detailed segments covered include:

  • Thermal Interface Materials
  • Heat Spreaders and Heat Sinks
  • Liquid Cooling Systems
  • Air Cooling Solutions
  • Cooling Plates
  • Spray Cooling Technology
  • Immersion Cooling Systems
  • Phase Change Materials
  • Coolant Fluids

Applications analyzed include:

  • Electric Vehicle Battery Systems
  • Data Center Infrastructure
  • Consumer Electronics
  • 5G/6G Communications
  • Aerospace Systems
  • ADAS Sensors
  • Power Electronics
  • EMI Shielding

TABLE OF CONTENTS

1. INTRODUCTION

  • 1.1. Thermal management
    • 1.1.1. Active
    • 1.1.2. Passive
  • 1.2. Thermal Management Systems
    • 1.2.1. Immersion Cooling Systems for Data Centers
    • 1.2.2. Battery Thermal Management for Electric Vehicles
    • 1.2.3. Heat Exchangers for Aerospace Cooling
    • 1.2.4. Air Cooling Systems
    • 1.2.5. Liquid Cooling Systems
    • 1.2.6. Vapor Compression Systems
    • 1.2.7. Spray Cooling Systems
    • 1.2.8. Hybrid Cooling Systems
      • 1.2.8.1. Hybrid Liquid-to-Air Cooling
      • 1.2.8.2. Hybrid Liquid-to-Liquid Cooling
      • 1.2.8.3. Hybrid Liquid-to-Refrigerant Cooling
      • 1.2.8.4. Hybrid Refrigerant-to-Refrigerant Cooling
  • 1.3. Main types of thermal management materials and technologies

2. THERMAL INTERFACE MATERIALS

  • 2.1. What are thermal interface materials (TIMs)?
    • 2.1.1. Types
    • 2.1.2. Thermal conductivity
  • 2.2. Comparative properties of TIMs
  • 2.3. Advantages and disadvantages of TIMs, by type
  • 2.4. Prices
  • 2.5. Thermal greases and pastes
  • 2.6. Thermal gap pads
  • 2.7. Thermal gap fillers
  • 2.8. Thermal adhesives and potting compounds
  • 2.9. Metal-based TIMs
    • 2.9.1. Solders and low melting temperature alloy TIMs
    • 2.9.2. Liquid metals
    • 2.9.3. Solid liquid hybrid (SLH) metals
      • 2.9.3.1. Hybrid liquid metal pastes
      • 2.9.3.2. SLH created during chip assembly (m2TIMs)
  • 2.10. Carbon-based TIMs
    • 2.10.1. Multi-walled nanotubes (MWCNT)
      • 2.10.1.1. Properties
      • 2.10.1.2. Application as thermal interface materials
    • 2.10.2. Single-walled carbon nanotubes (SWCNTs)
      • 2.10.2.1. Properties
      • 2.10.2.2. Application as thermal interface materials
    • 2.10.3. Vertically aligned CNTs (VACNTs)
      • 2.10.3.1. Properties
      • 2.10.3.2. Applications
      • 2.10.3.3. Application as thermal interface materials
    • 2.10.4. BN nanotubes (BNNT) and nanosheets (BNNS)
      • 2.10.4.1. Properties
      • 2.10.4.2. Application as thermal interface materials
    • 2.10.5. Graphene
      • 2.10.5.1. Properties
      • 2.10.5.2. Application as thermal interface materials
        • 2.10.5.2.1. Graphene fillers
        • 2.10.5.2.2. Graphene foam
        • 2.10.5.2.3. Graphene aerogel
    • 2.10.6. Nanodiamonds
      • 2.10.6.1. Properties
      • 2.10.6.2. Application as thermal interface materials
    • 2.10.7. Graphite
      • 2.10.7.1. Properties
      • 2.10.7.2. Natural graphite
        • 2.10.7.2.1. Classification
        • 2.10.7.2.2. Processing
        • 2.10.7.2.3. Flake
          • 2.10.7.2.3.1. Grades
          • 2.10.7.2.3.2. Applications
      • 2.10.7.3. Synthetic graphite
        • 2.10.7.3.1. Classification
          • 2.10.7.3.1.1. Primary synthetic graphite
          • 2.10.7.3.1.2. Secondary synthetic graphite
          • 2.10.7.3.1.3. Processing
      • 2.10.7.4. Applications as thermal interface materials
    • 2.10.8. Hexagonal Boron Nitride
      • 2.10.8.1. Properties
      • 2.10.8.2. Application as thermal interface materials
  • 2.11. Metamaterials
    • 2.11.1. Types and properties
      • 2.11.1.1. Thermal metamaterials
      • 2.11.1.2. Electromagnetic metamaterials
        • 2.11.1.2.1. Double negative (DNG) metamaterials
        • 2.11.1.2.2. Single negative metamaterials
        • 2.11.1.2.3. Electromagnetic bandgap metamaterials (EBG)
        • 2.11.1.2.4. Bi-isotropic and bianisotropic metamaterials
        • 2.11.1.2.5. Chiral metamaterials
        • 2.11.1.2.6. Electromagnetic "Invisibility" cloak
      • 2.11.1.3. Terahertz metamaterials
      • 2.11.1.4. Photonic metamaterials
      • 2.11.1.5. Tunable metamaterials
      • 2.11.1.6. Frequency selective surface (FSS) based metamaterials
      • 2.11.1.7. Nonlinear metamaterials
      • 2.11.1.8. Acoustic metamaterials
    • 2.11.2. Application as thermal interface materials
  • 2.12. Self-healing thermal interface materials
    • 2.12.1. Extrinsic self-healing
    • 2.12.2. Capsule-based
    • 2.12.3. Vascular self-healing
    • 2.12.4. Intrinsic self-healing
    • 2.12.5. Healing volume
    • 2.12.6. Types of self-healing materials, polymers and coatings
    • 2.12.7. Applications in thermal interface materials
  • 2.13. Phase change thermal interface materials (PCTIMs)
    • 2.13.1. Thermal pads
    • 2.13.2. Low Melting Alloys (LMAs)
  • 2.14. Global Market forecast 2020-2035

