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市场调查报告书
商品编码
1528120

全球云端 EDA 市场

Cloud EDA
出版日期: | 出版商: Global Industry Analysts, Inc. | 英文 218 Pages | 商品交期: 最快1-2个工作天内

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简介目录

预计2030年全球云端EDA市场将达到137亿美元

全球云端 EDA 市场预计 2023 年为 92 亿美元，预计到 2030 年将达到 137 亿美元，2023-2030 年分析期间复合年增长率为 5.9%。半导体智慧财产权 (SIP) 是本报告分析的细分市场之一，预计复合年增长率为 6.4%，到分析期结束时将达到 51 亿美元。分析期内，电脑辅助工程 (CAE) 领域的复合年增长率预计为 6.9%。

美国市场预估成长23亿美元，中国复合年增长率为7.0%

预计 2023 年美国云端 EDA 市场规模将达 23 亿美元。中国作为全球第二大经济体，预计2030年市场规模将达19亿美元，2023-2030年分析期间复合年增长率为7.0%。其他值得注意的区域市场包括日本和加拿大，在分析期间预计复合年增长率分别为 4.8% 和 5.4%。在欧洲，德国的复合年增长率预计为 5.1%。

全球云端 EDA 市场 - 主要趋势与驱动因素总结

什么是云端 EDA？

电子设计自动化 (EDA) 工具对于设计和製造复杂的电子系统和积体电路至关重要。传统上，EDA 工具一直存储在本机伺服器和系统上，但它们越来越多地迁移到云端，提供以前不可能的功能，例如灵活性、扩充性和协作功能。云端 EDA 允许多个使用者从不同地点同时存取和处理同一个计划，从而提高生产力并缩短新电子产品的上市时间。此外，云端环境可以消除对昂贵硬体和专门 IT 维护团队的需求，从而将成本结构从资本支出模型转变为更易于管理的营运支出模型，从而显着降低资本支出。

科技进步如何增强云端 EDA？

云端处理技术的进步为云端 EDA 产业带来了福音。云端服务中提供的高效能运算 (HPC) 功能可以更快地处理对 EDA 至关重要的复杂设计和模拟任务。鑑于智慧型手机和物联网设备等电子设备的复杂性日益增加，这一点尤其重要，这些设备需要大量的模拟来确保功能和可靠性。此外，云端中安全通讯协定的进步缓解了许多资料隐私和安全问题，这些问题曾经被认为是采用云端 EDA 解决方案的主要障碍。更强大的加密方法和改进的资料处理程序使企业能够利用云端 EDA 工具，而不会损害其智慧财产权。

云端EDA在现代电子开发中扮演什么角色？

云端 EDA 不仅仅是一种操作工具；它也是快速发展的电子产业的策略资产。随着设备变得更加高度整合和多功能，电路的复杂性急剧增加。云端 EDA 提供了有效管理这种复杂性所需的运算能力和灵活性。对于新兴企业和小型企业来说，云端 EDA 的初始成本较低，使小型团队能够处理雄心勃勃的电子计划，而无需承担传统 EDA 工具的财务负担。对于大型企业来说，云端资源的可扩展性使他们能够动态分配运算资源以满足计划需求，从而优化成本和开发进度。此外，云端 EDA 支援全球团队之间的即时协作。这是全球化市场的一个重要特征，因为开发通常在多个海外地点进行。

云端EDA市场成长的驱动力是什么？

云端 EDA 市场的成长受到多种因素的推动，包括电子设计复杂性的增加、电子市场的全球扩张以及整个技术领域向基于云端基础的解决方案的转变。在消费性电子、汽车和航太等产业，对更有效率、更具成本效益和更快的设计週期的需求尤其重要，这些产业的创新压力很大且持续。此外，消费行为向个人化和高效能电子产品的转变需要更复杂的设计和测试，而云端 EDA 工具可以有效促进这一点。此外，随着世界技术基础设施的成熟，​​宽频的普及和网路安全性的增强证明了这一点，更多的公司将转向云端 EDA 解决方案。这些趋势，加上云端运算和电子设计领域的持续技术进步，预示着云端 EDA 产业将出现强劲的成长轨迹。

