封面
市场调查报告书
商品编码
1532611

多层陶瓷电容器市场 - 按类型(通用、阵列、巨型电容器、串行设计)、按电介质类型(中(100 V-630 V)、高(1,000 V 以上))、按最终用途和预测,2024 年- 2032

Multi-layer Ceramic Capacitor Market - By Type (General Purpose, Array, Megacap, Serial Design), By Dielectric Type (Medium (100 V-630 V), High (1,000 V-Above)), By End Use & Forecast, 2024 - 2032

出版日期: | 出版商: Global Market Insights Inc. | 英文 250 Pages | 商品交期: 2-3个工作天内

价格
简介目录

在不断增加的产品推出和技术进步的带动下,2024 年至 2032 年多层陶瓷电容器市场规模将以超过 13% 的复合年增长率成长。随着新技术的不断涌现,以满足对更紧凑、更有效率的电子元件的需求,这些电容器越来越受到重视。

多层陶瓷电容器 (MLCC) 技术的进步正在以更小的封装实现更高的电容和更高的性能,以满足现代电子设备的需求。研究人员和製造商也致力于整合先进材料和製造技术,以满足各种应用不断变化的要求。例如,2023 年 7 月,京瓷推出了 EIA 0201 尺寸的新型多层陶瓷电容器,可提供增强的性能和紧凑性,以满足先进电子设备中对更小、高容量组件不断增长的需求。

整个市场分为类型、介电类型、额定电压、最终用途和地区。

根据类型,由于透过串联多个电容器来优化性能的需求不断增加,预计从 2024 年到 2032 年,串行设计领域的 MLCC 市场价值将大幅增长。这种设计方法可在各种电子应用中实现更高的额定电压并提高可靠性。串行配置有助于更有效地管理配电并提高电子电路的耐用性。

由于为电子行业的各种应用提供可靠和紧凑的解决方案的需求激增,预计到 2032 年,电子最终用途领域的多层陶瓷电容器行业将以复合年增长率大幅扩张。这些电容器能够在较小的占地面积内处理高电容和电压,有助于提高电子设备的性能和效率。 MLCC 还整合到各种消费性电子产品、汽车系统和通讯设备中,以进一步增强其功能。

从地区来看,由于严格的监管标准和不断变化的消费者对增强功能的偏好,北美多层陶瓷电容器市场规模可能会在 2024 年至 2032 年间强劲增长。该地区的一些开发商和製造商正在致力于创新,以满足监管要求和消费者对高级功能的期望,以支持更复杂的电子设备和系统的开发。

目录

第 1 章:方法与范围

第 2 章:执行摘要

第 3 章:产业洞察

  • 产业生态系统分析
  • 供应商矩阵
  • 利润率分析
  • 技术与创新格局
  • 专利分析
  • 重要新闻和倡议
  • 监管环境
  • 衝击力
    • 成长动力
      • 消费性电子产品需求
      • 物联网和连接的快速进步
      • 5G网路部署
      • 小型化和增强功能
      • 再生能源的新兴应用
    • 产业陷阱与挑战
      • 供应链挑战
      • 交货时间和产能限制
  • 成长潜力分析
  • 波特的分析
  • PESTEL分析

第 4 章:竞争格局

  • 介绍
  • 公司市占率分析
  • 竞争定位矩阵
  • 战略展望矩阵

第 5 章:市场估计与预测:按类型,2021-2032 年

  • 主要趋势
  • 一般
  • 大批
  • 巨型资本
  • 系列设计

第 6 章:市场估计与预测:按电介质类型,2021-2032 年

  • 主要趋势
  • Ⅰ类
  • 二级
  • 其他II类

第 7 章:市场估计与预测:依额定电压,2021-2032 年

  • 主要趋势
  • 低(高达 50V)
  • 中(100V-630V)
  • 高(1,000 V 以上)

