查看购物车
  • Traditional Chinese
  • English
  • Japanese
封面
市场调查报告书
商品编码
1639241

刚性-柔性 PCB 市场机会、成长动力、产业趋势分析与 2024 - 2032 年预测

Rigid-Flex PCB Market Opportunity, Growth Drivers, Industry Trend Analysis, and Forecast 2024 - 2032
出版日期: | 出版商: Global Market Insights Inc. | 英文 210 Pages | 商品交期: 2-3个工作天内

价格
简介目录

全球刚性-柔性PCB 市场将于2023 年达到221 亿美元，预计2024 年至2032 年复合年增长率为10.9%。 这种增长是由高密度电路解决方案的日益采用所推动的，特别是在物网路、穿戴式装置、以及医疗科技不断进步。随着工业电子产品的扩展，对刚柔结合 PCB 的需求不断增长，特别是在工厂和楼宇自动化等领域，这些 PCB 在提高系统性能和减少空间需求方面发挥着至关重要的作用。

刚挠结合板是工业自动化系统不可或缺的一部分，用于机器人、控制单元和人机介面 (HMI) 等应用。它们的灵活性、紧凑设计和耐用性使它们成为这些复杂系统的理想选择，可以在狭小空间内进行高效布线，同时确保连续使用下的可靠运作。同样，在管理照明、HVAC 和安全的楼宇自动化系统中，刚柔结合 PCB 允许高密度元件安装，从而促进更智慧、更有效率的系统的开发。

然而，市场面临挑战，包括与刚柔结合 PCB 相关的高製造复杂性和成本。生产过程涉及几个复杂的步骤，包括黏合柔性层和刚性层、创建多层结构以及确保精确对齐以避免缺陷。这些增加的复杂性导致更高的生产成本，因为製造商需要使用专门的材料、先进的设备和更长的加工时间来确保电路板符合所需的性能标准。

市场范围
开始年份 2023年
预测年份 2024-2032
起始值 221亿美元
预测值 556 亿美元
复合年增长率 10.9%

市场按产品类型细分，多层柔性 PCB 占据最大份额。由于汽车、航太和消费电子等产业对紧凑、高密度解决方案的需求不断增长，预计到 2023 年，该细分市场将达到 74 亿美元。多层柔性 PCB 因其增强的灵活性和耐用性而受到特别重视，使其成为需要小型化和复杂电路设计的应用的理想选择。

刚挠结合板市场也按最终用途产业进行细分，包括航太和国防、汽车、消费性电子、工业、IT 和电信、医疗保健等。其中，受智慧型手机、穿戴式装置和智慧家居产品等设备小型化和先进技术需求不断增长的推动，消费性电子产业占据最大的市场份额。由于需要能够支援高性能、空间受限的设计的紧凑、可靠且耐用的组件，推动了消费性电子产品中刚柔结合 PCB 的采用。

2023年美国刚挠性PCB航太为77.86%。物联网的扩展以及对更小、更有效率设备的需求不断增加，显着增加了对高效能、紧凑型刚挠结合板的需求。特别是，汽车行业，包括电动车 (EV) 领域，由于其耐用性和节省空间的优势，越来越多地采用刚柔结合 PCB。

目录

第 1 章：方法与范围

第 2 章：执行摘要

第 3 章：产业洞察

  • 产业生态系统分析
    • 影响价值链的因素
    • 利润率分析
    • 干扰
    • 未来展望
    • 製造商
    • 经销商
  • 供应商格局
  • 利润率分析
  • 重要新闻和倡议
  • 监管环境
  • 衝击力
  • 成长动力
      • 车辆中电子系统的整合度不断提高
      • 5G网路和物联网设备快速扩展
      • 工业自动化需求激增
      • 电子产品小型化趋势日益明显
      • 在资料中心和高效能运算中的使用不断增长
  • 产业陷阱与挑战
      • 製造复杂度高、成本高
      • 与设计和可靠性相关的挑战
  • 成长潜力分析
  • 波特的分析
  • PESTEL分析