3. HEAT SPREADERS AND HEAT SINKS

  • 3.1. Design
  • 3.2. Materials
    • 3.2.1. Aluminum alloys
    • 3.2.2. Copper
    • 3.2.3. Metal foams
    • 3.2.4. Metal matrix composites
    • 3.2.5. Graphene
    • 3.2.6. Carbon foams and nanotubes
    • 3.2.7. Graphite
    • 3.2.8. Diamond
    • 3.2.9. Liquid immersion cooling
    • 3.2.10. Applications
  • 3.3. Challenges
  • 3.4. Market forecast

4. LIQUID COOLING SYSTEMS

  • 4.1. Design
  • 4.2. Types
  • 4.3. Components of Liquid Cooling Systems
  • 4.4. Cooling in Data Centers
    • 4.4.1. Rack Level
    • 4.4.2. Chip Level
  • 4.5. Benefits
  • 4.6. Challenges
  • 4.7. Market forecast

5. AIR COOLING

  • 5.1. Introduction
  • 5.2. Air Cooling Methods
  • 5.3. Commercial examples
  • 5.4. Optimization of water and power consumption
  • 5.5. Applications
  • 5.6. Market forecast

6. COOLING PLATES

  • 6.1. Overview
    • 6.1.1. Advanced cooling plates
    • 6.1.2. Roll Bond Aluminium Cold Plates
    • 6.1.3. Cold Plate Design
    • 6.1.4. Commercial examples
    • 6.1.5. Graphite heat spreaders
      • 6.1.5.1. Commercial examples
    • 6.1.6. Cold Plate/Direct to Chip Cooling
    • 6.1.7. Liquid Cooling Cold Plates
    • 6.1.8. Single-Phase Cold Plate
      • 6.1.8.1. Commercial examples
    • 6.1.9. Two-Phase Cold Plate
      • 6.1.9.1. Commercial examples
  • 6.2. Design
  • 6.3. Enhancement Techniques
    • 6.3.1. Cost
  • 6.4. Applications
  • 6.5. Market forecast

7. SPRAY COOLING

  • 7.1. Overview
  • 7.2. Heat Transfer Mechanisms
  • 7.3. Spray Cooling Fluids
  • 7.4. Applications
  • 7.5. Market forecast

8. IMMERSION COOLING

  • 8.1. Overview
  • 8.2. Common immersion fluids
  • 8.3. Benefits
  • 8.4. Single-Phase Immersion Cooling
  • 8.5. Two-Phase Immersion Cooling
  • 8.6. Commercial examples
  • 8.7. Costs
  • 8.8. Challenges
  • 8.9. Market forecast

9. THERMOELECTRIC COOLERS

  • 9.1. Thermoelectric Modules
  • 9.2. Performance Factors
  • 9.3. Electronics Cooling

