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硅光子学·光积体电路的全球市场(2025年～2035年)
市场调查报告书
商品编码
1686674

硅光子学·光积体电路的全球市场(2025年～2035年)

The Global Silicon Photonics and Photonic Integrated Circuits Market 2025-2035
出版日期: | 出版商: Future Markets, Inc. | 英文 344 Pages, 146 Tables, 42 Figures | 订单完成后即时交付

价格

人工智慧技术的快速发展对网路和资料中心提出了前所未有的要求。硅光子学和整合光路为此问题提供了尖端的网路解决方案。人工智慧 "工厂" 是一种新型的超大型资料中心，需要对网路基础设施进行现代化改造才能容纳它们。美国人工智慧计算跨国公司 NVIDIA 最近宣布，计划利用硅光子学和共封装光学元件 (CPO) 连接这些人工智慧工厂中的数百万个 GPU。

硅光子学/光子积体电路 (PIC) 是半导体和光学交叉领域的变革性技术，能够在硅晶片上操纵光。由于资料中心面临由人工智慧工作负载、云端运算和视讯串流驱动的前所未有的频宽需求，传统铜互连在频宽、功耗和密度方面正在达到其根本的实体极限。硅光子学利用光​​的固有优势提供了一种解决方案：更高的频宽、更低的延迟、更低的功耗以及不受电磁干扰。

由于需要在处理器、记忆体和储存之间移动大量资料的 AI/ML 应用呈指数级增长，这项技术在当今尤为重要。硅光子学可以实现高频宽、节能的互连，这对于扩展这些系统至关重要。此外，硅光子学与成熟的CMOS製造製程的整合实现了经济高效的大规模生产，使其广泛应用变得越来越可行。

展望未来，硅光子学有望在多种新兴技术中发挥关键作用。在量子计算中，PIC 提供量子资讯处理所需的光学量子位元的精确控制。对于下一代感测，基于 PIC 的 LiDAR 系统将提高自动驾驶汽车的性能并降低成本。在通讯领域，硅光子学将支援5G/6G网路和Beyond 5G的主干网，以满足不断增长的频宽需求。

随着这项技术的成熟，我们看到了从分立光学元件到高度整合的光子电路的转变，这种光子电路将多种功能结合到单一晶片上，类似于电子和半导体产业的演变。这种整合以及共封装光学等先进的封装技术将继续推动性能、能源效率和成本的改善，使硅光子学成为日益互联、数据密集型世界的基础技术。

本报告对快速发展的硅光子学/光子积体电路 (PIC) 格局进行了深入分析，为 2023 年至 2035 年期间多个应用领域的市场动态、技术趋势和成长机会提供了策略见解。

目录

第1章 摘要整理

  • 市场概要
  • 电子与光子积分的比较
  • 硅光子收发器的演变
  • 市场地图
  • 全球硅光子市场趋势
  • 竞争与互补的光子技术
  • 光子 AI 加速的潜力
  • 硅光子学的商业部署
  • 製造课题

第2章 简介

  • 什么是硅光子学？
  • 硅光子学的优势
  • 硅光子学的应用
  • 与其他光学整合技术的比较
  • 从电子到光子整合的演化
  • 硅光子学与传统电子学
  • 最新的高效能 AI 资料中心
  • 核心技术组件
  • 基本光学资料传输
  • 硅光子电路架构

第3章 材料和零组件

  • 硅
  • 锗
  • 氮化硅
  • 薄膜铌酸锂(TFLN)
  • 磷化铟
  • 钡钛酸盐，稀土元素金属
  • 硅上的有机聚合物
  • 晶圆处理
  • 混合，异质整合

第4章 先进封装技术

  • 包装技术的演进
  • 2.5D整合技术
  • 3D整合方法
  • 共封装光学元件 (CPO)
  • 光学对准
  • 製造的课题

第5章 市场与用途

  • 数据通讯用途
  • 通讯
  • 感测用途
  • AI，机器学习
  • 量子运算，通讯
  • 生医光电(Biophotonics)，医疗诊断

第6章 全球市场规模

  • 全球硅光子学·光积体电路市场概要
  • 数据通讯用途
  • 通讯用途
  • 感测用途
  • 光积体电路市场:各材料

第7章 供应链的分析

  • 晶圆代工厂，晶圆供应商
  • 垂直整合型设备厂商(IDM)
  • 晶圆代工厂，晶圆供应商
  • 包装，试验
  • 系统厂商，终端用户

第8章 技术趋势

  • 雷射整合技术
  • 调製器技术
  • 光电检测器技术
  • 波导管和联轴器的创新
  • 包装和整合的进步

第9章 课题和今后趋势

  • CMOS晶圆代工厂互换设备，整合
  • 电力消耗，温度控管
  • 包装，试验
  • 扩充性，成本效率
  • 新材料，混合整合

第10章 企业简介(企业183公司的简介)

第11章 附录

第12章 参考文献

The rapid growth of AI technology has put unprecedented demands on networks and data centers. Silicon photonics and photonic integrated circuits offer the most advanced networking solution to this problem. AI "factories" are a new class of data centers with extreme scale, and networking infrastructure must be reinvented to keep pace. The US-based artificial intelligence (AI) computing multinational NVIDIA recently announced its plan to leverage silicon photonics and co-packaged optics (CPO) to connect millions of GPUs in these AI factories.

