智慧卡 IC 市场机会、成长动力、产业趋势分析及 2025 - 2034 年预测

2024 年全球智慧卡 IC 市场价值为 32 亿美元，预计到 2034 年将以 6.6% 的复合年增长率增长至 61 亿美元。随着全球各产业的数位转型加速，市场发展势头强劲。对电子化政府、电子运输、非接触式支付系统等技术的日益依赖以及物联网设备的广泛采用，推动了对更智慧、更快速、更安全的识别和交易方法的需求。随着各行各业持续数位营运以及政府推动增强公民服务，对智慧卡 IC 的需求正在大幅成长。对网路安全威胁的日益担忧以及对万无一失的身份验证解决方案的需求进一步扩大了市场成长。生物辨识身份验证、基于区块链的安全功能以及多应用智慧卡在银行、医疗保健和交通运输等领域的广泛使用，也加剧了强劲的需求。即使全球经济压力和监管变化影响製造和供应链，智慧卡 IC 市场仍然保持弹性，这得益于晶片技术的创新和领先企业的策略扩张。

对安全且高效的身份识别解决方案的需求，加上非接触式支付和验证系统的扩展，正在推动智慧卡积体电路市场向前发展。儘管贸易限制，尤其是川普时代对中国进口产品征收的关税，导致市场经历了动盪，但市场仍保持稳定成长的势头。这些关税增加了原料和包装零件的成本，导致供应链中断。严重依赖中国供应商的公司面临更高的成本，不得不将生产转移到台湾、墨西哥和越南等其他地区以降低风险。虽然这些调整增强了供应链的长期韧性，但也导致了短期采购延迟和营运成本上升。

智慧卡IC市场涵盖各种类型，旨在满足特定的安全需求和应用。其中，接触式IC市场在2024年创造了10.8亿美元的市场规模。这类IC需要与读卡机进行实体接触才能进行通信，广泛应用于安全环境，包括国民身分证、银行卡和门禁系统。它们能够安全地储存和传输敏感资料，使其成为安全至关重要的行业中不可或缺的组成部分。

基于微控制器的积体电路 (IC) 市场在 2024 年实现了 17 亿美元的收入。这些 IC 主要用于符合 EMV 标准的金融卡。它们采用嵌入式微控制器，支援安全的卡上资料处理、加密和身份验证。随着网路威胁的日益加剧，对强大安全措施的需求也日益增长，这使得基于微控制器的 IC 成为安全交易和身分保护的关键元件。

2024年，美国智慧卡IC市场规模达7.469亿美元，得益于政府和私营部门对数位身分系统、物联网支付解决方案和安全存取控制技术不断增加的投资，该市场正呈现强劲成长动能。美国政府致力于提升网路安全水平，并实施先进的身份验证计划（例如REAL ID），这推动了智慧卡IC在联邦和州政府计划中的应用。随着各行各业对安全数位交易和身分管理的重视，美国对智慧卡IC的需求持续成长。

全球智慧卡 IC 市场的主要参与者包括英飞凌科技股份公司、恩智浦半导体公司和义法半导体公司。这些公司在安全支付、身份验证和数位服务领域引领创新。他们专注于增强产品安全性，扩展晶片功能，与银行、电信和政府部门建立战略合作伙伴关係，并大力投资研发具有先进加密技术、更高耐用性和更快处理速度的下一代晶片。在低成本地区建立製造中心有助于他们控制生产成本并简化供应链，同时，行销工作也持续提升全球对安全数位支付系统和政府身分证专案的认知度。

