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市场调查报告书
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1620559

直接晶片液体冷却市场机会、成长驱动因素、产业趋势分析与预测 2024 - 2032 年

Direct-to-Chip Liquid Cooling Market Opportunity, Growth Drivers, Industry Trend Analysis, and Forecast 2024 - 2032

出版日期: | 出版商: Global Market Insights Inc. | 英文 210 Pages | 商品交期: 2-3个工作天内

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简介目录

全球资料直接液体冷却市场将于 2023 年达到 15 亿美元,预计 2024 年至 2032 年将以 20.3% 的复合年增长率成长。的。该市场根据组件分为 CPU、GPU、ASIC 和记忆体。其中,CPU 冷却领域预计到 2032 年将实现超过 20.6% 的复合年增长率。 CPU 的液体冷却解决方案有单相和两相设计,可在散发运行过程中产生的热量方面提供卓越的性能。

这些解决方案利用液体比传统空气冷却方法更有效吸收和传递热量的能力。在考虑冷却解决方案的类型时,直接晶片液体冷却分为单相和两相繫统。到 2032 年,单相冷却领域预计将达到 41 亿美元,这主要归功于其效率和简单性。这种冷却方法采用闭环设计,使用水或水-乙二醇混合物等液体来吸收关键部件的热量并将其带走。

液体在这些组件中循环,在再循环之前将吸收的热量传递到冷却机构,例如散热器。这种简单可靠的设计使单相冷却成​​为许多寻求有效热管理而又无需过多费用的运营商的经济高效的解决方案。在美国,直接晶片液冷市场在 2023 年占据了资料 % 的主导份额。随着组织专注于优化其IT 基础设施,他们正在采用液体冷却,因为它能够直接在晶片层级管理热量,从而提高性能和可靠性。持续冷却的过渡技术。遵守这些法规以及节省营运成本的潜力,有助于更广泛地转向先进的冷却解决方案。

市场范围
开始年份 2023年
预测年份 2024-2032
起始值 15亿美元
预测值 81 亿美元
复合年增长率 20.3%

目录

第 1 章:方法与范围

第 2 章:执行摘要

第 3 章:产业洞察

  • 产业生态系统分析
    • 影响价值链的因素
    • 利润率分析
    • 干扰
    • 未来展望
    • 製造商
    • 经销商
  • 供应商格局
  • 利润率分析
  • 重要新闻和倡议
  • 监管环境
  • 衝击力
    • 成长动力
      • 注意能源效率
      • 增加资料中心密度
      • 更加重视永续性
      • 高效能运算的需求不断增长
    • 产业陷阱与挑战
      • 初始投资成本高
      • 维护和操作的复杂性
  • 成长潜力分析
  • 波特的分析
  • PESTEL分析

第 4 章:竞争格局

  • 介绍
  • 公司市占率分析
  • 竞争定位矩阵
  • 战略展望矩阵

第 5 章:市场估计与预测:按冷却解决方案类型,2021-2032 年

  • 主要趋势
  • 单相液冷
  • 两相液冷

第 6 章:市场估计与预测:按组件冷却,2021-2032 年

  • 主要趋势
  • CPU散热
  • GPU冷却
  • 专用积体电路冷却
  • 记忆体冷却
  • 其他部件冷却

第 7 章:市场估计与预测:按液体冷却剂类型,2021-2032 年

  • 主要趋势
  • 水性冷却剂
  • 介电液
  • 矿物油
  • 工程流体

第 8 章:市场估计与预测:按应用划分,2021-2032 年

  • 主要趋势
  • 伺服器
  • 工作站
  • 边缘运算设备
  • 超电脑
  • 游戏电脑
  • 其他的

第 9 章:市场估计与预测:依最终用途产业,2021-2032 年

  • 主要趋势
  • 资料中心
  • 高效能运算 (HPC)
  • 人工智慧/机器学习系统
  • 游戏和电子竞技
  • 电信
  • 金融服务
  • 医疗保健和生命科学
  • 石油和天然气
  • 汽车(用于电动车电池)
  • 航太和国防