Silicon photonics and photonic integrated circuits (PICs) represent a transformative technology at the intersection of semiconductors and optics, enabling the manipulation of light on silicon chips. As data centers face unprecedented bandwidth demands driven by AI workloads, cloud computing, and video streaming, traditional copper interconnects reach fundamental physical limitations in terms of bandwidth, power consumption, and density. Silicon photonics offers a solution by leveraging light's inherent advantages: higher bandwidth, lower latency, reduced power consumption, and immunity to electromagnetic interference.

The technology is particularly crucial now due to the exponential growth in AI/ML applications, which require massive data movement between processors, memory, and storage. Silicon photonics enables the high-bandwidth, energy-efficient interconnects essential for scaling these systems. Additionally, the convergence of silicon photonics with mature CMOS manufacturing processes allows for cost-effective production at scale, making widespread adoption increasingly viable.

Looking toward the future, silicon photonics will play a pivotal role in multiple frontier technologies. In quantum computing, PICs provide the precise control of photonic qubits necessary for quantum information processing. For next-generation sensing, PIC-based LiDAR systems will enable autonomous vehicles with improved performance and reduced cost. In telecommunications, silicon photonics will support the backbone of 5G/6G networks and beyond, meeting ever-increasing bandwidth demands.

As the technology matures, we're witnessing a transition from discrete optical components to highly integrated photonic circuits that combine multiple functions on a single chip, similar to the evolution seen in the electronic semiconductor industry. This integration, coupled with advanced packaging technologies like co-packaged optics, will continue to drive improvements in performance, energy efficiency, and cost, cementing silicon photonics as a foundational technology for our increasingly connected, data-intensive world.

"The Global Silicon Photonics and Photonic Integrated Circuits Market 2023-2035" provides an in-depth analysis of the rapidly evolving silicon photonics and photonic integrated circuits (PICs) landscape, offering strategic insights into market dynamics, technology trends, and growth opportunities across multiple application segments from 2023 to 2035.

Key Report Features:

  • Material Platform Analysis: Comparative assessment of silicon, silicon nitride, lithium niobate, indium phosphide, and emerging material technologies
  • Application Segmentation: In-depth market forecasts for datacom, telecom, sensing, AI acceleration, and quantum computing applications
  • Manufacturing and Packaging: Evaluation of wafer processing challenges, yield management, and advanced packaging technologies including co-packaged optics
  • Competitive Landscape: Profiles of 186 companies across the entire value chain from materials suppliers to system integrators
  • Technology Roadmaps: Forecasts for product development timelines, performance improvements, and market adoption rates
  • Introduction to Silicon Photonics: Fundamental principles, comparative advantages over traditional technologies, and basic optical data transmission mechanisms
  • Materials and Components Analysis: Comprehensive review of platform technologies including silicon-on-insulator (SOI), germanium photodetectors, silicon nitride waveguides, thin-film lithium niobate, and hybrid integration approaches
  • Advanced Packaging Technologies: Detailed analysis of 2.5D and 3D integration technologies, through-silicon vias (TSVs), hybrid bonding, and co-packaged optics solutions
  • Market Applications in Depth:
    • Datacom: Data center architectures, transceiver evolution, co-packaged optics, and high-performance computing interconnects
    • Telecommunications: 5G/6G infrastructure, optical networking, and long-haul/metro applications
    • Sensing: LiDAR systems, chemical/biological sensing, and medical diagnostics
    • AI/ML: Photonic processors, neural network accelerators, and programmable photonic systems
    • Quantum: PIC-based quantum computing architectures, quantum communications, and single-photon sources
  • Market Forecasts 2023-2035:
    • Global market size and regional analysis
    • Segmentation by application, material platform, and component type
    • Pricing trends and volume projections for key product categories
    • Detailed forecasts for emerging segments including AI transceivers and quantum PICs
  • Supply Chain Analysis: Foundry landscape, fabless designers, integrated device manufacturers, and end-users
  • Technology Trends: Laser integration techniques, modulator innovations, photodetector developments, and waveguide advancements
  • Challenges and Future Directions: CMOS-foundry compatibility, power consumption issues, packaging optimization, and scalability solutions.

This report provides essential strategic intelligence for technology vendors, component manufacturers, system integrators, end-users, and investors to navigate the complex and rapidly evolving silicon photonics ecosystem. With detailed technical benchmarking, market forecasts, and competitive analysis, the report enables stakeholders to identify growth opportunities, anticipate technological disruptions, and develop informed strategies for this transformative market.

