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1750331

功率分立元件和模组市场机会、成长动力、产业趋势分析及 2025 - 2034 年预测

Power Discrete and Modules Market Opportunity, Growth Drivers, Industry Trend Analysis, and Forecast 2025 - 2034

出版日期: 2025年05月08日 | 出版商:

Global Market Insights Inc. | 英文 180 Pages | 商品交期: 2-3个工作天内

价格

简介目录

2024年，全球功率分立元件和模组市场规模达298亿美元，预计到2034年将以6.1%的复合年增长率成长，达到534亿美元，这得益于消费电子、资料中心和5G基础设施等高成长产业不断增长的需求。在这些应用中，采用先进的电力电子技术对于提高效率、小型化和性能至关重要。随着设备变得更加智慧和功率密度更高，IGBT、MOSFET和功率模组等元件对于管理能耗、热效率和开关速度至关重要。

在川普政府时期实施的贸易关税提高了关键材料和零件的进口成本，给美国半导体製造商带来了压力。许多在美国市场运营的公司采取了本地化生产、重组供应链以及投资区域晶圆製造设施的措施。全球企业，尤其是亚洲企业，也加大了对GaN和SiC技术的研发力度，以减少对外国的依赖。这些地缘政治变化显着影响了整个产业的采购模式、定价策略和创新时间表。此外，从个人设备到智慧家电，消费性电子产品的持续崛起，强化了分立电源解决方案在高频紧凑环境中的作用。

市场范围
起始年份	2024
预测年份	2025-2034
起始值	298亿美元
预测值	534亿美元
复合年增长率	6.1%

2024年，功率模组市场规模达124亿美元。其高需求源自于其卓越的散热性能、紧凑的设计和强大的功率处理能力，这些特性对于电动车、工业驱动和再生能源系统至关重要。随着风力涡轮机、太阳能发电场和电动车充电网路的不断发展，高压功率模组（尤其是基于SiC的模组）的部署正在迅速扩展。

功率分立元件和模组市场中的MOSFET细分市场在2024年达到87亿美元，这得益于其在中低功率应用的高效率和可靠性。 MOSFET在消费性电子、汽车控制单元和快速充电技术中的突出地位反映了其在外形尺寸和开关性能方面的多功能性和持续创新。基于GaN的MOSFET变体推动了需要紧凑型高速开关的应用的成长。

2024年，美国功率分立元件和模组市场规模达79亿美元，这得益于电动车需求的成长、太阳能和风能基础设施的大规模投资，以及国防和航太应用中功率模组的使用增加。工业自动化是另一个关键驱动因素，分离式元件可协助打造节能高效、反应迅速的智慧工厂系统。美国向清洁能源和电动出行的转变加速了高性能功率元件的集成，尤其是在电动车充电站、电池管理系统和可再生能源逆变器等应用中。

该行业的主要参与者包括Powerex、Littelfuse、英飞凌科技、丹佛斯、意法半导体、富士电机、德州仪器、罗姆半导体、瑞萨电子、赛米控、微芯科技、东芝、安森美半导体、威世科技、Wolfspeed、三菱电机和三垦电气。为了维持竞争优势，领导企业正在推动宽禁带技术（SiC/GaN），以提高产品效率和热性能。他们也正在扩大製造能力，组成供应链联盟，并进行策略性合併，以加强垂直整合并服务高成长的区域市场。

产业生态系统分析
川普政府关税
- 对贸易的影响
  - 贸易量中断
  - 报復措施
- 对产业的影响
  - 供应方影响（原料）
    - 主要材料价格波动
    - 供应链重组
    - 生产成本影响
  - 需求面影响（售价）
    - 价格传导至终端市场
    - 市占率动态
    - 消费者反应模式
- 受影响的主要公司
- 策略产业反应
  - 供应链重组
  - 定价和产品策略
  - 政策参与
- 展望与未来考虑
产业衝击力
- 成长动力
  - 智慧电网和智慧电錶的普及率不断上升
  - 扩大再生能源基础设施
  - 5G基础设施和资料中心的扩展
  - 消费性电子产品的成长
  - 宽频隙半导体的进展
- 产业陷阱与挑战
  - 宽频隙技术成本高
  - 设计复杂性和整合问题
成长潜力分析
监管格局
技术格局
未来市场趋势
差距分析
波特的分析
PESTEL分析

