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市场调查报告书
商品编码
1747675

3D 通孔 (TSV) 封装的全球市场

3D Through-Silicon Via (TSV) Package
出版日期: | 出版商: Global Industry Analysts, Inc. | 英文 182 Pages | 商品交期: 最快1-2个工作天内

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简介目录

预计到 2030 年全球 3D 通孔 (TSV) 封装市场规模将达到 239 亿美元

全球3D通孔（TSV）封装市场规模预计在2024年为98亿美元，预计到2030年将达到239亿美元，2024年至2030年的复合年增长率为16.0%。晶圆层次电子构装是本报告分析的细分市场之一，预计其复合年增长率为14.3%，到分析期结束时规模将达到141亿美元。硅穿孔电极孔细分市场在分析期间的复合年增长率预计为18.7%。

美国市场规模将达 26 亿美元；中国市场复合年增长率将达 15.1%

美国3D通孔(TSV)封装市场规模预计在2024年达到26亿美元。预计到2030年，作为世界第二大经济体的中国市场规模将达到37亿美元，在2024-2030年的分析期间内，复合年增长率为15.1%。其他值得关注的区域市场包括日本和加拿大，预计在分析期间内，这两个市场的复合年增长率分别为14.5%和14.0%。在欧洲，预计德国市场的复合年增长率为11.9%。

全球 3D 通孔 (TSV) 封装市场 - 主要趋势与驱动因素摘要

为什么 3D TSV 封装对于先进半导体整合如此重要

3D硅通孔 (TSV) 封装技术正在彻底革新半导体架构，它能够透过超短互连直接穿过硅晶圆，实现积体电路的垂直堆迭。这种方法显着降低了讯号延迟，提高了频宽，并减少了电子设备的整体占用空间，使其成为运算、IT和通讯以及消费性电子领域高效能应用的首选解决方案。

随着摩尔定律的放缓以及传统二维微缩技术接近其物理和经济极限，基于硅通孔 (TSV) 的三维整合技术正逐渐成为系统级小型化和性能提升的关键推动因素。 TSV 能够以紧凑的尺寸实现逻辑、记忆体和晶粒的异质整合，从而满足 AI 加速器、高频宽记忆体 (HBM)、先进行动处理器和网路基础设施组件的关键需求。

效能需求、功率效率和外形尺寸最佳化如何推动 TSV 的采用？

对更快的资料处理速度、更高记忆体密度和更节能运算的需求，正在加速向支援 TSV 架构的过渡。与引线接合法和模内通孔技术相比，TSV 提供更短的电气路径、更少的寄生损耗和更好的散热性能，使其成为 AI 推理、边缘运算和高效能运算 (HPC) 等资料密集型工作负载的理想选择。

TSV 封装也推动了记忆体堆迭的创新，尤其是在 HBM 和宽 I/O DRAM 领域，垂直整合技术可在不影响散热效能的情况下提高资料吞吐量。在行动和穿戴式装置中，TSV 有助于实现更薄、更轻的设计，同时还能容纳更丰富的功能。随着边缘设备要求在更小的占用空间内实现更强大的处理能力，TSV 整合正成为下一代封装策略的核心。

哪些应用领域和区域市场正在推动 TSV 封装的需求？

高效能处理器、记忆体模组、影像感测器和射频组件是推动 TSV 应用的关键应用。在 AI 硬体中，TSV 能够紧密耦合运算和记忆体资源，这对于降低延迟和功耗至关重要。消费性电子产品製造商正在整合基于 TSV 的组件，以满足智慧型手机、平板电脑和 AR/VR 设备对速度、响应能力和电池续航能力日益增长的期望。

受台湾、韩国、日本和中国大陆先进半导体生态系统的推动，亚太地区在 TSV 的生产和消费领域占据主导地位。该地区的主要晶圆代工厂和 OSAT 厂商正在提升 TSV 产能，以支援晶片製造商瞄准 3D IC 的发展。北美紧随其后，受资料中心基础设施、航太级电子产品和下一代汽车系统需求的推动。欧洲也正在获得发展动力，尤其是在工业和感测器密集型应用领域。

製造复杂性、成本和生态系统成熟度如何影响市场成长？

儘管TSV拥有卓越的电气和热性能，但高昂的製造成本、产量比率挑战以及製程复杂性阻碍了其商业性应用。然而，晶圆减薄、对准精度和通孔填充技术的进步正在缓解这些问题，使TSV整合更具可扩展性和成本竞争力。代工厂正在推出承包TSV平台，以缩短开发时间并降低无晶圆厂设计工作室的进入门槛。

随着TSV内插器的标准化、检测工具的改进以及温度控管材料的改进，供应链的成熟度也不断提升。随着产量比率的提高和单位成本的下降，TSV封装的应用范围正在不断扩大，从高阶设备扩展到主流和工业级电子产品。 IC设计商、OSAT厂商和EDA工具供应商之间的合作正在进一步加速从设计到製造的週期。

