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市场调查报告书
商品编码
1621886

射频连接器市场机会、成长驱动因素、产业趋势分析与 2024 - 2032 年预测

RF Connectors Market Opportunity, Growth Drivers, Industry Trend Analysis, and Forecast 2024 - 2032
出版日期: | 出版商: Global Market Insights Inc. | 英文 200 Pages | 商品交期: 2-3个工作天内

价格
简介目录

2023 年全球射频连接器市场价值为 320 亿美元，预计 2024 年至 2032 年复合年增长率为 7.7%。射频连接器可实现更快的资料传输并提高效率。随着资料速率的提高，对可靠射频连接器的需求变得至关重要，尤其是在企业网路中，管理大量资料需要强大且无缝的连接。这些连接器对于整合交换器、路由器和安全设备等网路设备至关重要，从而实现各种系统之间的顺畅通讯。即使在充满挑战的环境中，卓越的强度和灵活性也能确保可靠、一致的连结。

此外，其在高频下表现良好的能力使其成为 5G 等先进通讯技术的首选。随着各行业越来越多地寻求兼具耐用性和高性能的连接器，射频元件中对铍铜的需求正在稳步增长，从而推动了其市场的快速扩张。市场依安装类型分为边缘安装、通孔安装、面板安装、PCB安装等。 PCB 安装细分市场预计到 2032 年将达到 229 亿美元，成为成长最快的细分市场。

PCB 安装连接器广泛应用于电信、汽车、消费性电子和航太等产业。这些连接器能够将射频连接器直接有效地整合到印刷电路板上，使其成为当今紧凑型高性能电子设备中不可或缺的一部分。就材料而言，铍铜是成长最快的细分市场，预计2024 年至2032 年复合年增长率为9.2%。 ，使其成为高需求应用的理想选择在电信、航太和军事领域的应用。铍铜的强度和灵活性确保即使在恶劣的环境下也能实现一致、可靠的连接。

市场范围
开始年份 2023年
预测年份 2024-2032
起始值 320 亿美元
预测值 618 亿美元
复合年增长率 7.7%

由于航太、电信业和汽车的强劲需求，2023 年美国将占据北美射频连接器市场 77.9% 的份额。 5G 网路部署的推动以及军事和国防通讯系统的进步，极大增加了对高效能射频连接器的需求。此外，主要製造商的存在和无线通讯技术的持续创新正在推动市场成长。然而，来自替代无线连接解决方案的竞争日益激烈，对传统射频连接器製造商保持市场份额构成了挑战。

目录

第 1 章：方法与范围

第 2 章：执行摘要

第 3 章：产业洞察

  • 产业生态系统分析
    • 影响价值链的因素
    • 利润率分析
    • 干扰
    • 未来展望
    • 製造商
    • 经销商
  • 供应商格局
  • 利润率分析
  • 重要新闻和倡议
  • 监管环境
  • 衝击力
    • 成长动力
      • 将 112 G PAM4 连接扩展到企业网络
      • 增加对现代通讯网路的投资
      • 对可靠连接解决方案的需求不断增加。
      • V2X 和 ADAS 技术的采用。
      • 需要高性能、坚固的连接器
    • 产业陷阱与挑战
      • 先进的设计需要专门的专业知识和资源。
      • 激烈的竞争导致定价压力。
  • 成长潜力分析
  • 波特的分析
  • PESTEL分析

第 4 章：竞争格局

  • 介绍
  • 公司市占率分析
  • 竞争定位矩阵
  • 战略展望矩阵

第 5 章：市场估计与预测：依产品类型，2021-2032

  • 主要趋势
  • BNC 连接器
  • SMA连接器
  • MCX/MMCX 连接器
  • N 型连接器
  • TNC连接器
  • F 型连接器
  • 超高频连接器
  • QMA连接器
  • 其他（例如 SMB、SMC、SMP）

第 6 章：市场估计与预测：依频率范围，2021-2032 年

  • 主要趋势
  • 低频（< 1 GHz）
  • 中频（1-6 GHz）
  • 高频（> 6 GHz）

第 7 章：市场估计与预测：按安装类型，2021-2032 年

  • 主要趋势
  • 边缘安装
  • 通孔
  • 面板安装
  • PCB安装
  • 其他的

第 8 章：市场估计与预测：按材料划分，2021-2032 年

  • 主要趋势
  • 黄铜
  • 铍铜
  • 不銹钢
  • 铝
  • 其他的

第 9 章：市场估计与预测：依电镀分类，2021-2032 年

  • 主要趋势
  • 金子
  • 银
  • 镍
  • 其他的

第 10 章：市场估计与预测：依应用分类，2021-2032

  • 主要趋势
  • 无线基础设施
  • 测试和测量设备
  • 卫星通讯
  • 广播设备
  • 天线系统
  • 物联网设备
  • 医疗器材
  • 其他的

