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市场调查报告书
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1570866

铁电RAM市场、机会、成长动力、产业趋势分析与预测，2024-2032年

Ferroelectric Ram Market, Opportunity, Growth Drivers, Industry Trend Analysis and Forecast, 2024-2032
出版日期: | 出版商: Global Market Insights Inc. | 英文 210 Pages | 商品交期: 2-3个工作天内

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简介目录

2023 年全球铁电 RAM 市值为 4.522 亿美元，预计 2024 年至 2032 年复合年增长率将超过 5%。 FeRAM 等非挥发性记忆体技术具有至关重要的优势，因为即使在断电后也能保留资料。此功能在许多现代应用中至关重要。传统 RAM 一旦断电就会丢失资料，而 FeRAM（铁电 RAM）无需持续供电即可保留其讯息

2023 年 7 月，英飞凌在其汽车铁电 RAM 系列中推出了一款新装置。铁电随机存取记忆体 (FRAM) 作为一种非挥发性记忆体脱颖而出，融合了 RAM 和 ROM 的优点。与一旦断电就会遗失资料的传统 RAM 不同，FRAM 会像唯读记忆体 (ROM) 一样保留其资讯。这项独特的功能使 FRAM 成为优先考虑资料持久性的应用程式的首选。

FeRAM 市场的另一个显着趋势是汽车电子产品中越来越多的采用。目前，具有先进驾驶辅助系统 (ADAS)、资讯娱乐功能和众多感测器的车辆需要快速、可靠的记忆体解决方案。 FeRAM 具有无需电源即可保留资料的独特能力，加上其快速的读写速度，使其成为这些汽车应用的主要候选者。此外，随着产业转向电动和自动驾驶汽车，对强大记忆体解决方案的需求激增，巩固了 FeRAM 在汽车行业技术进步中的作用。

整个产业分为类型、储存密度、应用、最终用途产业和地区。

市场将类型分为独立式 FRAM 和嵌入式 FRAM，后者预计在预测期内将以 5% 的复合年增长率成长。嵌入式铁电 RAM (FRAM) 将非挥发性记忆体功能直接整合到微控制器和处理器等半导体设备。这种整合提高了效能并最大限度地减少了设备的实体占用空间。

记忆体密度类别包括高达 16Kb、32Kb 至 128Kb、256Kb 至 1Mb、2​​Mb 至 8Mb 以及高于 8Mb。资料2032 年，2Mb 至资料细分市场预计将达到 1 亿美元。它们非常适合先进的工业控制系统、汽车资讯娱乐系统和复杂的医疗设备，在这些设备中，快速且有效率的资料处理和储存至关重要。

到 2023 年，北美将引领全球铁电 RAM 市场，其份额将超过 40%。美国是主要参与者，在半导体研发方面投入大量资金。此外，该地区对智慧技术和物联网应用的关注营造了有利于 FeRAM 采用的环境。

目录

第 1 章：方法与范围

第 2 章：执行摘要

第 3 章：产业洞察

  • 产业生态系统分析
  • 供应商矩阵
  • 利润率分析
  • 技术与创新格局
  • 专利分析
  • 重要新闻和倡议
  • 监管环境
  • 衝击力
    • 成长动力
      • 对非挥发性记忆体解决方案的需求不断增长
      • 汽车业的采用率提高
      • 政府及产业支持
      • 物联网和穿戴式装置的扩展
      • 铁电材料的进展
    • 产业陷阱与挑战
      • 生产成本高
      • 来自新兴储存技术的竞争
  • 成长潜力分析
  • 波特的分析
  • PESTEL分析

第 4 章：竞争格局

  • 介绍
  • 公司市占率分析
  • 竞争定位矩阵
  • 战略展望矩阵

第 5 章：市场估计与预测：按类型，2021 - 2032

  • 主要趋势
  • 独立式铁电记忆体
  • 嵌入式铁电记忆体

第 6 章：市场估计与预测：按记忆体密度，2021 - 2032 年

  • 主要趋势
  • 高达 16Kb
  • 32Kb 至 128Kb
  • 256Kb 至 1Mb
  • 2Mb 至 8Mb
  • 8Mb以上

第 7 章：市场估计与预测：按应用分类，2021 - 2032

  • 主要趋势
  • 高级驾驶辅助系统（ADAS）
  • 电池管理系统（BMS）
  • CT扫描
  • 用户端设备 (CPE)
  • 智慧公用电錶
  • 穿戴式装置
  • 其他的