第四章：竞争格局

介绍
公司市占率分析
主要市场参与者的竞争分析
竞争定位矩阵
策略仪表板

第五章：市场估计与预测：按类型，2021 年至 2034 年

主要趋势
功率分立元件
电源模组

第六章：市场估计与预测：按组件，2021 年至 2034 年

主要趋势
闸流管
二极体
整流器
场效电晶体
绝缘栅双极电晶体（IGBT）
其他的

第七章：市场估计与预测：按材料，2021 年至 2034 年

主要趋势
硅
碳化硅
氮化镓
其他的

第 8 章：市场估计与预测：按应用，2021 年至 2034 年

主要趋势
电信和资料中心
工业的
汽车
再生能源
消费性电子产品
其他的

第九章：市场估计与预测：按地区，2021 年至 2034 年

主要趋势
北美洲
- 我们
- 加拿大
欧洲
- 德国
- 英国
- 法国
- 西班牙
- 义大利
- 荷兰
亚太地区
- 中国
- 印度
- 日本
- 澳洲
- 韩国
拉丁美洲
- 巴西
- 墨西哥
- 阿根廷
中东和非洲
- 沙乌地阿拉伯
- 南非
- 阿联酋

第十章：公司简介

Danfoss
Fuji Electric
Infineon Technologies
Littelfuse
Microchip Technology
Mitsubishi Electric
ON Semiconductor
Powerex
Renesas Electronics
ROHM Semiconductor
Sanken Electric
Semikron
STMicroelectronics
Texas Instruments
Toshiba
Vishay Intertechnology
Wolfspeed

简介目录

Product Code: 13770

The Global Power Discrete and Modules Market was valued at USD 29.8 billion in 2024 and is estimated to grow at a CAGR of 6.1% to reach USD 53.4 billion by 2034, fueled by rising demand from high-growth industries such as consumer electronics, data centers, and 5G infrastructure. Adopting advanced power electronics has become critical in these applications to support efficiency, miniaturization, and performance. As devices become smarter and power-dense, components like IGBTs, MOSFETs, and power modules are essential to managing energy use, thermal efficiency, and switching speed.

Power Discrete and Modules Market - IMG1

Trade tariffs enacted during the Trump administration placed pressure on US-based semiconductor manufacturers by raising import costs for critical materials and components. Many companies operating in the US market responded by localizing production, reengineering their supply chains, and investing in regional wafer fabrication facilities. Global players, particularly in Asia, also ramped up R&D around GaN and SiC technologies to reduce foreign dependency. These geopolitical shifts significantly influenced procurement patterns, pricing strategies, and innovation timelines across the industry. Moreover, the continued rise of consumer electronics, from personal devices to smart appliances, reinforces the role of discrete power solutions in high-frequency, compact environments.

Market Scope
Start Year	2024
Forecast Year	2025-2034
Start Value	$29.8 Billion
Forecast Value	$53.4 Billion
CAGR	6.1%

In 2024, the power module segment generated USD 12.4 billion. Its high demand stems from superior heat dissipation, compact design, and power-handling capability critical in EVs, industrial drives, and renewable energy systems. With the continued development of wind turbines, solar farms, and EV charging networks, the deployment of high-voltage power modules, especially those based on SiC, is expanding rapidly.

MOSFETs segment in the power discrete and modules market accounted for USD 8.7 billion in 2024 due to their high efficiency and reliability in low- to mid-power applications. Their prominence in consumer gadgets, automotive control units, and fast-charging technologies reflects their versatility and ongoing innovation in form factor and switching performance. GaN-based variants push growth in applications requiring compact high-speed switching.

U.S. Power Discrete and Modules Market was valued at USD 7.9 billion in 2024, driven by rising EV demand, large-scale investments in solar and wind infrastructure, and increased use of power modules in defense and aerospace applications. Industrial automation is another key driver, where discrete components enable power-efficient, responsive smart factory systems. The country's shift toward clean energy and electrified mobility has accelerated the integration of high-performance power devices, particularly in applications like EV charging stations, battery management systems, and renewable inverters.

Key players in the industry include Powerex, Littelfuse, Infineon Technologies, Danfoss, STMicroelectronics, Fuji Electric, Texas Instruments, ROHM Semiconductor, Renesas Electronics, Semikron, Microchip Technology, Toshiba, ON Semiconductor, Vishay Intertechnology, Wolfspeed, Mitsubishi Electric, and Sanken Electric. To maintain a competitive edge, leading firms are advancing wide-bandgap technology (SiC/GaN), enhancing product efficiency and thermal performance. They are also expanding fabrication capacity, forming supply chain alliances, and pursuing strategic mergers to strengthen vertical integration and serve high-growth regional markets.