受访企业范例（共36家）

  • Autodesk, Inc.
  • Cadence Design Systems, Inc.
  • ANSYS, Inc.
  • Arm Ltd.
  • Aspen Technology, Inc.
  • Aldec, Inc.
  • Altair Engineering, Inc.
  • Bentley Systems, Inc.
  • CAST, Inc.
  • Achronix Semiconductor Corporation
  • Altium Limited
  • Agnisys Inc.
  • ALTEM Technologies
  • 4.ST Belgium
  • Ceetron AS

目录

第一章调查方法

第 2 章执行摘要

  • 市场概况
  • 主要企业
  • 市场趋势和驱动因素
  • 全球市场展望

第三章市场分析

  • 美国
  • 加拿大
  • 日本
  • 中国
  • 欧洲
  • 法国
  • 德国
  • 义大利
  • 英国
  • 其他欧洲国家
  • 亚太地区
  • 世界其他地区

第四章 比赛

简介目录
Product Code: MCP11069

Global Cloud EDA Market to Reach US$13.7 Billion by 2030

The global market for Cloud EDA estimated at US$9.2 Billion in the year 2023, is expected to reach US$13.7 Billion by 2030, growing at a CAGR of 5.9% over the analysis period 2023-2030. Semiconductor Intellectual Property (SIP), one of the segments analyzed in the report, is expected to record a 6.4% CAGR and reach US$5.1 Billion by the end of the analysis period. Growth in the Computer Aided Engineering (CAE) segment is estimated at 6.9% CAGR over the analysis period.

The U.S. Market is Estimated at US$2.3 Billion While China is Forecast to Grow at 7.0% CAGR

The Cloud EDA market in the U.S. is estimated at US$2.3 Billion in the year 2023. China, the world's second largest economy, is forecast to reach a projected market size of US$1.9 Billion by the year 2030 trailing a CAGR of 7.0% over the analysis period 2023-2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at a CAGR of 4.8% and 5.4% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 5.1% CAGR.

Global Cloud EDA Market - Key Trends & Drivers Summarized

What Is Cloud EDA, and How Is It Transforming the Design Landscape?

Electronic Design Automation (EDA) tools are critical for the design and production of complex electronic systems and integrated circuits. Traditionally housed on local servers and systems, EDA tools are increasingly being migrated to the cloud, providing flexibility, scalability, and collaborative capabilities that were previously unattainable. Cloud EDA enables multiple users to access and work on the same project simultaneously from different locations, enhancing productivity and reducing the time to market for new electronic products. Moreover, the cloud environment can significantly cut down capital expenditure as it eliminates the need for expensive hardware and dedicated IT maintenance teams, shifting the cost structure from a capex model to a more manageable opex model.

How Are Technological Advancements Enhancing Cloud EDA?

The advancement of cloud computing technologies has been a boon for the Cloud EDA sector. High-performance computing (HPC) capabilities available via cloud services allow for faster processing of complex design and simulation tasks that are fundamental to EDA. This is particularly important given the growing complexity of electronic devices, such as smartphones and IoT devices, which require extensive simulation to ensure functionality and reliability. Furthermore, advancements in security protocols in the cloud have alleviated many of the concerns related to data sensitivity and security, which were once seen as major barriers to the adoption of cloud EDA solutions. With stronger encryption methods and improved data handling procedures, firms can now take advantage of cloud EDA tools without compromising their intellectual property.

What Role Does Cloud EDA Play in Modern Electronics Development?

Cloud EDA is not just an operational tool; it is a strategic asset in the rapidly evolving electronics industry. As devices become more integrated and feature-rich, the underlying complexity of circuits grows exponentially. Cloud EDA provides the necessary computational power and flexibility to manage this complexity effectively. For startups and smaller firms, the lower upfront costs associated with cloud EDA mean that smaller teams can undertake ambitious electronics projects without the financial burden of traditional EDA tools. For larger enterprises, the scalability of cloud resources allows for the dynamic allocation of computing resources to match project demands, optimizing both costs and development timelines. Additionally, cloud EDA supports real-time collaboration across global teams, an indispensable feature in a globalized market where development often occurs across multiple international sites.

