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市场调查报告书
商品编码
1579783

G.Fast晶片组全球市场

G.Fast Chipsets
出版日期: | 出版商: Global Industry Analysts, Inc. | 英文 223 Pages | 商品交期: 最快1-2个工作天内

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简介目录

到 2030 年，G.Fast 晶片组的全球市场将达到 169 亿美元

预计 2023 年全球 G.Fast 晶片组市场规模为 35 亿美元，预计到 2030 年将达到 169 亿美元，2023-2030 年分析期间复合年增长率为 25.5%。 CPE 部署是本报告分析的细分市场之一，预计复合年增长率为 22.9%，到分析期结束时将达到 95 亿美元。在分析期间，DPU 部署部分的复合年增长率预计为 29.4%。

美国市场预估成长10亿美元，中国复合年增长率24.5%

预计2023年美国G.Fast晶片组市场规模将达10亿美元。中国作为全球第二大经济体，预计2030年市场规模将达29亿美元，2023-2030年分析期间复合年增长率为24.5%。其他值得注意的区域市场包括日本和加拿大，在分析期间预计复合年增长率分别为 22.9% 和 22.2%。在欧洲，德国的复合年增长率预计约为 17.8%。

全球 G.Fast 晶片组市场 – 主要趋势与驱动因素总结

G.Fast 晶片组将如何改变宽频连线和通讯？

G.Fast 晶片组透过现有铜质电话线实现超高速互联网，从而彻底改变了宽频连接，使电信业者能够连接Gigabit位元。 G.fast 技术代表“千兆位元快速”，是数位用户线路(DSL) 技术，旨在利用大多数都市区现有的铜缆基础设施。 G.Fast 晶片组是实现这一目标的核心组件，使互联网服务提供商 (ISP) 能够利用更短的铜缆环路提供类似光纤的高速宽频服务。

对于升级到全光纤到府 (FTTH) 网路成本高或物流困难的地区，引进 G.Fast 晶片组尤其重要。 G.fast 允许通讯业者将光纤引入路边机柜等分配点，并使用铜线进行最终连接，从而显着减少对新基础设施的需求。 G.Fast 晶片组提供高达 1Gbps 的速度，支援 4K 视讯串流、线上游戏、云端运算和智慧家庭技术等需要频宽的应用。随着全球对高速网路的需求不断增加，G.Fast 晶片组在弥合数位落差和加速Gigabit宽频服务的推出方面发挥关键作用。

哪些技术进步正在提升 G.Fast 晶片组的效能？

G.Fast晶片组的效能和功能透过多项技术进步得到了显着提高，使其更有效率并能够适应各种网路环境。其中一项关键创新是向量化技术的发展，该技术有助于减少相邻铜线之间的干扰（也称为串扰）。在多用户住宅(MDU) 和密集的都市区，多根铜线紧密相连，串扰会显着降低讯号品质。采用向量化技术的 G.Fast 晶片组可主动消除此干扰，从而实现更稳定、更快速的连接。因此，即使在充满挑战的环境中，G.fast 网路也能够实现更高的频宽和更高的可靠性。

另一个重大进步是在 G.Fast 晶片组中引入动态时间分配 (DTA)。 DTA允许晶片组动态分配上行和下行频宽，以满足使用者的即时需求。例如，当家庭将大檔案上传到云端时，晶片组会暂时增加上传频宽以适应资料传输，然后下载频宽以完成视讯串流等任务，您可以转移优先顺序。这种灵活性改善了整体用户体验，并使 G.fast 成为更通用的高速宽频解决方案，尤其是在频宽需求不对称的环境中。

进一步的创新包括增强 G.fast 以支援更高的频率和更长的距离。 G.fast 的早期版本在非常短的铜环（通常为 300 公尺或更短）上效果最佳，限制了其在某些环境中的应用。然而，晶片组设计的进步使G.fast的覆盖范围增加到约500公尺或更长，使其能够部署在更广泛的场景中，包括农村地区和大型建筑。此外，新的G.Fast晶片组的运作频率高达212MHz，可实现更快的资料传输和更高的频宽利用率。这些技术改进使G.Fast晶片组能够适应各种网路情况，使ISP能够在各种部署场景中提供可靠的Gigabit宽频。

