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半导体生产设备半导体製造设备

市场调查报告书

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1616041

半导体键合设备市场机会、成长动力、产业趋势分析与预测 2024 - 2032

Semiconductor Bonding Equipment Market Opportunity, Growth Drivers, Industry Trend Analysis, and Forecast 2024 - 2032

出版日期: 2024年09月11日 | 出版商:

Global Market Insights Inc. | 英文 168 Pages | 商品交期: 2-3个工作天内

价格

简介目录

2023 年全球半导体键合设备市场价值为 5.304 亿美元，预计 2024 年至 2032 年复合年增长率为 10%。这种需求激增主要是由人工智慧 (AI)、5G、电动车 (EV) 和物联网 (IoT) 等技术推动的，所有这些技术都依赖先进的半导体元件。这种上升趋势将进一步提振半导体产业。例如，2024年2月，半导体产业协会预测到2030年半导体市场将达到1兆美元。

根据设备类型分類的市场包括晶片键合设备、引线键合设备、晶圆键合设备和倒装晶片键合设备。 2023 年，引线键合设备占据市场主导地位，占超过 39% 的收入份额。引线键合设备领域因其在半导体封装领域的牢固地位而引领市场。引线键合是一种经过时间考验的技术，广泛应用于积体电路组装，因其可靠性和成本效益而备受讚誉。

它在处理各种半导体装置方面的多功能性以及对各种封装类型的适应性进一步巩固了其市场领导地位。市场按黏合类型细分，包括永久黏合、临时黏合和混合黏合。值得注意的是，混合黏合正在成为成长最快的领域，预计在预测期内复合年增长率将超过 12%。混合键合设备的激增可归因于其融合多种键合技术的能力，从而提高了半导体封装性能和灵活性。

市场范围
开始年份	2023年
预测年份	2024-2032
起始值	5.304 亿美元
预测值	13亿美元
复合年增长率	10%

这种方法有利于多种材料和工艺的集成，满足先进应用的严格要求。 2023 年，亚太地区占据了超过 55% 的主导份额，预计在整个预测期内将保持这一领先地位。亚太地区的霸主地位很大程度上归功于其在半导体製造和电子产品生产方面的领先地位。中国、韩国、台湾和日本等国家拥有着名的半导体代工厂和电子巨头，推动了对先进键合设备的强劲需求。的地位电子元件生产中心巩固了其在半导体键合设备市场的关键作用。

产业生态系统分析
供应商矩阵
技术与创新格局
专利分析
重要新闻和倡议
监管环境
衝击力
- 成长动力
  - 半导体产业的成长
  - 技术进步
  - 5G网路的扩展
  - 电动车 (EV) 的日益普及
  - 加大研发投入
- 产业陷阱与挑战
  - 初始成本高
  - 供应链中断
成长潜力分析
波特的分析
PESTEL分析

第 4 章：竞争格局

公司市占率分析
竞争定位矩阵
战略展望矩阵

第 5 章：市场估计与预测：按黏合类型，2021 - 2032 年

主要趋势
永久黏合
临时黏接
混合键合

第 6 章：市场估计与预测：按设备类型，2021 - 2032 年

主要趋势
焊接线设备
固晶设备
倒装晶片邦定设备
晶圆键合设备

第 7 章：市场估计与预测：依应用分类，2021 - 2032

主要趋势
先进封装
功率IC和功率分立元件
光子装置
MEMS 感测器和执行器
工程基材
CMOS影像感测器
射频设备
其他的

第 8 章：市场估计与预测：依最终用途产业，2021 - 2032 年

主要趋势
消费性电子产品
汽车
电信
卫生保健
航太与国防
工业的
其他的

第 9 章：市场估计与预测：按地区，2021 - 2032

主要趋势
北美洲
- 我们
- 加拿大
欧洲
- 英国
- 德国
- 法国
- 义大利
- 西班牙
- 欧洲其他地区
亚太地区
- 中国
- 印度
- 日本
- 韩国
- 澳新银行
- 亚太地区其他地区
拉丁美洲
- 巴西
- 墨西哥
- 拉丁美洲其他地区
MEA
- 阿联酋
- 沙乌地阿拉伯
- 南非
- MEA 的其余部分

第 10 章：公司简介

Applied Materials, Inc.
Applied Microengineering Ltd.
ASMPT Ltd (ASM Pacific Technology)
BE Semiconductor Industries NV (Besi)
Canon Inc.
DIAS Automation
Dr. Tresky AG
EV Group (EVG)
Fasford Technology Co., Ltd.
Hesse GmbH
Kaijo Shibuya Europe GmbH
Kulicke and Soffa Industries, Inc.
MRSI Systems
Mycronic
Nidec Corporation
Palomar Technologies
Panasonic Connect Co., Ltd.
Shibaura Mechatronics Corp
SUSS MicroTec SE
Tokyo Electron Limited
TORAY ENGINEERING Co.,Ltd
TPT Wire Bonder GmbH & Co KG
Ultrasonic Engineering Co., Ltd.
WestBond, Inc.

简介目录

Product Code: 11349

The Global Semiconductor Bonding Equipment Market was valued at USD 530.4 million in 2023 and is projected to indicate a CAGR of 10% from 2024 to 2032. The semiconductor industry is witnessing robust growth, spurred by rising chip demands across sectors like consumer electronics, automotive, telecommunications, and industrial applications. This demand surge is largely driven by technologies such as artificial intelligence (AI), 5G, electric vehicles (EVs), and the Internet of Things (IoT), all of which rely on advanced semiconductor components. This upward trend is set to further bolster the semiconductor industry. For example, in February 2024, the Semiconductor Industry Association projected the semiconductor market would reach USD 1 trillion by 2030. The overall semiconductor bonding equipment industry is classified based on bonding type, equipment type, application, end-use, and region.

