封面
市场调查报告书
商品编码
1871148

汽车储存半导体市场机会、成长驱动因素、产业趋势分析及预测(2025-2034年)

Automotive Memory Semiconductors Market Opportunity, Growth Drivers, Industry Trend Analysis, and Forecast 2025 - 2034

出版日期: | 出版商: Global Market Insights Inc. | 英文 180 Pages | 商品交期: 2-3个工作天内

价格
简介目录

2024 年全球汽车储存半导体市场价值为 820 万美元,预计到 2034 年将以 12.5% 的复合年增长率增长至 2,650 万美元。

汽车储存半导体市场 - IMG1

高级驾驶辅助系统 (ADAS) 和自动驾驶技术的日益普及推动了对高性能汽车储存半导体的需求。这些系统需要对来自感测器、摄影机、光达和雷达单元的大量资料进行瞬时处理,因此对快速、可靠的储存解决方案提出了迫切需求。 DRAM 和 NAND 快闪记忆体对于在复杂的运算平台中实现快速储存、传输和分析至关重要。随着车辆自动化程度的不断提高,容量更大、延迟更低、耐久性更强的记忆体变得日益重要。向电动和混合动力汽车 (EV 和 HEV) 的转型进一步推动了这一增长,因为复杂的电子控制单元 (ECU) 和电池管理系统需要先进的记忆体来监控能源使用、性能和安全性。 NOR 快闪记忆体、NAND 和 DRAM 等储存组件支援感测器、动力系统和控制模组之间的即时通信,从而优化效率和稳定性。

市场范围
起始年份 2024
预测年份 2025-2034
起始值 820万美元
预测值 2650万美元
复合年增长率 12.5%

2024年,NAND快闪记忆体和託管储存领域的市场规模预计为320万美元。包括DRAM和SRAM在内的易失性记忆体对于ADAS(高级驾驶辅助系统)、资讯娱乐系统和自动驾驶应用中的高速处理至关重要。汽车製造商正越来越多地部署DRAM和SRAM来处理即时感测器资料和人工智慧驱动的功能,从而推动了下一代汽车平台的需求。

2024年,内燃机(ICE)汽车市场规模预计将达350万美元。传统汽车的ECU、资讯娱乐系统和安全系统仍然需要记忆体。 ADAS、车载资讯系统和车联网功能的整合增加了对即时资料处理、储存和监控的记忆体需求,从而持续推动了对DRAM、SRAM和快闪记忆体解决方案的需求。

美国汽车储存半导体市场规模预计在2024年达到220万美元,到2034年将以13%的复合年增长率成长。电动车、智慧网联汽车和高级驾驶辅助系统(ADAS)的普及是推动市场成长的主要动力。包括《晶片和资讯安全法案》(CHIPS Act)在内的政府项目,促进了国内半导体生产,增强了供应链韧性,并刺激了汽车级记忆体的创新。机会包括原始设备製造商(OEM)与半导体製造商之间的合作,共同开发适用于电动车、自动驾驶汽车和支援空中升级(OTA)系统的可扩展、高能源效率储存解决方案。

全球汽车记忆体半导体市场的主要参与者包括:Analog Devices, Inc.、Applied Materials, Inc.、Denso、L&T Semiconductor Technologies、Macronix International Co., Ltd.、Microchip Technology Inc.、NXP Semiconductors NV、OmniVision、ON Semem. Industries, LLC、Tongfu Microelectronics (TFME)、Toshiba 和 Valens Semiconductor。这些公司采取的关键策略包括:与汽车製造商建立策略合作伙伴关係,共同开发客製化的储存解决方案;透过併购拓展技术组合;以及大力投资研发高容量、低延迟和高能源效率的记忆体。此外,各公司也正在扩大生产规模、提升供应链韧性并实现半导体製造的在地化。

