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市场调查报告书
商品编码
1721628

下一代非挥发性记忆体市场机会、成长动力、产业趋势分析及 2025 - 2034 年预测

Next Generation Non Volatile Memory Market Opportunity, Growth Drivers, Industry Trend Analysis, and Forecast 2025 - 2034
出版日期: | 出版商: Global Market Insights Inc. | 英文 190 Pages | 商品交期: 2-3个工作天内

价格
简介目录

2024 年全球新一代非挥发性记忆体市场价值为 82 亿美元，预计到 2034 年将以 14.4% 的复合年增长率成长，达到 311 亿美元。这一成长主要得益于对高效能、低功耗记忆体技术日益增长的需求，这些技术可以支援人工智慧和机器学习中的新兴应用。随着人工智慧工作负载变得越来越复杂，传统的记忆体架构无法满足延迟和功率效率要求。相比之下，MRAM 和 ReRAM 等先进的记忆体解决方案可提供更快的资料存取速度并降低能耗，满足现代运算需求。各行各业都在加速采用这些技术，寻求在资料密集型环境中实现最佳化的效能和低功耗功能。

下一代非挥发性记忆体市场 - IMG1

随着边缘运算和物联网 (IoT) 的广泛应用，对嵌入式 NVM 的需求正在呈现显着成长动能。这些记忆体解决方案提供低延迟和能源效率，这在远端、电力受限的环境中至关重要。从智慧型穿戴装置到工业物联网应用，对即时、本地化资料处理的追求正在提高对能够在各种用例中可靠运行的嵌入式记忆体的需求。不断发展的 5G 基础设施和 AI 与互联生态系统的整合进一步推动了对能够在不同工作负载下持续运行的记忆体解决方案的需求。随着智慧家庭、自动化系统和医疗保健监控工具的发展，它们越来越依赖支援长运行生命週期的安全、高耐用性的记忆体技术。

市场范围
起始年份 2024
预测年份 2025-2034
起始值 82亿美元
预测值 311亿美元
复合年增长率 14.4%

根据产品类型，市场分为 MRAM、ReRAM、PCM、FeRAM/F-RAM 等。其中，MRAM在2024年的估值为38亿美元，其提供接近DRAM的速度和高耐用性，非常适合频繁读写的功能，尤其是在高效能运算应用中。同时，ReRAM 和 FeRAM 也因其可扩展性和快速切换能力而受到青睐，满足了消费和工业应用的需求。

根据晶圆尺寸，市场包括 200 毫米和 300 毫米类别。光是 200 毫米晶圆市场在 2024 年的价值就达到 35 亿美元。这些晶圆对于在成本效率是首要考虑因素的应用中製造嵌入式 NVM 仍然非常重要，尤其是在汽车和工业领域。儘管晶圆技术不断进步，200 毫米晶圆厂仍能提供性能和价格之间的平衡组合。

按产业垂直分析，下一代 NVM 市场分为 BFSI、IT 和云端运算、汽车、航太和国防、医疗保健和医疗设备、消费品等。光是 IT 和云端运算领域在 2024 年就达到了 30 亿美元。基于 MRAM 和 ReRAM 的持久记忆体解决方案的部署日益增多，以提高伺服器速度并减少资料密集型工作负载的处理延迟。

从地区来看，美国将占据全球主导地位，预计到 2034 年其市场规模将达到 80 亿美元。

非挥发性记忆体（NVM）市场竞争激烈，三星、美光、英特尔、GlobalFoundries 和 SK HYNIX 等顶级公司占据了 62.3% 的份额。这些领导者正在加大 MRAM、ReRAM 和 FeRAM 技术的研发力度，为人工智慧、汽车和资料中心应用提供高速、低功耗的解决方案。三星与汽车製造商的合作等策略合作伙伴关係正在加强市场地位。永续性也是一个主要关注点，该公司正在开发超低功耗 NVM 以符合全球碳目标。製造商正在为物联网、边缘和神经形态处理和自动驾驶汽车等高阶运算应用提供客製化的、整合人工智慧的记忆体解决方案。

目录

第一章：方法论与范围

第二章：执行摘要

第三章：行业洞察

  • 产业生态系统分析
  • 产业衝击力
    • 成长动力
      • 不断增长的人工智慧 (AI) 和机器学习 (ML) 应用
      • 崛起的汽车产业
      • 物联网 (IoT) 设备和边缘运算的成长
      • 资料中心和云端运算的激增
    • 产业陷阱与挑战
      • 製造和研发成本高
      • 与现有系统的复杂集成
  • 成长潜力分析
  • 监管格局
  • 技术格局
  • 未来市场趋势
  • 差距分析
  • 波特的分析
  • PESTEL分析

