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市场调查报告书
商品编码
1805851

电涂装铜薄膜的全球市场-产业分析，规模，占有率，成长，趋势，预测(2025年～2032年):各厚度，各用途，各地区，各企业

Electrodeposited Copper Foils Market - Global Electrodeposited Copper Foils Industry Analysis, Size, Share, Growth, Trends, and Forecast 2025-2032 - (By Thickness, By Application, By Geographic Coverage and By Company)
出版日期: | 出版商: Fairfield Market Research | 英文 188 Pages | 商品交期: 2-5个工作天内

价格
简介目录

全球电解铜薄膜市场预计将持续扩张，主要受两大关键产业——锂离子电池 (LiB) 和印刷电路板 (PCB)——的强劲需求驱动。根据最新的市场预测，该行业规模预计将在 2025 年达到 136 亿美元，并在 2025 年至 2032 年期间以 9.3% 的强劲复合年增长率增长，最终在 2032 年达到 253 亿美元。汽车电气化的日益普及、再生能源发电系统的快速普及以及下一代电子产品的进步，正在加速这个竞争激烈的产业发展。

市场洞察

电解铜薄膜在各种应用中，在提供导电性、稳定性和结构完整性方面发挥关键作用。在印刷电路板 (PCB) 中，它为高性能电子设备提供必要的导电层；在锂离子电池中，它充当集电器，确保安全性和能源效率。

市场需求受两股平行力量的影响：小型电子设备对超薄箔（＜=12 微米）的需求快速成长，以及高能量密度电池组对厚箔的需求不断增加。这两大需求为製造商创造了机会，使其能够在维持稳定品质标准的同时实现产品线多元化。此外，全球供应链重组和回收利用措施的增加预计将在预测期内影响原物料供应和价格趋势。

主要的促进因素

1. 电动车加速发展

全球向电动车的转变正在显着改变电解铜薄膜市场。中国、美国和欧洲的电动车销量正在激增，电池製造商正在大力投资新的超级工厂。每个锂离子电池都需要大量的铜薄膜作为集流体，这使得该行业成为主要的需求来源。

2. 对先进电子产品的需求不断成长

消费性电子、通讯和运算设备持续朝着更有效率和小型化的方向发展。 5G、物联网连接和人工智慧设备的推出，推动了对更高效能PCB的需求。电解铜薄膜提供了支援这些应用所需的精度和一致性。

3. 製造创新

电解技术的进步使得能够大量生产厚度均匀、表面处理更完善、导电性更强的箔片。箔片柔韧性的创新也支持了柔性PCB的发展，而柔性PCB在汽车电子、穿戴式装置和医疗保健设备中正变得越来越重要。

机会

电解铜薄膜市场的成长轨迹为多个产业领域提供了机会。能够生产用于下一代电子产品的超薄箔片和用于长循环电动汽车电池的厚箔片的製造商，预计将抓住新的收入来源。

此外，再生能源储能系统，尤其是太阳能和风能发电设备，正在成为铜薄膜的新兴应用领域。预计在可预见的未来，铜薄膜製造商、电池供应商和电子公司之间的策略合作伙伴关係将会扩大。此外，以永续发展为重点的举措，例如闭环铜回收，为环保成长和成本优化铺平了道路。

区域分析

  • 得益于中国、韩国和日本等主要电动车电池製造商的存在，以及强大的PCB製造基础设施，亚太地区仍然是无可争议的领先者。政府对电动车普及和再生能源的激励措施正在推动市场进一步扩张。
  • 北美正在崛起成为一个高成长地区，这得益于美国和加拿大的超级工厂项目、强劲的电动车普及率以及先进的电子技术研究。有利于再生能源应用的政策也为该地区提供了额外的动力。
  • 由于注重永续发展的法规以及对电动车生产和清洁能源储存的大规模投资，欧洲已成为关键市场。欧盟致力于减少二氧化碳排放，这与电池和电子产品对铜薄膜的需求密切相关。
  • 拉丁美洲和中东/非洲仍处于起步阶段，但不断增加对工业电子的投资，加上再生能源项目，可能会带来稳定的长期商业机会。