G.Fast晶片如何支援都市区Gigabit宽频部署？

G.Fast晶片组在支援都市区Gigabit宽频业务部署方面发挥关键作用。在都市区，特别是公寓和公寓等多用户住宅(MDU)，G.fast 是实现光纤般速度且无需更换现有铜基础设施的理想解决方案。电讯可以透过在建筑物中安装光纤并使用 G.Fast 晶片组透过连接各个公寓的短铜环路提供超高速互联网来节省安装时间和成本。

G.fast 利用现有基础设施的能力使其成为人口稠密地区的一个有吸引力的选择，因为在这些地区挖掘道路来安装新的光纤电缆成本高昂且具有破坏性。透过在城市环境中部署G.fast技术，电信业者可以提供与FTTH相当的Gigabit速度，使居民能够存取4K和8K视讯串流、线上游戏和云端基础的应用程式等宽频服务。 G.fast 网路的部署速度比全光纤网路更快，使 ISP 能够快速满足对更快宽频不断增长的需求。

在升级到全光纤网路在经济和物流方面都存在困难的农村地区，G.Fast 晶片组提供了有效的解决方案，为服务不足的地区带来更快的网路速度。透过将光纤覆盖范围扩展到附近的分配点和节点，并在现有铜线上使用 G.fast 进行最终连接，通讯业者可以避免与远距光纤安装相关的高成本，从而显着提高速度。这使得 G.fast 成为解决数位落差的关键技术，为网路存取传统上落后于城市中心的农村和偏远地区带来Gigabit宽频。随着越来越多的国家开始建立全国性的Gigabit网络，越来越多的国家开始部署 G.Fast 晶片组，为都市区和农村地区提供可扩展且经济实惠的超高速宽频途径。

推动G.fast晶片组市场成长的因素有哪些？

G.fast 晶片组市场的成长受到多种因素的推动，包括全球对高速互联网需求的增加、铜线网路升级成本效益的提高以及旨在扩大宽频接入的政府倡议。随着消费者越来越多地采用串流媒体服务、云端运算、线上游戏和视讯会议等频宽密集型应用，对更快、更可靠的宽频服务的需求是关键驱动因素之一。随着 4K 和 8K 视讯、虚拟实境和智慧家居设备的兴起，传统 DSL 和较旧的铜基技术已不足以满足高速互联网的需求。 G.fast通讯业者为营运商提供了实用的解决方案，可将其网路升级到Gigabit位元速度，而无需进行全光纤部署所需的巨额投资。

G.fast的高性价比也是推动市场成长的重要因素。与需要大量基础设施投资的光纤到户 (FTTH) 部署不同，G.fast 利用现有的铜缆基础设施进行最后一英里连接，从而减少了部署时间和成本。这使得 G.fast 对于希望增强宽频服务同时降低成本的电信业者来说成为一个有吸引力的选择。随着对Gigabit速度的需求增加，G.fast 将传统铜网路与完整的光纤基础设施连接起来，使营运商能够在新光纤安装不切实际或成本过高的情况下连接新的光纤安装。

政府扩大宽频接入和弥合数位鸿沟的努力也推动了 G.Fast 晶片组的采用。许多国家都有雄心勃勃的目标，即向所有公民提供Gigabit位元互联网，特别是在服务不足的地区。 G.fast 技术使通讯业者能够快速、经济地升级其网路以实现这些目标，而无需用光纤替换整个铜缆网路。随着各国政府继续推动普及宽频接入，G.Fast 晶片组将在帮助通讯业者实现这些目标方面发挥关键作用，特别是在光纤安装昂贵且困难的地区。

G.Fast晶片组的未来趋势是什么？

一些新趋势正在塑造 G.Fast 晶片组的未来发展，包括 5G 技术的整合、多GigabitG.fast 解决方案的进步以及混合光纤和铜缆网路的融合。最重要的趋势之一是 G.fast 和 5G 网路的交叉。随着通讯业者部署 5G 基础设施，他们越来越依赖回程传输光纤来支援 5G 所需的高资料传输和低延迟。 G.fast 技术被用作补充解决方案，允许通讯业者将光纤延伸到家庭和建筑物，而无需到处安装光纤。透过使用 G.fast 为铜线的最终连接提供动力，即使在无法部署光纤的地区，营运商也可以为固定和行动用户提供Gigabit速度的 5G 服务。

