市场调查报告书
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1490876
全球可剥离黏剂的成长机会Global De-bondable Adhesives Growth Opportunities |
维修、再利用和回收趋势以及关键需求推动产业扩张
可释放黏剂被定义为透过施加外部刺激而有利于去除黏剂的黏剂,从而允许在医疗应用中拆卸部件或组件或从皮肤上去除黏剂产品。
随着各种最终用途产业对材料回收和再利用等永续实践的需求不断增加,剥离材料、零件和组件的需求处于最前沿。此外,使用无损坏且无麻烦的拆卸过程临时拆卸零件以进行维护和修理的趋势日益明显。可剥离黏剂技术对于实现这些产业和消费者目标至关重要。因此,研究和开发计划旨在开发超音波、紫外线、电、热、化学、雷射和磁等消融技术和方法。快速成长的消费者群体正在推动各行业的需求,包括消费性电子和电器、汽车和运输、包装和医疗保健,从而促进了离型黏剂应用的强劲成长。
此分析包括消费性电子/电器、包装、医疗保健、汽车/运输、建筑、纺织、军事、能源和其他行业最终用途(例如太阳能、风力发电、半导体和工业机械应用组合)。黏剂的需求前景。它还描述了所使用的主要消融刺激,包括紫外线、热、电、化学、磁性、超音波和雷射。
鑑于最终用途工业应用、消费量份额、全球消费量和收益预测估计中讨论的需求不断上升,可剥离黏剂的需求前景是动态的。
Repair, Reuse, and Recycle Trends and Critical Needs Fuel Industry Expansion
De-bondable adhesives are defined as adhesives that enable the disassembling of parts and components or detaching the adhesive product from the skin in healthcare applications by facilitating adhesive de-bonding on demand through the application of an external stimulus.
With the rising need for sustainable practices such as recycling and reusing materials across diverse end-use industry applications, the need to de-bond materials, components, and parts is paramount. Furthermore, temporary disassembly of components for maintenance and repair using damage-free and less tedious disassembly processes is also a growing trend. De-bondable adhesive technologies are vital enablers in achieving these industry and consumer goals. As a result, R&D initiatives target the development of de-bonding technologies and methods, such as ultrasound, UV light, electrical, thermal, chemical, laser, and magnetic. A fast-growing consumer population is driving demand across various industries, including consumer electronics and electrical appliances, automotive and transportation, packaging, and healthcare, contributing to the robust use of de-bondable adhesive applications.
This analysis covers the demand outlook for de-bondable adhesives across consumer electronics and electrical appliances, packaging, healthcare, automotive and transportation, construction, textiles, military, and energy and other industrial end-use applications (e.g., solar PV, wind energy, semiconductor, and industrial machinery applications combined). It also discusses the main de-bonding stimuli used, such as UV-light, thermal, electrical, chemical, magnetic, ultrasound, and laser.
The demand outlook for de-bondable adhesives is dynamic, given the growing requirements discussed for each end-use industry application, volume consumption share, global volume consumption, and revenue forecast estimates.