主要参与者

竞争格局取决于技术领先地位、产品品质和策略​​合作伙伴关係。主要参与者正在扩大其全球业务并投资研发，以满足不断变化的应用需求。以下列出了主要参与者。

  • Doosan Corporation Electro
  • Furukawa Electric Co., Ltd.
  • Fukuda Metal Foil & Powder Co., Ltd.
  • Circuit Foil
  • Chang Chun Group
  • LS Mtron Ltd.
  • Mitsui Mining & Smelting Co., Ltd.
  • JX Nippon Mining & Metals Corporation
  • ILJIN Materials Co., Ltd.
  • Targray Technology International, Inc.
  • Nippon Denkai, Ltd.
  • All Foils, Inc.
  • Oak-Mitsui Technologies LLC
  • Rogers Corporation

各市场区隔

各厚度

  • 12微米以下
  • 13～20微米
  • 21～35微米
  • 36～70微米
  • 超过105微米

各用途

  • 印刷电路板(PCB)
  • 锂离子电池(LiBs)
  • 其他

各地区

  • 北美
  • 欧洲
  • 亚太地区
  • 南美
  • 中东·非洲

目录

第1章 摘要整理

  • 全球电涂装铜薄膜市场概述
  • 未来的预测
  • 主要的市场趋势
  • 各地区概述(各金额，2025年)
  • 分析师的推荐事项

第2章 市场概要

  • 市场定义和市场区隔
  • 市场动态
    • 促进因素
    • 阻碍因素
    • 市场机会
  • 价值链分析
  • COVID-19影响分析
  • 波特的五力分析
  • 俄罗斯·乌克兰纠纷的影响
  • 大环境分析
  • 法规分析
  • 价格趋势分析
    • 目前价格与未来的预测，2024～2032年
    • 价格影响要素

第3章 全球电涂装铜薄膜市场预测，2019年～2032年

  • 全球电涂装铜薄膜市场预测，各厚度，金额(10亿美元)，2019年～2032年
    • ＜＝12????????
    • 13～20微米
    • 21～35微米
    • 36～70微米
    • >105微米
  • 全球电涂装铜薄膜市场预测，各用途，金额(10亿美元)，2019年～2032年
    • 印刷电路板(PCB)
    • 锂离子电池(LiB)
    • 其他
  • 全球电涂装铜薄膜市场预测，各地区，金额(10亿美元)，2019年～2032年
    • 北美
    • 欧洲
    • 亚太地区
    • 南美
    • 中东·非洲

第4章 北美的电涂装铜薄膜市场预测，2019年～2032年

第5章 欧洲的电涂装铜薄膜市场预测，2019年～2032年

第6章 亚太地区的电涂装铜薄膜市场预测，2019年～2032年

第7章 南美的电涂装铜薄膜市场预测，2019年～2032年

第8章 中东·bi非洲的电涂装铜薄膜市场预测，2019年～2032年

第9章 竞争情形

  • 企业对市场区隔热图
  • 企业市场占有率分析，2024年
  • 竞争仪表板
  • 企业简介
    • Doosan Corporation Electro
    • Furukawa Electric Co., Ltd.
    • Fukuda Metal Foil & Powder Co., Ltd.
    • Circuit Foil
    • Chang Chun Group
    • LS Mtron Ltd.
    • Mitsui Mining & Smelting Co., Ltd.
    • JX Nippon Mining & Metals Corporation
    • ILJIN Materials Co., Ltd.
    • Targray Technology International, Inc.