多GigabitG.fast 技术的进步也正在塑造该市场的未来。目前的 G.fast 解决方案通常提供高达 1Gbps 的速度，但新版本的 G.fast 正在开发中，以支援更快的速度，接近 2Gbps 甚至更高。这种多Gigabit的能力对于满足云端游戏、虚拟实境和 8K 视讯串流等资料密集型应用程式不断增长的需求至关重要。随着消费者对超高速互联网的需求不断增长，多GigabitG.Fast晶片组的开发将使通讯业者能够在不安装光纤的情况下提供尖端的宽频服务，从而使G.Fast在业界保持竞争力。

另一个重要趋势是混合光纤和铜缆网路的融合，G.fast 在弥合光纤和铜缆基础设施之间的差距方面发挥着重要作用。为了更有效地提供Gigabit速度，通讯业者越来越多地采用混合网路模型，将光纤的优势与铜缆的灵活性结合起来。 G.fast 允许营运商将光纤延伸到邻近的节点和街道机柜，使用现有的铜线最终连接到家庭和企业。这种混合方法降低了全光纤部署的成本和复杂性，同时提供现代应用所需的高速网路。随着混合网路模型变得越来越普遍，G.Fast 晶片组将继续发展以支援更快的速度、远距和更灵活的网路架构。

在这些趋势中，G.Fast 晶片组的未来将由多Gigabit功能的演进、与 5G 网路的整合以及光纤和铜缆网路的持续融合来定义。这些创新确保 G.fast 仍然是从城市高层建筑到农村社区的各种部署场景中提供高速宽频的重要技术。随着晶片组设计的不断发展，G.fast 技术将在推动Gigabit宽频连接领域发挥更重要的作用。

受访企业范例（共46家）

  • Broadcom Ltd.
  • BT Group PLC
  • CenturyLink, Inc.
  • Chongqing Polycomp International Corporation
  • Marvell Technology Group Ltd.
  • Mediatek, Inc.
  • Metanoia Communications, Inc.
  • Qualcomm, Inc.
  • Sckipio Technologies
  • Swisscom AG

目录

第一章调查方法

第 2 章执行摘要

  • 市场概况
  • 主要企业
  • 市场趋势和驱动因素
  • 全球市场展望

第三章市场分析

  • 美国
  • 加拿大
  • 日本
  • 中国
  • 欧洲
  • 法国
  • 德国
  • 义大利
  • 英国
  • 其他欧洲国家
  • 亚太地区
  • 其他领域

第四章 比赛

简介目录
Product Code: MCP12110

Global G.Fast Chipsets Market to Reach US$16.9 Billion by 2030

The global market for G.Fast Chipsets estimated at US$3.5 Billion in the year 2023, is expected to reach US$16.9 Billion by 2030, growing at a CAGR of 25.5% over the analysis period 2023-2030. CPE Deployment, one of the segments analyzed in the report, is expected to record a 22.9% CAGR and reach US$9.5 Billion by the end of the analysis period. Growth in the DPU Deployment segment is estimated at 29.4% CAGR over the analysis period.

The U.S. Market is Estimated at US$1.0 Billion While China is Forecast to Grow at 24.5% CAGR

The G.Fast Chipsets market in the U.S. is estimated at US$1.0 Billion in the year 2023. China, the world's second largest economy, is forecast to reach a projected market size of US$2.9 Billion by the year 2030 trailing a CAGR of 24.5% over the analysis period 2023-2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at a CAGR of 22.9% and 22.2% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 17.8% CAGR.

Global G.Fast Chipsets Market - Key Trends and Drivers Summarized

How Are G.fast Chipsets Transforming Broadband Connectivity and Telecommunications?

G.fast chipsets are revolutionizing broadband connectivity by enabling ultra-fast internet speeds over existing copper telephone lines, helping telecommunications companies deliver gigabit-level speeds without the need for costly fiber optic installations to every home. G.fast technology, which stands for "Gigabit fast," is a digital subscriber line (DSL) technology designed to leverage the copper infrastructure that already exists in most urban areas. G.fast chipsets are the core components that make this possible, allowing internet service providers (ISPs) to offer high-speed broadband services, similar to fiber optic performance, by utilizing shorter copper loops.