The report provides comprehensive profiles of 183 companies across the silicon photonics and photonic integrated circuits ecosystem, including Accelink Technologies, Aeva Technologies, Aeponyx, Advanced Fiber Resources, AIM Photonics, AIO Core, Alibaba Cloud, Amazon (AWS), ANSYS, Advanced Micro Foundry (AMF), Amkor Technology, AMO GmbH, Analog Photonics, Anello Photonics, Aryballe, A*STAR, ASE Holdings, Aurora Innovation, Axalume, AXT, Ayar Labs, Baidu, Bay Photonics, BE Epitaxy Semiconductor, Broadcom, Black Semiconductor, Broadex, ByteDance, Cadence, Camgraphic, CEA LETI, Celestial AI, Centera Photonics, Cambridge Industries Group (CIG), Ciena Corporation, CISCO Systems, CNIT, Coherent Corp., CompoundTek, Cornerstone, Crealights Technology, DustPhotonics, EFFECT Photonics, Eoptolink (Alpine Optoelectronics), Ephos, Epiphany, Fabrinet, Fast Photonics, Fiberhome, Fibertop China Shen Zhen Fibertop Technology, ficonTEC, FormFactor, Fujitsu, Genalyte, Gigalight, GlobalFoundries, HGGenuine, Hisense Broadband, HyperLight, HyperPhotonix, Icon Photonics, InnoLight Technology, Innosemi, IntelliEpi, Inphotec, Intel, Imec, IMECAS, iPronics, JABIL, JCET Group, JFS Laboratory, JSR Corporation, Juniper Networks, Ki3 Photonics, LandMark, Leoni AG, Ligentec, Lightelligence, Lightium, Lightmatter, Lightsynq Technologies, Lightwave Logic, Light Trace Photonics, Liobate Technologies, LioniX International, LPKF, Lumentum, Luceda, Luminous Computing, LuminWave Technology, Lumiphase AG, Luxshare Precision Industry, Luxtelligence SA, MACOM, Marvell, Molex, NanoLN, NanoWired, NEC Corporation, NewPhotonics, NGK Insulators, NLM Photonics, Nokia Corporation, Novel Si Integration Technology, NTT Corporation, Nvidia, O-Net, OpenLight Photonics, OriChip Optoelectronics Technology, Partow Technologies, PETRA, Phix, PHOTON IP, and many more. Each profile includes company background, technology focus, product offerings, manufacturing capabilities, partnerships, and market positioning to provide a complete view of the competitive landscape and ecosystem relationships.

TABLE OF CONTENTS

1. EXECUTIVE SUMMARY

  • 1.1. Market Overview
  • 1.2. Electronic and Photonic Integration Compared
  • 1.3. Silicon Photonic Transceiver Evolution
  • 1.4. Market Map
  • 1.5. Global Market Trends in Silicon Photonics
  • 1.6. Competing and Complementary Photonics Technologies
    • 1.6.1. Metaphotonics
    • 1.6.2. III-V Photonics
    • 1.6.3. Lithium Niobate Photonics
    • 1.6.4. Polymer Photonics
    • 1.6.5. Plasmonic Photonics
  • 1.7. Potential of photonic AI acceleration
  • 1.8. Commercial deployment of silicon photonics
  • 1.9. Manufacturing challenges

2. INTRODUCTION

  • 2.1. What is Silicon Photonics?
    • 2.1.1. Definition and Principles of Silicon Photonics
    • 2.1.2. Comparison with traditional technologies
    • 2.1.3. Silicon and Photonic Integrated Circuits
    • 2.1.4. Optical IO, Coupling and Couplers
    • 2.1.5. Emission and Photon Sources/Lasers
    • 2.1.6. Detection and Photodetectors
    • 2.1.7. Compound Semiconductor Lasers and Photodetectors (III-V)
    • 2.1.8. Modulation, Modulators, and Mach-Zehnder Interferometers
      • 2.1.8.1. New modulator technologies
    • 2.1.9. Light Propagation and Waveguides
    • 2.1.10. Optical Component Density
  • 2.2. Advantages of Silicon Photonics
  • 2.3. Applications of Silicon Photonics
  • 2.4. Comparison with Other Photonic Integration Technologies
  • 2.5. Evolution from Electronic to Photonic Integration
  • 2.6. Silicon Photonics vs Traditional Electronics
  • 2.7. Modern high-performance AI data centers
  • 2.8. Core Technology Components
    • 2.8.1. Optical IO, Coupling and Couplers
    • 2.8.2. Emission and Photon Sources/Lasers
      • 2.8.2.1. III-V Integration Challenges
      • 2.8.2.2. Laser Integration Approaches
    • 2.8.3. Detection and Photodetectors
    • 2.8.4. Modulation Technologies
      • 2.8.4.1. Mach-Zehnder Interferometers
      • 2.8.4.2. Ring Modulators
    • 2.8.5. Light Propagation and Waveguides
    • 2.8.6. Optical Component Density
  • 2.9. Basic Optical Data Transmission
  • 2.10. Silicon Photonic Circuit Architecture