成长要素的因素有哪些？

随着晶片製造商追求垂直整合架构以克服传统平面设计的局限性，3D TSV 封装市场正蓬勃发展。关键驱动因素包括性能驱动型应用对更高频宽、更高能效和更小外形规格的需求。 TSV 製造技术的进步，加上日益成熟的供应生态系统，使其更具扩充性和商业性可行性。

未来的成长将取决于TSV生态系统如何在整合复杂性与设计灵活性、成本效率和上市时间压力之间取得平衡。随着半导体产业向异构和3D架构转型，TSV封装能否成为迈向下一个晶片级性能和创新时代的基础桥樑？

部分

技术（晶圆级封装、硅通孔）、应用（基于记忆体的应用、基于逻辑的应用、MEMS 和感测器）、最终用途（消费性电子、汽车、医疗保健、航太和国防、其他最终用途）

受访企业范例（共48家）

  • 3M Company
  • Advanced Micro Devices, Inc.（AMD）
  • Amkor Technology, Inc.
  • Analog Devices, Inc.
  • ASE Technology Holding Co., Ltd.
  • ASML Holding NV
  • Broadcom Inc.
  • Dialog Semiconductor plc
  • GLOBALFOUNDRIES Inc.
  • IBM Corporation
  • Infineon Technologies AG
  • Intel Corporation
  • JCET Group Co., Ltd.
  • Jiangsu Changjiang Electronics Technology Co., Ltd.
  • Micron Technology, Inc.
  • Monolithic 3D Inc.
  • NXP Semiconductors NV
  • Panasonic Corporation
  • Powertech Technology Inc.
  • Qualcomm Incorporated

关税影响係数

全球产业分析师根据公司总部所在国家、製造地、进出口（成品和原始OEM）来预测其竞争地位的变化。这种复杂且多面向的市场动态预计将以多种方式影响竞争对手，包括人为提高销货成本、盈利下降、供应链重组以及其他微观和宏观市场动态。

全球产业分析师密切关注来自全球顶尖首席经济学家（14,949位）、智库（62家）以及贸易和产业协会（171家）的专家的意见，以评估其对生态系统的影响并应对新的市场现实。我们追踪了来自每个主要国家的专家和经济学家对关税及其对本国影响的看法。

全球产业分析师预计，这场动盪将在未来2-3个月内逐渐平息，新的世界秩序将更加清晰地建立。全球产业分析师正在即时追踪这些事态发展。

2025年4月：谈判阶段

在4月的报告中，我们将探讨关税对全球整体市场的影响，并提供区域市场调整。我们的预测是基于历史数据和不断变化的市场影响因素。

2025年7月：最终关税调整

在各国宣布最终重置后，客户也将在 7 月收到免费更新，最终更新将包含明确的关税影响分析。

相互和双边贸易及关税影响分析：

美国<>中国<>墨西哥<>加拿大<>欧盟<>日本<>印度<>其他176个国家

领先的产业经济学家：全球产业分析师知识库追踪了 14,949 位经济学家，其中包括来自民族国家、智库、贸易和产业协会、大型企业以及各领域专家的最具影响力的首席经济学家，他们共用了这场前所未有的全球经济状况模式转移的影响。我们超过 16,491 份报告大多遵循基于里程碑的两阶段发布计划。

目录

第一章调查方法

第二章执行摘要

  • 市场概览
  • 主要企业
  • 市场趋势和驱动因素
  • 全球市场展望

第三章市场分析

  • 美国
  • 加拿大
  • 日本
  • 中国
  • 欧洲
  • 法国
  • 德国
  • 义大利
  • 英国
  • 其他欧洲国家
  • 亚太地区
  • 其他地区

第四章 竞赛

简介目录
Product Code: MCP34526

Global 3D Through-Silicon Via (TSV) Package Market to Reach US$23.9 Billion by 2030

The global market for 3D Through-Silicon Via (TSV) Package estimated at US$9.8 Billion in the year 2024, is expected to reach US$23.9 Billion by 2030, growing at a CAGR of 16.0% over the analysis period 2024-2030. Wafer Level Packaging, one of the segments analyzed in the report, is expected to record a 14.3% CAGR and reach US$14.1 Billion by the end of the analysis period. Growth in the Through Silicon Via segment is estimated at 18.7% CAGR over the analysis period.

The U.S. Market is Estimated at US$2.6 Billion While China is Forecast to Grow at 15.1% CAGR

The 3D Through-Silicon Via (TSV) Package market in the U.S. is estimated at US$2.6 Billion in the year 2024. China, the world's second largest economy, is forecast to reach a projected market size of US$3.7 Billion by the year 2030 trailing a CAGR of 15.1% over the analysis period 2024-2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at a CAGR of 14.5% and 14.0% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 11.9% CAGR.