The introduction of G.fast chipsets has been particularly significant in areas where upgrading to full fiber-to-the-home (FTTH) networks is cost-prohibitive or logistically challenging. By using G.fast, telecom operators can bring fiber to distribution points like street cabinets and use copper lines for the final connection, drastically reducing the need for new infrastructure. G.fast chipsets deliver speeds of up to 1 Gbps, supporting bandwidth-intensive applications like 4K video streaming, online gaming, cloud computing, and smart home technologies. As global demand for high-speed internet grows, G.fast chipsets are playing a crucial role in bridging the digital divide and accelerating the rollout of gigabit broadband services.

What Technological Advancements Are Improving the Performance of G.fast Chipsets?

Several technological advancements are significantly enhancing the performance and capabilities of G.fast chipsets, making them more efficient and adaptable to varying network environments. One of the key innovations is the development of vectoring technology, which helps reduce interference between neighboring copper lines—also known as crosstalk. In multi-dwelling units (MDUs) and dense urban areas, where multiple copper lines run close together, crosstalk can significantly degrade signal quality. G.fast chipsets equipped with vectoring technology actively cancel this interference, allowing for more stable and higher-speed connections. As a result, G.fast networks can achieve higher bandwidths with improved reliability, even in challenging environments.

Another major advancement is the introduction of dynamic time allocation (DTA) in G.fast chipsets, which enables more efficient use of bandwidth based on network demand. DTA allows the chipset to allocate upstream and downstream bandwidth dynamically, adjusting to the real-time needs of the user. For example, if a household is uploading large files to the cloud, the chipset can temporarily increase upstream capacity to accommodate the data transfer, and then shift back to prioritizing downstream bandwidth for tasks like video streaming. This flexibility improves the overall user experience, making G.fast a more versatile solution for high-speed broadband, especially in environments with asymmetric bandwidth demands.

Further innovations include the expansion of G.fast to support higher frequencies and longer distances. Early versions of G.fast worked best over very short copper loops, typically under 300 meters, limiting its application in certain settings. However, advancements in chipset design have extended the reach of G.fast to approximately 500 meters or more, allowing it to be deployed in a wider range of scenarios, such as in rural areas or larger buildings. In addition, newer G.fast chipsets can operate at frequencies up to 212 MHz, enabling even faster data transmission and higher bandwidth availability. These technological improvements are making G.fast chipsets more adaptable to a variety of network conditions, ensuring that ISPs can deliver reliable gigabit broadband across different deployment scenarios.

How Are G.fast Chipsets Supporting the Rollout of Gigabit Broadband in Urban and Rural Areas?

G.fast chipsets are playing a crucial role in supporting the rollout of gigabit broadband services in both urban and rural areas, providing a cost-effective and efficient way to deliver high-speed internet without the need for full fiber deployment. In urban areas, especially in multi-dwelling units (MDUs) like apartment buildings and condominiums, G.fast is an ideal solution for delivering fiber-like speeds without the need to replace existing copper infrastructure. Telecom operators can deploy fiber to the building and use G.fast chipsets to deliver ultra-fast internet over the short copper loops that connect individual apartments, significantly reducing installation time and costs.

This ability to leverage existing infrastructure makes G.fast an attractive option in densely populated areas, where digging up streets to lay new fiber cables is both expensive and disruptive. By deploying G.fast technology in urban environments, telecom companies can offer gigabit speeds comparable to FTTH, enabling residents to access high-bandwidth services such as 4K and 8K video streaming, online gaming, and cloud-based applications. This approach also speeds up the rollout of high-speed internet services, as G.fast networks can be deployed more quickly than full fiber installations, allowing ISPs to meet growing demand for faster broadband in a shorter time frame.