第10章 附录

简介目录

The global electrodeposited copper foils market is positioned for sustained expansion, underpinned by strong demand from two critical industries-lithium-ion batteries (LiBs) and printed circuit boards (PCBs). As per the latest market projections, the industry is expected to reach a value of US$ 13.6 billion in 2025 and register a robust CAGR of 9.3% during 2025-2032, ultimately attaining a market size of US$ 25.3 billion by 2032. Growing electrification of vehicles, rapid penetration of renewable energy storage systems, and advancements in next-generation electronics are accelerating the momentum of this highly competitive industry.

Market Insights

Electrodeposited copper foils play a vital role in enabling conductivity, stability, and structural integrity in a wide range of applications. In PCBs, they provide the conductive layer necessary for high-performance electronic devices, while in lithium-ion batteries, they serve as current collectors, ensuring safety and energy efficiency.

Market demand is being shaped by two parallel forces: the surging requirement for ultra-thin foils (<=12 µm) for compact electronics and the rising volume of thicker foils required for high-energy-density battery packs. This dual demand is creating opportunities for manufacturers to diversify product lines while maintaining consistent quality standards. Moreover, global supply chain realignments and increasing recycling initiatives are expected to influence raw material availability and pricing trends over the forecast period.

Key Drivers

1. Electric Vehicle Acceleration

The worldwide shift toward electric mobility is a game-changer for the electrodeposited copper foils market. With EV sales surging across China, the U.S., and Europe, battery makers are investing heavily in new gigafactories. Each lithium-ion battery requires significant volumes of copper foils as current collectors, making the sector a leading demand generator.

2. Rising Need for Advanced Electronics

Consumer electronics, telecommunications, and computing devices continue to evolve toward higher efficiency and miniaturization. The rollout of 5G, IoT connectivity, and AI-driven devices is driving demand for PCBs with greater performance capabilities. Electrodeposited copper foils provide the precision and consistency required to support these applications.

3. Manufacturing Innovations

Progress in electrodeposition technology is enabling mass production of foils with uniform thickness, improved surface treatment, and enhanced conductivity. Innovations in foil flexibility also support the development of flexible PCBs, which are increasingly important in automotive electronics, wearables, and healthcare devices.

Business Opportunities

The growth trajectory of the electrodeposited copper foils market offers opportunities across several verticals. Producers with the ability to manufacture ultra-thin foils for next-generation electronics and high-thickness foils for long-cycle EV batteries are well positioned to capture emerging value pools.

Furthermore, renewable energy storage systems-particularly in solar and wind installations-represent a rising application area for copper foils. Strategic partnerships between copper foil manufacturers, battery suppliers, and electronics firms are expected to expand over the forecast horizon. Additionally, sustainability-driven initiatives, including closed-loop recycling of copper, open pathways for eco-friendly growth and cost optimization.

Regional Analysis

  • Asia Pacific remains the undisputed leader, anchored by the presence of leading EV battery producers in China, South Korea, and Japan, coupled with extensive PCB manufacturing infrastructure. Government incentives for EV adoption and renewable energy are propelling further market expansion.
  • North America is emerging as a high-growth region, supported by gigafactory projects in the U.S. and Canada, strong EV adoption, and advanced electronics research. Favorable policies for renewable energy deployment are adding further traction.
  • Europe is positioned as a key market due to its regulatory emphasis on sustainability and large-scale investments in EV production and clean energy storage. The EU's focus on reducing carbon emissions aligns closely with copper foil demand in batteries and electronics.
  • Latin America and the Middle East & Africa are still nascent markets, but rising investments in industrial electronics, coupled with renewable power projects, indicate steady long-term opportunities.