第 10 章:市场估计与预测:按地区划分,2021-2032 年

  • 主要趋势
  • 北美洲
    • 我们
    • 加拿大
  • 欧洲
    • 英国
    • 德国
    • 法国
    • 义大利
    • 西班牙
    • 俄罗斯
  • 亚太地区
    • 中国
    • 印度
    • 日本
    • 韩国
    • 澳洲
  • 拉丁美洲
    • 巴西
    • 墨西哥
  • MEA
    • 南非
    • 沙乌地阿拉伯
    • 阿联酋

第 11 章:公司简介

  • Asetek
  • Alfa Laval
  • CoolIT Systems
  • Cisco Systems, Inc.
  • Danfoss A/S
  • DCX The Liquid Cooling Company
  • DUG Technology
  • Fujitsu Limited
  • Green Revolution Cooling (GRC)
  • Huawei Technologies Co., Ltd.
  • Iceotope Technologies Ltd.
  • Inspur Systems
  • LiquidCool Solutions
  • LiquidStack
  • Rittal GmbH & Co. KG
  • Schneider Electric
  • STULZ GmbH
  • Super Micro Computer, Inc.
  • Vertiv Group Corp.
简介目录
Product Code: 11960

The Global Direct-To-Chip Liquid Cooling Market reached USD 1.5 billion in 2023 and is projected to grow at a remarkable CAGR of 20.3% from 2024 to 2032. This growth is primarily driven by data center operators' increasing emphasis on reducing energy consumption, leading to a greater adoption of energy-efficient cooling solutions. The market, based on the components, is segmented into CPUs, GPUs, ASICs, and memory. Among these, the CPU cooling segment is expected to achieve an impressive CAGR of over 20.6% through 2032. Given that CPUs play a crucial role in high-performance computing systems, effective thermal management is essential. Liquid cooling solutions for CPUs are available in both single-phase and two-phase designs, offering superior performance in dissipating heat generated during operations.

These solutions leverage the liquid's ability to absorb and transfer heat more efficiently than traditional air cooling methods. When considering the types of cooling solutions, direct-to-chip liquid cooling is categorized into single-phase and two-phase systems. The single-phase cooling segment is projected to reach USD 4.1 billion by 2032, largely due to its efficiency and simplicity. This cooling method utilizes a closed-loop design, employing liquids like water or water-glycol mixtures to absorb and transport heat away from critical components.

The liquid circulates through these components, transferring the absorbed heat to a cooling mechanism, such as a radiator before it recirculates. This straightforward and reliable design makes single-phase cooling a cost-effective solution for many operators seeking effective heat management without excessive expenses. In the United States, the direct-to-chip liquid cooling market held a dominant 77.9% share in 2023. The demand for these liquid cooling solutions is significantly driven by the rapid expansion of cloud services and the increasing presence of data centers. As organizations focus on optimizing their IT infrastructure, they are adopting liquid cooling for its capability to manage heat directly at the chip level, thereby enhancing performance and reliability.Additionally, U.S. regulatory initiatives aimed at promoting energy efficiency are encouraging the transition to these sustainable cooling technologies. Compliance with these regulations, along with the potential for operational cost savings, is contributing to a broader shift toward advanced cooling solutions.

Market Scope
Start Year2023
Forecast Year2024-2032
Start Value$1.5 Billion
Forecast Value$8.1 Billion
CAGR20.3%

Table of Contents

Chapter 1 Methodology & Scope

  • 1.1 Market scope & definitions
  • 1.2 Base estimates & calculations
  • 1.3 Forecast calculations
  • 1.4 Data sources
    • 1.4.1 Primary
    • 1.4.2 Secondary
      • 1.4.2.1 Paid sources
      • 1.4.2.2 Public sources

Chapter 2 Executive Summary

  • 2.1 Industry synopsis, 2021-2032

Chapter 3 Industry Insights

  • 3.1 Industry ecosystem analysis
    • 3.1.1 Factor affecting the value chain
    • 3.1.2 Profit margin analysis
    • 3.1.3 Disruptions
    • 3.1.4 Future outlook
    • 3.1.5 Manufacturers
    • 3.1.6 Distributors
  • 3.2 Supplier landscape
  • 3.3 Profit margin analysis
  • 3.4 Key news & initiatives
  • 3.5 Regulatory landscape
  • 3.6 Impact forces
    • 3.6.1 Growth drivers
      • 3.6.1.1 Focus on energy efficiency
      • 3.6.1.2 Increasing data center density
      • 3.6.1.3 Increased focus on sustainability
      • 3.6.1.4 Rising demand for high-performance computing
    • 3.6.2 Industry pitfalls & challenges
      • 3.6.2.1 High initial investment costs
      • 3.6.2.2 Complexity of maintenance and operations
  • 3.7 Growth potential analysis
  • 3.8 Porter's analysis
  • 3.9 PESTEL analysis