In rural areas, where upgrading to full fiber is often financially or logistically challenging, G.fast chipsets provide an effective solution for bringing faster internet speeds to underserved communities. By extending the reach of fiber to nearby distribution points or nodes and using G.fast over the existing copper lines for the final connection, telecom operators can offer significant speed improvements without the high costs associated with laying fiber across long distances. This makes G.fast a key technology in addressing the digital divide, bringing gigabit broadband to rural and remote areas where internet access has traditionally lagged behind urban centers. As more countries push for nationwide gigabit-capable networks, G.fast chipsets are increasingly being deployed to provide a scalable, affordable path to ultra-fast broadband in both urban and rural regions.

What’s Driving the Growth of the G.fast Chipset Market?

Several factors are driving the growth of the G.fast chipset market, including the rising global demand for high-speed internet, the increasing cost-effectiveness of upgrading copper networks, and government initiatives aimed at expanding broadband access. One of the primary drivers is the growing need for faster and more reliable broadband services as consumers adopt bandwidth-intensive applications such as streaming services, cloud computing, online gaming, and video conferencing. With the rise of 4K and 8K video, virtual reality, and smart home devices, traditional DSL and older copper-based technologies are no longer sufficient to meet the demand for high-speed internet. G.fast technology provides telecom operators with a practical solution to upgrade their networks to gigabit speeds without the massive investments required for full fiber deployment.

The cost-effectiveness of G.fast is another key factor contributing to market growth. Unlike fiber-to-the-home (FTTH) installations, which require significant infrastructure investment, G.fast leverages the existing copper infrastructure for the last-mile connection, reducing both deployment time and costs. This makes G.fast an attractive option for telecom companies looking to enhance broadband services while keeping costs manageable. As the demand for gigabit speeds increases, G.fast provides a bridge between legacy copper networks and full fiber infrastructure, allowing operators to deliver high-speed internet in areas where laying new fiber is either impractical or cost-prohibitive.

Government initiatives to expand broadband access and close the digital divide are also driving the adoption of G.fast chipsets. Many countries have set ambitious goals to provide gigabit-capable internet to all citizens, especially in underserved and rural areas. G.fast technology allows telecom operators to quickly and affordably upgrade their networks to meet these goals without having to replace entire copper networks with fiber. As governments continue to push for universal broadband access, G.fast chipsets will play a critical role in helping telecom providers achieve these objectives, particularly in areas where fiber installation is too expensive or difficult.

What Future Trends Are Shaping the Development of G.fast Chipsets?

Several emerging trends are shaping the future development of G.fast chipsets, including the integration of 5G technology, advancements in multi-gigabit G.fast solutions, and the convergence of hybrid fiber-copper networks. One of the most significant trends is the intersection of G.fast and 5G networks. As telecom operators roll out 5G infrastructure, they are increasingly relying on fiber for backhaul to support the high data rates and low latency required by 5G. G.fast technology is being used as a complementary solution, enabling operators to extend fiber to the premises or buildings without the need for full fiber deployment. By using G.fast to enhance the final connection over copper lines, operators can deliver gigabit speeds for 5G services in areas where it is not feasible to deploy fiber, creating a seamless, high-speed broadband experience for both fixed and mobile users.

Advancements in multi-gigabit G.fast technology are also shaping the future of this market. While current G.fast solutions typically offer speeds of up to 1 Gbps, newer versions of G.fast are being developed to support even higher speeds, approaching 2 Gbps and beyond. This multi-gigabit capability is critical for meeting the growing demands of data-intensive applications such as cloud gaming, virtual reality, and 8K video streaming. As consumer demand for ultra-fast internet continues to rise, the development of multi-gigabit G.fast chipsets will enable telecom operators to deliver cutting-edge broadband services without the need for full fiber installations, ensuring that G.fast remains a competitive technology in the evolving broadband landscape.

Another key trend is the convergence of hybrid fiber-copper networks, where G.fast plays an essential role in bridging the gap between fiber and copper infrastructure. Telecom operators are increasingly adopting hybrid network models that combine the strengths of fiber optics with the flexibility of copper to deliver gigabit speeds more efficiently. G.fast allows operators to extend fiber to neighborhood nodes or street cabinets and use existing copper wiring for the final connection to homes and businesses. This hybrid approach reduces the cost and complexity of full fiber deployment while still providing the high-speed internet required for modern applications. As the hybrid network model becomes more widespread, G.fast chipsets will continue to evolve to support higher speeds, longer distances, and more flexible network architectures.