目录

第一章：方法论与范围

第二章：执行摘要

第三章：行业洞察

• 产业生态系统分析
• 川普政府关税
  • 对贸易的影响
    • 贸易量中断
    • 报復措施
  • 对产业的影响
    • 供给侧影响（原料）
      • 主要材料价格波动
      • 供应链重组
      • 生产成本影响
    • 需求面影响（售价）
      • 价格传导至终端市场
      • 市占率动态
      • 消费者反应模式
  • 受影响的主要公司
  • 策略产业反应
    • 供应链重组
    • 定价和产品策略
    • 政策参与
  • 展望与未来考虑
• 供应商矩阵
• 利润率分析
• 技术与创新格局
• 专利分析
• 重要新闻和倡议
• 产业衝击力
  • 成长动力
    • 电子交通需求不断成长
    • 日益重视电子化政府
    • 非接触式支付的兴起
    • 医疗保健领域的采用
    • 物联网应用扩充
  • 产业陷阱与挑战
    • 安全问题
    • 转向数位支付系统
• 成长潜力分析
• 波特的分析
• PESTEL分析
• 未来市场趋势
• 监管格局

第四章：市场估计与预测：依类型，2021 年至 2034 年

• 主要趋势
• 接触式积体电路
• 非接触式积体电路
• 双接口IC
• 混合积体电路

第五章：市场估计与预测：按比特大小，2021 年至 2034 年

• 主要趋势
• 8位IC
• 16位IC
• 32位IC

第六章：市场估计与预测：按功能，2021 年至 2034 年

• 主要趋势
• 基于微控制器的IC
• 基于记忆体的IC

第七章：市场估计与预测：依最终用途，2021 年至 2034 年

• 主要趋势
• 电信
• 银行、金融服务和保险
• 政府和公共部门
• 运输
• 卫生保健
• 零售和忠诚度计划
• 企业存取控制
• 其他的

第八章：市场估计与预测：按地区，2021-2034 年

• 主要趋势
• 北美洲
  • 我们
  • 加拿大
• 欧洲
  • 德国
  • 英国
  • 法国
  • 西班牙
  • 义大利
• 亚太地区
  • 日本
  • 中国
  • 印度
  • 韩国
  • 澳新银行
• 拉丁美洲
  • 巴西
  • 墨西哥
• 中东和非洲
  • 南非
  • 阿联酋
  • 沙乌地阿拉伯

第九章：公司简介

• CPI Card Group Inc.
• Eastcompeace Technology Co., Ltd.
• EM Microelectronic-Marin SA (Swatch Group)
• Giesecke+Devrient GmbH (G+D)
• HED Technologies
• Hubei Dinglong Co., Ltd.
• IDEMIA
• Infineon Technologies AG
• Microchip Technology Inc.
• NXP Semiconductors NV
• Renesas ElectronICs Corporation
• Samsung ElectronICs Co., Ltd.
• Shanghai Fudan MicroelectronICs Group Co., Ltd.
• STMicroelectronICs NV
• Thales Group
• Unigroup Guoxin MicroelectronICs Co., Ltd.
• Watchdata Technologies
• Winbond ElectronICs Corporation
• Wuhan Tianyu Information Industry Co., Ltd.
• Xingtera Inc.

The Global Smart Card IC Market was valued at USD 3.2 billion in 2024 and is estimated to grow at a CAGR of 6.6% to reach USD 6.1 billion by 2034. The market is gaining momentum as digital transformation across sectors accelerates worldwide. Growing reliance on technologies such as e-governance, e-transportation, contactless payment systems, and the widespread adoption of IoT devices is driving the need for smarter, faster, and more secure identification and transaction methods. As industries continue to digitize operations and governments push for enhanced citizen services, the demand for smart card ICs is seeing a significant surge. Increasing concerns over cybersecurity threats and the need for foolproof authentication solutions further amplify market growth. The expanding use of biometric authentication, blockchain-based security features, and multi-application smart cards across sectors like banking, healthcare, and transportation adds to the strong demand. Even with global economic pressures and regulatory changes impacting manufacturing and supply chains, the Smart Card IC Market remains resilient, backed by innovations in chip technology and strategic expansions by leading players.