10. COOLANT FLUIDS

  • 10.1. Overview
    • 10.1.1. Properties
      • 10.1.1.1. Electrical
      • 10.1.1.2. Corrosion
      • 10.1.1.3. Viscosity reduction
  • 10.2. EVs
    • 10.2.1. Coolant Fluid Requirements
    • 10.2.2. Common EV Coolant Fluids
    • 10.2.3. Commercial examples
    • 10.2.4. Refrigerants for EVs
    • 10.2.5. EV coolant fluid trends
    • 10.2.6. Design Considerations
  • 10.3. Growing adoption of immersion cooling
  • 10.4. Market forecast

11. PHASE CHANGE MATERIALS

  • 11.1. Properties of Phase Change Materials (PCMs)
  • 11.2. Types
    • 11.2.1. Organic/biobased phase change materials
      • 11.2.1.1. Advantages and disadvantages
      • 11.2.1.2. Paraffin wax
      • 11.2.1.3. Non-Paraffins/Bio-based
    • 11.2.2. Inorganic phase change materials
      • 11.2.2.1. Salt hydrates
        • 11.2.2.1.1. Advantages and disadvantages
      • 11.2.2.2. Metal and metal alloy PCMs (High-temperature)
    • 11.2.3. Eutectic mixtures
    • 11.2.4. Encapsulation of PCMs
      • 11.2.4.1. Macroencapsulation
      • 11.2.4.2. Micro/nanoencapsulation
    • 11.2.5. Nanomaterial phase change materials
  • 11.3. Thermal energy storage (TES)
    • 11.3.1. Sensible heat storage
    • 11.3.2. Latent heat storage
  • 11.4. Battery Thermal Management
  • 11.5. Market forecast