Global 3D Through-Silicon Via (TSV) Package Market - Key Trends & Drivers Summarized

Why Is 3D TSV Packaging Gaining Prominence in Advanced Semiconductor Integration?

3D Through-Silicon Via (TSV) packaging is revolutionizing semiconductor architecture by enabling vertical stacking of integrated circuits with ultra-short interconnects that pass directly through silicon wafers. This approach drastically reduces signal latency, enhances bandwidth, and shrinks the overall footprint of electronic devices, making it a preferred solution for high-performance applications in computing, telecommunications, and consumer electronics.

As Moore’s Law slows and conventional 2D scaling approaches their physical and economic limits, TSV-based 3D integration is emerging as a key enabler of system-level miniaturization and performance gains. It allows for heterogeneous integration of logic, memory, and sensor dies in compact form factors, addressing critical demands in AI accelerators, high-bandwidth memory (HBM), advanced mobile processors, and network infrastructure components.

How Are Performance Requirements, Power Efficiency, and Form Factor Optimization Driving TSV Adoption?

The demand for faster data processing, greater memory density, and energy-efficient computing is accelerating the transition to TSV-enabled architectures. Compared to wire bonding or through-mold via technologies, TSVs offer shorter electrical paths, reduced parasitic loss, and superior thermal dissipation. This makes them ideal for data-intensive workloads such as AI inference, edge computing, and high-performance computing (HPC).

TSV packaging is also driving innovation in memory stacking-particularly HBM and wide I/O DRAM-where vertical integration enhances data throughput without compromising thermal performance. In mobile and wearable devices, TSV facilitates thinner, lighter designs while accommodating growing functionality. As edge devices demand more processing power within smaller footprints, TSV integration is becoming central to next-generation packaging strategies.

Which Application Areas and Regional Markets Are Accelerating TSV Package Demand?

High-performance processors, memory modules, image sensors, and RF components are among the key applications driving TSV adoption. In AI hardware, TSV enables tight coupling of compute and memory resources, which is essential for reducing latency and power consumption. Consumer electronics manufacturers are integrating TSV-based components to meet rising expectations for speed, responsiveness, and battery life in smartphones, tablets, and AR/VR gear.

Asia-Pacific dominates TSV production and consumption, led by advanced semiconductor ecosystems in Taiwan, South Korea, Japan, and China. Major foundries and OSATs in the region are ramping TSV capacity to support chipmakers targeting 3D IC development. North America follows closely, driven by demand in data center infrastructure, aerospace-grade electronics, and next-gen automotive systems. Europe is also showing increased traction, especially in industrial and sensor-rich applications.

How Are Manufacturing Complexity, Cost Considerations, and Ecosystem Maturity Influencing Market Growth?

While TSV offers superior electrical and thermal performance, its commercial adoption has historically been hindered by high fabrication costs, yield challenges, and process complexity. However, advances in wafer thinning, alignment precision, and via filling techniques are mitigating these issues, making TSV integration more scalable and cost-competitive. Foundries are introducing turnkey TSV platforms to reduce development timelines and lower barriers to entry for fabless design houses.

Supply chain maturity is also improving, with standardization of TSV interposers, improved inspection tools, and better thermal management materials. As yield rates increase and unit costs decline, TSV packaging is becoming viable for a broader range of applications, extending beyond premium devices to mainstream and industrial-grade electronics. Collaborative efforts between IC designers, OSATs, and EDA tool providers are further accelerating design-to-manufacture cycles.

What Are the Factors Driving Growth in the 3D TSV Package Market?

The 3D TSV package market is gaining momentum as chipmakers pursue vertically integrated architectures to overcome the limitations of traditional planar designs. Key drivers include the need for higher bandwidth, improved energy efficiency, and form factor reduction across performance-critical applications. Technological improvements in TSV manufacturing, coupled with a maturing supply ecosystem, are enhancing scalability and commercial viability.

Looking ahead, growth will be influenced by how well the TSV ecosystem can balance integration complexity with design flexibility, cost efficiency, and time-to-market pressures. As the semiconductor industry shifts toward heterogeneous and 3D architectures, could TSV packaging become the foundational bridge to the next era of chip-level performance and innovation?

SCOPE OF STUDY:

The report analyzes the 3D Through-Silicon Via (TSV) Package market in terms of units by the following Segments, and Geographic Regions/Countries:

Segments:

Technology (Wafer Level Packaging, Through Silicon Via); Application (Memory Based Application, Logic Based Application, Mems & Sensors); End-Use (Consumer Electronics, Automotive, Healthcare, Aerospace & Defense, Other End-Uses)

Geographic Regions/Countries:

World; United States; Canada; Japan; China; Europe (France; Germany; Italy; United Kingdom; and Rest of Europe); Asia-Pacific; Rest of World.