Key Players

The competitive scenario is shaped by technological leadership, product quality, and strategic collaborations. Leading companies are expanding their global footprint and investing in R&D to meet evolving application needs. Major players include:

  • Doosan Corporation Electro
  • Furukawa Electric Co., Ltd.
  • Fukuda Metal Foil & Powder Co., Ltd.
  • Circuit Foil
  • Chang Chun Group
  • LS Mtron Ltd.
  • Mitsui Mining & Smelting Co., Ltd.
  • JX Nippon Mining & Metals Corporation
  • ILJIN Materials Co., Ltd.
  • Targray Technology International, Inc.
  • Nippon Denkai, Ltd.
  • All Foils, Inc.
  • Oak-Mitsui Technologies LLC
  • Rogers Corporation

Segmentation

By Thickness

  • <=12 µm
  • 13-20 µm
  • 21-35 µm
  • 36-70 µm
  • 105 µm

By Application

  • Printed Circuit Boards (PCBs)
  • Lithium-ion Batteries (LiBs)
  • Miscellaneous

By Region

  • North America
  • Europe
  • Asia Pacific
  • Latin America
  • Middle East & Africa

Table of Contents

1. Executive Summary

  • 1.1. Global Electrodeposited Copper Foils Market Snapshot
  • 1.2. Future Projections
  • 1.3. Key Market Trends
  • 1.4. Regional Snapshot, by Value, 2025
  • 1.5. Analyst Recommendations

2. Market Overview

  • 2.1. Market Definitions and Segmentations
  • 2.2. Market Dynamics
    • 2.2.1. Drivers
    • 2.2.2. Restraints
    • 2.2.3. Market Opportunities
  • 2.3. Value Chain Analysis
  • 2.4. COVID-19 Impact Analysis
  • 2.5. Porter's Fiver Forces Analysis
  • 2.6. Impact of Russia-Ukraine Conflict
  • 2.7. PESTLE Analysis
  • 2.8. Regulatory Analysis
  • 2.9. Price Trend Analysis
    • 2.9.1. Current Prices and Future Projections, 2024-2032
    • 2.9.2. Price Impact Factors

3. Global Electrodeposited Copper Foils Market Outlook, 2019-2032

  • 3.1. Global Electrodeposited Copper Foils Market Outlook, by Thickness, Value (US$ Bn), 2019-2032
    • 3.1.1. <=12 µm
    • 3.1.2. 13-20 µm
    • 3.1.3. 21-35 µm
    • 3.1.4. 36-70 µm
    • 3.1.5. >105 µm
  • 3.2. Global Electrodeposited Copper Foils Market Outlook, by Application, Value (US$ Bn), 2019-2032
    • 3.2.1. Printed Circuit Boards (PCBs)
    • 3.2.2. Lithium-ion Batteries (LiBs)
    • 3.2.3. Misc.
  • 3.3. Global Electrodeposited Copper Foils Market Outlook, by Region, Value (US$ Bn), 2019-2032
    • 3.3.1. North America
    • 3.3.2. Europe
    • 3.3.3. Asia Pacific
    • 3.3.4. Latin America
    • 3.3.5. Middle East & Africa

4. North America Electrodeposited Copper Foils Market Outlook, 2019-2032

  • 4.1. North America Electrodeposited Copper Foils Market Outlook, by Thickness, Value (US$ Bn), 2019-2032
    • 4.1.1. <=12 µm
    • 4.1.2. 13-20 µm
    • 4.1.3. 21-35 µm
    • 4.1.4. 36-70 µm
    • 4.1.5. >105 µm
  • 4.2. North America Electrodeposited Copper Foils Market Outlook, by Application, Value (US$ Bn), 2019-2032
    • 4.2.1. Printed Circuit Boards (PCBs)
    • 4.2.2. Lithium-ion Batteries (LiBs)
    • 4.2.3. Misc.
  • 4.3. North America Electrodeposited Copper Foils Market Outlook, by Country, Value (US$ Bn), 2019-2032
    • 4.3.1. U.S. Electrodeposited Copper Foils Market Outlook, by Thickness, 2019-2032
    • 4.3.2. U.S. Electrodeposited Copper Foils Market Outlook, by Application, 2019-2032
    • 4.3.3. Canada Electrodeposited Copper Foils Market Outlook, by Thickness, 2019-2032
    • 4.3.4. Canada Electrodeposited Copper Foils Market Outlook, by Application, 2019-2032
  • 4.4. BPS Analysis/Market Attractiveness Analysis