Chapter 1 Methodology and Scope

1.1 Market scope and definitions
1.2 Research design
- 1.2.1 Research approach
- 1.2.2 Data collection methods
1.3 Base estimates and calculations
- 1.3.1 Base year calculation
- 1.3.2 Key trends for market estimation
1.4 Forecast model
1.5 Primary research and validation
- 1.5.1 Primary sources
- 1.5.2 Data mining sources

Chapter 2 Executive Summary

2.1 Industry 360° synopsis

Chapter 3 Industry Insights

3.1 Industry ecosystem analysis
3.2 Trump administration tariffs
- 3.2.1 Impact on trade
  - 3.2.1.1 Trade volume disruptions
  - 3.2.1.2 Retaliatory measures
- 3.2.2 Impact on the industry
  - 3.2.2.1 Supply-side impact (raw materials)
    - 3.2.2.1.1 Price volatility in key materials
    - 3.2.2.1.2 Supply chain restructuring
    - 3.2.2.1.3 Production cost implications
  - 3.2.2.2 Demand-side impact (selling price)
    - 3.2.2.2.1 Price transmission to end markets
    - 3.2.2.2.2 Market share dynamics
    - 3.2.2.2.3 Consumer response patterns
- 3.2.3 Key companies impacted
- 3.2.4 Strategic industry responses
  - 3.2.4.1 Supply chain reconfiguration
  - 3.2.4.2 Pricing and product strategies
  - 3.2.4.3 Policy engagement
- 3.2.5 Outlook and future considerations
3.3 Industry impact forces
- 3.3.1 Growth drivers
  - 3.3.1.1 Rising adoption of smart grids & smart meters
  - 3.3.1.2 Expansion of renewable energy infrastructure
  - 3.3.1.3 Expansion of 5G infrastructure & data centres
  - 3.3.1.4 Growth in consumer electronics
  - 3.3.1.5 Advancements in wide-bandgap semiconductors
- 3.3.2 Industry pitfalls and challenges
  - 3.3.2.1 High cost of wide-bandgap technologies
  - 3.3.2.2 Design complexity and integration issues
3.4 Growth potential analysis
3.5 Regulatory landscape
3.6 Technology landscape
3.7 Future market trends
3.8 Gap analysis
3.9 Porter's analysis
3.10 PESTEL analysis

Chapter 4 Competitive Landscape, 2024

4.1 Introduction
4.2 Company market share analysis
4.3 Competitive analysis of major market players
4.4 Competitive positioning matrix
4.5 Strategy dashboard

Chapter 5 Market Estimates and Forecast, By Type, 2021 – 2034 (USD Billion & Million Units)

5.1 Key trends
5.2 Power discrete
5.3 Power module

Chapter 6 Market Estimates and Forecast, By Component, 2021 – 2034 (USD Billion & Million Units)

6.1 Key trends
6.2 Thyristor
6.3 Diode
6.4 Rectifier
6.5 MOSFET
6.6 IGBT
6.7 Others

Chapter 7 Market Estimates and Forecast, By Material, 2021 – 2034 (USD Billion & Million Units)

7.1 Key trends
7.2 Si
7.3 SiC
7.4 GaN
7.5 Others

Chapter 8 Market Estimates and Forecast, By Application, 2021 – 2034 (USD Billion & Million Units)

8.1 Key trends
8.2 Telecom & data centers
8.3 Industrial
8.4 Automotive
8.5 Renewable energy
8.6 Consumer electronics
8.7 Others

Chapter 9 Market Estimates and Forecast, By Region, 2021 – 2034 (USD Billion & Million Units)

9.1 Key trends
9.2 North America
- 9.2.1 U.S.
- 9.2.2 Canada
9.3 Europe
- 9.3.1 Germany
- 9.3.2 UK
- 9.3.3 France
- 9.3.4 Spain
- 9.3.5 Italy
- 9.3.6 Netherlands
9.4 Asia Pacific
- 9.4.1 China
- 9.4.2 India
- 9.4.3 Japan
- 9.4.4 Australia
- 9.4.5 South Korea
9.5 Latin America
- 9.5.1 Brazil
- 9.5.2 Mexico
- 9.5.3 Argentina
9.6 Middle East and Africa
- 9.6.1 Saudi Arabia
- 9.6.2 South Africa
- 9.6.3 UAE