3. MATERIALS AND COMPONENTS

  • 3.1. Silicon
    • 3.1.1. Silicon as a Photonic Material
      • 3.1.1.1. Optical Properties of Silicon
      • 3.1.1.2. Fabrication Processes for Silicon Photonics
    • 3.1.2. Silicon and Silicon-on-insulator (SOI)
      • 3.1.2.1. SOI Manufacturing Process
      • 3.1.2.2. SOI Performance Benchmarks
      • 3.1.2.3. Key SOI Players
  • 3.2. Germanium
    • 3.2.1. Germanium Integration in Silicon Photonics
    • 3.2.2. Germanium Photodetectors
    • 3.2.3. Germanium-on-Silicon Modulators
  • 3.3. Silicon Nitride
    • 3.3.1. Silicon Nitride (SiN) in Photonics Integrated Circuits
    • 3.3.2. Optical Properties and Fabrication of SiN
    • 3.3.3. SiN Modulator Technologies
    • 3.3.4. SiN Applications in Photonics Integrated Circuits
    • 3.3.5. Advances in SiN Modulator Technologies
    • 3.3.6. SiN-based Waveguides and Devices
    • 3.3.7. SiN Performance Analysis
    • 3.3.8. Applications of SiN in Photonics
    • 3.3.9. SiN PIC Players
  • 3.4. Thin Film Lithium Niobate (TFLN)
    • 3.4.1. Overview
    • 3.4.2. Lithium Niobate on Insulator (LNOI)
      • 3.4.2.1. Overview of LNOI Technology
      • 3.4.2.2. Characteristics and Properties of LNOI
      • 3.4.2.3. LNOI Fabrication Processes
      • 3.4.2.4. LNOI-based Modulator and Switch Technologies
      • 3.4.2.5. Trends Toward Higher Speed and Improved Power Efficiency
      • 3.4.2.6. High-Speed LNOI Modulators
        • 3.4.2.6.1. Energy-Efficient LNOI Devices
        • 3.4.2.6.2. Emerging LNOI Device Technologies
  • 3.5. Indium Phosphide
    • 3.5.1. Indium Phosphide (InP) Integration
      • 3.5.1.1. InP as a Direct Bandgap Semiconductor
      • 3.5.1.2. InP-based Active Components
      • 3.5.1.3. Hybrid Integration of InP with Silicon Photonics
    • 3.5.2. InP PIC Players
  • 3.6. Barium Titanite and Rare Earth metals
    • 3.6.1. Barium Titanate (BTO) Modulators
  • 3.7. Organic Polymer on Silicon
    • 3.7.1. Polymer-based Modulators
  • 3.8. Wafer Processing
    • 3.8.1. Wafer Sizes by Platform
    • 3.8.2. Processing Challenges
    • 3.8.3. Yield Management
  • 3.9. Hybrid and Heterogeneous Integration
    • 3.9.1. Monolithic Integration
    • 3.9.2. Hybrid Integration
    • 3.9.3. Heterogeneous Integration
    • 3.9.4. III-V-on-Silicon
    • 3.9.5. Bonding and Die-Attachment Techniques
    • 3.9.6. Monolithic versus Hybrid Integration

4. ADVANCED PACKAGING TECHNOLOGIES

  • 4.1. Evolution of Packaging Technologies
    • 4.1.1. Traditional Packaging Approaches
    • 4.1.2. Advanced Packaging Roadmap
    • 4.1.3. Key Performance Metrics
  • 4.2. 2.5D Integration Technologies
    • 4.2.1. Silicon Interposer Technology
    • 4.2.2. Glass Interposer Solutions
    • 4.2.3. Organic Substrate Options
  • 4.3. 3D Integration Approaches
    • 4.3.1. Through-Silicon Via (TSV)
      • 4.3.1.1. TSV Manufacturing Process
      • 4.3.1.2. TSV Challenges and Solutions
    • 4.3.2. Hybrid Bonding Technologies
      • 4.3.2.1. Cu-Cu Bonding
      • 4.3.2.2. Direct Bonding
  • 4.4. Co-Packaged Optics (CPO)
    • 4.4.1. CPO Architecture Overview
    • 4.4.2. Benefits and Challenges
    • 4.4.3. Integration Approaches
      • 4.4.3.1. 2D Integration
      • 4.4.3.2. 2.5D Integration
      • 4.4.3.3. 3D Integration
    • 4.4.4. Thermal Management
    • 4.4.5. Optical Coupling Solutions
  • 4.5. Optical Alignment
    • 4.5.1. Active vs Passive Alignment
    • 4.5.2. Coupling Efficiency
  • 4.6. Manufacturing Challenges