第 4 章：竞争格局

  • 介绍
  • 公司市占率分析
  • 竞争定位矩阵
  • 战略展望矩阵

第 5 章：市场估计与预测：依产品类型，2021-2032

  • 主要趋势
  • 单面柔性
  • 双面柔性
  • 多层柔性
  • 多层线路板
  • 快点刚挠结合板

第 6 章：市场估计与预测：依层数，2021-2032

  • 主要趋势
  • 单层
  • 双层
  • 多层

第 7 章：市场估计与预测：依弹性类型，2021-2032 年

  • 主要趋势
  • 静态弯曲
  • 动态弯曲

第 8 章：市场估计与预测：按材料划分，2021-2032 年

  • 主要趋势
  • FR4
  • 聚酰亚胺
  • 罗杰斯
  • 其他的

第 9 章：市场估计与预测：依最终用途产业 2021-2032 年

  • 主要趋势
  • 航太和国防
  • 汽车
  • 消费性电子产品
  • 工业的
  • 资讯科技和电信
  • 卫生保健
  • 其他（例如能源、交通）

第 10 章：市场估计与预测：按地区划分，2021-2032 年

  • 主要趋势
  • 北美洲
    • 我们
    • 加拿大
  • 欧洲
    • 英国
    • 德国
    • 法国
    • 义大利
    • 西班牙
    • 俄罗斯
  • 亚太地区
    • 中国
    • 印度
    • 日本
    • 韩国
    • 澳洲
  • 拉丁美洲
    • 巴西
    • 墨西哥
  • MEA
    • 南非
    • 沙乌地阿拉伯
    • 阿联酋

第 11 章：公司简介

  • Zhen Ding Technology Holding Limited
  • Nippon Mektron, Ltd.
  • Sumitomo Electric Industries, Ltd.
  • Unimicron Technology Corporation
  • Interflex Co., Ltd.
  • Young Poong Electronics Co., Ltd.
  • TTM Technologies, Inc.
  • Multek (a Flex Company)
  • Shengyi Technology Co., Ltd.
  • AT&S Austria Technologie & Systemtechnik AG
  • Meiko Electronics Co., Ltd.
  • Kinwong Electronic Co., Ltd.
  • Sierra Circuits, Inc.
  • Eltek Ltd.
  • Jabil Circuit, Inc.
  • Samsung Electro-Mechanics
  • Wurth Elektronik GmbH & Co. KG
  • Shenzhen Kinwong Electronic Co., Ltd.
  • Flex PCB (Printed Circuits LLC)
简介目录
Product Code: 12297

The Global Rigid-Flex PCB Market reached USD 22.1 billion in 2023 and is projected to grow at 10.9% CAGR from 2024 to 2032. This growth is driven by the increasing adoption of high-density circuit solutions, particularly as industries like IoT, wearables, and medical technology continue to advance. The demand for rigid-flex PCBs is rising as industrial electronics expand, especially in sectors like factory and building automation, where these PCBs play a crucial role in improving system performance and reducing space requirements.

Rigid-flex PCBs are integral to industrial automation systems, where they are used in applications such as robotics, control units, and human-machine interfaces (HMIs). Their flexibility, compact design, and durability make them ideal for these complex systems, allowing for efficient wiring in tight spaces while ensuring reliable operation under continuous use. Similarly, in building automation systems that manage lighting, HVAC, and security, rigid-flex PCBs allow high-density component mounting, facilitating the development of smarter, more efficient systems.

However, the market faces challenges, including the high manufacturing complexity and cost associated with rigid-flex PCBs. The production process involves several intricate steps, including bonding flexible and rigid layers, creating multi-layered structures, and ensuring precise alignment to avoid defects. These added complexities result in higher production costs, as manufacturers need to use specialized materials, advanced equipment, and longer processing times to ensure the boards meet the required performance standards.

Market Scope
Start Year2023
Forecast Year2024-2032
Start Value$22.1 Billion
Forecast Value$55.6 Billion
CAGR10.9%

The market is segmented by product type, with multi-layer flex PCBs holding the largest share. This segment is expected to reach USD 7.4 billion by 2023, driven by the growing need for compact, high-density solutions across industries such as automotive, aerospace, and consumer electronics. Multi-layer flex PCBs are particularly valued for their enhanced flexibility and durability, making them ideal for applications that require miniaturization and complex circuit designs.

The rigid-flex PCB market is also segmented by end-use industries, including aerospace and defense, automotive, consumer electronics, industrial, IT and telecommunications, healthcare, and others. Among these, the consumer electronics sector holds the largest market share, driven by increasing demand for miniaturization and advanced technology in devices like smartphones, wearables, and smart home products. The adoption of rigid-flex PCBs in consumer electronics is fueled by the need for compact, reliable, and durable components capable of supporting high-performance, space-constrained designs.

U.S. rigid-flex PCB market generated 77.86% share in 2023. The growth of the U.S. rigid-flex PCB industry is fueled by the rising demand in sectors such as advanced consumer electronics, automotive electronics, and aerospace. The expansion of the IoT and the increasing need for smaller, more efficient devices have significantly boosted the demand for high-performance, compact rigid-flex PCBs. In particular, the automotive industry, including the electric vehicle (EV) segment, is increasingly adopting rigid-flex PCBs due to their durability and space-saving advantages.