What Drives the Growth in the Cloud EDA Market?

The growth in the Cloud EDA market is driven by several factors, including the increasing complexity of electronic device design, the global expansion of the electronics market, and the overall shift towards cloud-based solutions across the technology sector. The need for more efficient, cost-effective, and faster design cycles is particularly critical in industries like consumer electronics, automotive, and aerospace, where the pressure to innovate is high and continuous. Additionally, the shift in consumer behavior towards personalized and high-performance electronic devices requires more sophisticated design and testing, which cloud EDA tools facilitate effectively. Moreover, as the technology infrastructure globally continues to mature—exemplified by wider broadband availability and stronger network security—more firms are likely to transition to cloud EDA solutions. These trends, coupled with ongoing technological advancements in both cloud computing and electronic design, forecast a robust growth trajectory for the Cloud EDA industry.

Select Competitors (Total 36 Featured) -

  • Autodesk, Inc.
  • Cadence Design Systems, Inc.
  • ANSYS, Inc.
  • Arm Ltd.
  • Aspen Technology, Inc.
  • Aldec, Inc.
  • Altair Engineering, Inc.
  • Bentley Systems, Inc.
  • CAST, Inc.
  • Achronix Semiconductor Corporation
  • Altium Limited
  • Agnisys Inc.
  • ALTEM Technologies
  • 4.ST Belgium
  • Ceetron AS