目录

第一章:方法论与范围

第二章:执行概要

第三章:行业洞察

  • 产业生态系分析
    • 供应商格局
    • 利润率
    • 成本结构
    • 每个阶段的价值增加
    • 影响价值链的因素
    • 中断
  • 产业影响因素
    • 成长驱动因素
      • 高级驾驶辅助系统(ADAS)和自动驾驶技术的日益普及
      • 汽车电气化(电动车和混合动力车)的成长
      • 资讯娱乐系统与连网汽车系统的集成
      • 汽车级记忆体技术的进步
      • 车联网(V2X)通讯的扩展
    • 产业陷阱与挑战
      • 汽车级半导体的高製造成本和认证成本
      • 快速的技术演进
  • 成长潜力分析
  • 监管环境
    • 北美洲
    • 欧洲
    • 亚太地区
    • 拉丁美洲
    • 中东和非洲
  • 波特的分析
  • PESTEL 分析
  • 技术与创新格局
    • 当前技术趋势
    • 新兴技术
  • 价格趋势
    • 历史价格分析(2021-2024)
    • 价格趋势驱动因素
    • 区域价格差异
    • 价格预测(2025-2034)
  • 定价策略
  • 新兴商业模式
  • 合规要求
  • 永续性措施
    • 永续材料评估
    • 碳足迹分析
    • 循环经济实施
    • 永续性认证和标准
    • 永续性投资报酬率分析
  • 全球消费者情绪分析
  • 专利分析

第四章:竞争格局

  • 介绍
  • 公司市占率分析
    • 按地区
      • 北美洲
      • 欧洲
      • 亚太地区
      • 拉丁美洲
      • 中东和非洲
    • 市场集中度分析
  • 对主要参与者进行竞争基准分析
    • 财务绩效比较
      • 收入
      • 利润率
      • 研发
    • 产品组合比较
      • 产品范围广度
      • 科技
      • 创新
    • 地理位置比较
      • 全球足迹分析
      • 服务网路覆盖
      • 按地区分類的市场渗透率
    • 竞争定位矩阵
      • 领导人
      • 挑战者
      • 追踪者
      • 小众玩家
    • 战略展望矩阵
  • 2021-2024 年主要发展动态
    • 併购
    • 伙伴关係与合作
    • 技术进步
    • 扩张和投资策略
    • 永续发展倡议
    • 数位转型计划
  • 新兴/新创企业竞争对手格局

第五章:市场估算与预测:依记忆体类型划分,2021-2034年

  • 主要趋势
  • 挥发性记忆体(DRAM/SRAM)
  • NOR快闪记忆体
  • NAND快闪记忆体和管理型储存
  • 新兴的非挥发性记忆体

第六章:市场估价与预测:依车辆类型划分,2021-2034年

  • 主要趋势
  • 内燃机(ICE)车辆
  • 混合动力电动车(HEV)
  • 电池电动车(BEV)
  • 自动驾驶汽车

第七章:市场估计与预测:依应用领域划分,2021-2034年

  • 主要趋势
  • 高级驾驶辅助系统(ADAS)
  • 资讯娱乐与互联
  • 动力系统和引擎控制
  • 车身电子设备和仪錶板
  • 其他的

第八章:市场估算与预测:依最终用途划分,2021-2034年

  • 主要趋势
  • 原始设备製造商 (OEM) SIA
  • 一级汽车供应商 SEMI
  • 记忆体模组製造商 JEDEC
  • 电子控制单元 (ECU) 製造商 AEC
  • 其他的

第九章:市场估计与预测:依地区划分,2021-2034年

  • 主要趋势
  • 北美洲
    • 我们
    • 加拿大
  • 欧洲
    • 德国
    • 英国
    • 法国
    • 西班牙
    • 义大利
    • 荷兰
  • 亚太地区
    • 中国
    • 印度
    • 日本
    • 澳洲
    • 韩国
  • 拉丁美洲
    • 巴西
    • 墨西哥
    • 阿根廷
  • 中东和非洲
    • 沙乌地阿拉伯
    • 南非
    • 阿联酋