5. MARKETS AND APPLICATIONS

  • 5.1. Datacom Applications
    • 5.1.1. Data Center Architecture Evolution
    • 5.1.2. Transceivers
      • 5.1.2.1. Integration
    • 5.1.3. Artificial intelligence (AI) and machine learning (ML)
    • 5.1.4. Pluggable optics
    • 5.1.5. Linear drive and linear pluggable optics (LPO)
    • 5.1.6. Interconnects
      • 5.1.6.1. PIC-based on-device interconnects
      • 5.1.6.2. Advanced Packaging and Co-Packaged Optics
        • 5.1.6.2.1. Glass materials
        • 5.1.6.2.2. Co-Packaged Optics
      • 5.1.6.3. Photonic Engines and Accelerators
        • 5.1.6.3.1. Photonic processing for AI
        • 5.1.6.3.2. Convergence with software
        • 5.1.6.3.3. Photonic field-programmable gate arrays (FPGAs)
      • 5.1.6.4. Photonic Integrated Circuits for Quantum Computing
        • 5.1.6.4.1. Photonic qubits
    • 5.1.7. Optical Transceivers
      • 5.1.7.1. Architecture and Operation
      • 5.1.7.2. Market Players
      • 5.1.7.3. Technology Roadmap
    • 5.1.8. Co-Packaged Optics for Switches
      • 5.1.8.1. CPO vs Pluggable Solutions
      • 5.1.8.2. Power and Performance Benefits
      • 5.1.8.3. Implementation Challenges
    • 5.1.9. Data Center Networks
    • 5.1.10. High-Performance Computing
      • 5.1.10.1. On-Device Interconnects
      • 5.1.10.2. Chip-to-Chip Communication
      • 5.1.10.3. System Architecture Impact
    • 5.1.11. Chip-to-Chip and Board-to-Board Interconnects
    • 5.1.12. Ethernet Networking
  • 5.2. Telecommunications
    • 5.2.1. 5G/6G Infrastructure
    • 5.2.2. Bandwidth Requirements
    • 5.2.3. Long-Haul and Metro Networks
    • 5.2.4. 5G and Fiber-to-the-X (FTTx) Applications
    • 5.2.5. Optical Transceivers and Transponders
  • 5.3. Sensing Applications
    • 5.3.1. Lidar and Automotive Sensing
      • 5.3.1.1. Photonic Integrated Circuit-based LiDAR
    • 5.3.2. Chemical and Biological Sensing
    • 5.3.3. Optical Coherence Tomography
  • 5.4. Artificial Intelligence and Machine Learning
    • 5.4.1. AI Data Traffic Requirements
    • 5.4.2. Silicon Photonics for AI Accelerators
    • 5.4.3. Photonic Processors
    • 5.4.4. Photonic Processing for AI
    • 5.4.5. Programmable Photonics
    • 5.4.6. Neural Network Applications
    • 5.4.7. Future AI Architecture Requirements
  • 5.5. Quantum Computing and Communication
    • 5.5.1. Quantum Photonic Requirements
    • 5.5.2. Integration Challenges
    • 5.5.3. Photonic Platform Quantum Computing
    • 5.5.4. PICs for Quantum systems
    • 5.5.5. Operational cycle of photonic quantum computers
    • 5.5.6. Market Players and Development
    • 5.5.7. AI Neuromorphic Computing
  • 5.6. Biophotonics and Medical Diagnostics

6. GLOBAL MARKET SIZE

  • 6.1. Global Silicon Photonics and Photonic Integrated Circuits Market Overview
    • 6.1.1. Market Size and Growth Trends
    • 6.1.2. Market Segmentation by Application
    • 6.1.3. Modules & PICs (Dies) Market Forecast 2023-2035
    • 6.1.4. SOI Wafers Market Forecast 2023-2035
    • 6.1.5. LPO & New Modulator Materials Market Forecast 2023-2035
  • 6.2. Datacom Applications
    • 6.2.1. Market Forecast 2023-2035
      • 6.2.1.1. Modules Market Forecast 2023-2035
      • 6.2.1.2. PICs (Dies) Market Forecast 2023-2035
      • 6.2.1.3. PIC Transceivers for AI
      • 6.2.1.4. PIC Transceiver Pricing
      • 6.2.1.5. PIC Datacom Transceiver Market Forecast
    • 6.2.2. Key Drivers and Restraints
  • 6.3. Telecom Applications
    • 6.3.1. Market Forecast 2023-2035
      • 6.3.1.1. PIC-based Transceivers for 5G
    • 6.3.2. Key Drivers and Restraints
  • 6.4. Sensing Applications
    • 6.4.1. Market Forecast 2023-2035
    • 6.4.2. PIC-based Sensor Market Forecast
    • 6.4.3. PIC-based LiDAR Market Forecast, 2023-2035
    • 6.4.4. Key Drivers and Restraints
  • 6.5. Photonic Integrated Circuit Market, by Material

