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市场调查报告书
商品编码
1495566

超级结 MOSFET 市场 - 按应用(能源和电力、消费性电子产品、逆变器和 UPS、电动车、工业系统、其他)、按类型(通孔型、表面贴装型)和预测 2024 - 2032 年

Super Junction MOSFET Market - By Application (Energy and Power, Consumer Electronics, Inverter and UPS, Electric Vehicle, Industrial System, Others), By Type (Through Hole Type, Surface Mount Type) & Forecast 2024 - 2032

出版日期: | 出版商: Global Market Insights Inc. | 英文 220 Pages | 商品交期: 2-3个工作天内

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简介目录

受汽车、消费电子和工业自动化等各行业对节能电子设备需求不断增长的推动,超级结 MOSFET 市场规模在 2024 年至 2032 年间复合年增长率将超过 11.5%。这些 MOSFET 具有卓越的性能特性,例如低导通电阻、高速开关和降低的功率损耗,使其成为需要高效率和可靠性的应用的理想选择。例如,2024 年 1 月,Alpha and Omega Semiconductor Limited (AOS) 推出了 aMOS5(TM) 600V FRD 超级结 MOSFET。

元件设计不断创新,例如单元结构的最佳化以及碳化硅 (SiC) 和氮化镓 (GaN) 等先进材料的使用,使得 MOSFET 的生产具有更高的功率密度和更好的热性能。因此,製造商越来越多地采用超级结 MOSFET 来满足对高性能功率半导体解决方案不断增长的需求,从而推动市场成长。

超结MOSFET产业依产业、应用、类型、地区划分。

预计到 2032 年,工业系统应用领域的市场份额将大幅增长。工业营运中对能源效率和永续性的日益重视也推动了超级结 MOSFET 的采用,以优化功率转换并降低能耗。这些 MOSFET 的坚固性和耐用性进一步使其成为恶劣工业环境的理想选择,以确保在具有挑战性的条件下提供可靠的性能。

根据类型,表面贴装型 (SMT) 领域的超级结 MOSFET 市场将在 2024 年至 2032 年期间以超过 10.5% 的复合年增长率产生可观的收入。基于 SMT 的 MOSFET 结构紧凑、空间效率高且易于组装,非常适合电路板空间有限且设计复杂的现代电子设备。表面贴装封装格式还可实现高效散热并增强热性能,同时确保在严苛环境中可靠运作。

到2032 年,北美超级结MOSFET 产业的成长率预计将超过12.5%。高功率元件的需求。公司不断投资于研发活动,以提高 MOSFET 性能、降低生产成本并为这些装置开发新应用。此外,半导体公司、汽车製造商和研究机构之间的合作将进一步加速区域产品的采用。

目录

第 1 章:方法与范围

第 2 章:执行摘要

第 3 章:产业洞察

  • 产业生态系统分析
  • 供应商矩阵
  • 技术与创新格局
  • 专利分析
  • 重要新闻和倡议
  • 监管环境
  • 衝击力
    • 成长动力
      • 对能源效率的需求不断增加
      • 电力电子应用快速成长
      • 半导体技术的进步
      • 汽车产业的发展和向再生能源系统的转变
      • 扩大不间断电源系统的生产
    • 产业陷阱与挑战
      • 技术复杂性
      • 成本压力
  • 成长潜力分析
  • 波特的分析
  • PESTEL分析

第 4 章:竞争格局

  • 公司市占率分析
  • 竞争定位矩阵
  • 战略展望矩阵

第 5 章:市场估计与预测:按应用划分,2018 年 - 2032 年

  • 主要趋势
  • 能源与电力
  • 消费性电子产品
  • 逆变器和UPS
  • 电动车
  • 工业体系
  • 其他的

第 6 章:市场估计与预测:按类型,2018 - 2032

  • 主要趋势
  • 通孔型
  • 表面贴装型

第 7 章:市场估计与预测:按地区划分,2018 年 - 2032 年

  • 主要趋势
  • 北美洲
    • 我们
    • 加拿大
  • 欧洲
    • 英国
    • 德国
    • 法国
    • 义大利
    • 西班牙
    • 欧洲其他地区
  • 亚太地区
    • 中国
    • 印度
    • 日本
    • 韩国
    • 澳新银行
    • 亚太地区其他地区
  • 拉丁美洲
    • 巴西
    • 墨西哥
    • 拉丁美洲其他地区
  • MEA
    • 阿联酋
    • 沙乌地阿拉伯
    • 南非
    • MEA 的其余部分

第 8 章:公司简介

  • Alpha and Omega Semiconductor
  • Fuji Electric Co., Ltd.
  • IceMOS Technology Ltd.
  • Infineon Technologies AG
  • Magnachip
  • ON Semiconductor Corporation
  • PANJIT
  • ROHM Co., Ltd.
  • STMicroelectronics N.V.
  • Toshiba Corporation
  • Vishay Intertechnology, Inc.
简介目录
Product Code: 8758

Super junction MOSFET market size will register over 11.5% CAGR between 2024 and 2032, driven by the increasing demand for energy-efficient electronic devices across various industries, including automotive, consumer electronics, and industrial automation. These MOSFETs offer superior performance characteristics, such as low on-resistance, high-speed switching, and reduced power losses, making them ideal for applications requiring high efficiency and reliability. For instance, in January 2024, Alpha and Omega Semiconductor Limited (AOS) unveiled aMOS5(TM) 600V FRD Super Junction MOSFETs.