Select Competitors (Total 48 Featured) -

  • 3M Company
  • Advanced Micro Devices, Inc. (AMD)
  • Amkor Technology, Inc.
  • Analog Devices, Inc.
  • ASE Technology Holding Co., Ltd.
  • ASML Holding N.V.
  • Broadcom Inc.
  • Dialog Semiconductor plc
  • GLOBALFOUNDRIES Inc.
  • IBM Corporation
  • Infineon Technologies AG
  • Intel Corporation
  • JCET Group Co., Ltd.
  • Jiangsu Changjiang Electronics Technology Co., Ltd.
  • Micron Technology, Inc.
  • Monolithic 3D Inc.
  • NXP Semiconductors N.V.
  • Panasonic Corporation
  • Powertech Technology Inc.
  • Qualcomm Incorporated

TARIFF IMPACT FACTOR

Our new release incorporates impact of tariffs on geographical markets as we predict a shift in competitiveness of companies based on HQ country, manufacturing base, exports and imports (finished goods and OEM). This intricate and multifaceted market reality will impact competitors by artificially increasing the COGS, reducing profitability, reconfiguring supply chains, amongst other micro and macro market dynamics.

We are diligently following expert opinions of leading Chief Economists (14,949), Think Tanks (62), Trade & Industry bodies (171) worldwide, as they assess impact and address new market realities for their ecosystems. Experts and economists from every major country are tracked for their opinions on tariffs and how they will impact their countries.

We expect this chaos to play out over the next 2-3 months and a new world order is established with more clarity. We are tracking these developments on a real time basis.

As we release this report, U.S. Trade Representatives are pushing their counterparts in 183 countries for an early closure to bilateral tariff negotiations. Most of the major trading partners also have initiated trade agreements with other key trading nations, outside of those in the works with the United States. We are tracking such secondary fallouts as supply chains shift.

To our valued clients, we say, we have your back. We will present a simplified market reassessment by incorporating these changes!

APRIL 2025: NEGOTIATION PHASE

Our April release addresses the impact of tariffs on the overall global market and presents market adjustments by geography. Our trajectories are based on historic data and evolving market impacting factors.

JULY 2025 FINAL TARIFF RESET

Complimentary Update: Our clients will also receive a complimentary update in July after a final reset is announced between nations. The final updated version incorporates clearly defined Tariff Impact Analyses.

Reciprocal and Bilateral Trade & Tariff Impact Analyses:

USA <> CHINA <> MEXICO <> CANADA <> EU <> JAPAN <> INDIA <> 176 OTHER COUNTRIES.

Leading Economists - Our knowledge base tracks 14,949 economists including a select group of most influential Chief Economists of nations, think tanks, trade and industry bodies, big enterprises, and domain experts who are sharing views on the fallout of this unprecedented paradigm shift in the global econometric landscape. Most of our 16,491+ reports have incorporated this two-stage release schedule based on milestones.

COMPLIMENTARY PREVIEW

Contact your sales agent to request an online 300+ page complimentary preview of this research project. Our preview will present full stack sources, and validated domain expert data transcripts. Deep dive into our interactive data-driven online platform.