第四章：竞争格局

  • 介绍
  • 公司市占率分析
  • 主要市场参与者的竞争分析
  • 竞争定位矩阵
  • 策略仪表板

第五章：市场估计与预测：依产品类型，2021 - 2034 年

  • 主要趋势
  • MRAM
  • 电阻式随机存取记忆体
  • 脉衝编码调变
  • 铁RAM/F-RAM
  • 其他的

第六章：市场预估与预测：依晶圆尺寸，2021 - 2034

  • 主要趋势
  • 200毫米
  • 300毫米

第七章：市场估计与预测：按产业垂直，2021 - 2034 年

  • 主要趋势
  • 金融服务业
  • IT与云端运算
  • 汽车
  • 航太与国防
  • 医疗保健和医疗器械
  • 消费品
  • 其他的

第八章：市场估计与预测：按地区，2021 - 2034 年

  • 主要趋势
  • 北美洲
    • 我们
    • 加拿大
  • 欧洲
    • 德国
    • 英国
    • 法国
    • 西班牙
    • 义大利
    • 荷兰
  • 亚太地区
    • 中国
    • 印度
    • 日本
    • 澳洲
    • 韩国
  • 拉丁美洲
    • 巴西
    • 墨西哥
    • 阿根廷
  • 中东和非洲
    • 沙乌地阿拉伯
    • 南非
    • 阿联酋

第九章：公司简介

  • SAMSUNG
  • Micron Technology, Inc.
  • Intel Corporation
  • Everspin Technologies Inc.
  • GlobalFoundries
  • CrossBar, Inc.
  • Weebit
  • FUJITSU
  • STMicroelectronics
  • Renesas Electronics Corporation
  • Panasonic Holdings Corporation
  • Infineon Technologies AG
  • Avalanche Technology
  • SK HYNIX INC.
简介目录
Product Code: 9734

The Global Next Generation Non Volatile Memory Market was valued at USD 8.2 billion in 2024 and is estimated to grow at a CAGR of 14.4% to reach USD 31.1 billion by 2034. This growth is largely driven by the increasing demand for high-performance, low-power memory technologies that can support emerging applications in AI and machine learning. As AI workloads become more sophisticated, traditional memory architectures fail to meet latency and power efficiency requirements. In contrast, advanced memory solutions like MRAM and ReRAM offer faster data access and reduced energy consumption, aligning with modern computing demands. The adoption of these technologies is accelerating across industries looking for optimized performance and low-power capabilities in data-intensive environments.

Next Generation Non Volatile Memory Market - IMG1

With the expanding use of edge computing and the Internet of Things (IoT), the need for embedded NVM is witnessing significant momentum. These memory solutions offer low latency and energy efficiency, which are essential in remote, power-constrained environments. From smart wearables to industrial IoT applications, the push for real-time, localized data processing is raising the demand for embedded memory that can function reliably in diverse use cases. The growing 5G infrastructure and integration of AI into connected ecosystems are further fueling the need for memory solutions that can perform consistently under varying workloads. As smart homes, automation systems, and healthcare monitoring tools evolve, they increasingly rely on secure, high-endurance memory technologies that support long operational lifecycles.

Market Scope
Start Year2024
Forecast Year2025-2034
Start Value$8.2 Billion
Forecast Value$31.1 Billion
CAGR14.4%

The market based on product type is segmented into MRAM, ReRAM, PCM, FeRAM/F-RAM, and others. Among these, MRAM held a valuation of USD 3.8 billion in 2024. Its ability to deliver near-DRAM speed and high durability makes it ideal for frequent read/write functions, especially in high-performance computing applications. Meanwhile, ReRAM and FeRAM are also gaining traction due to their scalability and fast switching capabilities, meeting requirements across both consumer and industrial applications.

Based on wafer size, the market includes 200 mm and 300 mm categories. The 200 mm wafer segment alone was valued at USD 3.5 billion in 2024. These wafers remain highly relevant for manufacturing embedded NVMs in applications where cost efficiency is a top priority, especially in the automotive and industrial sectors. Despite advances in wafer technology, 200 mm fabs continue to offer a balanced combination of performance and affordability.

When analyzed by industry vertical, the next-generation NVM market is categorized into BFSI, IT and cloud computing, automotive, aerospace and defense, healthcare and medical devices, consumer goods, and others. The IT and cloud computing segment alone accounted for USD 3 billion in 2024. Persistent memory solutions based on MRAM and ReRAM are increasingly deployed to improve server speed and reduce processing latency in data-intensive workloads.

Regionally, the United States is set to dominate the global landscape, with the country's market projected to hit USD 8 billion by 2034.