第十章:公司简介

  • Analog Devices, Inc.
  • Applied Materials, Inc.
  • Denso
  • L&T Semiconductor Technologies
  • Macronix International Co., Ltd.
  • Microchip Technology Inc.
  • NXP Semiconductors NV
  • OmniVision
  • ON Semiconductor (onsemi)
  • Robert Bosch GmbH
  • ROHM Co., Ltd.
  • Semiconductor Components Industries, LLC
  • Tongfu Microelectronics (TFME)
  • Toshiba
  • Valens Semiconductor
简介目录
Product Code: 15016

The Global Automotive Memory Semiconductors Market was valued at USD 8.2 million in 2024 and is estimated to grow at a CAGR of 12.5% to reach USD 26.5 million by 2034.

Automotive Memory Semiconductors Market - IMG1

The rising adoption of advanced driver-assistance systems (ADAS) and autonomous driving technologies is fueling demand for high-performance automotive memory semiconductors. These systems require instantaneous processing of massive amounts of data from sensors, cameras, LiDAR, and radar units, creating a strong need for fast, reliable memory solutions. DRAM and NAND flash are crucial for enabling rapid storage, transfer, and analysis within complex computing platforms. As vehicles evolve toward higher automation, memory with larger capacity, low latency, and long-term endurance is becoming increasingly critical. The shift to electric and hybrid vehicles (EVs and HEVs) is further driving growth, as sophisticated electronic control units (ECUs) and battery management systems demand advanced memory for monitoring energy usage, performance, and safety. Memory components like NOR flash, NAND, and DRAM support real-time communication between sensors, powertrains, and control modules to optimize efficiency and stability.

Market Scope
Start Year2024
Forecast Year2025-2034
Start Value$8.2 Million
Forecast Value$26.5 Million
CAGR12.5%

The NAND flash and managed storage segment was valued at USD 3.2 million in 2024. Volatile memory types, including DRAM and SRAM, are essential for high-speed processing in ADAS, infotainment, and autonomous driving applications. Automakers are increasingly deploying DRAM and SRAM to handle real-time sensor data and AI-driven functions, fueling demand across next-generation vehicle platforms.

The internal combustion engine (ICE) vehicles segment generated USD 3.5 million in 2024. Traditional vehicles continue to require memory for ECUs, infotainment, and safety systems. The incorporation of ADAS, telematics, and connected vehicle features increases memory demands for real-time data processing, storage, and monitoring, sustaining the need for DRAM, SRAM, and flash solutions.

United States Automotive Memory Semiconductors Market reached USD 2.2 million in 2024 with a CAGR of 13% through 2034. Growth is driven by the adoption of EVs, connected vehicles, and ADAS. Government programs, including the CHIPS Act, promote domestic semiconductor production, enhance supply chain resilience, and stimulate innovation in automotive-grade memory. Opportunities include collaborations between OEMs and semiconductor manufacturers to develop scalable, energy-efficient memory solutions for EVs, autonomous vehicles, and over-the-air update-enabled systems.

Prominent Automotive Memory Semiconductors Market participants include Analog Devices, Inc., Applied Materials, Inc., Denso, L&T Semiconductor Technologies, Macronix International Co., Ltd., Microchip Technology Inc., NXP Semiconductors N.V., OmniVision, ON Semiconductor (onsemi), Robert Bosch GmbH, ROHM Co., Ltd., Semiconductor Components Industries, LLC, Tongfu Microelectronics (TFME), Toshiba, and Valens Semiconductor. Key strategies adopted by companies in the Global Automotive Memory Semiconductors Market include forging strategic partnerships with automakers to co-develop tailored memory solutions, pursuing mergers and acquisitions to broaden technology portfolios, and investing heavily in R&D for high-capacity, low-latency, and energy-efficient memory. Firms are also scaling up production facilities, improving supply chain resilience, and localizing semiconductor manufacturing.