TABLE OF CONTENTS

I. METHODOLOGY

II. EXECUTIVE SUMMARY

  • 1. MARKET OVERVIEW
    • Cloud EDA - Global Key Competitors Percentage Market Share in 2024 (E)
    • Competitive Market Presence - Strong/Active/Niche/Trivial for Players Worldwide in 2024 (E)
    • Moving to the Cloud is a Matter of Survival for Companies in the 21st Century
    • Cloud is a Matter of Survival, A Urgent Business Need for Businesses to Stay Afloat & Excel in Competitive Markets: Global Market for Cloud Computing Services (In US$ Billion) for Years 2021, 2023, 2025 and 2027
    • Global Economic Outlook
    • Electronic Design Automation (EDA) & Cloud EDA: Definition, Importance & Benefits
    • Companies Move EDA Into the Cloud. Here's Why
    • Recent Market Activity
  • 2. FOCUS ON SELECT PLAYERS
  • 3. MARKET TRENDS & DRIVERS
    • The Storm Wrought by the Pandemic Changes Competitive Dynamics, Forcing Semiconductor Leaders to Weave New Strategies to Survive Post Pandemic Times
    • EDA & IP Are Two Sides of the Same Coin. Competitive Pressure to Secure IPs Push Up Willingness to Invest in Cloud EDA
    • IP Cores per SoC
    • The Race to Secure IP Increases Reliance on Innovative EDA Tools to Rapidly Design Chips, Especially Cloud EDA: Global Semiconductor (Silicon) Intellectual Property (SIP) (In US$ Million) for Years 2021, 2023, 2025 and 2027
    • Semiconductor Industry Comes Under Extreme Pressure to Outperform as Time-to-Market Challenges Worsens
    • Pushed to Innovate Semiconductor Companies Adopt Cloud Based EDA Tools
    • Cloud EPA to Tackle Challenges Arising from Growing Complexities in Chip Design
    • EDA in the Cloud Holds Key in Rapidly Innovating SoC Design
    • Accelerating Advanced Networking SoC Design with Cloud-Based Emulation
    • Robust Outlook for CAD, CAM and CAE to Bring Cheer to the Cloud EDA Market
    • With Adoption of Engineering Software Reaching Mainstream, Focus Now Shifts to Migration to the Cloud: Global Market for Engineering Software (CAD, CAM, CAE, AEC, & EDA) (In US$ Billion) for Years 2021, 2023, 2025 and 2027
    • Advent of Autonomous Vehicles and Rising Demand for Connected Cars to Boost Need for Innovative Chip Design
    • Autonomous Cars & Vehicle Electronification Push Up the Need for Rapid Designing of Innovative Chips: Global Market for Autonomous Vehicles (In Units) for Years 2021, 2023, 2025 and 2027
    • Healthy Demand for PCBs Bodes Well for Market Growth
    • Faster Time-to-Market Need Pushes EDA for PCB Design into the Cloud: Global Opportunity for Printed Circuit Boards (PCBs) (In US$ Billion) for Years 2021, 2023, 2025 and 2027
    • Challenges to Cloud EDA & How They Can be Overcome
  • 4. GLOBAL MARKET PERSPECTIVE
    • TABLE 1: World Recent Past, Current & Future Analysis for Cloud EDA by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 2: World 7-Year Perspective for Cloud EDA by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets for Years 2024 & 2030
    • TABLE 3: World Recent Past, Current & Future Analysis for Semiconductor Intellectual Property (SIP) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 4: World 7-Year Perspective for Semiconductor Intellectual Property (SIP) by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2024 & 2030
    • TABLE 5: World Recent Past, Current & Future Analysis for Computer Aided Engineering (CAE) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 6: World 7-Year Perspective for Computer Aided Engineering (CAE) by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2024 & 2030
    • TABLE 7: World Recent Past, Current & Future Analysis for IC Physical Design & Verification by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 8: World 7-Year Perspective for IC Physical Design & Verification by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2024 & 2030
    • TABLE 9: World Recent Past, Current & Future Analysis for Printed Circuit Board (PCB) & Multi-Chip Module (MCM) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 10: World 7-Year Perspective for Printed Circuit Board (PCB) & Multi-Chip Module (MCM) by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2024 & 2030
    • TABLE 11: World Recent Past, Current & Future Analysis for Military / Defense by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 12: World 7-Year Perspective for Military / Defense by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2024 & 2030
    • TABLE 13: World Recent Past, Current & Future Analysis for Aerospace by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 14: World 7-Year Perspective for Aerospace by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2024 & 2030
    • TABLE 15: World Recent Past, Current & Future Analysis for Telecom by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 16: World 7-Year Perspective for Telecom by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2024 & 2030
    • TABLE 17: World Recent Past, Current & Future Analysis for Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 18: World 7-Year Perspective for Automotive by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2024 & 2030
    • TABLE 19: World Recent Past, Current & Future Analysis for Other Applications by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 20: World 7-Year Perspective for Other Applications by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2024 & 2030
    • TABLE 21: World Cloud EDA Market Analysis of Annual Sales in US$ Million for Years 2020 through 2030