TABLE OF CONTENTS

I. METHODOLOGY

II. EXECUTIVE SUMMARY

  • 1. MARKET OVERVIEW
    • Influencer Market Insights
    • World Market Trajectories
    • 3D Through-Silicon Via (TSV) Package - Global Key Competitors Percentage Market Share in 2025 (E)
    • Competitive Market Presence - Strong/Active/Niche/Trivial for Players Worldwide in 2025 (E)
  • 2. FOCUS ON SELECT PLAYERS
  • 3. MARKET TRENDS & DRIVERS
    • Increasing Need for High-Performance and Compact IC Architectures Throws the Spotlight on 3D TSV Packaging
    • Surge in AI, HPC, and Data Center Applications Spurs Demand for Advanced TSV-Based Semiconductor Integration
    • TSVs Ability to Enable Faster Signal Transmission Strengthens Business Case in High-Speed Computing Environments
    • Rising Demand for Memory Stacking and Logic Integration Propels Growth of 3D TSV Packaging
    • Continued Shrinking of Semiconductor Nodes Bodes Well for TSV as an Enabler of Vertical Scaling
    • Growing Interest in Heterogeneous Integration Drives Adoption of 3D TSV in Advanced Packaging Roadmaps
    • Expansion of IoT and Edge Devices Sets the Stage for TSV Packaging in Ultra-Compact System Designs
    • Thermal Management Capabilities of TSVs Crucial for Market Growth in High-Power Applications
    • Demand for Miniaturized Consumer Electronics Generates Momentum for 3D TSV in Wearables and Mobile Devices
    • TSVs Role in Enabling Chiplets and Multi-Die Integration Expands Addressable Market Opportunities
    • Emerging Trends in 3D ICs and Fan-Out Technologies Drive Co-Development with TSV Packaging
    • Increased R&D Activity in TSV Wafer Bonding and Etching Techniques Fuels Next-Gen Innovation in the Market
  • 4. GLOBAL MARKET PERSPECTIVE
    • TABLE 1: World 3D Through-Silicon Via (TSV) Package Market Analysis of Annual Sales in US$ Million for Years 2015 through 2030
    • TABLE 2: World Recent Past, Current & Future Analysis for 3D Through-Silicon Via (TSV) Package by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 3: World 6-Year Perspective for 3D Through-Silicon Via (TSV) Package by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets for Years 2025 & 2030
    • TABLE 4: World Recent Past, Current & Future Analysis for Wafer Level Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 5: World 6-Year Perspective for Wafer Level Packaging by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2025 & 2030
    • TABLE 6: World Recent Past, Current & Future Analysis for Through Silicon Via by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 7: World 6-Year Perspective for Through Silicon Via by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2025 & 2030
    • TABLE 8: World Recent Past, Current & Future Analysis for Other End-Uses by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 9: World 6-Year Perspective for Other End-Uses by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2025 & 2030
    • TABLE 10: World Recent Past, Current & Future Analysis for Consumer Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 11: World 6-Year Perspective for Consumer Electronics by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2025 & 2030
    • TABLE 12: World Recent Past, Current & Future Analysis for Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 13: World 6-Year Perspective for Automotive by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2025 & 2030
    • TABLE 14: World Recent Past, Current & Future Analysis for Healthcare by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 15: World 6-Year Perspective for Healthcare by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2025 & 2030
    • TABLE 16: World Recent Past, Current & Future Analysis for Aerospace & Defense by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 17: World 6-Year Perspective for Aerospace & Defense by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2025 & 2030
    • TABLE 18: World Recent Past, Current & Future Analysis for Memory Based Application by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 19: World 6-Year Perspective for Memory Based Application by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2025 & 2030
    • TABLE 20: World Recent Past, Current & Future Analysis for Logic Based Application by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 21: World 6-Year Perspective for Logic Based Application by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2025 & 2030
    • TABLE 22: World Recent Past, Current & Future Analysis for Mems & Sensors by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 23: World 6-Year Perspective for Mems & Sensors by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2025 & 2030