12. MARKETS FOR THERMAL MANAGEMENT MATERIALS AND SYSTEMS

  • 12.1. Consumer electronics
    • 12.1.1. Market overview
    • 12.1.2. Market drivers
    • 12.1.3. Applications
      • 12.1.3.1. Smartphones and tablets
      • 12.1.3.2. Wearable electronics
    • 12.1.4. Global market revenues 2020-2035
  • 12.2. Electric Vehicles (EV)
    • 12.2.1. Overview
    • 12.2.2. Electric vehicle thermal system architecture and components
    • 12.2.3. Commercial vehicle thermal management systems
      • 12.2.3.1. Transition to 800V architecture
    • 12.2.4. Market drivers
    • 12.2.5. EV Cooling
      • 12.2.5.1. Coolant Fluids
        • 12.2.5.1.1. Properties
        • 12.2.5.1.2. Integration of battery and eAxle cooling
      • 12.2.5.2. Refrigerants
        • 12.2.5.2.1. PFAS Free Refrigerants
        • 12.2.5.2.2. The integration of heat pump systems in EVs
      • 12.2.5.3. Active vs Passive Cooling
      • 12.2.5.4. Air Cooling
      • 12.2.5.5. Liquid Cooling
      • 12.2.5.6. Refrigerant Cooling
      • 12.2.5.7. Cell-to-pack designs
      • 12.2.5.8. Cell-to-chassis/body
      • 12.2.5.9. Immersion Cooling
        • 12.2.5.9.1. Phase Change Materials
        • 12.2.5.9.2. Commercial examples
        • 12.2.5.9.3. Operating Temperature
      • 12.2.5.10. Heat Spreaders and Cooling Plates
        • 12.2.5.10.1. Heat spreader technology
          • 12.2.5.10.1.1. Commercial examples
          • 12.2.5.10.1.2. Graphite Heat Spreaders
        • 12.2.5.10.2. Advanced cold plates
          • 12.2.5.10.2.1. Commercial examples
          • 12.2.5.10.2.2. Integration of cold plates into battery enclosures
        • 12.2.5.10.3. Polymer Heat Exchangers
      • 12.2.5.11. Coolant Hoses
      • 12.2.5.12. Thermal Interface Materials
      • 12.2.5.13. Fire Protection Materials
        • 12.2.5.13.1. Overview
        • 12.2.5.13.2. Thermal runaway in electric vehicles
        • 12.2.5.13.3. Vehicle fires
        • 12.2.5.13.4. Regulations
      • 12.2.5.14. Printed Sensors
      • 12.2.5.15. Other cooling
    • 12.2.6. Electric motors
      • 12.2.6.1. Air Cooling
      • 12.2.6.2. Water-glycol Cooling
      • 12.2.6.3. Oil Cooling
      • 12.2.6.4. Advanced cooling structures
        • 12.2.6.4.1. Refrigerant Cooling
        • 12.2.6.4.2. Immersion Cooling
      • 12.2.6.5. Motor Insulation and Encapsulation
        • 12.2.6.5.1. Commercial activity
        • 12.2.6.5.2. Axial Flux Motors
        • 12.2.6.5.3. In-wheel Motors
    • 12.2.7. Power electronics
      • 12.2.7.1. Overview
      • 12.2.7.2. Technology and materials evolution
      • 12.2.7.3. Power module packaging technology
      • 12.2.7.4. Single- vs Double-Sided Cooling
      • 12.2.7.5. TIMs in Power Electronics
        • 12.2.7.5.1. Thermal Interface Material 1 (TIM1)
        • 12.2.7.5.2. Thermal Interface Material 2 (TIM2)
      • 12.2.7.6. Wire Bonding
      • 12.2.7.7. Substrate Materials
      • 12.2.7.8. Cooling Power Electronics
        • 12.2.7.8.1. Inverter package cooling
        • 12.2.7.8.2. Direct cooling
    • 12.2.8. Charging stations
      • 12.2.8.1.1. Charging Levels
      • 12.2.8.1.2. Liquid Cooling
      • 12.2.8.1.3. Commercial examples
      • 12.2.8.1.4. Immersion Cooling
      • 12.2.8.2. Cabin heating
      • 12.2.8.3. Heat Pumps
    • 12.2.9. Global Market Revenues 2020-2035
  • 12.3. Data Centers
    • 12.3.1. Market overview
    • 12.3.2. Market drivers
    • 12.3.3. Data Center thermal management requirements
      • 12.3.3.1. Increase in Thermal Design Power (TDP)
      • 12.3.3.2. Energy Efficiency
    • 12.3.4. Data Center Cooling
      • 12.3.4.1. Cooling Technology
      • 12.3.4.2. Air Cooling
      • 12.3.4.3. Hybrid Liquid-to-Air Cooling (L2A)
      • 12.3.4.4. Hybrid Liquid-to-Liquid Cooling (L2L)
      • 12.3.4.5. Hybrid Liquid-to-Refrigerant Cooling
      • 12.3.4.6. Hybrid Refrigerant-to-Refrigerant Cooling
      • 12.3.4.7. Thermal Interface Materials
        • 12.3.4.7.1. Data center power supplies
      • 12.3.4.8. Cold plates
      • 12.3.4.9. Spray Cooling
      • 12.3.4.10. Immersion Cooling
    • 12.3.5. Applications
      • 12.3.5.1. Router, switches and line cards
      • 12.3.5.2. Servers
      • 12.3.5.3. Power supply converters
    • 12.3.6. Global Market Revenues 2020-2035
  • 12.4. ADAS Sensors
    • 12.4.1. Market overview
    • 12.4.2. Market drivers
    • 12.4.3. Applications
      • 12.4.3.1. ADAS Cameras
      • 12.4.3.2. ADAS Radar
      • 12.4.3.3. ADAS LiDAR
    • 12.4.4. Global Market Revenues 2020-2035
  • 12.5. EMI shielding
    • 12.5.1. Market overview
    • 12.5.2. Market drivers
    • 12.5.3. Applications
    • 12.5.4. Global Market Revenues 2020-2035
  • 12.6. 5G/6G
    • 12.6.1. Market overview
    • 12.6.2. Market drivers
    • 12.6.3. Applications
      • 12.6.3.1. Antenna
      • 12.6.3.2. Base Band Unit (BBU)
    • 12.6.4. Global Market Revenues 2020-2035
  • 12.7. Aerospace
    • 12.7.1. Market overview
    • 12.7.2. Market drivers
    • 12.7.3. Applications
    • 12.7.4. Global Market Revenues 2020-2035
  • 12.8. Energy systems
    • 12.8.1. Market overview
    • 12.8.2. Market drivers
    • 12.8.3. Applications
    • 12.8.4. Global Market Revenues 2020-2035
  • 12.9. Other markets
    • 12.9.1. Advanced Robotics
      • 12.9.1.1. Design Considerations
      • 12.9.1.2. Implementation Strategies
      • 12.9.1.3. Advanced Cooling Technologies
      • 12.9.1.4. Environmental Considerations
      • 12.9.1.5. Future Trends

13. GLOBAL REVENUES

  • 13.1. Global revenues 2023, by type
  • 13.2. Global revenues 2024-2035, by materials type
    • 13.2.1. Telecommunications market
    • 13.2.2. Electronics and data centers market
    • 13.2.3. ADAS market
    • 13.2.4. Electric vehicles (EVs) market
  • 13.3. By end-use market
  • 13.4. By region