5. Europe Electrodeposited Copper Foils Market Outlook, 2019-2032

  • 5.1. Europe Electrodeposited Copper Foils Market Outlook, by Thickness, Value (US$ Bn), 2019-2032
    • 5.1.1. <=12 µm
    • 5.1.2. 13-20 µm
    • 5.1.3. 21-35 µm
    • 5.1.4. 36-70 µm
    • 5.1.5. >105 µm
  • 5.2. Europe Electrodeposited Copper Foils Market Outlook, by Application, Value (US$ Bn), 2019-2032
    • 5.2.1. Printed Circuit Boards (PCBs)
    • 5.2.2. Lithium-ion Batteries (LiBs)
    • 5.2.3. Misc.
  • 5.3. Europe Electrodeposited Copper Foils Market Outlook, by Country, Value (US$ Bn), 2019-2032
    • 5.3.1. Germany Electrodeposited Copper Foils Market Outlook, by Thickness, 2019-2032
    • 5.3.2. Germany Electrodeposited Copper Foils Market Outlook, by Application, 2019-2032
    • 5.3.3. Italy Electrodeposited Copper Foils Market Outlook, by Thickness, 2019-2032
    • 5.3.4. Italy Electrodeposited Copper Foils Market Outlook, by Application, 2019-2032
    • 5.3.5. France Electrodeposited Copper Foils Market Outlook, by Thickness, 2019-2032
    • 5.3.6. France Electrodeposited Copper Foils Market Outlook, by Application, 2019-2032
    • 5.3.7. U.K. Electrodeposited Copper Foils Market Outlook, by Thickness, 2019-2032
    • 5.3.8. U.K. Electrodeposited Copper Foils Market Outlook, by Application, 2019-2032
    • 5.3.9. Spain Electrodeposited Copper Foils Market Outlook, by Thickness, 2019-2032
    • 5.3.10. Spain Electrodeposited Copper Foils Market Outlook, by Application, 2019-2032
    • 5.3.11. Russia Electrodeposited Copper Foils Market Outlook, by Thickness, 2019-2032
    • 5.3.12. Russia Electrodeposited Copper Foils Market Outlook, by Application, 2019-2032
    • 5.3.13. Rest of Europe Electrodeposited Copper Foils Market Outlook, by Thickness, 2019-2032
    • 5.3.14. Rest of Europe Electrodeposited Copper Foils Market Outlook, by Application, 2019-2032
  • 5.4. BPS Analysis/Market Attractiveness Analysis

6. Asia Pacific Electrodeposited Copper Foils Market Outlook, 2019-2032

  • 6.1. Asia Pacific Electrodeposited Copper Foils Market Outlook, by Thickness, Value (US$ Bn), 2019-2032
    • 6.1.1. <=12 µm
    • 6.1.2. 13-20 µm
    • 6.1.3. 21-35 µm
    • 6.1.4. 36-70 µm
    • 6.1.5. >105 µm
  • 6.2. Asia Pacific Electrodeposited Copper Foils Market Outlook, by Application, Value (US$ Bn), 2019-2032
    • 6.2.1. Printed Circuit Boards (PCBs)
    • 6.2.2. Lithium-ion Batteries (LiBs)
    • 6.2.3. Misc.
  • 6.3. Asia Pacific Electrodeposited Copper Foils Market Outlook, by Country, Value (US$ Bn), 2019-2032
    • 6.3.1. China Electrodeposited Copper Foils Market Outlook, by Thickness, 2019-2032
    • 6.3.2. China Electrodeposited Copper Foils Market Outlook, by Application, 2019-2032
    • 6.3.3. Japan Electrodeposited Copper Foils Market Outlook, by Thickness, 2019-2032
    • 6.3.4. Japan Electrodeposited Copper Foils Market Outlook, by Application, 2019-2032
    • 6.3.5. South Korea Electrodeposited Copper Foils Market Outlook, by Thickness, 2019-2032
    • 6.3.6. South Korea Electrodeposited Copper Foils Market Outlook, by Application, 2019-2032
    • 6.3.7. India Electrodeposited Copper Foils Market Outlook, by Thickness, 2019-2032
    • 6.3.8. India Electrodeposited Copper Foils Market Outlook, by Application, 2019-2032
    • 6.3.9. Southeast Asia Electrodeposited Copper Foils Market Outlook, by Thickness, 2019-2032
    • 6.3.10. Southeast Asia Electrodeposited Copper Foils Market Outlook, by Application, 2019-2032
    • 6.3.11. Rest of SAO Electrodeposited Copper Foils Market Outlook, by Thickness, 2019-2032
    • 6.3.12. Rest of SAO Electrodeposited Copper Foils Market Outlook, by Application, 2019-2032
  • 6.4. BPS Analysis/Market Attractiveness Analysis