III. MARKET ANALYSIS

  • UNITED STATES
    • 3D Through-Silicon Via (TSV) Package Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United States for 2025 (E)
    • TABLE 24: USA Recent Past, Current & Future Analysis for 3D Through-Silicon Via (TSV) Package by Technology - Wafer Level Packaging and Through Silicon Via - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 25: USA 6-Year Perspective for 3D Through-Silicon Via (TSV) Package by Technology - Percentage Breakdown of Value Sales for Wafer Level Packaging and Through Silicon Via for the Years 2025 & 2030
    • TABLE 26: USA Recent Past, Current & Future Analysis for 3D Through-Silicon Via (TSV) Package by End-Use - Other End-Uses, Consumer Electronics, Automotive, Healthcare and Aerospace & Defense - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 27: USA 6-Year Perspective for 3D Through-Silicon Via (TSV) Package by End-Use - Percentage Breakdown of Value Sales for Other End-Uses, Consumer Electronics, Automotive, Healthcare and Aerospace & Defense for the Years 2025 & 2030
    • TABLE 28: USA Recent Past, Current & Future Analysis for 3D Through-Silicon Via (TSV) Package by Application - Memory Based Application, Logic Based Application and Mems & Sensors - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 29: USA 6-Year Perspective for 3D Through-Silicon Via (TSV) Package by Application - Percentage Breakdown of Value Sales for Memory Based Application, Logic Based Application and Mems & Sensors for the Years 2025 & 2030
  • CANADA
    • TABLE 30: Canada Recent Past, Current & Future Analysis for 3D Through-Silicon Via (TSV) Package by Technology - Wafer Level Packaging and Through Silicon Via - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 31: Canada 6-Year Perspective for 3D Through-Silicon Via (TSV) Package by Technology - Percentage Breakdown of Value Sales for Wafer Level Packaging and Through Silicon Via for the Years 2025 & 2030
    • TABLE 32: Canada Recent Past, Current & Future Analysis for 3D Through-Silicon Via (TSV) Package by End-Use - Other End-Uses, Consumer Electronics, Automotive, Healthcare and Aerospace & Defense - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 33: Canada 6-Year Perspective for 3D Through-Silicon Via (TSV) Package by End-Use - Percentage Breakdown of Value Sales for Other End-Uses, Consumer Electronics, Automotive, Healthcare and Aerospace & Defense for the Years 2025 & 2030
    • TABLE 34: Canada Recent Past, Current & Future Analysis for 3D Through-Silicon Via (TSV) Package by Application - Memory Based Application, Logic Based Application and Mems & Sensors - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 35: Canada 6-Year Perspective for 3D Through-Silicon Via (TSV) Package by Application - Percentage Breakdown of Value Sales for Memory Based Application, Logic Based Application and Mems & Sensors for the Years 2025 & 2030
  • JAPAN
    • 3D Through-Silicon Via (TSV) Package Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Japan for 2025 (E)
    • TABLE 36: Japan Recent Past, Current & Future Analysis for 3D Through-Silicon Via (TSV) Package by Technology - Wafer Level Packaging and Through Silicon Via - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 37: Japan 6-Year Perspective for 3D Through-Silicon Via (TSV) Package by Technology - Percentage Breakdown of Value Sales for Wafer Level Packaging and Through Silicon Via for the Years 2025 & 2030
    • TABLE 38: Japan Recent Past, Current & Future Analysis for 3D Through-Silicon Via (TSV) Package by End-Use - Other End-Uses, Consumer Electronics, Automotive, Healthcare and Aerospace & Defense - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 39: Japan 6-Year Perspective for 3D Through-Silicon Via (TSV) Package by End-Use - Percentage Breakdown of Value Sales for Other End-Uses, Consumer Electronics, Automotive, Healthcare and Aerospace & Defense for the Years 2025 & 2030
    • TABLE 40: Japan Recent Past, Current & Future Analysis for 3D Through-Silicon Via (TSV) Package by Application - Memory Based Application, Logic Based Application and Mems & Sensors - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 41: Japan 6-Year Perspective for 3D Through-Silicon Via (TSV) Package by Application - Percentage Breakdown of Value Sales for Memory Based Application, Logic Based Application and Mems & Sensors for the Years 2025 & 2030
  • CHINA
    • 3D Through-Silicon Via (TSV) Package Market Presence - Strong/Active/Niche/Trivial - Key Competitors in China for 2025 (E)
    • TABLE 42: China Recent Past, Current & Future Analysis for 3D Through-Silicon Via (TSV) Package by Technology - Wafer Level Packaging and Through Silicon Via - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 43: China 6-Year Perspective for 3D Through-Silicon Via (TSV) Package by Technology - Percentage Breakdown of Value Sales for Wafer Level Packaging and Through Silicon Via for the Years 2025 & 2030
    • TABLE 44: China Recent Past, Current & Future Analysis for 3D Through-Silicon Via (TSV) Package by End-Use - Other End-Uses, Consumer Electronics, Automotive, Healthcare and Aerospace & Defense - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 45: China 6-Year Perspective for 3D Through-Silicon Via (TSV) Package by End-Use - Percentage Breakdown of Value Sales for Other End-Uses, Consumer Electronics, Automotive, Healthcare and Aerospace & Defense for the Years 2025 & 2030
    • TABLE 46: China Recent Past, Current & Future Analysis for 3D Through-Silicon Via (TSV) Package by Application - Memory Based Application, Logic Based Application and Mems & Sensors - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 47: China 6-Year Perspective for 3D Through-Silicon Via (TSV) Package by Application - Percentage Breakdown of Value Sales for Memory Based Application, Logic Based Application and Mems & Sensors for the Years 2025 & 2030