第 8 章:市场估计与预测:依最终用途,2021-2032 年

  • 主要趋势
  • 汽车
  • 电子产品
  • 电信
  • 工业设备
  • 其他的

第 9 章:市场估计与预测:按地区,2021-2032 年

  • 主要趋势
  • 北美洲
    • 我们
    • 加拿大
  • 欧洲
    • 英国
    • 德国
    • 法国
    • 义大利
    • 西班牙
    • 欧洲其他地区
  • 亚太地区
    • 中国
    • 印度
    • 日本
    • 韩国
    • 澳新银行
    • 亚太地区其他地区
  • 拉丁美洲
    • 巴西
    • 墨西哥
    • 拉丁美洲其他地区
  • MEA
    • 阿联酋
    • 南非
    • 沙乌地阿拉伯
    • MEA 的其余部分

第 10 章:公司简介

  • Darfon Electronics Corp Murata Manufacturing Co., Ltd.
  • Samsung Electro-Mechanics (SEM)
  • TDK Corporation
  • Taiyo Yuden Co., Ltd.
  • AVX Corporation
  • KEMET Corporation
  • Vishay Intertechnology, Inc.
  • Kyocera Corporation
  • Wurth Elektronik GmbH & Co. KG
  • Yageo Corporation
  • Johanson Technology Inc.
  • Holy Stone Enterprise Co., Ltd.
  • Fenghua Advanced Technology Holding Co., Ltd.
  • NIC Components Corp.
  • Tai-I Electric Wire & Cable Co., Ltd.
简介目录
Product Code: 9671

Multi-layer Ceramic Capacitor Market size will expand at over 13% CAGR from 2024 to 2032, led by the increasing launches and technological advancements. These capacitors are gaining prominence as new technologies are emerging to cater to the demand for more compact and efficient electronic components.

Advancements in multi-layer ceramic capacitor (MLCC) technology are leading to higher capacitance and improved performance in smaller packages for accommodating the needs of modern electronic devices. Researchers and manufacturers are also working on integrating advanced materials and manufacturing techniques to meet the evolving requirements of various applications. For instance, in July 2023, Kyocera introduced a new multilayer ceramic capacitor in the EIA 0201 size to offer enhanced performance and compactness in addressing the growing demand for smaller, high-capacity components in advanced electronic devices.

The overall market is segregated into type, dielectric type, rated voltage, end-use, and region.

Based on type, the MLCC market value from the serial design segment is estimated to rise at substantial rate from 2024 to 2032, due to the increasing need for optimizing performance by aligning multiple capacitors in series. This design approach is enabling higher voltage ratings and improved reliability in various electronic applications. The serial configuration is helping to manage power distribution more effectively and enhance the durability of electronic circuits.

Multi-layer ceramic capacitor industry from the electronics end-use segment is anticipated to expand at substantial CAGR through 2032, owing to the surging requirement to provide reliable and compact solutions for various applications in electronics sector. These capacitors are helping to improve the performance and efficiency of electronic devices through their ability to handle high capacitance and voltage in a small footprint. MLCCs are also integrated into a wide range of consumer electronics, automotive systems, and communication devices to further enhance their capabilities.

Regionally, the North America multi-layer ceramic capacitor market size may depict robust growth between 2024 and 2032, on account of the stringent regulatory standards and evolving consumer preferences for enhanced features. Several developers and manufacturers in the region are working on innovations to meet the regulatory demands and consumer expectations for advanced features for supporting the development of more sophisticated electronic devices and systems.

Table of Contents

Chapter 1 Methodology & Scope

  • 1.1 Market scope & definition
  • 1.2 Base estimates & calculations
  • 1.3 Forecast calculation
  • 1.4 Data sources
    • 1.4.1 Primary
    • 1.4.2 Secondary
      • 1.4.2.1 Paid sources
      • 1.4.2.2 Public sources

Chapter 2 Executive Summary

  • 2.1 Industry 360° synopsis, 2021 - 2032
  • 2.2 Business trends
    • 2.2.1 Total addressable market (TAM), 2024-2032