第 11 章：市场估计与预测：依最终用途产业，2021-2032 年

  • 主要趋势
  • 电信
  • 航太与国防
  • 消费性电子产品
  • 汽车
  • 工业的
  • 资讯科技与网路
  • 卫生保健
  • 其他的

第 12 章：市场估计与预测：按地区划分，2021-2032 年

  • 主要趋势
  • 北美洲
    • 我们
    • 加拿大
  • 欧洲
    • 英国
    • 德国
    • 法国
    • 义大利
    • 西班牙
    • 俄罗斯
  • 亚太地区
    • 中国
    • 印度
    • 日本
    • 韩国
    • 澳洲
  • 拉丁美洲
    • 巴西
    • 墨西哥
  • MEA
    • 南非
    • 沙乌地阿拉伯
    • 阿联酋

第 13 章：公司简介

  • Amphenol Corporation
  • Anritsu Corporation
  • AVX Corporation
  • Belden Inc.
  • Bomar Interconnect Products, Inc.
  • Carlisle Interconnect Technologies
  • Corning Optical Communications
  • Delta Electronics, Inc.
  • Digi-Key Electronics
  • Hirose Electric Co., Ltd.
  • HUBER+SUHNER
  • JAE (Japan Aviation Electronics Industry, Ltd.)
  • Johanson Technology, Inc.
  • L-com Global Connectivity
  • Molex, LLC
  • Pasternack Enterprises Inc.
  • Radiall SA
  • RF Industries, Ltd.
  • Rosenberger Hochfrequenztechnik GmbH & Co. KG
  • Samtec Inc.
  • Smiths Interconnect
  • TE Connectivity Ltd.
  • WL Gore & Associates, Inc.
简介目录
Product Code: 11948

The Global RF Connectors Market was valued at USD 32 billion in 2023 and is projected to grow at a CAGR of 7.7% from 2024 to 2032. A major factor driving this growth is the extension of 112G PAM4 connection in enterprise networks, which demands high-performance RF connectors for faster data transmission and improved efficiency. As data rates increase, the need for reliable RF connectors becomes essential, especially in enterprise networking, where managing large data volumes requires robust and seamless connectivity. These connectors are vital for integrating networking devices such as switches, routers, and security appliances, enabling smooth communication across various systems. The exceptional strength and flexibility ensure reliable, consistent connections, even in challenging environments.

Furthermore, its capacity to perform well at high frequencies makes it a preferred choice in advanced communication technologies such as 5G. As industries increasingly seek connectors that combine durability with high performance, the necessity for beryllium copper in RF components is steadily growing, fueling its rapid market expansion. The market is categorized by mounting type into edge mount, through-hole, panel mount, PCB mount, and others. The PCB mount segment is expected to reach USD 22.9 billion by 2032, making it the fastest-growing segment.

PCB mount connectors are extensively used across industries such as telecommunications, automotive, consumer electronics, and aerospace. These connectors enable efficient integration of RF connectors straight onto printed circuit boards, making them indispensable in today's compact and high-performance electronic devices. In terms of material, beryllium copper is the fastest-growing segment, with an expected CAGR of 9.2% between 2024 and 2032. Its superior mechanical and electrical properties, including excellent conductivity, durability, and corrosion resistance, make it ideal for high-demand applications in telecommunications, aerospace, and military sectors. Beryllium copper's strength and flexibility ensure consistent and reliable connections, even in harsh environments.

Market Scope
Start Year2023
Forecast Year2024-2032
Start Value$32 Billion
Forecast Value$61.8 Billion
CAGR7.7%

The U.S. held a 77.9% share of the North America RF connectors market in 2023, backed by strong needs across the aerospace, telecommunications industries, and automotive. The push towards 5G network deployment, alongside advancements in military and defense communication systems, has sharply increased the demand for high-performance RF connectors. Furthermore, the presence of key manufacturers and ongoing innovations in wireless communication technology are fueling market growth. However, growing competition from alternative wireless connectivity solutions poses a challenge for traditional RF connector manufacturers to retain their market share.

Table of Contents

Chapter 1 Methodology & Scope

  • 1.1 Market scope & definitions
  • 1.2 Base estimates & calculations
  • 1.3 Forecast calculations
  • 1.4 Data sources
    • 1.4.1 Primary
    • 1.4.2 Secondary
      • 1.4.2.1 Paid sources
      • 1.4.2.2 Public sources

Chapter 2 Executive Summary

  • 2.1 Industry synopsis, 2021-2032

Chapter 3 Industry Insights

  • 3.1 Industry ecosystem analysis
    • 3.1.1 Factor affecting the value chain
    • 3.1.2 Profit margin analysis
    • 3.1.3 Disruptions
    • 3.1.4 Future outlook
    • 3.1.5 Manufacturers
    • 3.1.6 Distributors
  • 3.2 Supplier landscape
  • 3.3 Profit margin analysis
  • 3.4 Key news & initiatives
  • 3.5 Regulatory landscape
  • 3.6 Impact forces
    • 3.6.1 Growth drivers
      • 3.6.1.1. Expansion of 112 G PAM4 connectivity into enterprise networks
      • 3.6.1.2 Increased investment in modern communication networks
      • 3.6.1.3 Increased demand for reliable connectivity solutions.
      • 3.6.1.4. Adoption in V2 X and ADAS technologies.
      • 3.6.1.5 Need for high-performance, rugged connectors
    • 3.6.2 Industry pitfalls & challenges
      • 3.6.2.1 Advanced designs require specialized expertise and resources.
      • 3.6.2.2 Intense competition leads to pricing pressures.
  • 3.7 Growth potential analysis
  • 3.8 Porter's analysis
  • 3.9 PESTEL analysis