The non-volatile memory (NVM) market is fiercely competitive, with top players like SAMSUNG, Micron, Intel, GlobalFoundries, and SK HYNIX commanding 62.3% of the share. These leaders are ramping up R&D in MRAM, ReRAM, and FeRAM technologies to deliver high-speed, low-power solutions for AI, automotive, and data center applications. Strategic partnerships, such as Samsung's collaborations with automakers, are strengthening market presence. Sustainability is also a major focus, with firms developing ultra-low-power NVMs to align with global carbon goals. Manufacturers are offering customized, AI-integrated memory solutions for IoT, edge, and advanced computing applications like neuromorphic processing and autonomous vehicles.

Table of Contents

Chapter 1 Methodology and Scope

  • 1.1 Market scope and definitions
  • 1.2 Research design
    • 1.2.1 Research approach
    • 1.2.2 Data collection methods
  • 1.3 Base estimates and calculations
    • 1.3.1 Base year calculation
    • 1.3.2 Key trends for market estimation
  • 1.4 Forecast model
  • 1.5 Primary research and validation
    • 1.5.1 Primary sources
    • 1.5.2 Data mining sources

Chapter 2 Executive Summary

  • 2.1 Industry 3600 synopsis

Chapter 3 Industry Insights

  • 3.1 Industry ecosystem analysis
  • 3.2 Industry impact forces
    • 3.2.1 Growth drivers
      • 3.2.1.1 Growing artificial intelligence (AI) and machine learning (ML) applications
      • 3.2.1.2 Rising automotive industry
      • 3.2.1.3 Growth in Internet of Things (IoT) devices and edge computing
      • 3.2.1.4 Proliferation of data centers and cloud computing
    • 3.2.2 Industry pitfalls and challenges
      • 3.2.2.1 High manufacturing and R&D costs
      • 3.2.2.2 Complex integration with existing systems
  • 3.3 Growth potential analysis
  • 3.4 Regulatory landscape
  • 3.5 Technology landscape
  • 3.6 Future market trends
  • 3.7 Gap analysis
  • 3.8 Porter’s analysis
  • 3.9 PESTEL analysis

Chapter 4 Competitive Landscape, 2024

  • 4.1 Introduction
  • 4.2 Company market share analysis
  • 4.3 Competitive analysis of major market players
  • 4.4 Competitive positioning matrix
  • 4.5 Strategy dashboard

Chapter 5 Market Estimates & Forecast, By Product Type, 2021 - 2034 (USD Million & Million Units)

  • 5.1 Key trends
  • 5.2 MRAM
  • 5.3 ReRAM
  • 5.4 PCM
  • 5.5 FeRAM/F-RAM
  • 5.6 Others

Chapter 6 Market Estimates & Forecast, By Wafer Size, 2021 - 2034 (USD Million & Million Units)

  • 6.1 Key trends
  • 6.2 200 mm
  • 6.3 300 mm

Chapter 7 Market Estimates & Forecast, By Industry Vertical, 2021 - 2034 (USD Million & Million Units)

  • 7.1 Key trends
  • 7.2 BFSI
  • 7.3 IT & cloud computing
  • 7.4 Automotive
  • 7.5 Aerospace & defense
  • 7.6 Healthcare & medical devices
  • 7.7 Consumer goods
  • 7.8 Others

Chapter 8 Market Estimates and Forecast, By Region, 2021 - 2034 (USD Million & Million Units)

  • 8.1 Key trends
  • 8.2 North America
    • 8.2.1 U.S.
    • 8.2.2 Canada
  • 8.3 Europe
    • 8.3.1 Germany
    • 8.3.2 UK
    • 8.3.3 France
    • 8.3.4 Spain
    • 8.3.5 Italy
    • 8.3.6 Netherlands
  • 8.4 Asia Pacific
    • 8.4.1 China
    • 8.4.2 India
    • 8.4.3 Japan
    • 8.4.4 Australia
    • 8.4.5 South Korea
  • 8.5 Latin America
    • 8.5.1 Brazil
    • 8.5.2 Mexico
    • 8.5.3 Argentina
  • 8.6 Middle East and Africa
    • 8.6.1 Saudi Arabia
    • 8.6.2 South Africa
    • 8.6.3 UAE

Chapter 9 Company Profiles

  • 9.1 SAMSUNG
  • 9.2 Micron Technology, Inc.
  • 9.3 Intel Corporation
  • 9.4 Everspin Technologies Inc.
  • 9.5 GlobalFoundries
  • 9.6 CrossBar, Inc.
  • 9.7 Weebit
  • 9.8 FUJITSU
  • 9.9 STMicroelectronics
  • 9.10 Renesas Electronics Corporation
  • 9.11 Panasonic Holdings Corporation
  • 9.12 Infineon Technologies AG
  • 9.13 Avalanche Technology
  • 9.14 SK HYNIX INC.