Chapter 4 Competitive Landscape, 2023

  • 4.1 Introduction
  • 4.2 Company market share analysis
  • 4.3 Competitive positioning matrix
  • 4.4 Strategic outlook matrix

Chapter 5 Market Estimates & Forecast, By Cooling Solution Type, 2021-2032 (USD Million)

  • 5.1 Key trends
  • 5.2 Single-phase liquid cooling
  • 5.3 Two-phase liquid cooling

Chapter 6 Market Estimates & Forecast, By Component Cooled, 2021-2032 (USD Million)

  • 6.1 Key trends
  • 6.2 CPU cooling
  • 6.3 GPU cooling
  • 6.4 ASIC cooling
  • 6.5 Memory cooling
  • 6.6 Other component cooling

Chapter 7 Market Estimates & Forecast, By Liquid Coolant Type, 2021-2032 (USD Million)

  • 7.1 Key trends
  • 7.2 Water-based coolants
  • 7.3 Dielectric fluids
  • 7.4 Mineral oils
  • 7.5 Engineered fluids

Chapter 8 Market Estimates & Forecast, By Application, 2021-2032 (USD Million)

  • 8.1 Key trends
  • 8.2 Servers
  • 8.3 Workstations
  • 8.4 Edge computing devices
  • 8.5 Supercomputers
  • 8.6 Gaming PCs
  • 8.7 Others

Chapter 9 Market Estimates & Forecast, By End Use Industry, 2021-2032 (USD Million)

  • 9.1 Key trends
  • 9.2 Data centers
  • 9.3 High-performance computing (HPC)
  • 9.4 Artificial intelligence/machine learning systems
  • 9.5 Gaming and eSports
  • 9.6 Telecommunications
  • 9.7 Financial services
  • 9.8 Healthcare and life sciences
  • 9.9 Oil and gas
  • 9.10 Automotive (for electric vehicle batteries)
  • 9.11 Aerospace and defense

Chapter 10 Market Estimates & Forecast, By Region, 2021-2032 (USD Million)

  • 10.1 Key trends
  • 10.2 North America
    • 10.2.1 U.S.
    • 10.2.2 Canada
  • 10.3 Europe
    • 10.3.1 UK
    • 10.3.2 Germany
    • 10.3.3 France
    • 10.3.4 Italy
    • 10.3.5 Spain
    • 10.3.6 Russia
  • 10.4 Asia Pacific
    • 10.4.1 China
    • 10.4.2 India
    • 10.4.3 Japan
    • 10.4.4 South Korea
    • 10.4.5 Australia
  • 10.5 Latin America
    • 10.5.1 Brazil
    • 10.5.2 Mexico
  • 10.6 MEA
    • 10.6.1 South Africa
    • 10.6.2 Saudi Arabia
    • 10.6.3 UAE

Chapter 11 Company Profiles

  • 11.1 Asetek
  • 11.2 Alfa Laval
  • 11.3 CoolIT Systems
  • 11.4 Cisco Systems, Inc.
  • 11.5 Danfoss A/S
  • 11.6 DCX The Liquid Cooling Company
  • 11.7 DUG Technology
  • 11.8 Fujitsu Limited
  • 11.9 Green Revolution Cooling (GRC)
  • 11.10 Huawei Technologies Co., Ltd.
  • 11.11 Iceotope Technologies Ltd.
  • 11.12 Inspur Systems
  • 11.13 LiquidCool Solutions
  • 11.14 LiquidStack
  • 11.15 Rittal GmbH & Co. KG
  • 11.16 Schneider Electric
  • 11.17 STULZ GmbH
  • 11.18 Super Micro Computer, Inc.
  • 11.19 Vertiv Group Corp.