Chapter 4 Competitive Landscape, 2023

  • 4.1 Introduction
  • 4.2 Company market share analysis
  • 4.3 Competitive positioning matrix
  • 4.4 Strategic outlook matrix

Chapter 5 Market Estimates & Forecast, By Product Type, 2021-2032 (USD Billion)

  • 5.1 Key trends
  • 5.2 BNC connectors
  • 5.3 SMA connectors
  • 5.4 MCX/MMCX connectors
  • 5.5 N-Type connectors
  • 5.6 TNC connectors
  • 5.7 F-Type connectors
  • 5.8 UHF connectors
  • 5.9 QMA connectors
  • 5.10 Others (e.g., SMB, SMC, SMP)

Chapter 6 Market Estimates & Forecast, By Frequency Range, 2021-2032 (USD Billion)

  • 6.1 Key trends
  • 6.2 Low frequency (< 1 GHz)
  • 6.3 Medium frequency (1-6 GHz)
  • 6.4 High frequency (> 6 GHz)

Chapter 7 Market Estimates & Forecast, By Mounting Type, 2021-2032 (USD Billion)

  • 7.1 Key trends
  • 7.2 Edge mount
  • 7.3 Through hole
  • 7.4 Panel mount
  • 7.5 PCB mount
  • 7.6 Others

Chapter 8 Market Estimates & Forecast, By Material, 2021-2032 (USD Billion)

  • 8.1 Key trends
  • 8.2 Brass
  • 8.3 Beryllium copper
  • 8.4 Stainless steel
  • 8.5 Aluminum
  • 8.6 Others

Chapter 9 Market Estimates & Forecast, By Plating, 2021-2032 (USD Billion)

  • 9.1 Key trends
  • 9.2 Gold
  • 9.3 Silver
  • 9.4 Nickel
  • 9.5 Others

Chapter 10 Market Estimates & Forecast, By Application, 2021-2032 (USD Billion)

  • 10.1 Key trends
  • 10.2 Wireless infrastructure
  • 10.3 Test & measurement equipment
  • 10.4 Satellite communication
  • 10.5 Broadcast equipment
  • 10.6 Antenna systems
  • 10.7 IoT devices
  • 10.8 Medical devices
  • 10.9 Others

Chapter 11 Market Estimates & Forecast, By End Use Industry, 2021-2032 (USD Billion)

  • 11.1 Key trends
  • 11.2 Telecommunications
  • 11.3 Aerospace & defense
  • 11.4 Consumer electronics
  • 11.5 Automotive
  • 11.6 Industrial
  • 11.7 IT & networking
  • 11.8 Healthcare
  • 11.9 Others

Chapter 12 Market Estimates & Forecast, By Region, 2021-2032 (USD Billion)

  • 12.1 Key trends
  • 12.2 North America
    • 12.2.1 U.S.
    • 12.2.2 Canada
  • 12.3 Europe
    • 12.3.1 UK
    • 12.3.2 Germany
    • 12.3.3 France
    • 12.3.4 Italy
    • 12.3.5 Spain
    • 12.3.6 Russia
  • 12.4 Asia Pacific
    • 12.4.1 China
    • 12.4.2 India
    • 12.4.3 Japan
    • 12.4.4 South Korea
    • 12.4.5 Australia
  • 12.5 Latin America
    • 12.5.1 Brazil
    • 12.5.2 Mexico
  • 12.6 MEA
    • 12.6.1 South Africa
    • 12.6.2 Saudi Arabia
    • 12.6.3 UAE

Chapter 13 Company Profiles

  • 13.1 Amphenol Corporation
  • 13.2 Anritsu Corporation
  • 13.3 AVX Corporation
  • 13.4 Belden Inc.
  • 13.5 Bomar Interconnect Products, Inc.
  • 13.6 Carlisle Interconnect Technologies
  • 13.7 Corning Optical Communications
  • 13.8 Delta Electronics, Inc.
  • 13.9 Digi-Key Electronics
  • 13.10 Hirose Electric Co., Ltd.
  • 13.11 HUBER+SUHNER
  • 13.12 JAE (Japan Aviation Electronics Industry, Ltd.)
  • 13.13 Johanson Technology, Inc.
  • 13.14 L-com Global Connectivity
  • 13.15 Molex, LLC
  • 13.16 Pasternack Enterprises Inc.
  • 13.17 Radiall SA
  • 13.18 RF Industries, Ltd.
  • 13.19 Rosenberger Hochfrequenztechnik GmbH & Co. KG
  • 13.20 Samtec Inc.
  • 13.21 Smiths Interconnect
  • 13.22 TE Connectivity Ltd.
  • 13.23 W.L. Gore & Associates, Inc.