The demand for secure and efficient identification solutions, coupled with the expansion of contactless payment and verification systems, is propelling the smart card IC market forward. Although the market has experienced turbulence due to trade restrictions, especially the Trump-era tariffs on Chinese imports, it remains positioned for steady growth. These tariffs increased the cost of raw materials and packaging components, leading to supply chain disruptions. Companies heavily reliant on Chinese suppliers faced higher costs and shifted production to alternative regions such as Taiwan, Mexico, and Vietnam to mitigate risks. While these adjustments have strengthened long-term supply chain resilience, they caused short-term procurement delays and operational cost hikes.

The smart card IC market includes various types designed to meet specific security needs and applications. Among these, the contact-based ICs segment generated USD 1.08 billion in 2024. These ICs require physical contact with a reader for communication and are widely used in secure environments, including national identity cards, banking cards, and access control systems. Their ability to securely store and transmit sensitive data makes them indispensable across industries where security is critical.

The microcontroller-based ICs segment generated USD 1.7 billion in 2024. These ICs are predominantly used in financial cards adhering to EMV standards. Featuring embedded microcontrollers, they support secure on-card data processing, encryption, and identity verification. With rising cyber threats, the need for robust security measures is escalating, making microcontroller-based ICs a critical component for secure transactions and identity protection.

The U.S. Smart Card IC Market was valued at USD 746.9 million in 2024 and is seeing strong growth fueled by increasing investments from both government and private sectors in digital identity systems, IoT payment solutions, and secure access control technologies. The U.S. government's focus on improving cybersecurity and implementing advanced identity verification programs, such as REAL ID, is driving the adoption of smart card ICs across federal and state initiatives. As industries prioritize secure digital transactions and identity management, the demand for smart card ICs in the U.S. continues to rise.

Key players in the Global Smart Card IC Market include Infineon Technologies AG, NXP Semiconductors N.V., and STMicroelectronics N.V. These companies are leading innovations in secure payments, identity verification, and digital services. They are focusing on strengthening product security, expanding chip capabilities, forming strategic partnerships across banking, telecom, and government sectors, and investing heavily in R&D to develop next-generation chips with advanced encryption, greater durability, and faster processing speeds. The establishment of manufacturing hubs in low-cost regions is helping them control production costs and streamline supply chains, while marketing efforts continue to raise global awareness about secure digital payment systems and government ID programs.

Table of Contents

Chapter 1 Methodology & Scope

• 1.1 Market scope & definitions
• 1.2 Research design
  • 1.2.1 Research approach
  • 1.2.2 Data collection methods
• 1.3 Base estimates & calculations
  • 1.3.1 Base year calculation
  • 1.3.2 Key trends for market estimation
• 1.4 Forecast model
• 1.5 Primary research and validation
  • 1.5.1 Primary sources
  • 1.5.2 Data mining sources

Chapter 2 Executive Summary

• 2.1 Industry 360⁰ synopsis

Chapter 3 Industry Insights

• 3.1 Industry ecosystem analysis
• 3.2 Trump administration tariffs
  • 3.2.1 Impact on trade
    • 3.2.1.1 Trade volume disruptions
    • 3.2.1.2 Retaliatory measures
  • 3.2.2 Impact on the industry
    • 3.2.2.1 Supply-side impact (raw materials)
      • 3.2.2.1.1 Price volatility in key materials
      • 3.2.2.1.2 Supply chain restructuring
      • 3.2.2.1.3 Production cost implications
    • 3.2.2.2 Demand-side impact (selling price)
      • 3.2.2.2.1 Price transmission to end markets
      • 3.2.2.2.2 Market share dynamics
      • 3.2.2.2.3 Consumer response patterns
  • 3.2.3 Key companies impacted
  • 3.2.4 Strategic industry responses
    • 3.2.4.1 Supply chain reconfiguration
    • 3.2.4.2 Pricing and product strategies
    • 3.2.4.3 Policy engagement
  • 3.2.5 Outlook and future considerations
• 3.3 Vendor matrix
• 3.4 Profit margin analysis
• 3.5 Technology & innovation landscape
• 3.6 Patent analysis
• 3.7 Key news and initiatives
• 3.8 Industry impact forces
  • 3.8.1 Growth drivers
    • 3.8.1.1 Growing demand for e-transportation
    • 3.8.1.2 Growing emphasis on e-Governance
    • 3.8.1.3 Rise in contactless payments
    • 3.8.1.4 Adoption in the healthcare sector
    • 3.8.1.5 Expansion of IoT applications
  • 3.8.2 Industry pitfalls & challenges
    • 3.8.2.1 Security concerns
    • 3.8.2.2 Shift towards digital payment systems
• 3.9 Growth potential analysis
• 3.10 Porter's analysis
• 3.11 PESTEL analysis
• 3.12 Future market trends
• 3.13 Regulatory landscape