As these trends unfold, the future of G.fast chipsets will be defined by advancements in multi-gigabit capabilities, integration with 5G networks, and the continued convergence of fiber and copper networks. These innovations will ensure that G.fast remains a vital technology for delivering high-speed broadband in a variety of deployment scenarios, from urban high-rises to rural communities. With ongoing developments in chipset design, G.fast technology is poised to play an even more prominent role in the global push for gigabit broadband connectivity.

Select Competitors (Total 46 Featured) -

  • Broadcom Ltd.
  • BT Group PLC
  • CenturyLink, Inc.
  • Chongqing Polycomp International Corporation
  • Marvell Technology Group Ltd.
  • Mediatek, Inc.
  • Metanoia Communications, Inc.
  • Qualcomm, Inc.
  • Sckipio Technologies
  • Swisscom AG

TABLE OF CONTENTS

I. METHODOLOGY

II. EXECUTIVE SUMMARY

  • 1. MARKET OVERVIEW
    • Influencer Market Insights
    • Global Economic Update
    • G.Fast Chipsets - Global Key Competitors Percentage Market Share in 2024 (E)
    • Competitive Market Presence - Strong/Active/Niche/Trivial for Players Worldwide in 2024 (E)
  • 2. FOCUS ON SELECT PLAYERS
  • 3. MARKET TRENDS & DRIVERS
    • Rising Demand for High-Speed Internet Services Drives Growth in G.Fast Chipset Market
    • Consumer Trends Toward Streaming Services and High-Bandwidth Applications
    • Role of G.Fast in Reducing Digital Divide in Urban and Rural Areas
    • Economic Analysis of G.Fast Deployment Compared to Full Fiber Solutions
    • Global Expansion of G.Fast Technology in Developing Telecom Markets
    • Role of G.Fast in Smart Home and IoT Connectivity
  • 4. GLOBAL MARKET PERSPECTIVE
    • TABLE 1: World G.Fast Chipsets Market Analysis of Annual Sales in US$ Million for Years 2014 through 2030
    • TABLE 2: World Recent Past, Current & Future Analysis for G.Fast Chipsets by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 3: World 7-Year Perspective for G.Fast Chipsets by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets for Years 2024 & 2030
    • TABLE 4: World Recent Past, Current & Future Analysis for CPE Deployment by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 5: World 7-Year Perspective for CPE Deployment by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2024 & 2030
    • TABLE 6: World Recent Past, Current & Future Analysis for DPU Deployment by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 7: World 7-Year Perspective for DPU Deployment by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2024 & 2030
    • TABLE 8: World Recent Past, Current & Future Analysis for Residential End-User by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 9: World 7-Year Perspective for Residential End-User by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2024 & 2030
    • TABLE 10: World Recent Past, Current & Future Analysis for Commercial End-User by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 11: World 7-Year Perspective for Commercial End-User by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2024 & 2030