Table of Contents

Chapter 1 Methodology & Scope

  • 1.1 Market scope & definitions
  • 1.2 Base estimates & calculations
  • 1.3 Forecast calculations
  • 1.4 Data sources
    • 1.4.1 Primary
    • 1.4.2 Secondary
      • 1.4.2.1 Paid sources
      • 1.4.2.2 Public sources

Chapter 2 Executive Summary

  • 2.1 Industry synopsis, 2021-2032

Chapter 3 Industry Insights

  • 3.1 Industry ecosystem analysis
    • 3.1.1 Factor affecting the value chain
    • 3.1.2 Profit margin analysis
    • 3.1.3 Disruptions
    • 3.1.4 Future outlook
    • 3.1.5 Manufacturers
    • 3.1.6 Distributors
  • 3.2 Supplier landscape
  • 3.3 Profit margin analysis
  • 3.4 Key news & initiatives
  • 3.5 Regulatory landscape
  • 3.6 Impact forces
  • 3.7 Growth drivers
      • 3.7.1.1 Rising integration of electronic systems in vehicles
      • 3.7.1.2 Rapid expansion of 5G networks and IoT devices
      • 3.7.1.3 Surging demand in industrial automation
      • 3.7.1.4 Increasing trend of miniaturization in electronics
      • 3.7.1.5 Growing use in data centers and high-performance computing
  • 3.8 Industry pitfalls & challenges
      • 3.8.1.1 High manufacturing complexity and cost
      • 3.8.1.2 Challenges associated with design and reliability
  • 3.9 Growth potential analysis
  • 3.10 Porter's analysis
  • 3.11 PESTEL analysis

Chapter 4 Competitive Landscape, 2023

  • 4.1 Introduction
  • 4.2 Company market share analysis
  • 4.3 Competitive positioning matrix
  • 4.4 Strategic outlook matrix

Chapter 5 Market Estimates & Forecast, By Product Type, 2021-2032 (USD Billion & Units)

  • 5.1 Key trends
  • 5.2 Single-sided flex
  • 5.3 Double-sided flex
  • 5.4 Multi-layer flex
  • 5.5 Multilayer PCB
  • 5.6 Quick turn rigid flex PCB

Chapter 6 Market Estimates & Forecast, By Layer Count, 2021-2032 (USD Billion & Units)

  • 6.1 Key trends
  • 6.2 Single layer
  • 6.3 Double layer
  • 6.4 Multi-Layer

Chapter 7 Market Estimates & Forecast, By Flexibility Type, 2021-2032 (USD Billion & Units)

  • 7.1 Key trends
  • 7.2 Static flex
  • 7.3 Dynamic flex

Chapter 8 Market Estimates & Forecast, By Materials, 2021-2032 (USD Billion & Units)

  • 8.1 Key trends
  • 8.2 FR4
  • 8.3 Kapton
  • 8.4 Rogers
  • 8.5 Others

Chapter 9 Market Estimates & Forecast, By End Use Industry 2021-2032 (USD Billion & Units)

  • 9.1 Key trends
  • 9.2 Aerospace and defense
  • 9.3 Automotive
  • 9.4 Consumer electronics
  • 9.5 Industrial
  • 9.6 IT and telecommunications
  • 9.7 Healthcare
  • 9.8 Others (e.g., Energy, Transportation)

Chapter 10 Market Estimates & Forecast, By Region, 2021-2032 (USD Billion & Units)

  • 10.1 Key trends
  • 10.2 North America
    • 10.2.1 U.S.
    • 10.2.2 Canada
  • 10.3 Europe
    • 10.3.1 UK
    • 10.3.2 Germany
    • 10.3.3 France
    • 10.3.4 Italy
    • 10.3.5 Spain
    • 10.3.6 Russia
  • 10.4 Asia Pacific
    • 10.4.1 China
    • 10.4.2 India
    • 10.4.3 Japan
    • 10.4.4 South Korea
    • 10.4.5 Australia
  • 10.5 Latin America
    • 10.5.1 Brazil
    • 10.5.2 Mexico
  • 10.6 MEA
    • 10.6.1 South Africa
    • 10.6.2 Saudi Arabia
    • 10.6.3 UAE

Chapter 11 Company Profiles

  • 11.1 Zhen Ding Technology Holding Limited
  • 11.2 Nippon Mektron, Ltd.
  • 11.3 Sumitomo Electric Industries, Ltd.
  • 11.4 Unimicron Technology Corporation
  • 11.5 Interflex Co., Ltd.
  • 11.6 Young Poong Electronics Co., Ltd.
  • 11.7 TTM Technologies, Inc.
  • 11.8 Multek (a Flex Company)
  • 11.9 Shengyi Technology Co., Ltd.
  • 11.10 AT&S Austria Technologie & Systemtechnik AG
  • 11.11 Meiko Electronics Co., Ltd.
  • 11.12 Kinwong Electronic Co., Ltd.
  • 11.13 Sierra Circuits, Inc.
  • 11.14 Eltek Ltd.
  • 11.15 Jabil Circuit, Inc.
  • 11.16 Samsung Electro-Mechanics
  • 11.17 Wurth Elektronik GmbH & Co. KG
  • 11.18 Shenzhen Kinwong Electronic Co., Ltd.
  • 11.19 Flex PCB (Printed Circuits LLC)