Chapter 3 Industry Insights

  • 3.1 Industry ecosystem analysis
  • 3.2 Vendor matrix
  • 3.3 Profit margin analysis
  • 3.4 Technology & innovation landscape
  • 3.5 Patent analysis
  • 3.6 Key news and initiatives
  • 3.7 Regulatory landscape
  • 3.8 Impact forces
    • 3.8.1 Growth drivers
      • 3.8.1.1 Demand for consumer electronics
      • 3.8.1.2 Rapid advancements in the IoT and connectivity
      • 3.8.1.3 5G network deployment
      • 3.8.1.4 Miniaturization and increased functionality
      • 3.8.1.5 Emerging applications in renewable energy
    • 3.8.2 Industry pitfalls & challenges
      • 3.8.2.1 Supply chain challenges
      • 3.8.2.2 Lead times and capacity constraints
  • 3.9 Growth potential analysis
  • 3.10 Porter's analysis
    • 3.10.1 Supplier power
    • 3.10.2 Buyer power
    • 3.10.3 Threat of new entrants
    • 3.10.4 Threat of substitutes
    • 3.10.5 Industry rivalry
  • 3.11 PESTEL analysis

Chapter 4 Competitive Landscape, 2023

  • 4.1 Introduction
  • 4.2 Company market share analysis
  • 4.3 Competitive positioning matrix
  • 4.4 Strategic outlook matrix

Chapter 5 Market Estimates & Forecast, By Type, 2021-2032 (USD Million)

  • 5.1 Key trends
  • 5.2 General purpose
  • 5.3 Array
  • 5.4 Megacap
  • 5.5 Serial design

Chapter 6 Market Estimates & Forecast, By Dielectric Type, 2021-2032 (USD Million)

  • 6.1 Key trends
  • 6.2 Class I
  • 6.3 Class II
  • 6.4 Others class II

Chapter 7 Market Estimates & Forecast, By Rated Voltage, 2021-2032 (USD Million)

  • 7.1 Key trends
  • 7.2 Low (Up to 50V)
  • 7.3 Medium (100 V-630 V)
  • 7.4 High (1,000 V-Above)

Chapter 8 Market Estimates & Forecast, By End-use, 2021-2032 (USD Million)

  • 8.1 Key trends
  • 8.2 Automotive
  • 8.3 Electronics
  • 8.4 Telecommunication
  • 8.5 Industrial equipment
  • 8.6 Others

Chapter 9 Market Estimates & Forecast, By Region, 2021-2032 (USD Million)

  • 9.1 Key trends
  • 9.2 North America
    • 9.2.1 U.S.
    • 9.2.2 Canada
  • 9.3 Europe
    • 9.3.1 UK
    • 9.3.2 Germany
    • 9.3.3 France
    • 9.3.4 Italy
    • 9.3.5 Spain
    • 9.3.6 Rest of Europe
  • 9.4 Asia Pacific
    • 9.4.1 China
    • 9.4.2 India
    • 9.4.3 Japan
    • 9.4.4 South Korea
    • 9.4.5 ANZ
    • 9.4.6 Rest of Asia Pacific
  • 9.5 Latin America
    • 9.5.1 Brazil
    • 9.5.2 Mexico
    • 9.5.3 Rest of Latin America
  • 9.6 MEA
    • 9.6.1 UAE
    • 9.6.2 South Africa
    • 9.6.3 Saudi Arabia
    • 9.6.4 Rest of MEA

Chapter 10 Company Profiles

  • 10.1 Darfon Electronics Corp Murata Manufacturing Co., Ltd.
  • 10.2 Samsung Electro-Mechanics (SEM)
  • 10.3 TDK Corporation
  • 10.4 Taiyo Yuden Co., Ltd.
  • 10.5 AVX Corporation
  • 10.6 KEMET Corporation
  • 10.7 Vishay Intertechnology, Inc.
  • 10.8 Kyocera Corporation
  • 10.9 Wurth Elektronik GmbH & Co. KG
  • 10.10 Yageo Corporation
  • 10.11 Johanson Technology Inc.
  • 10.12 Holy Stone Enterprise Co., Ltd.
  • 10.13 Fenghua Advanced Technology Holding Co., Ltd.
  • 10.14 NIC Components Corp.
  • 10.15 Tai-I Electric Wire & Cable Co., Ltd.