  • EUROPE
    • 3D Through-Silicon Via (TSV) Package Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Europe for 2025 (E)
    • TABLE 48: Europe Recent Past, Current & Future Analysis for 3D Through-Silicon Via (TSV) Package by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 49: Europe 6-Year Perspective for 3D Through-Silicon Via (TSV) Package by Geographic Region - Percentage Breakdown of Value Sales for France, Germany, Italy, UK and Rest of Europe Markets for Years 2025 & 2030
    • TABLE 50: Europe Recent Past, Current & Future Analysis for 3D Through-Silicon Via (TSV) Package by Technology - Wafer Level Packaging and Through Silicon Via - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 51: Europe 6-Year Perspective for 3D Through-Silicon Via (TSV) Package by Technology - Percentage Breakdown of Value Sales for Wafer Level Packaging and Through Silicon Via for the Years 2025 & 2030
    • TABLE 52: Europe Recent Past, Current & Future Analysis for 3D Through-Silicon Via (TSV) Package by End-Use - Other End-Uses, Consumer Electronics, Automotive, Healthcare and Aerospace & Defense - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 53: Europe 6-Year Perspective for 3D Through-Silicon Via (TSV) Package by End-Use - Percentage Breakdown of Value Sales for Other End-Uses, Consumer Electronics, Automotive, Healthcare and Aerospace & Defense for the Years 2025 & 2030
    • TABLE 54: Europe Recent Past, Current & Future Analysis for 3D Through-Silicon Via (TSV) Package by Application - Memory Based Application, Logic Based Application and Mems & Sensors - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 55: Europe 6-Year Perspective for 3D Through-Silicon Via (TSV) Package by Application - Percentage Breakdown of Value Sales for Memory Based Application, Logic Based Application and Mems & Sensors for the Years 2025 & 2030
  • FRANCE
    • 3D Through-Silicon Via (TSV) Package Market Presence - Strong/Active/Niche/Trivial - Key Competitors in France for 2025 (E)
    • TABLE 56: France Recent Past, Current & Future Analysis for 3D Through-Silicon Via (TSV) Package by Technology - Wafer Level Packaging and Through Silicon Via - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 57: France 6-Year Perspective for 3D Through-Silicon Via (TSV) Package by Technology - Percentage Breakdown of Value Sales for Wafer Level Packaging and Through Silicon Via for the Years 2025 & 2030
    • TABLE 58: France Recent Past, Current & Future Analysis for 3D Through-Silicon Via (TSV) Package by End-Use - Other End-Uses, Consumer Electronics, Automotive, Healthcare and Aerospace & Defense - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 59: France 6-Year Perspective for 3D Through-Silicon Via (TSV) Package by End-Use - Percentage Breakdown of Value Sales for Other End-Uses, Consumer Electronics, Automotive, Healthcare and Aerospace & Defense for the Years 2025 & 2030
    • TABLE 60: France Recent Past, Current & Future Analysis for 3D Through-Silicon Via (TSV) Package by Application - Memory Based Application, Logic Based Application and Mems & Sensors - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 61: France 6-Year Perspective for 3D Through-Silicon Via (TSV) Package by Application - Percentage Breakdown of Value Sales for Memory Based Application, Logic Based Application and Mems & Sensors for the Years 2025 & 2030
  • GERMANY
    • 3D Through-Silicon Via (TSV) Package Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Germany for 2025 (E)
    • TABLE 62: Germany Recent Past, Current & Future Analysis for 3D Through-Silicon Via (TSV) Package by Technology - Wafer Level Packaging and Through Silicon Via - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 63: Germany 6-Year Perspective for 3D Through-Silicon Via (TSV) Package by Technology - Percentage Breakdown of Value Sales for Wafer Level Packaging and Through Silicon Via for the Years 2025 & 2030
    • TABLE 64: Germany Recent Past, Current & Future Analysis for 3D Through-Silicon Via (TSV) Package by End-Use - Other End-Uses, Consumer Electronics, Automotive, Healthcare and Aerospace & Defense - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 65: Germany 6-Year Perspective for 3D Through-Silicon Via (TSV) Package by End-Use - Percentage Breakdown of Value Sales for Other End-Uses, Consumer Electronics, Automotive, Healthcare and Aerospace & Defense for the Years 2025 & 2030
    • TABLE 66: Germany Recent Past, Current & Future Analysis for 3D Through-Silicon Via (TSV) Package by Application - Memory Based Application, Logic Based Application and Mems & Sensors - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 67: Germany 6-Year Perspective for 3D Through-Silicon Via (TSV) Package by Application - Percentage Breakdown of Value Sales for Memory Based Application, Logic Based Application and Mems & Sensors for the Years 2025 & 2030
  • ITALY
    • TABLE 68: Italy Recent Past, Current & Future Analysis for 3D Through-Silicon Via (TSV) Package by Technology - Wafer Level Packaging and Through Silicon Via - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 69: Italy 6-Year Perspective for 3D Through-Silicon Via (TSV) Package by Technology - Percentage Breakdown of Value Sales for Wafer Level Packaging and Through Silicon Via for the Years 2025 & 2030
    • TABLE 70: Italy Recent Past, Current & Future Analysis for 3D Through-Silicon Via (TSV) Package by End-Use - Other End-Uses, Consumer Electronics, Automotive, Healthcare and Aerospace & Defense - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 71: Italy 6-Year Perspective for 3D Through-Silicon Via (TSV) Package by End-Use - Percentage Breakdown of Value Sales for Other End-Uses, Consumer Electronics, Automotive, Healthcare and Aerospace & Defense for the Years 2025 & 2030