14. FUTURE MARKET OUTLOOK

15. COMPANY PROFILES (169 company profiles)

16. RESEARCH METHODOLOGY

17. REFERENCES

List of Tables

  • Table 1. Comparison of active and passive thermal management
  • Table 2. Air Cooling Systems Characteristics
  • Table 3. Liquid Cooling System Characteristics
  • Table 4. Vapor Compression System Characteristics
  • Table 5. Spray Cooling System Characteristics
  • Table 6. Hybrid Cooling System Characteristics
  • Table 7. Types of thermal management materials and solutions
  • Table 8. Thermal conductivities (k) of common metallic, carbon, and ceramic fillers employed in TIMs
  • Table 9. Commercial TIMs and their properties
  • Table 10. Advantages and disadvantages of TIMs, by type
  • Table 11. Thermal interface materials prices
  • Table 12. Characteristics of some typical TIMs
  • Table 13. Properties of CNTs and comparable materials
  • Table 14. Typical properties of SWCNT and MWCNT
  • Table 15. Comparison of carbon-based additives in terms of the main parameters influencing their value proposition as a conductive additive
  • Table 16. Thermal conductivity of CNT-based polymer composites
  • Table 17. Comparative properties of BNNTs and CNTs
  • Table 18. Properties of graphene, properties of competing materials, applications thereof
  • Table 19. Properties of nanodiamonds
  • Table 20. Comparison between Natural and Synthetic Graphite
  • Table 21. Classification of natural graphite with its characteristics
  • Table 22. Characteristics of synthetic graphite
  • Table 23. Properties of hexagonal boron nitride (h-BN)
  • Table 24. Comparison of self-healing systems
  • Table 25. Types of self-healing coatings and materials
  • Table 26. Comparative properties of self-healing materials
  • Table 27. Benefits and drawbacks of PCMs in TIMs
  • Table 28. Global Revenue Forecast for Thermal Interface Materials 2020-2035 (Millions USD)
  • Table 29. Challenges with heat spreaders and heat sinks
  • Table 30. Global Revenue Forecast for Heat Spreaders and Heat Sinks 2020- 2035 (Millions USD), by End Use
  • Table 31. Comparison of Liquid Cooling Methods
  • Table 32. Comparison of Liquid Cooling Technologies
  • Table 33. Cooling System Components
  • Table 34. Data Centers By Power
  • Table 35. Rack Power and Cooling
  • Table 36.Data Center Cooling Methods Comparison
  • Table 37. Benefits of Liquid Cooling Systems
  • Table 38. Challenges in Liquid Cooling Systems
  • Table 39. Global Revenue Forecast for Liquid Cooling 2020- 2035 (Millions USD), by End Use
  • Table 40. Air Cooling Methods
  • Table 41. Applications of Air Cooling in Thermal Management
  • Table 42. Global Revenue Forecast for Air Cooling 2020-2035 (Millions USD), by End Use
  • Table 43. Benefits and Challenges of Cold Plate Cooling
  • Table 44. Examples of Cold Plate Design
  • Table 45. Cold Plate Requirements
  • Table 46. Benefits and Drawbacks of Cold Plate Cooling
  • Table 47. Thermal Cost Analysis of Cold Plate Systems
  • Table 48. Global Revenue Forecast for Cooling Plates 2020- 2035 (Millions USD)
  • Table 49. Applications of Spray Cooling in Thermal Management
  • Table 50. Global Revenue Forecast for Spray Cooling 2020- 2035 (Millions USD)
  • Table 51. Applications of Immersion Cooling in Thermal Management
  • Table 52. Cost Comparison - Immersion and Air Cooling
  • Table 53. Applications of Immersion Cooling
  • Table 54. Pricing of Direct-to-Chip, Immersion and Air Cooling (US$/Watt)
  • Table 55. Challenges in Immersion Cooling
  • Table 56. Global Revenue Forecast for Immersion Cooling 2020- 2035 (Millions USD)
  • Table 57. Thermoelectric Cooling in Electronics
  • Table 58. Application of Coolant Fluids
  • Table 59. Electrical Properties of Coolants
  • Table 60. Coolant Fluid Comparison - Operating Temperature
  • Table 61. Immersion Coolant Liquid Suppliers
  • Table 62. Global Revenue Forecast for Coolant Fluids 2020- 2035 (Millions USD), by End Use
  • Table 63. Common PCMs used in electronics cooling and their melting temperatures
  • Table 64. Properties of PCMs
  • Table 65. PCM Types and properties
  • Table 66. Advantages and disadvantages of organic PCMs
  • Table 67. Advantages and disadvantages of organic PCM Fatty Acids
  • Table 68. Advantages and disadvantages of salt hydrates
  • Table 69. Advantages and disadvantages of low melting point metals
  • Table 70. Advantages and disadvantages of eutectics
  • Table 71. Global Revenue Forecast for PCM Thermal Management Materials 2020- 2035 (Millions USD)
  • Table 72. Market Drivers in consumer electronics
  • Table 73. Applications and Thermal Management Materials Types in Consumer Electronics
  • Table 74. Global Market Revenues for Thermal Management Materials in Consumer Electronics 2020-2035, by materials type
  • Table 75. Thermal Management of EV Motors by OEM
  • Table 76. EV Thermal System Companies
  • Table 77. Applications and Types in EVs
  • Table 78. Battery Thermal Management Strategy by OEM
  • Table 79. Market Drivers for EV Thermal Management
  • Table 80. Fluids per Vehicle Market Average 2023 vs 2035