7. Latin America Electrodeposited Copper Foils Market Outlook, 2019-2032

  • 7.1. Latin America Electrodeposited Copper Foils Market Outlook, by Thickness, Value (US$ Bn), 2019-2032
    • 7.1.1. <=12 µm
    • 7.1.2. 13-20 µm
    • 7.1.3. 21-35 µm
    • 7.1.4. 36-70 µm
    • 7.1.5. >105 µm
  • 7.2. Latin America Electrodeposited Copper Foils Market Outlook, by Application, Value (US$ Bn), 2019-2032
    • 7.2.1. Printed Circuit Boards (PCBs)
    • 7.2.2. Lithium-ion Batteries (LiBs)
    • 7.2.3. Misc.
  • 7.3. Latin America Electrodeposited Copper Foils Market Outlook, by Country, Value (US$ Bn), 2019-2032
    • 7.3.1. Brazil Electrodeposited Copper Foils Market Outlook, by Thickness, 2019-2032
    • 7.3.2. Brazil Electrodeposited Copper Foils Market Outlook, by Application, 2019-2032
    • 7.3.3. Mexico Electrodeposited Copper Foils Market Outlook, by Thickness, 2019-2032
    • 7.3.4. Mexico Electrodeposited Copper Foils Market Outlook, by Application, 2019-2032
    • 7.3.5. Argentina Electrodeposited Copper Foils Market Outlook, by Thickness, 2019-2032
    • 7.3.6. Argentina Electrodeposited Copper Foils Market Outlook, by Application, 2019-2032
    • 7.3.7. Rest of LATAM Electrodeposited Copper Foils Market Outlook, by Thickness, 2019-2032
    • 7.3.8. Rest of LATAM Electrodeposited Copper Foils Market Outlook, by Application, 2019-2032
  • 7.4. BPS Analysis/Market Attractiveness Analysis