第 8 章：市场估计与预测：按最终用途产业，2021 - 2032 年

  • 主要趋势
  • 汽车
  • 消费性电子产品
  • 能源和公用事业
  • 卫生保健
  • 工业的
  • 资讯科技和电信
  • 其他的

第 9 章：市场估计与预测：按地区划分，2021 - 2032 年

  • 主要趋势
  • 北美洲
    • 我们
    • 加拿大
  • 欧洲
    • 英国
    • 德国
    • 法国
    • 义大利
    • 西班牙
    • 欧洲其他地区
  • 亚太地区
    • 中国
    • 印度
    • 日本
    • 韩国
    • 澳新银行
    • 亚太地区其他地区
  • 拉丁美洲
    • 巴西
    • 墨西哥
    • 拉丁美洲其他地区
  • MEA
    • 阿联酋
    • 南非
    • 沙乌地阿拉伯
    • MEA 的其余部分

第 10 章：公司简介

  • ActivAirTech, Inc.
  • Anaren, Inc.
  • Antenova Ltd.
  • Cypress Semiconductor Corporation
  • Digi-Key Electronics
  • Everspin Technologies, Inc.
  • Ferroelectric Memory Company
  • Fujitsu Limited
  • Future Electronics
  • Honeywell International, Inc.
  • Infineon Technologies AG
  • International Business Machines Corporation (IBM)
  • Laird Technologies, Inc.
  • LAPIS Semiconductor Co., Ltd. (Rohm Semiconductor)
  • Pulse Electronics Corporation
  • Ralec Electronic Co., Ltd.
  • Ramtron International Corporation
  • Samsung Electronics Co., Ltd.
  • SK Hynix Inc.
  • Symetrix Corporation
  • Tamura Corporation
  • Texas Instruments Incorporated
  • Toshiba Corporation
  • TriQuint Semiconductor, Inc.
  • TX Marine Messsysteme GmbH
简介目录
Product Code: 10671

The Global Ferroelectric RAM Market was valued at USD 452.2 million in 2023 and is projected to indicate a CAGR of over 5% from 2024 to 2032. A primary catalyst for this growth is the surging demand for non-volatile memory solutions. Non-volatile memory technologies, like FeRAM, offer a crucial advantage as they retain data even after a power loss. This capability is vital in many modern applications. While traditional RAM loses its data once powered off, FeRAM (ferroelectric RAM) maintains its information without a continuous power supply

In July 2023, Infineon introduced a new device to its lineup of automotive ferroelectric RAMs. Ferroelectric random-access memory (FRAM) stands out as a non-volatile memory, merging the advantages of both RAM and ROM. Unlike conventional RAM, which loses data once power is cut, FRAM retains its information akin to read-only memory (ROM). This distinctive feature positions FRAM as a preferred choice in applications prioritizing data persistence.

Another notable trend in the FeRAM market is growing adoption in automotive electronics. Currently vehicles, with their advanced driver-assistance systems (ADAS), infotainment features, and numerous sensors, demand swift and reliable memory solutions. FeRAM's unique ability to retain data without power, combined with its rapid read and write speeds, makes it a prime candidate for these automotive applications. Furthermore, as the industry pivots towards electric and autonomous vehicles, the demand for robust memory solutions surges, solidifying FeRAM's role in the automotive sector's technological advancements.

The overall industry is divided into type, memory density, application, end-use industry and region.

The market categorizes types into stand-alone FRAM and embedded FRAM, with the latter projected to grow at a CAGR of 5% during the forecast period. Embedded ferroelectric RAM (FRAM) integrates non-volatile memory capabilities directly into semiconductor devices like microcontrollers and processors. This integration boosts performance and minimizes the device's physical footprint.

Memory density categories include Up to 16Kb, 32Kb to 128Kb, 256Kb to 1Mb, 2Mb to 8Mb, and Above 8Mb. The 2Mb to 8Mb segment is anticipated to reach USD 100 million by 2032. Devices in the 2Mb to 8Mb FRAM segment cater to applications demanding extensive data storage and intricate data management. They are ideal for advanced industrial control systems, automotive infotainment, and sophisticated medical devices, where swift and efficient data processing and storage are paramount.

North America led the global ferroelectric RAM market with a share exceeding 40% in 2023. The region's dominance is fueled by technological innovations and robust demand across sectors like aerospace, healthcare, and telecommunications. The U.S., a key player, invests heavily in semiconductor R&D. Moreover, the region's focus on smart technologies and IoT applications fosters an environment conducive to FeRAM adoption.