  • Table 81. EV Models with EV Specific Fluids
  • Table 82. Coolants Properties Comparison
  • Table 83. Refrigerant Content in EV Models
  • Table 84. EV Refrigerant Forecast 2015-2035 (kg)
  • Table 85. Battery Cooling Methods
  • Table 86. Active Battery Cooling Methods
  • Table 87. Passive Battery Cooling Methods
  • Table 88. Commercial Liquid Cooling Comparison
  • Table 89. Fluids in EVs
  • Table 90. PCM Categories and Pros and Cons
  • Table 91. PCM vs Battery
  • Table 92. Operating Temperature Range of Commercial PCMs
  • Table 93. Thermal Conductivity and Density Comparison of EV Battery PCMs
  • Table 94. Cold Plate Design
  • Table 95. Cold Plate Suppliers
  • Table 96. Alternate Hose Materials
  • Table 97. Types of Fire Protection Materials
  • Table 98. Fire Protection Material Comparison
  • Table 99. Density vs Thermal Conductivity for Fire Protection Materials
  • Table 100. Fire Protection Materials Forecast (kg)
  • Table 101. Cooling Electric Motors Strategies
  • Table 102. Traction Motor Types
  • Table 103. Motor Cooling Strategy by Power
  • Table 104. Advanced Cooling Structures Comparison
  • Table 105. Potting and Encapsulation Companies
  • Table 106. Wide Bandgap (WBG) Semiconductor Advantages & Disadvantages
  • Table 107. SiC Drives 800V Platforms
  • Table 108. Market Share of Single and Double-Sided Cooling: 2024-2034
  • Table 109. General Trend of TIMs in Power Electronics
  • Table 110. Substrate materials properties
  • Table 111. Comparison of Al2O3, ZTA, and Si3N4 Substrate
  • Table 112. Inverter Liquid Cooling Forecast 2015-2035 (units)
  • Table 113. Drivers for Direct Oil Cooling of Inverters
  • Table 114. Commercial Direct Oil Cooling Activity
  • Table 115. EV Charging Levels
  • Table 116. Market Trends in EV Charging
  • Table 117. Thermal Management Strategies in HPC
  • Table 118.EVs with Heat Pumps
  • Table 119. Global Market Revenues for Thermal Management Materials in Electric Vehicles 2020-2035
  • Table 120. Overview of Thermal Management Methods for Data Centers
  • Table 121. Market Drivers for thermal management in data centers
  • Table 122. Data Center Equipment Overview
  • Table 123. Historic Data of TDP - GPU
  • Table 124. TDP Trend: Historic Data and Forecast Data - CPU
  • Table 125. Data Center Server Rack and Server Structure
  • Table 126. Comparison of Data Center Cooling Technology
  • Table 127.Total TIM Area in Server Boards Forecast (m2): 2022-2035
  • Table 128. TIM Consumption in Data Center Power Supplies
  • Table 129.TIM Area for Power Supply Forecast (m2): 2025-2035
  • Table 130. TIMs for Immersion Cooling
  • Table 131. Applications and Types of thermal management materials and systems in data centers
  • Table 132. Global Market Revenues for Thermal Management Materials in Data Centers 2020-2035
  • Table 133. Market Drivers for thermal management in ADAS sensors
  • Table 134. Applications and Types for thermal management in ADAS sensors
  • Table 135. Global Market Revenues for Thermal Management Materials in ADAS Sensors 2020-2035
  • Table 136. Market Drivers for thermal management in EMI shielding
  • Table 137. Applications and Types for thermal management in EMI shielding
  • Table 138. Global Market Revenues for Thermal Management Materials in EMI Shielding 2020-2035
  • Table 139. Market Drivers for 5G//6G thermal management
  • Table 140. 5G//6G thermal management Applications and Types
  • Table 141. Global Market Revenues for Thermal Management Materials in 5G/6G 2020-2035
  • Table 142. Market Drivers for thermal management in Aerospace
  • Table 143. Thermal management in Aerospace Applications and Types
  • Table 144. Global Market Revenues for Thermal Management Materials in Aerospace 2020-2035
  • Table 145. Market Drivers for thermal management in energy systems
  • Table 146. Thermal management in energy systems Applications and Types
  • Table 147. Global Market Revenues for Thermal Management Materials in Energy Systems 2020-2035
  • Table 148. Other Markets for Thermal Management Materials and Systems
  • Table 149. Thermal Management by Robot Type
  • Table 150. Global revenues for thermal management materials and systems, 2023, by type
  • Table 151. Global Revenues for Thermal Management in Telecommunications, 2024-2035 ($M)
  • Table 152. Global Revenues for Thermal Management in Electronics & Data Centers, 2024-2035 ($M)
  • Table 153. Global Revenues for Thermal Management in ADAS, 2024-2035 ($M)
  • Table 154. Global Revenues for Thermal Management in EVs, 2024-2035 ($M)
  • Table 155. Global revenues for thermal management materials & systems, 2024-2035, by end use market (millions USD)
  • Table 156. Global revenues for thermal management materials and systems 2024-2035, by region (millions USD)
  • Table 157. Future Outlook for Thermal Management Materials and Systems
  • Table 158. Carbodeon Ltd. Oy nanodiamond product list
  • Table 159. CrodaTherm Range
  • Table 160. Ray-Techniques Ltd. nanodiamonds product list
  • Table 161. Comparison of ND produced by detonation and laser synthesis