III. MARKET ANALYSIS

  • UNITED STATES
    • G.Fast Chipsets Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United States for 2024 (E)
    • TABLE 12: USA Recent Past, Current & Future Analysis for G.Fast Chipsets by Deployment Type - CPE Deployment and DPU Deployment - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 13: USA 7-Year Perspective for G.Fast Chipsets by Deployment Type - Percentage Breakdown of Value Sales for CPE Deployment and DPU Deployment for the Years 2024 & 2030
    • TABLE 14: USA Recent Past, Current & Future Analysis for G.Fast Chipsets by End-user - Residential End-User and Commercial End-User - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 15: USA 7-Year Perspective for G.Fast Chipsets by End-user - Percentage Breakdown of Value Sales for Residential End-User and Commercial End-User for the Years 2024 & 2030
  • CANADA
    • TABLE 16: Canada Recent Past, Current & Future Analysis for G.Fast Chipsets by Deployment Type - CPE Deployment and DPU Deployment - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 17: Canada 7-Year Perspective for G.Fast Chipsets by Deployment Type - Percentage Breakdown of Value Sales for CPE Deployment and DPU Deployment for the Years 2024 & 2030
    • TABLE 18: Canada Recent Past, Current & Future Analysis for G.Fast Chipsets by End-user - Residential End-User and Commercial End-User - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 19: Canada 7-Year Perspective for G.Fast Chipsets by End-user - Percentage Breakdown of Value Sales for Residential End-User and Commercial End-User for the Years 2024 & 2030
  • JAPAN
    • G.Fast Chipsets Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Japan for 2024 (E)
    • TABLE 20: Japan Recent Past, Current & Future Analysis for G.Fast Chipsets by Deployment Type - CPE Deployment and DPU Deployment - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 21: Japan 7-Year Perspective for G.Fast Chipsets by Deployment Type - Percentage Breakdown of Value Sales for CPE Deployment and DPU Deployment for the Years 2024 & 2030
    • TABLE 22: Japan Recent Past, Current & Future Analysis for G.Fast Chipsets by End-user - Residential End-User and Commercial End-User - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 23: Japan 7-Year Perspective for G.Fast Chipsets by End-user - Percentage Breakdown of Value Sales for Residential End-User and Commercial End-User for the Years 2024 & 2030
  • CHINA
    • G.Fast Chipsets Market Presence - Strong/Active/Niche/Trivial - Key Competitors in China for 2024 (E)
    • TABLE 24: China Recent Past, Current & Future Analysis for G.Fast Chipsets by Deployment Type - CPE Deployment and DPU Deployment - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 25: China 7-Year Perspective for G.Fast Chipsets by Deployment Type - Percentage Breakdown of Value Sales for CPE Deployment and DPU Deployment for the Years 2024 & 2030
    • TABLE 26: China Recent Past, Current & Future Analysis for G.Fast Chipsets by End-user - Residential End-User and Commercial End-User - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 27: China 7-Year Perspective for G.Fast Chipsets by End-user - Percentage Breakdown of Value Sales for Residential End-User and Commercial End-User for the Years 2024 & 2030
  • EUROPE
    • G.Fast Chipsets Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Europe for 2024 (E)
    • TABLE 28: Europe Recent Past, Current & Future Analysis for G.Fast Chipsets by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 29: Europe 7-Year Perspective for G.Fast Chipsets by Geographic Region - Percentage Breakdown of Value Sales for France, Germany, Italy, UK and Rest of Europe Markets for Years 2024 & 2030
    • TABLE 30: Europe Recent Past, Current & Future Analysis for G.Fast Chipsets by Deployment Type - CPE Deployment and DPU Deployment - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 31: Europe 7-Year Perspective for G.Fast Chipsets by Deployment Type - Percentage Breakdown of Value Sales for CPE Deployment and DPU Deployment for the Years 2024 & 2030
    • TABLE 32: Europe Recent Past, Current & Future Analysis for G.Fast Chipsets by End-user - Residential End-User and Commercial End-User - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 33: Europe 7-Year Perspective for G.Fast Chipsets by End-user - Percentage Breakdown of Value Sales for Residential End-User and Commercial End-User for the Years 2024 & 2030
  • FRANCE
    • G.Fast Chipsets Market Presence - Strong/Active/Niche/Trivial - Key Competitors in France for 2024 (E)
    • TABLE 34: France Recent Past, Current & Future Analysis for G.Fast Chipsets by Deployment Type - CPE Deployment and DPU Deployment - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 35: France 7-Year Perspective for G.Fast Chipsets by Deployment Type - Percentage Breakdown of Value Sales for CPE Deployment and DPU Deployment for the Years 2024 & 2030
