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市场调查报告书
商品编码
1871148
汽车储存半导体市场机会、成长驱动因素、产业趋势分析及预测(2025-2034年)Automotive Memory Semiconductors Market Opportunity, Growth Drivers, Industry Trend Analysis, and Forecast 2025 - 2034 |
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2024 年全球汽车储存半导体市场价值为 820 万美元,预计到 2034 年将以 12.5% 的复合年增长率增长至 2,650 万美元。

高级驾驶辅助系统 (ADAS) 和自动驾驶技术的日益普及推动了对高性能汽车储存半导体的需求。这些系统需要对来自感测器、摄影机、光达和雷达单元的大量资料进行瞬时处理,因此对快速、可靠的储存解决方案提出了迫切需求。 DRAM 和 NAND 快闪记忆体对于在复杂的运算平台中实现快速储存、传输和分析至关重要。随着车辆自动化程度的不断提高,容量更大、延迟更低、耐久性更强的记忆体变得日益重要。向电动和混合动力汽车 (EV 和 HEV) 的转型进一步推动了这一增长,因为复杂的电子控制单元 (ECU) 和电池管理系统需要先进的记忆体来监控能源使用、性能和安全性。 NOR 快闪记忆体、NAND 和 DRAM 等储存组件支援感测器、动力系统和控制模组之间的即时通信,从而优化效率和稳定性。
| 市场范围 | |
|---|---|
| 起始年份 | 2024 |
| 预测年份 | 2025-2034 |
| 起始值 | 820万美元 |
| 预测值 | 2650万美元 |
| 复合年增长率 | 12.5% |
2024年,NAND快闪记忆体和託管储存领域的市场规模预计为320万美元。包括DRAM和SRAM在内的易失性记忆体对于ADAS(高级驾驶辅助系统)、资讯娱乐系统和自动驾驶应用中的高速处理至关重要。汽车製造商正越来越多地部署DRAM和SRAM来处理即时感测器资料和人工智慧驱动的功能,从而推动了下一代汽车平台的需求。
2024年,内燃机(ICE)汽车市场规模预计将达350万美元。传统汽车的ECU、资讯娱乐系统和安全系统仍然需要记忆体。 ADAS、车载资讯系统和车联网功能的整合增加了对即时资料处理、储存和监控的记忆体需求,从而持续推动了对DRAM、SRAM和快闪记忆体解决方案的需求。
美国汽车储存半导体市场规模预计在2024年达到220万美元,到2034年将以13%的复合年增长率成长。电动车、智慧网联汽车和高级驾驶辅助系统(ADAS)的普及是推动市场成长的主要动力。包括《晶片和资讯安全法案》(CHIPS Act)在内的政府项目,促进了国内半导体生产,增强了供应链韧性,并刺激了汽车级记忆体的创新。机会包括原始设备製造商(OEM)与半导体製造商之间的合作,共同开发适用于电动车、自动驾驶汽车和支援空中升级(OTA)系统的可扩展、高能源效率储存解决方案。
全球汽车记忆体半导体市场的主要参与者包括:Analog Devices, Inc.、Applied Materials, Inc.、Denso、L&T Semiconductor Technologies、Macronix International Co., Ltd.、Microchip Technology Inc.、NXP Semiconductors NV、OmniVision、ON Semem. Industries, LLC、Tongfu Microelectronics (TFME)、Toshiba 和 Valens Semiconductor。这些公司采取的关键策略包括:与汽车製造商建立策略合作伙伴关係,共同开发客製化的储存解决方案;透过併购拓展技术组合;以及大力投资研发高容量、低延迟和高能源效率的记忆体。此外,各公司也正在扩大生产规模、提升供应链韧性并实现半导体製造的在地化。
The Global Automotive Memory Semiconductors Market was valued at USD 8.2 million in 2024 and is estimated to grow at a CAGR of 12.5% to reach USD 26.5 million by 2034.

The rising adoption of advanced driver-assistance systems (ADAS) and autonomous driving technologies is fueling demand for high-performance automotive memory semiconductors. These systems require instantaneous processing of massive amounts of data from sensors, cameras, LiDAR, and radar units, creating a strong need for fast, reliable memory solutions. DRAM and NAND flash are crucial for enabling rapid storage, transfer, and analysis within complex computing platforms. As vehicles evolve toward higher automation, memory with larger capacity, low latency, and long-term endurance is becoming increasingly critical. The shift to electric and hybrid vehicles (EVs and HEVs) is further driving growth, as sophisticated electronic control units (ECUs) and battery management systems demand advanced memory for monitoring energy usage, performance, and safety. Memory components like NOR flash, NAND, and DRAM support real-time communication between sensors, powertrains, and control modules to optimize efficiency and stability.
| Market Scope | |
|---|---|
| Start Year | 2024 |
| Forecast Year | 2025-2034 |
| Start Value | $8.2 Million |
| Forecast Value | $26.5 Million |
| CAGR | 12.5% |
The NAND flash and managed storage segment was valued at USD 3.2 million in 2024. Volatile memory types, including DRAM and SRAM, are essential for high-speed processing in ADAS, infotainment, and autonomous driving applications. Automakers are increasingly deploying DRAM and SRAM to handle real-time sensor data and AI-driven functions, fueling demand across next-generation vehicle platforms.
The internal combustion engine (ICE) vehicles segment generated USD 3.5 million in 2024. Traditional vehicles continue to require memory for ECUs, infotainment, and safety systems. The incorporation of ADAS, telematics, and connected vehicle features increases memory demands for real-time data processing, storage, and monitoring, sustaining the need for DRAM, SRAM, and flash solutions.
United States Automotive Memory Semiconductors Market reached USD 2.2 million in 2024 with a CAGR of 13% through 2034. Growth is driven by the adoption of EVs, connected vehicles, and ADAS. Government programs, including the CHIPS Act, promote domestic semiconductor production, enhance supply chain resilience, and stimulate innovation in automotive-grade memory. Opportunities include collaborations between OEMs and semiconductor manufacturers to develop scalable, energy-efficient memory solutions for EVs, autonomous vehicles, and over-the-air update-enabled systems.
Prominent Automotive Memory Semiconductors Market participants include Analog Devices, Inc., Applied Materials, Inc., Denso, L&T Semiconductor Technologies, Macronix International Co., Ltd., Microchip Technology Inc., NXP Semiconductors N.V., OmniVision, ON Semiconductor (onsemi), Robert Bosch GmbH, ROHM Co., Ltd., Semiconductor Components Industries, LLC, Tongfu Microelectronics (TFME), Toshiba, and Valens Semiconductor. Key strategies adopted by companies in the Global Automotive Memory Semiconductors Market include forging strategic partnerships with automakers to co-develop tailored memory solutions, pursuing mergers and acquisitions to broaden technology portfolios, and investing heavily in R&D for high-capacity, low-latency, and energy-efficient memory. Firms are also scaling up production facilities, improving supply chain resilience, and localizing semiconductor manufacturing.