List of Figures

  • Figure 1. (L-R) Surface of a commercial heatsink surface at progressively higher magnifications, showing tool marks that create a rough surface and a need for a thermal interface material
  • Figure 2. Schematic of thermal interface materials used in a flip chip package
  • Figure 3. Thermal grease
  • Figure 4. Dispensing a bead of silicone-based gap filler onto the heat sink of a power electronics module
  • Figure 5. Application of thermal silicone grease
  • Figure 6. A range of thermal grease products
  • Figure 7. Thermal Pad
  • Figure 8. Dispensing a bead of silicone-based gap filler onto the heat sink of a power electronics module
  • Figure 9. Thermal tapes
  • Figure 10. Thermal adhesive products
  • Figure 11. Typical IC package construction identifying TIM1 and TIM2
  • Figure 12. Liquid metal TIM product
  • Figure 13. Pre-mixed SLH
  • Figure 14. HLM paste and Liquid Metal Before and After Thermal Cycling
  • Figure 15. SLH with Solid Solder Preform
  • Figure 16. Automated process for SLH with solid solder preforms and liquid metal
  • Figure 17. Schematic diagram of a multi-walled carbon nanotube (MWCNT)
  • Figure 18. Schematic of single-walled carbon nanotube
  • Figure 19. Types of single-walled carbon nanotubes
  • Figure 20. Schematic of a vertically aligned carbon nanotube (VACNT) membrane used for water treatment
  • Figure 21. Schematic of Boron Nitride nanotubes (BNNTs). Alternating B and N atoms are shown in blue and red
  • Figure 22. Graphene layer structure schematic
  • Figure 23. Illustrative procedure of the Scotch-tape based micromechanical cleavage of HOPG
  • Figure 24. Graphene and its descendants: top right: graphene; top left: graphite = stacked graphene; bottom right: nanotube=rolled graphene; bottom left: fullerene=wrapped graphene
  • Figure 25. Detonation Nanodiamond
  • Figure 26. DND primary particles and properties
  • Figure 27. Flake graphite
  • Figure 28. Applications of flake graphite
  • Figure 29. Graphite-based TIM products
  • Figure 30. Structure of hexagonal boron nitride
  • Figure 31. Classification of metamaterials based on functionalities
  • Figure 32. Electromagnetic metamaterial
  • Figure 33. Schematic of Electromagnetic Band Gap (EBG) structure
  • Figure 34. Schematic of chiral metamaterials
  • Figure 35. Nonlinear metamaterials- 400-nm thick nonlinear mirror that reflects frequency-doubled output using input light intensity as small as that of a laser pointer
  • Figure 36. Schematic of self-healing polymers. Capsule based (a), vascular (b), and intrinsic (c) schemes for self-healing materials. Red and blue colours indicate chemical species which react (purple) to heal damage
  • Figure 37. Stages of self-healing mechanism
  • Figure 38. Self-healing mechanism in vascular self-healing systems
  • Figure 39. PCM TIMs
  • Figure 40. Phase Change Material - die cut pads ready for assembly
  • Figure 41. Global Revenue Forecast for Thermal Interface Materials 2020- 2035 (Millions USD)
  • Figure 42. Global Revenue Forecast for Heat Spreaders and Heat Sinks 2020- 2035 (Millions USD)
  • Figure 43. Global Revenue Forecast for Liquid Cooling 2020- 2035 (Millions USD)
  • Figure 44. Global Revenue Forecast for Air Cooling 2020- 2035 (Millions USD), by End Use
  • Figure 45. Direct Water-Cooled Server
  • Figure 46. Global Revenue Forecast for Cooling Plates 2020- 2035 (Millions USD)
  • Figure 47. Global Revenue Forecast for Spray Cooling 2020- 2035 (Millions USD)
  • Figure 48. Roadmap of Single-Phase Immersion Cooling
  • Figure 49. Roadmap of Two-Phase Immersion Cooling