    • TABLE 36: France Recent Past, Current & Future Analysis for G.Fast Chipsets by End-user - Residential End-User and Commercial End-User - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 37: France 7-Year Perspective for G.Fast Chipsets by End-user - Percentage Breakdown of Value Sales for Residential End-User and Commercial End-User for the Years 2024 & 2030
  • GERMANY
    • G.Fast Chipsets Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Germany for 2024 (E)
    • TABLE 38: Germany Recent Past, Current & Future Analysis for G.Fast Chipsets by Deployment Type - CPE Deployment and DPU Deployment - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 39: Germany 7-Year Perspective for G.Fast Chipsets by Deployment Type - Percentage Breakdown of Value Sales for CPE Deployment and DPU Deployment for the Years 2024 & 2030
    • TABLE 40: Germany Recent Past, Current & Future Analysis for G.Fast Chipsets by End-user - Residential End-User and Commercial End-User - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 41: Germany 7-Year Perspective for G.Fast Chipsets by End-user - Percentage Breakdown of Value Sales for Residential End-User and Commercial End-User for the Years 2024 & 2030
  • ITALY
    • TABLE 42: Italy Recent Past, Current & Future Analysis for G.Fast Chipsets by Deployment Type - CPE Deployment and DPU Deployment - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 43: Italy 7-Year Perspective for G.Fast Chipsets by Deployment Type - Percentage Breakdown of Value Sales for CPE Deployment and DPU Deployment for the Years 2024 & 2030
    • TABLE 44: Italy Recent Past, Current & Future Analysis for G.Fast Chipsets by End-user - Residential End-User and Commercial End-User - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 45: Italy 7-Year Perspective for G.Fast Chipsets by End-user - Percentage Breakdown of Value Sales for Residential End-User and Commercial End-User for the Years 2024 & 2030
  • UNITED KINGDOM
    • G.Fast Chipsets Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United Kingdom for 2024 (E)
    • TABLE 46: UK Recent Past, Current & Future Analysis for G.Fast Chipsets by Deployment Type - CPE Deployment and DPU Deployment - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 47: UK 7-Year Perspective for G.Fast Chipsets by Deployment Type - Percentage Breakdown of Value Sales for CPE Deployment and DPU Deployment for the Years 2024 & 2030
    • TABLE 48: UK Recent Past, Current & Future Analysis for G.Fast Chipsets by End-user - Residential End-User and Commercial End-User - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 49: UK 7-Year Perspective for G.Fast Chipsets by End-user - Percentage Breakdown of Value Sales for Residential End-User and Commercial End-User for the Years 2024 & 2030
  • REST OF EUROPE
    • TABLE 50: Rest of Europe Recent Past, Current & Future Analysis for G.Fast Chipsets by Deployment Type - CPE Deployment and DPU Deployment - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 51: Rest of Europe 7-Year Perspective for G.Fast Chipsets by Deployment Type - Percentage Breakdown of Value Sales for CPE Deployment and DPU Deployment for the Years 2024 & 2030
    • TABLE 52: Rest of Europe Recent Past, Current & Future Analysis for G.Fast Chipsets by End-user - Residential End-User and Commercial End-User - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 53: Rest of Europe 7-Year Perspective for G.Fast Chipsets by End-user - Percentage Breakdown of Value Sales for Residential End-User and Commercial End-User for the Years 2024 & 2030
  • ASIA-PACIFIC
    • G.Fast Chipsets Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Asia-Pacific for 2024 (E)
    • TABLE 54: Asia-Pacific Recent Past, Current & Future Analysis for G.Fast Chipsets by Deployment Type - CPE Deployment and DPU Deployment - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 55: Asia-Pacific 7-Year Perspective for G.Fast Chipsets by Deployment Type - Percentage Breakdown of Value Sales for CPE Deployment and DPU Deployment for the Years 2024 & 2030
    • TABLE 56: Asia-Pacific Recent Past, Current & Future Analysis for G.Fast Chipsets by End-user - Residential End-User and Commercial End-User - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 57: Asia-Pacific 7-Year Perspective for G.Fast Chipsets by End-user - Percentage Breakdown of Value Sales for Residential End-User and Commercial End-User for the Years 2024 & 2030
  • REST OF WORLD
    • TABLE 58: Rest of World Recent Past, Current & Future Analysis for G.Fast Chipsets by Deployment Type - CPE Deployment and DPU Deployment - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 59: Rest of World 7-Year Perspective for G.Fast Chipsets by Deployment Type - Percentage Breakdown of Value Sales for CPE Deployment and DPU Deployment for the Years 2024 & 2030
    • TABLE 60: Rest of World Recent Past, Current & Future Analysis for G.Fast Chipsets by End-user - Residential End-User and Commercial End-User - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 61: Rest of World 7-Year Perspective for G.Fast Chipsets by End-user - Percentage Breakdown of Value Sales for Residential End-User and Commercial End-User for the Years 2024 & 2030

IV. COMPETITION