III. MARKET ANALYSIS

  • UNITED STATES
    • Cloud EDA Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United States for 2024 (E)
    • TABLE 22: USA Recent Past, Current & Future Analysis for Cloud EDA by Product Segment - Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 23: USA 7-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Revenues for Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) for the Years 2024 & 2030
    • TABLE 24: USA Recent Past, Current & Future Analysis for Cloud EDA by Application - Military / Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 25: USA 7-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Revenues for Military / Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2024 & 2030
  • CANADA
    • TABLE 26: Canada Recent Past, Current & Future Analysis for Cloud EDA by Product Segment - Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 27: Canada 7-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Revenues for Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) for the Years 2024 & 2030
    • TABLE 28: Canada Recent Past, Current & Future Analysis for Cloud EDA by Application - Military / Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 29: Canada 7-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Revenues for Military / Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2024 & 2030
  • JAPAN
    • Cloud EDA Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Japan for 2024 (E)
    • TABLE 30: Japan Recent Past, Current & Future Analysis for Cloud EDA by Product Segment - Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 31: Japan 7-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Revenues for Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) for the Years 2024 & 2030
    • TABLE 32: Japan Recent Past, Current & Future Analysis for Cloud EDA by Application - Military / Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 33: Japan 7-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Revenues for Military / Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2024 & 2030
  • CHINA
    • Cloud EDA Market Presence - Strong/Active/Niche/Trivial - Key Competitors in China for 2024 (E)
    • TABLE 34: China Recent Past, Current & Future Analysis for Cloud EDA by Product Segment - Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 35: China 7-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Revenues for Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) for the Years 2024 & 2030
    • TABLE 36: China Recent Past, Current & Future Analysis for Cloud EDA by Application - Military / Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 37: China 7-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Revenues for Military / Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2024 & 2030
  • EUROPE
    • Cloud EDA Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Europe for 2024 (E)
    • TABLE 38: Europe Recent Past, Current & Future Analysis for Cloud EDA by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 39: Europe 7-Year Perspective for Cloud EDA by Geographic Region - Percentage Breakdown of Value Revenues for France, Germany, Italy, UK and Rest of Europe Markets for Years 2024 & 2030
    • TABLE 40: Europe Recent Past, Current & Future Analysis for Cloud EDA by Product Segment - Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 41: Europe 7-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Revenues for Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) for the Years 2024 & 2030
    • TABLE 42: Europe Recent Past, Current & Future Analysis for Cloud EDA by Application - Military / Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 43: Europe 7-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Revenues for Military / Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2024 & 2030
  • FRANCE
    • Cloud EDA Market Presence - Strong/Active/Niche/Trivial - Key Competitors in France for 2024 (E)
    • TABLE 44: France Recent Past, Current & Future Analysis for Cloud EDA by Product Segment - Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 45: France 7-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Revenues for Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) for the Years 2024 & 2030
    • TABLE 46: France Recent Past, Current & Future Analysis for Cloud EDA by Application - Military / Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 47: France 7-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Revenues for Military / Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2024 & 2030
  • GERMANY
    • Cloud EDA Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Germany for 2024 (E)
    • TABLE 48: Germany Recent Past, Current & Future Analysis for Cloud EDA by Product Segment - Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 49: Germany 7-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Revenues for Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) for the Years 2024 & 2030
    • TABLE 50: Germany Recent Past, Current & Future Analysis for Cloud EDA by Application - Military / Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 51: Germany 7-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Revenues for Military / Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2024 & 2030
  • ITALY
    • TABLE 52: Italy Recent Past, Current & Future Analysis for Cloud EDA by Product Segment - Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 53: Italy 7-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Revenues for Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) for the Years 2024 & 2030
    • TABLE 54: Italy Recent Past, Current & Future Analysis for Cloud EDA by Application - Military / Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 55: Italy 7-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Revenues for Military / Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2024 & 2030
  • UNITED KINGDOM
    • Cloud EDA Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United Kingdom for 2024 (E)
    • TABLE 56: UK Recent Past, Current & Future Analysis for Cloud EDA by Product Segment - Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 57: UK 7-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Revenues for Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) for the Years 2024 & 2030
    • TABLE 58: UK Recent Past, Current & Future Analysis for Cloud EDA by Application - Military / Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 59: UK 7-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Revenues for Military / Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2024 & 2030
  • REST OF EUROPE
    • TABLE 60: Rest of Europe Recent Past, Current & Future Analysis for Cloud EDA by Product Segment - Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 61: Rest of Europe 7-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Revenues for Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) for the Years 2024 & 2030
    • TABLE 62: Rest of Europe Recent Past, Current & Future Analysis for Cloud EDA by Application - Military / Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 63: Rest of Europe 7-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Revenues for Military / Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2024 & 2030
  • ASIA-PACIFIC
    • Cloud EDA Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Asia-Pacific for 2024 (E)
    • TABLE 64: Asia-Pacific Recent Past, Current & Future Analysis for Cloud EDA by Product Segment - Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 65: Asia-Pacific 7-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Revenues for Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) for the Years 2024 & 2030
    • TABLE 66: Asia-Pacific Recent Past, Current & Future Analysis for Cloud EDA by Application - Military / Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 67: Asia-Pacific 7-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Revenues for Military / Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2024 & 2030
  • REST OF WORLD
    • TABLE 68: Rest of World Recent Past, Current & Future Analysis for Cloud EDA by Product Segment - Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 69: Rest of World 7-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Revenues for Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) for the Years 2024 & 2030
    • TABLE 70: Rest of World Recent Past, Current & Future Analysis for Cloud EDA by Application - Military / Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 71: Rest of World 7-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Revenues for Military / Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2024 & 2030

IV. COMPETITION