  • Figure 50. Global Revenue Forecast for Immersion Cooling 2020- 2035 (Millions USD)
  • Figure 51. Global Revenue Forecast for Coolant Fluids 2020- 2035 (Millions USD)
  • Figure 52. Phase-change TIM products
  • Figure 53. PCM mode of operation
  • Figure 54. Classification of PCMs
  • Figure 55. Phase-change materials in their original states
  • Figure 56. Thermal energy storage materials
  • Figure 57. Phase Change Material transient behaviour
  • Figure 58. Global Revenue Forecast for PCM Thermal Management Materials 2020- 2035 (Millions USD)
  • Figure 59. Schematic of TIM operation in electronic devices
  • Figure 60. Schematic of Thermal Management Materials in smartphone
  • Figure 61. Wearable technology inventions
  • Figure 62. Global Market Revenues for Thermal Management Materials in Consumer Electronics 2020-2035, by materials type
  • Figure 63. Application of thermal interface materials in automobiles
  • Figure 64. Battery pack with a cell-to-pack design and prismatic cells
  • Figure 65. Cell-to-chassis battery pack
  • Figure 66. Application of thermal interface materials in automobiles
  • Figure 67. EV battery components including TIMs
  • Figure 68. Axial Flux Motor
  • Figure 69. Exploded view of In-Wheel Motor
  • Figure 70. TIMS in EV charging station
  • Figure 71. Global Market Revenues for Thermal Management Materials in Electric Vehicles 2020-2035
  • Figure 72. Image of data center layout
  • Figure 73. Application of TIMs in line card
  • Figure 74. Global Market Revenues for Thermal Management Materials in Data Centers 2020-2035
  • Figure 75. ADAS radar unit incorporating TIMs
  • Figure 76. Global Market Revenues for Thermal Management Materials in ADAS Sensors 2020-2035
  • Figure 77. Coolzorb 5G
  • Figure 78. Global Market Revenues for Thermal Management Materials in EMI Shielding 2020-2035
  • Figure 79. TIMs in Base Band Unit (BBU)
  • Figure 80. Global Market Revenues for Thermal Management Materials in 5G/6G 2020-2035
  • Figure 81. Global Market Revenues for Thermal Management Materials in Aerospace 2020-2035
  • Figure 82. Global Market Revenues for Thermal Management Materials in Energy Systems 2020-2035
  • Figure 83. Global revenues for thermal management materials and systems in telecommuncations, 2024-2035, by type
  • Figure 84. Global revenues for thermal management materials and systems in electronics & data centers, 2024-2035, by type
  • Figure 85. Global revenues for thermal management materials and systems in ADAS, 2024-2035, by type
  • Figure 86. Global revenues for thermal management materials and systems in Electric Vehicles (EVs), 2024-2035, by type
  • Figure 87. Global revenues for thermal management materials and systems 2024-2035, by market
  • Figure 88. Global revenues for thermal management materials and systems 2024-2035, by region (millions USD)
  • Figure 89. Boron Nitride Nanotubes products
  • Figure 90. Transtherm-R PCMs
  • Figure 91. Carbice carbon nanotubes
  • Figure 92. Internal structure of carbon nanotube adhesive sheet
  • Figure 93. Carbon nanotube adhesive sheet
  • Figure 94. HI-FLOW Phase Change Materials
  • Figure 95. Thermoelectric foil, consists of a sequence of semiconductor elements connected with conductive metal. At the top (in red) is the thermal interface
  • Figure 96. Parker Chomerics THERM-A-GAP GEL
  • Figure 97. CredoTM ProMed transport bags
  • Figure 98. Metamaterial structure used to control thermal emission
  • Figure 99. Shinko Carbon Nanotube TIM product
  • Figure 100. The Sixth Element graphene products
  • Figure 101. Thermal conductive graphene film
  • Figure 102. VB Series of TIMS from Zeon