8. Middle East & Africa Electrodeposited Copper Foils Market Outlook, 2019-2032

  • 8.1. Middle East & Africa Electrodeposited Copper Foils Market Outlook, by Thickness, Value (US$ Bn), 2019-2032
    • 8.1.1. <=12 µm
    • 8.1.2. 13-20 µm
    • 8.1.3. 21-35 µm
    • 8.1.4. 36-70 µm
    • 8.1.5. >105 µm
  • 8.2. Middle East & Africa Electrodeposited Copper Foils Market Outlook, by Application, Value (US$ Bn), 2019-2032
    • 8.2.1. Printed Circuit Boards (PCBs)
    • 8.2.2. Lithium-ion Batteries (LiBs)
    • 8.2.3. Misc.
  • 8.3. Middle East & Africa Electrodeposited Copper Foils Market Outlook, by Country, Value (US$ Bn), 2019-2032
    • 8.3.1. GCC Electrodeposited Copper Foils Market Outlook, by Thickness, 2019-2032
    • 8.3.2. GCC Electrodeposited Copper Foils Market Outlook, by Application, 2019-2032
    • 8.3.3. South Africa Electrodeposited Copper Foils Market Outlook, by Thickness, 2019-2032
    • 8.3.4. South Africa Electrodeposited Copper Foils Market Outlook, by Application, 2019-2032
    • 8.3.5. Egypt Electrodeposited Copper Foils Market Outlook, by Thickness, 2019-2032
    • 8.3.6. Egypt Electrodeposited Copper Foils Market Outlook, by Application, 2019-2032
    • 8.3.7. Nigeria Electrodeposited Copper Foils Market Outlook, by Thickness, 2019-2032
    • 8.3.8. Nigeria Electrodeposited Copper Foils Market Outlook, by Application, 2019-2032
    • 8.3.9. Rest of Middle East Electrodeposited Copper Foils Market Outlook, by Thickness, 2019-2032
    • 8.3.10. Rest of Middle East Electrodeposited Copper Foils Market Outlook, by Application, 2019-2032
  • 8.4. BPS Analysis/Market Attractiveness Analysis

9. Competitive Landscape

  • 9.1. Company Vs Segment Heatmap
  • 9.2. Company Market Share Analysis, 2024
  • 9.3. Competitive Dashboard
  • 9.4. Company Profiles
    • 9.4.1. Doosan Corporation Electro
      • 9.4.1.1. Company Overview
      • 9.4.1.2. Product Portfolio
      • 9.4.1.3. Financial Overview
      • 9.4.1.4. Business Strategies and Developments
    • 9.4.2. Furukawa Electric Co., Ltd.
      • 9.4.2.1. Company Overview
      • 9.4.2.2. Product Portfolio
      • 9.4.2.3. Financial Overview
      • 9.4.2.4. Business Strategies and Developments
    • 9.4.3. Fukuda Metal Foil & Powder Co., Ltd.
      • 9.4.3.1. Company Overview
      • 9.4.3.2. Product Portfolio
      • 9.4.3.3. Financial Overview
      • 9.4.3.4. Business Strategies and Developments
    • 9.4.4. Circuit Foil
      • 9.4.4.1. Company Overview
      • 9.4.4.2. Product Portfolio
      • 9.4.4.3. Financial Overview
      • 9.4.4.4. Business Strategies and Developments
    • 9.4.5. Chang Chun Group
      • 9.4.5.1. Company Overview
      • 9.4.5.2. Product Portfolio
      • 9.4.5.3. Financial Overview
      • 9.4.5.4. Business Strategies and Developments
    • 9.4.6. LS Mtron Ltd.
      • 9.4.6.1. Company Overview
      • 9.4.6.2. Product Portfolio
      • 9.4.6.3. Financial Overview
      • 9.4.6.4. Business Strategies and Developments
    • 9.4.7. Mitsui Mining & Smelting Co., Ltd.
      • 9.4.7.1. Company Overview
      • 9.4.7.2. Product Portfolio
      • 9.4.7.3. Financial Overview
      • 9.4.7.4. Business Strategies and Developments
    • 9.4.8. JX Nippon Mining & Metals Corporation
      • 9.4.8.1. Company Overview
      • 9.4.8.2. Product Portfolio
      • 9.4.8.3. Financial Overview
      • 9.4.8.4. Business Strategies and Developments
    • 9.4.9. ILJIN Materials Co., Ltd.
      • 9.4.9.1. Company Overview
      • 9.4.9.2. Product Portfolio
      • 9.4.9.3. Financial Overview
      • 9.4.9.4. Business Strategies and Developments
    • 9.4.10. Targray Technology International, Inc.
      • 9.4.10.1. Company Overview
      • 9.4.10.2. Product Portfolio
      • 9.4.10.3. Financial Overview
      • 9.4.10.4. Business Strategies and Developments

10. Appendix

  • 10.1. Research Methodology
  • 10.2. Report Assumptions
  • 10.3. Acronyms and Abbreviations