Chapter 4 Market Estimates and Forecast, by Type, 2021 – 2034 (USD Bn & Mn Units)

• 4.1 Key trends
• 4.2 Contact-based ICs
• 4.3 Contactless ICs
• 4.4 Dual interface ICs
• 4.5 Hybrid ICs

Chapter 5 Market Estimates and Forecast, by Bit Size, 2021 – 2034 (USD Bn & Mn Units)

• 5.1 Key trends
• 5.2 8-bit ICs
• 5.3 16-bit ICs
• 5.4 32-bit ICs

Chapter 6 Market Estimates and Forecast, by Functionality, 2021 – 2034 (USD Bn & Mn Units)

• 6.1 Key trends
• 6.2 Microcontroller-based ICs
• 6.3 Memory-based ICs

Chapter 7 Market Estimates and Forecast, by End Use, 2021 – 2034 (USD Bn & Mn Units)

• 7.1 Key trends
• 7.2 Telecommunications
• 7.3 Banking, financial services & insurance
• 7.4 Government & public sector
• 7.5 Transportation
• 7.6 Healthcare
• 7.7 Retail & loyalty programs
• 7.8 Enterprise access control
• 7.9 Others

Chapter 8 Market Estimates and Forecast, By Region, 2021– 2034 (USD Bn & Mn Units)

• 8.1 Key trends
• 8.2 North America
  • 8.2.1 U.S.
  • 8.2.2 Canada
• 8.3 Europe
  • 8.3.1 Germany
  • 8.3.2 UK
  • 8.3.3 France
  • 8.3.4 Spain
  • 8.3.5 Italy
• 8.4 Asia Pacific
  • 8.4.1 Japan
  • 8.4.2 China
  • 8.4.3 India
  • 8.4.4 South Korea
  • 8.4.5 ANZ
• 8.5 Latin America
  • 8.5.1 Brazil
  • 8.5.2 Mexico
• 8.6 Middle East and Africa
  • 8.6.1 South Africa
  • 8.6.2 UAE
  • 8.6.3 Saudi Arabia

Chapter 9 Company Profile

• 9.1 CPI Card Group Inc.
• 9.2 Eastcompeace Technology Co., Ltd.
• 9.3 EM Microelectronic-Marin SA (Swatch Group)
• 9.4 Giesecke+Devrient GmbH (G+D)
• 9.5 HED Technologies
• 9.6 Hubei Dinglong Co., Ltd.
• 9.7 IDEMIA
• 9.8 Infineon Technologies AG
• 9.9 Microchip Technology Inc.
• 9.10 NXP Semiconductors N.V.
• 9.11 Renesas ElectronICs Corporation
• 9.12 Samsung ElectronICs Co., Ltd.
• 9.13 Shanghai Fudan MicroelectronICs Group Co., Ltd.
• 9.14 STMicroelectronICs N.V.
• 9.15 Thales Group
• 9.16 Unigroup Guoxin MicroelectronICs Co., Ltd.
• 9.17 Watchdata Technologies
• 9.18 Winbond ElectronICs Corporation
• 9.19 Wuhan Tianyu Information Industry Co., Ltd.
• 9.20 Xingtera Inc.