7. SUPPLY CHAIN ANALYSIS

  • 7.1. Foundries and Wafer Suppliers
    • 7.1.1. CMOS Foundries
    • 7.1.2. Specialty Photonics Foundries
  • 7.2. Integrated Device Manufacturers (IDMs)
    • 7.2.1. Fabless Companies
    • 7.2.2. Fully Integrated Photonics Companies
  • 7.3. Foundries and Wafer Suppliers
  • 7.4. Packaging and Testing
    • 7.4.1. Chip-Scale Packaging
    • 7.4.2. Module-Level Packaging
    • 7.4.3. Testing and Characterization
  • 7.5. System Integrators and End-Users

8. TECHNOLOGY TRENDS

  • 8.1. Laser Integration Techniques
    • 8.1.1. Direct Epitaxial Growth
    • 8.1.2. Flip-Chip Bonding
    • 8.1.3. Hybrid Integration
    • 8.1.4. Advances and Challenges
  • 8.2. Modulator Technologies
    • 8.2.1. Silicon Modulators
    • 8.2.2. Germanium Modulators
    • 8.2.3. Lithium Niobate Modulators
    • 8.2.4. Polymer Modulators
  • 8.3. Photodetector Technologies
    • 8.3.1. Silicon Photodetectors
    • 8.3.2. Germanium Photodetectors
    • 8.3.3. III-V Photodetectors
  • 8.4. Waveguide and Coupling Innovations
    • 8.4.1. Silicon Waveguides
    • 8.4.2. Silicon Nitride Waveguides
    • 8.4.3. Coupling Techniques
  • 8.5. Packaging and Integration Advancements
    • 8.5.1. Chip-Scale Packaging
    • 8.5.2. Wafer-Scale Integration
    • 8.5.3. 3D Integration and Interposer Technologies

9. CHALLENGES AND FUTURE TRENDS

  • 9.1. CMOS-Foundry-Compatible Devices and Integration
    • 9.1.1. Scaling and Miniaturization
    • 9.1.2. Process Complexity and Yield Improvement
  • 9.2. Power Consumption and Thermal Management
    • 9.2.1. Energy-Efficient Photonic Devices
    • 9.2.2. Thermal Optimization Techniques
  • 9.3. Packaging and Testing
    • 9.3.1. Advanced Packaging Solutions
    • 9.3.2. Automated Testing and Characterization
  • 9.4. Scalability and Cost-Effectiveness
    • 9.4.1. Wafer-Scale Integration
    • 9.4.2. Outsourced Semiconductor Assembly and Test (OSAT)
  • 9.5. Emerging Materials and Hybrid Integration
    • 9.5.1. Novel Semiconductor Materials
    • 9.5.2. Heterogeneous Integration Approaches

10. COMPANY PROFILES (183 company profiles)

11. APPENDICES

  • 11.1. Glossary of Terms
  • 11.2. List of Abbreviations
  • 11.3. Research Methodology