Table of Contents

Chapter 1 Methodology and Scope

  • 1.1 Market scope and definition
  • 1.2 Research design
    • 1.2.1 Research approach
    • 1.2.2 Data collection methods
  • 1.3 Data mining sources
    • 1.3.1 Global
    • 1.3.2 Regional/Country
  • 1.4 Base estimates and calculations
    • 1.4.1 Base year calculation
    • 1.4.2 Key trends for market estimation
  • 1.5 Primary research and validation
    • 1.5.1 Primary sources
  • 1.6 Forecast model
  • 1.7 Research assumptions and limitations

Chapter 2 Executive Summary

  • 2.1 Industry snapshot
  • 2.2 Key market trends
    • 2.2.1 Packaging type trends
    • 2.2.2 Material trends
    • 2.2.3 Application trends
    • 2.2.4 Regional
  • 2.3 TAM Analysis, 2025-2034 (USD Billion)
  • 2.4 CXO perspective: Strategic imperatives
    • 2.4.1 Executive decision points
    • 2.4.2 critical success factors
  • 2.5 Future outlook and strategic recommendations

Chapter 3 Industry Insights

  • 3.1 Industry ecosystem analysis
    • 3.1.1 Supplier Landscape
    • 3.1.2 Profit Margin
    • 3.1.3 Cost structure
    • 3.1.4 Value addition at each stage
    • 3.1.5 Factor affecting the value chain
    • 3.1.6 Disruptions
  • 3.2 Industry impact forces
    • 3.2.1 Growth drivers
      • 3.2.1.1 Rising adoption of Advanced Driver Assistance Systems (ADAS) and autonomous driving
      • 3.2.1.2 Growing vehicle electrification (EVs and HEVs)
      • 3.2.1.3 Integration of infotainment and connected car systems
      • 3.2.1.4 Advancements in automotive-grade memory
      • 3.2.1.5 Expansion of vehicle-to-everything (V2X) communication
    • 3.2.2 Industry pitfalls and challenges
      • 3.2.2.1 High manufacturing and qualification costs of automotive-grade semiconductors
      • 3.2.2.2 Rapid technology evolution
  • 3.3 Growth potential analysis
  • 3.4 Regulatory landscape
    • 3.4.1 North America
    • 3.4.2 Europe
    • 3.4.3 Asia Pacific
    • 3.4.4 Latin America
    • 3.4.5 Middle East & Africa
  • 3.5 Porter's analysis
  • 3.6 PESTEL analysis
  • 3.7 Technology and innovation landscape
    • 3.7.1 Current technological trends
    • 3.7.2 Emerging technologies
  • 3.8 Price trends
    • 3.8.1 Historical price analysis (2021-2024)
    • 3.8.2 Price trend drivers
    • 3.8.3 Regional price variations
    • 3.8.4 Price forecast (2025-2034)
  • 3.9 Pricing strategies
  • 3.10 Emerging business models
  • 3.11 Compliance requirements
  • 3.12 Sustainability measures
    • 3.12.1 Sustainable materials assessment
    • 3.12.2 Carbon footprint analysis
    • 3.12.3 Circular economy implementation
    • 3.12.4 Sustainability certifications and standards
    • 3.12.5 Sustainability ROI analysis
  • 3.13 Global consumer sentiment analysis
  • 3.14 Patent analysis