Table of Contents

Chapter 1 Methodology and Scope

  • 1.1 Market scope and definition
  • 1.2 Base estimates and calculations
  • 1.3 Forecast calculation
  • 1.4 Data sources
    • 1.4.1 Primary
    • 1.4.2 Secondary
      • 1.4.2.1 Paid sources
      • 1.4.2.2 Public sources

Chapter 2 Executive Summary

  • 2.1 Industry 360° synopsis, 2021 - 2032

Chapter 3 Industry Insights

  • 3.1 Industry ecosystem analysis
  • 3.2 Vendor matrix
  • 3.3 Profit margin analysis
  • 3.4 Technology and innovation landscape
  • 3.5 Patent analysis
  • 3.6 Key news and initiatives
  • 3.7 Regulatory landscape
  • 3.8 Impact forces
    • 3.8.1 Growth drivers
      • 3.8.1.1 Rising demand for non-volatile memory solutions
      • 3.8.1.2 Increased adoption in automotive industry
      • 3.8.1.3 Government and industrial support
      • 3.8.1.4 Expansion in IoT and wearable devices
      • 3.8.1.5 Advancements in ferroelectric materials
    • 3.8.2 Industry pitfalls and challenges
      • 3.8.2.1 High production costs
      • 3.8.2.2 Competition from emerging memory technologies
  • 3.9 Growth potential analysis
  • 3.10 Porter's analysis
    • 3.10.1 Supplier power
    • 3.10.2 Buyer power
    • 3.10.3 Threat of new entrants
    • 3.10.4 Threat of substitutes
    • 3.10.5 Industry rivalry
  • 3.11 PESTEL analysis

Chapter 4 Competitive Landscape, 2023

  • 4.1 Introduction
  • 4.2 Company market share analysis
  • 4.3 Competitive positioning matrix
  • 4.4 Strategic outlook matrix

Chapter 5 Market Estimates and Forecast, By Type, 2021 - 2032 (USD Million)

  • 5.1 Key Trends
  • 5.2 Stand-alone FRAM
  • 5.3 Embedded FRAM

Chapter 6 Market Estimates and Forecast, By Memory Density, 2021 - 2032 (USD Million)

  • 6.1 Key Trends
  • 6.2 Up to 16Kb
  • 6.3 32Kb to 128Kb
  • 6.4 256Kb to 1Mb
  • 6.5 2Mb to 8Mb
  • 6.6 Above 8Mb

Chapter 7 Market Estimates and Forecast, By Application, 2021 - 2032 (USD Million)

  • 7.1 Key Trends
  • 7.2 Advanced driver assistance system (ADAS)
  • 7.3 Battery management system (BMS)
  • 7.4 CT-Scan
  • 7.5 Customer premise equipment (CPE)
  • 7.6 Smart utility meter
  • 7.7 Wearable device
  • 7.8 Others

Chapter 8 Market Estimates and Forecast, By End-Use Industry, 2021 - 2032 (USD Million)

  • 8.1 Key Trends
  • 8.2 Automotive
  • 8.3 Consumer electronics
  • 8.4 Energy and utility
  • 8.5 Healthcare
  • 8.6 Industrial
  • 8.7 IT and telecommunication
  • 8.8 Others

Chapter 9 Market Estimates and Forecast, By Region, 2021 - 2032 (USD Million)

  • 9.1 Key trends
  • 9.2 North America
    • 9.2.1 U.S.
    • 9.2.2 Canada
  • 9.3 Europe
    • 9.3.1 UK
    • 9.3.2 Germany
    • 9.3.3 France
    • 9.3.4 Italy
    • 9.3.5 Spain
    • 9.3.6 Rest of Europe
  • 9.4 Asia Pacific
    • 9.4.1 China
    • 9.4.2 India
    • 9.4.3 Japan
    • 9.4.4 South Korea
    • 9.4.5 ANZ
    • 9.4.6 Rest of Asia Pacific
  • 9.5 Latin America
    • 9.5.1 Brazil
    • 9.5.2 Mexico
    • 9.5.3 Rest of Latin America
  • 9.6 MEA
    • 9.6.1 UAE
    • 9.6.2 South Africa
    • 9.6.3 Saudi Arabia
    • 9.6.4 Rest of MEA

Chapter 10 Company Profiles

  • 10.1 ActivAirTech, Inc.
  • 10.2 Anaren, Inc.
  • 10.3 Antenova Ltd.
  • 10.4 Cypress Semiconductor Corporation
  • 10.5 Digi-Key Electronics
  • 10.6 Everspin Technologies, Inc.
  • 10.7 Ferroelectric Memory Company
  • 10.8 Fujitsu Limited
  • 10.9 Future Electronics
  • 10.10 Honeywell International, Inc.
  • 10.11 Infineon Technologies AG
  • 10.12 International Business Machines Corporation (IBM)
  • 10.13 Laird Technologies, Inc.
  • 10.14 LAPIS Semiconductor Co., Ltd. (Rohm Semiconductor)
  • 10.15 Pulse Electronics Corporation
  • 10.16 Ralec Electronic Co., Ltd.
  • 10.17 Ramtron International Corporation
  • 10.18 Samsung Electronics Co., Ltd.
  • 10.19 SK Hynix Inc.
  • 10.20 Symetrix Corporation
  • 10.21 Tamura Corporation
  • 10.22 Texas Instruments Incorporated
  • 10.23 Toshiba Corporation
  • 10.24 TriQuint Semiconductor, Inc.
  • 10.25 TX Marine Messsysteme GmbH