12. REFERENCES

List of Tables

  • Table 1. Silicon Photonics vs. Electronics: Key Metrics Comparison
  • Table 2. Photonic Technologies Comparative Analysis
  • Table 3. Comparison between electronic and photonic computing
  • Table 4. Electronics companies silicon photonics commercial activities
  • Table 5. Manufacturing Metrics & Challenges
  • Table 6. Manufacturing Targets vs Current State
  • Table 7. Comparative cost analysis
  • Table 8. Challenges for CMOS-Foundry-Compatible Photonic Devices
  • Table 9. Silicon Photonics Integration Schemes
  • Table 10. Benefits of PICs
  • Table 11. Current & Future Photonic Integrated Circuits Applications
  • Table 12. Photodetector Performance
  • Table 13. III-V Device Performance
  • Table 14. Optical Modulator Performance Comparison
  • Table 15. Silicon Photonic Waveguide Characteristics
  • Table 16. Optical Component Integration Metrics
  • Table 17. Advantages of Silicon Photonics
  • Table 18. Applications of Silicon Photonics
  • Table 19. Comparison with Other Photonic Integration Technologies
  • Table 20. Silicon Photonics vs Traditional Electronics: Performance Metrics
  • Table 21. Switch IC Bandwidth and CPO Technology Evolution
  • Table 22. Challenges in data center architectures
  • Table 23. Key Trends of Optical Transceivers in High-End Data Centers
  • Table 24. Core Components Specifications and Requirements
  • Table 25. Types of Emission and Photon Sources/Lasers
  • Table 26. III-V Integration Challenges
  • Table 27. Laser Integration Approaches Comparison
  • Table 28. Modulator Types and Configurations
  • Table 29. Waveguide Specifications and Requirements
  • Table 30. Data Transmission Parameters and Specifications
  • Table 31. Circuit Architecture Building Blocks
  • Table 32. Integration Approaches
  • Table 33. Silicon Photonics Component Specifications
  • Table 34. Optical Properties of Silicon
  • Table 35. Fabrication Processes for Silicon Photonics
  • Table 36. Silicon Foundry Technology Comparison
  • Table 37. Silicon-on-insulator (SOI) Platform Benchmarking
  • Table 38. SOI Performance Benchmarks
  • Table 39. Key SOI Players
  • Table 40. Germanium Integration Methods and Applications
  • Table 41. SiN Key Foundries
  • Table 42. SiN Modulator Technologies
  • Table 43. Silicon (SOI and SiN) Device Heterogeneous Integration
  • Table 44. SiN Benchmarking
  • Table 45. Applications of SiN in Photonics
  • Table 46. SiN PIC Players
  • Table 47. Benchmarking of TFLN
  • Table 48. Characteristics and Properties of LNOI
  • Table 49. LNOI Fabrication Processes
  • Table 50. LNOI-based Modulator and Switch Technologies
  • Table 51. Emerging LNOI Device Technologies
  • Table 52. InP Benchmarking
  • Table 53. Integration Technologies
  • Table 54. InP PIC Players
  • Table 55. BTO Benchmarking
  • Table 56. Comparative analysis of materials
  • Table 57. Benchmarking of Polymer on Insulator
  • Table 58. Wafer Size Comparison by Platform
  • Table 59. Wafer Processing Challenges
  • Table 60. Yield Analysis by Process Step
  • Table 61. Integration Scheme Comparison
  • Table 62. Bonding and Die-Attachment Techniques
  • Table 63. Monolithic versus Hybrid Integration
  • Table 64. Packaging Technology Comparison Matrix
  • Table 65. Evolution of semiconductor packaging
  • Table 66. Summary of key advanced semiconductor packaging approaches
  • Table 67. Key Performance Metrics for Advanced Packaging Technologies
  • Table 68. Glass Interposer Solutions
  • Table 69. Organic Substrate Options
  • Table 70. TSV Specifications by Application
  • Table 71. TSV Challenges and Solutions
  • Table 72. Comparative benchmark overview table of key semiconductor interconnection technologies
  • Table 73. CPO Benefits and Challenges
  • Table 74. Performance Metrics Comparison
  • Table 75. CPO Integration Approaches Comparison
  • Table 76. Manufacturing Process Comparison
  • Table 77. Thermal Management Approaches
  • Table 78. Optical Coupling Solutions
  • Table 79. Alignment Tolerance Analysis
  • Table 80. Active vs Passive Alignment Comparison
  • Table 81. Coupling Efficiency Analysis
  • Table 82. Advanced packaging manufacturing challenges
  • Table 83. Energy Consumption Analysis
  • Table 84. Key Metrics for Advanced Semiconductor Packaging Performance
  • Table 85. Pluggable Optics vs. Co-Packaged Optics (CPO)
  • Table 86. Future Challenges in Co-Packaged Optics (CPO)
  • Table 87. Key Technology Building Blocks for Co-Packaged Optics
  • Table 88. Key Packaging Components for Co-Packaged Optics
  • Table 89. Key Players in Photonic Quantum Computing
  • Table 90. Comparison of PICs vs Traditional Optical Systems
  • Table 91. Future PIC Requirements of the Quantum Industry
  • Table 92. Optical Transceivers Market Players
  • Table 93. Power and Performance Benefits
  • Table 94. Implementation Challenges
  • Table 95. Silicon Photonics in HPC: Technical Parameters
  • Table 96. Applications of Silicon Photonics in Telecommunications
  • Table 97. Bandwidth Requirements by Segment
  • Table 98. 5G and FTTx Applications Technical Parameters
  • Table 99. Opportunities for PIC Sensors in LiDAR Applications
  • Table 100. Challenges of PIC-based FMCW LiDARs
  • Table 101. Companies Developing PIC-based LiDAR
  • Table 102. Companies Developing PIC Biosensors
  • Table 103. Companies Developing PIC-based Gas Sensors
  • Table 104. Companies Developing Spectroscopy PICs
  • Table 105. AI Data Traffic Requirements
  • Table 106. Neural Network Applications
  • Table 107. Future AI Architecture Requirements
  • Table 108. Quantum Photonic Requirements
  • Table 109. Integration Challenges in Quantum Computing and Communication
  • Table 110. Future PIC Requirements of the Quantum Industry
  • Table 111. Roadmap for Photonic Quantum Hardware
  • Table 112. Market players and development
  • Table 113. Biophotonics Applications
  • Table 114. Global Market for Silicon Photonics and Photonic Integrated Circuits 2023-2035 (Billions USD)
  • Table 115. Market Segmentation by Application 2023-2035 (Billions USD)
  • Table 116. Silicon Photonics and Photonic Integrated Circuits Server Boards, CPUs and GPUs/Accelerators Forecast
  • Table 117. Modules & PICs (Dies) Market Forecast 2023-2035
  • Table 118. SOI Wafers Market Forecast 2023-2035
  • Table 119. LPO & New Modulator Materials Market Forecast 2023-2035
  • Table 120. Market Forecast for Silicon Photonics in Datacom Applications 2023-2035 (Billions USD)
  • Table 121. Modules Market Forecast 2023-2035
  • Table 122. PICs (Dies) Market Forecast 2023-2035
  • Table 123. PIC Transceivers for AI Units Forecast, 2023-2035
  • Table 124. PIC Transceiver Pricing
  • Table 125. PIC Datacom Transceiver Market Forecast, 2025-2035
  • Table 126. PIC Datacom Transceiver Revenue Forecast
  • Table 127. Quantum PIC Market Forecast, 2023-2035
  • Table 128. Key market drivers and restraints for silicon photonics in Datacom Applications
  • Table 129. Market Forecast for Silicon Photonics in Telecom Applications 2023-2035 (Billions USD)
  • Table 130. Key market drivers and restraints for silicon photonics in Telecom Applications
  • Table 131. Market Forecast for Silicon Photonics in Sensing Applications 2023-2035 (Billions USD)
  • Table 132. Key market drivers and restraints for silicon photonics in Sensing Applications
  • Table 133. Photonic Integrated Circuit Market, by Material, 2023-2035
  • Table 134. CMOS Foundries
  • Table 135. Specialty Photonics Foundries
  • Table 136. Fabless Companies
  • Table 137. Fully Integrated Photonics Companies
  • Table 138. Foundries and Wafer Suppliers
  • Table 139. System Integrators and End-Users
  • Table 140. Laser Integration Methods Comparison
  • Table 141. Advanced Techniques and Challenges
  • Table 142. Modulator Technology Benchmarking
  • Table 143. Photodetector Performance Metrics
  • Table 144. Novel semiconductor materials for silicon photonics
  • Table 145. Glossary of terms
  • Table 146. List of abbreviations.