The market segments based on equipment type include die-bonding equipment, wire-bonding equipment, wafer-bonding equipment, and flip-chip bonding equipment. In 2023, wire bonding equipment dominated the market, capturing over 39% of the revenue share. The wire bonding equipment segment led the market due to its entrenched position in semiconductor packaging. Wire bonding, a time-tested technology, is widely employed in integrated circuit assembly, prized for its reliability and cost-efficiency.

Its versatility in handling diverse semiconductor devices and adaptability to various packaging types further cement its market leadership. The market, segmented by bonding type, includes permanent bonding, temporary bonding, and hybrid bonding. Notably, hybrid bonding is emerging as the fastest-growing segment, projected to expand at a CAGR exceeding 12% during the forecast period. The surge in hybrid bonding equipment can be attributed to its capability of amalgamating multiple bonding technologies, thereby boosting semiconductor packaging performance and flexibility.

Market Scope
Start Year	2023
Forecast Year	2024-2032
Start Value	$530.4 Million
Forecast Value	$1.3 Billion
CAGR	10%

This approach facilitates the integration of diverse materials and processes, catering to the stringent demands of advanced applications. In 2023, the Asia Pacific region commanded a dominant share of over 55%, with expectations to maintain this lead throughout the forecast period. The Asia Pacific's supremacy is largely due to its leadership in semiconductor manufacturing and electronics production. Nations such as China, South Korea, Taiwan, and Japan host prominent semiconductor foundries and electronics powerhouses, driving a robust demand for advanced bonding equipment.Coupled with a strong industrial foundation and a concentration of semiconductor manufacturing facilities, the Asia Pacific's status as a global electronic device production hub cements its pivotal role in the semiconductor bonding equipment market.

Chapter 1 Scope & Methodology

1.1 Market scope & definition
1.2 Base estimates & calculations
1.3 Forecast parameters
1.4 Data sources
- 1.4.1 Primary
- 1.4.2 Secondary
  - 1.4.2.1 Paid sources
  - 1.4.2.2 Public sources

Chapter 2 Executive Summary

2.1 Industry 360° synopsis, 2021 - 2032

Chapter 3 Industry Insights

3.1 Industry ecosystem analysis
3.2 Vendor matrix
3.3 Technology & innovation landscape
3.4 Patent analysis
3.5 Key news and initiatives
3.6 Regulatory landscape
3.7 Impact forces
- 3.7.1 Growth drivers
  - 3.7.1.1 Growth in semiconductor industry
  - 3.7.1.2 Advancements in technology
  - 3.7.1.3 Expansion of 5G networks
  - 3.7.1.4 The growing adoption of electric vehicles (EVs)
  - 3.7.1.5 Increased Investment in R&D
- 3.7.2 Industry pitfalls & challenges
  - 3.7.2.1 High initial costs
  - 3.7.2.2 Supply chain disruptions
3.8 Growth potential analysis
3.9 Porter's analysis
- 3.9.1 Supplier power
- 3.9.2 Buyer power
- 3.9.3 Threat of new entrants
- 3.9.4 Threat of substitutes
- 3.9.5 Industry rivalry
3.10 PESTEL analysis

Chapter 4 Competitive Landscape, 2023

4.1 Company market share analysis
4.2 Competitive positioning matrix
4.3 Strategic outlook matrix

Chapter 5 Market Estimates & Forecast, By Bonding Type, 2021 - 2032 (USD Million)

5.1 Key trends
5.2 Permanent bonding
5.3 Temporary bonding
5.4 Hybrid bonding

Chapter 6 Market Estimates & Forecast, By Equipment Type, 2021 - 2032 (USD Million)

6.1 Key trends
6.2 Wire bonding equipment
6.3 Die bonding equipment
6.4 Flip chip Bonding equipment
6.5 Wafer bonding equipment

Chapter 7 Market Estimates & Forecast, By Application, 2021 - 2032 (USD Million)

7.1 Key trends
7.2 Advanced packaging
7.3 Power IC and power discrete
7.4 Photonic devices
7.5 MEMS Sensors and Actuators
7.6 Engineered substrates
7.7 CMOS image sensors
7.8 RF devices
7.9 Others

Chapter 8 Market Estimates & Forecast, By End Use Industry, 2021 - 2032 (USD Million)

8.1 Key trends
8.2 Consumer electronics
8.3 Automotive
8.4 Telecommunications
8.5 Healthcare
8.6 Aerospace & defense
8.7 Industrial
8.8 Others

Chapter 9 Market Estimates & Forecast, By Region, 2021 - 2032 (USD Million)

9.1 Key trends
9.2 North America
- 9.2.1 U.S.
- 9.2.2 Canada
9.3 Europe
- 9.3.1 UK
- 9.3.2 Germany
- 9.3.3 France
- 9.3.4 Italy
- 9.3.5 Spain
- 9.3.6 Rest of Europe
9.4 Asia Pacific
- 9.4.1 China
- 9.4.2 India
- 9.4.3 Japan
- 9.4.4 South Korea
- 9.4.5 ANZ
- 9.4.6 Rest of Asia Pacific
9.5 Latin America
- 9.5.1 Brazil
- 9.5.2 Mexico
- 9.5.3 Rest of Latin America
9.6 MEA
- 9.6.1 UAE
- 9.6.2 Saudi Arabia
- 9.6.3 South Africa
- 9.6.4 Rest of MEA