Chapter 4 Competitive Landscape, 2024

  • 4.1 Introduction
  • 4.2 Company market share analysis
    • 4.2.1 By region
      • 4.2.1.1 North America
      • 4.2.1.2 Europe
      • 4.2.1.3 Asia Pacific
      • 4.2.1.4 Latin America
      • 4.2.1.5 Middle East & Africa
    • 4.2.2 Market Concentration Analysis
  • 4.3 Competitive benchmarking of key players
    • 4.3.1 Financial performance comparison
      • 4.3.1.1 Revenue
      • 4.3.1.2 Profit margin
      • 4.3.1.3 R&D
    • 4.3.2 Product portfolio comparison
      • 4.3.2.1 Product range breadth
      • 4.3.2.2 Technology
      • 4.3.2.3 Innovation
    • 4.3.3 Geographic presence comparison
      • 4.3.3.1 Global footprint analysis
      • 4.3.3.2 Service network coverage
      • 4.3.3.3 Market penetration by region
    • 4.3.4 Competitive positioning matrix
      • 4.3.4.1 Leaders
      • 4.3.4.2 Challengers
      • 4.3.4.3 Followers
      • 4.3.4.4 Niche players
    • 4.3.5 Strategic outlook matrix
  • 4.4 Key developments, 2021-2024
    • 4.4.1 Mergers and acquisitions
    • 4.4.2 Partnerships and collaborations
    • 4.4.3 Technological advancements
    • 4.4.4 Expansion and investment strategies
    • 4.4.5 Sustainability initiatives
    • 4.4.6 Digital transformation initiatives
  • 4.5 Emerging/ startup competitors landscape

Chapter 5 Market Estimates and Forecast, By Memory Type, 2021 - 2034 (USD Million)

  • 5.1 Key trends
  • 5.2 Volatile Memory (DRAM/SRAM)
  • 5.3 NOR flash memory
  • 5.4 NAND flash & managed storage
  • 5.5 Emerging non-volatile memory

Chapter 6 Market Estimates and Forecast, By Vehicle Type, 2021 - 2034 (USD Million)

  • 6.1 Key trends
  • 6.2 Internal Combustion Engine (ICE) Vehicles
  • 6.3 Hybrid Electric Vehicles (HEV)
  • 6.4 Battery Electric Vehicles (BEV)
  • 6.5 Autonomous vehicles

Chapter 7 Market Estimates and Forecast, By Application, 2021 - 2034 (USD Million)

  • 7.1 Key trends
  • 7.2 Advanced Driver Assistance Systems (ADAS)
  • 7.3 Infotainment & connectivity
  • 7.4 Powertrain & engine control
  • 7.5 Body electronics & instrument clusters
  • 7.6 Others

Chapter 8 Market Estimates and Forecast, By End Use, 2021 - 2034 (USD Million)

  • 8.1 Key trends
  • 8.2 Original Equipment Manufacturers (OEMs) SIA
  • 8.3 Tier-1 automotive suppliers SEMI
  • 8.4 Memory module manufacturers JEDEC
  • 8.5 Electronic Control Unit (ECU) manufacturers AEC
  • 8.6 Others

Chapter 9 Market Estimates and Forecast, By Region, 2021 - 2034 (USD Million)

  • 9.1 Key trends
  • 9.2 North America
    • 9.2.1 U.S.
    • 9.2.2 Canada
  • 9.3 Europe
    • 9.3.1 Germany
    • 9.3.2 UK
    • 9.3.3 France
    • 9.3.4 Spain
    • 9.3.5 Italy
    • 9.3.6 Netherlands
  • 9.4 Asia Pacific
    • 9.4.1 China
    • 9.4.2 India
    • 9.4.3 Japan
    • 9.4.4 Australia
    • 9.4.5 South Korea
  • 9.5 Latin America
    • 9.5.1 Brazil
    • 9.5.2 Mexico
    • 9.5.3 Argentina
  • 9.6 Middle East and Africa
    • 9.6.1 Saudi Arabia
    • 9.6.2 South Africa
    • 9.6.3 UAE

Chapter 10 Company Profiles

  • 10.1 Analog Devices, Inc.
  • 10.2 Applied Materials, Inc.
  • 10.3 Denso
  • 10.4 L&T Semiconductor Technologies
  • 10.5 Macronix International Co., Ltd.
  • 10.6 Microchip Technology Inc.
  • 10.7 NXP Semiconductors N.V.
  • 10.8 OmniVision
  • 10.9 ON Semiconductor (onsemi)
  • 10.10 Robert Bosch GmbH
  • 10.11 ROHM Co., Ltd.
  • 10.12 Semiconductor Components Industries, LLC
  • 10.13 Tongfu Microelectronics (TFME)
  • 10.14 Toshiba
  • 10.15 Valens Semiconductor