List of Figures

  • Figure 1. Silicon Photonic Transceiver Evolution Timeline
  • Figure 2. Silicon Photonics Player Market Map
  • Figure 3. Basic Silicon Photonic Circuit Architecture
  • Figure 4. High Performance AI data center
  • Figure 5. Optical IO Coupling Mechanisms Diagram
  • Figure 6. Optical Component Density Evolution
  • Figure 7. Basic Optical Data Transmission Diagram
  • Figure 8. SOI Wafer Structure
  • Figure 9. Manufacturing Process Flow
  • Figure 10. Germanium Photodetector
  • Figure 11. Silicon Nitride Layer Stack
  • Figure 12. AEPONYX SiN PICs
  • Figure 13. SiN Waveguide Cross-sections
  • Figure 14. LNOI Device Structures
  • Figure 15. Timeline of different packaging technologies
  • Figure 16. Advanced Packaging Roadmap
  • Figure 17. 2D chip packaging
  • Figure 18. Typical structure of 2.5D IC package utilizing interposer
  • Figure 19. TSV Structure and Implementation
  • Figure 20. Hybrid Bonding Process Flow
  • Figure 21. Co-Packaged Optics Architecture
  • Figure 22. Optical module with pluggable fibre interconnect
  • Figure 23. Roadmap for PIC-Based Transceivers
  • Figure 24. Evolution Roadmap for Semiconductor Packaging
  • Figure 25. Roadmap for photonic quantum hardware
  • Figure 26. Optical Transceivers Technology Roadmap
  • Figure 27. 5G/6G Implementation Roadmap
  • Figure 28. LiDAR System Design
  • Figure 29. Global Market for Silicon Photonics and Photonic Integrated Circuits 2023-2035 (Billions USD)
  • Figure 30. Market Segmentation by Application 2023-2035 (Billions USD)
  • Figure 31. Market Forecast for Silicon Photonics in Datacom Applications 2023-2035 (Billions USD)
  • Figure 32. Market Forecast for Silicon Photonics in Telecom Applications 2023-2035 (Billions USD)
  • Figure 33. PIC-based Transceivers for 5G Forecast (Units and Market), 2023-2035
  • Figure 34. Market Forecast for Silicon Photonics in Sensing Applications 2023-2035 (Billions USD)
  • Figure 35. PIC-based Sensor Market Forecast, 2023-2035
  • Figure 36. Silicon Photonics Supply Chain and Ecosystem
  • Figure 37. Concept for advanced packaging for integrated photonics
  • Figure 38. Aeries II LiDAR system
  • Figure 39. NVIDIA's silicon photonics switches
  • Figure 40. PsiQuantum's modularized quantum computing system networks
  • Figure 41. Q.ANT Native Processing Unit (NPU)
  • Figure 42. QuiX low-loss photonic quantum processors