Rising innovations in device designs, such as the optimization of cell structure and the use of advanced materials like silicon carbide (SiC) and gallium nitride (GaN) have enabled the production of MOSFETs with higher power density and improved thermal performance. As a result, manufacturers are increasingly adopting Super Junction MOSFETs to meet the growing demand for high-performance power semiconductor solutions, driving the market growth.

The super junction MOSFET industry is divided into industry into application, type, and region.

The market share from the industrial system application segment is anticipated to witness substantial growth through 2032. The increasing automation and digitization of industrial processes is necessitating the use of efficient and reliable power semiconductor devices. The growing emphasis on energy efficiency and sustainability in industrial operations is also driving the adoption of super junction MOSFETs to optimize power conversion and reduce energy consumption. The ruggedness and durability of these MOSFETs further makes them ideal for harsh industrial environments for ensuring reliable performance under challenging conditions.

Based on type, the super junction MOSFET market from the surface mount type (SMT) segment will generate notable revenue at over 10.5% CAGR during 2024-2032. Driven by their compactness, space efficiency, and ease of assembly, SMT-based MOSFETs are well-suited for modern electronic devices with limited board space and complex designs. The surface mount packaging format also enables efficient heat dissipation and enhances thermal performance while ensuring reliable operations in demanding environments.

North America super junction MOSFET industry is slated to record over 12.5% growth rate through 2032. The robust automotive and industrial sectors, coupled with increasing investments in electric vehicles (EVs), renewable energy, and smart grid infrastructure are propelling the demand for high-performance power semiconductor solutions. Companies are continuously investing in R&D activities to improve MOSFET performance, reduce production costs, and develop new applications for these devices. Additionally, collaborations between semiconductor companies, automotive manufacturers, and research institutions will further accelerate the regional product adoption.

Table of Contents

Chapter 1 Methodology & Scope

  • 1.1 Market scope & definition
  • 1.2 Base estimates & calculations
  • 1.3 Forecast parameters
  • 1.4 Data sources
    • 1.4.1 Primary
    • 1.4.2 Secondary
      • 1.4.2.1 Paid sources
      • 1.4.2.2 Public sources

Chapter 2 Executive Summary

  • 2.1 Industry 360 degree synopsis, 2018 - 2032
  • 2.2 Business trends
    • 2.2.1 Total addressable market (TAM), 2024-2032

Chapter 3 Industry Insights

  • 3.1 Industry ecosystem analysis
  • 3.2 Vendor matrix
  • 3.3 Technology & innovation landscape
  • 3.4 Patent analysis
  • 3.5 Key news and initiatives
  • 3.6 Regulatory landscape
  • 3.7 Impact forces
    • 3.7.1 Growth drivers
      • 3.7.1.1 Increasing demand for energy efficiency
      • 3.7.1.2 Rapid growth in power electronics applications
      • 3.7.1.3 Advancements in semiconductor technology
      • 3.7.1.4 Growing automotive sector and shift towards renewable energy system
      • 3.7.1.5 Expansion in the production of uninterruptible power systems
    • 3.7.2 Industry pitfalls & challenges
      • 3.7.2.1 Technological complexity
      • 3.7.2.2 Cost pressure
  • 3.8 Growth potential analysis
  • 3.9 Porter's analysis
    • 3.9.1 Supplier power
    • 3.9.2 Buyer power
    • 3.9.3 Threat of new entrants
    • 3.9.4 Threat of substitutes
    • 3.9.5 Industry rivalry
  • 3.10 PESTEL analysis

Chapter 4 Competitive Landscape, 2023

  • 4.1 Company market share analysis
  • 4.2 Competitive positioning matrix
  • 4.3 Strategic outlook matrix

Chapter 5 Market Estimates & Forecast, By Application, 2018 - 2032 (USD Million)

  • 5.1 Key trends
  • 5.2 Energy and power
  • 5.3 Consumer electronics
  • 5.4 Inverter and UPS
  • 5.5 Electric vehicle
  • 5.6 Industrial system
  • 5.7 Others

Chapter 6 Market Estimates & Forecast, By Type, 2018 - 2032 (USD Million)

  • 6.1 Key trends
  • 6.2 Through hole type
  • 6.3 Surface mount type

Chapter 7 Market Estimates & Forecast, By Region, 2018 - 2032 (USD Million)

  • 7.1 Key trends
  • 7.2 North America
    • 7.2.1 U.S.
    • 7.2.2 Canada
  • 7.3 Europe
    • 7.3.1 UK
    • 7.3.2 Germany
    • 7.3.3 France
    • 7.3.4 Italy
    • 7.3.5 Spain
    • 7.3.6 Rest of Europe
  • 7.4 Asia Pacific
    • 7.4.1 China
    • 7.4.2 India
    • 7.4.3 Japan
    • 7.4.4 South Korea
    • 7.4.5 ANZ
    • 7.4.6 Rest of Asia Pacific
  • 7.5 Latin America
    • 7.5.1 Brazil
    • 7.5.2 Mexico
    • 7.5.3 Rest of Latin America
  • 7.6 MEA
    • 7.6.1 UAE
    • 7.6.2 Saudi Arabia
    • 7.6.3 South Africa
    • 7.6.4 Rest of MEA

Chapter 8 Company Profiles

  • 8.1 Alpha and Omega Semiconductor
  • 8.2 Fuji Electric Co., Ltd.
  • 8.3 IceMOS Technology Ltd.
  • 8.4 Infineon Technologies AG
  • 8.5 Magnachip
  • 8.6 ON Semiconductor Corporation
  • 8.7 PANJIT
  • 8.8 ROHM Co., Ltd.
  • 8.9 STMicroelectronics N.V.
  • 8.10 Toshiba Corporation
  • 8.11 Vishay Intertechnology, Inc.