    • TABLE 72: Italy Recent Past, Current & Future Analysis for 3D Through-Silicon Via (TSV) Package by Application - Memory Based Application, Logic Based Application and Mems & Sensors - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 73: Italy 6-Year Perspective for 3D Through-Silicon Via (TSV) Package by Application - Percentage Breakdown of Value Sales for Memory Based Application, Logic Based Application and Mems & Sensors for the Years 2025 & 2030
  • UNITED KINGDOM
    • 3D Through-Silicon Via (TSV) Package Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United Kingdom for 2025 (E)
    • TABLE 74: UK Recent Past, Current & Future Analysis for 3D Through-Silicon Via (TSV) Package by Technology - Wafer Level Packaging and Through Silicon Via - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 75: UK 6-Year Perspective for 3D Through-Silicon Via (TSV) Package by Technology - Percentage Breakdown of Value Sales for Wafer Level Packaging and Through Silicon Via for the Years 2025 & 2030
    • TABLE 76: UK Recent Past, Current & Future Analysis for 3D Through-Silicon Via (TSV) Package by End-Use - Other End-Uses, Consumer Electronics, Automotive, Healthcare and Aerospace & Defense - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 77: UK 6-Year Perspective for 3D Through-Silicon Via (TSV) Package by End-Use - Percentage Breakdown of Value Sales for Other End-Uses, Consumer Electronics, Automotive, Healthcare and Aerospace & Defense for the Years 2025 & 2030
    • TABLE 78: UK Recent Past, Current & Future Analysis for 3D Through-Silicon Via (TSV) Package by Application - Memory Based Application, Logic Based Application and Mems & Sensors - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 79: UK 6-Year Perspective for 3D Through-Silicon Via (TSV) Package by Application - Percentage Breakdown of Value Sales for Memory Based Application, Logic Based Application and Mems & Sensors for the Years 2025 & 2030
  • REST OF EUROPE
    • TABLE 80: Rest of Europe Recent Past, Current & Future Analysis for 3D Through-Silicon Via (TSV) Package by Technology - Wafer Level Packaging and Through Silicon Via - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 81: Rest of Europe 6-Year Perspective for 3D Through-Silicon Via (TSV) Package by Technology - Percentage Breakdown of Value Sales for Wafer Level Packaging and Through Silicon Via for the Years 2025 & 2030
    • TABLE 82: Rest of Europe Recent Past, Current & Future Analysis for 3D Through-Silicon Via (TSV) Package by End-Use - Other End-Uses, Consumer Electronics, Automotive, Healthcare and Aerospace & Defense - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 83: Rest of Europe 6-Year Perspective for 3D Through-Silicon Via (TSV) Package by End-Use - Percentage Breakdown of Value Sales for Other End-Uses, Consumer Electronics, Automotive, Healthcare and Aerospace & Defense for the Years 2025 & 2030
    • TABLE 84: Rest of Europe Recent Past, Current & Future Analysis for 3D Through-Silicon Via (TSV) Package by Application - Memory Based Application, Logic Based Application and Mems & Sensors - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 85: Rest of Europe 6-Year Perspective for 3D Through-Silicon Via (TSV) Package by Application - Percentage Breakdown of Value Sales for Memory Based Application, Logic Based Application and Mems & Sensors for the Years 2025 & 2030
  • ASIA-PACIFIC
    • 3D Through-Silicon Via (TSV) Package Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Asia-Pacific for 2025 (E)
    • TABLE 86: Asia-Pacific Recent Past, Current & Future Analysis for 3D Through-Silicon Via (TSV) Package by Technology - Wafer Level Packaging and Through Silicon Via - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 87: Asia-Pacific 6-Year Perspective for 3D Through-Silicon Via (TSV) Package by Technology - Percentage Breakdown of Value Sales for Wafer Level Packaging and Through Silicon Via for the Years 2025 & 2030
    • TABLE 88: Asia-Pacific Recent Past, Current & Future Analysis for 3D Through-Silicon Via (TSV) Package by End-Use - Other End-Uses, Consumer Electronics, Automotive, Healthcare and Aerospace & Defense - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 89: Asia-Pacific 6-Year Perspective for 3D Through-Silicon Via (TSV) Package by End-Use - Percentage Breakdown of Value Sales for Other End-Uses, Consumer Electronics, Automotive, Healthcare and Aerospace & Defense for the Years 2025 & 2030
    • TABLE 90: Asia-Pacific Recent Past, Current & Future Analysis for 3D Through-Silicon Via (TSV) Package by Application - Memory Based Application, Logic Based Application and Mems & Sensors - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 91: Asia-Pacific 6-Year Perspective for 3D Through-Silicon Via (TSV) Package by Application - Percentage Breakdown of Value Sales for Memory Based Application, Logic Based Application and Mems & Sensors for the Years 2025 & 2030
  • REST OF WORLD
    • TABLE 92: Rest of World Recent Past, Current & Future Analysis for 3D Through-Silicon Via (TSV) Package by Technology - Wafer Level Packaging and Through Silicon Via - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 93: Rest of World 6-Year Perspective for 3D Through-Silicon Via (TSV) Package by Technology - Percentage Breakdown of Value Sales for Wafer Level Packaging and Through Silicon Via for the Years 2025 & 2030
    • TABLE 94: Rest of World Recent Past, Current & Future Analysis for 3D Through-Silicon Via (TSV) Package by End-Use - Other End-Uses, Consumer Electronics, Automotive, Healthcare and Aerospace & Defense - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 95: Rest of World 6-Year Perspective for 3D Through-Silicon Via (TSV) Package by End-Use - Percentage Breakdown of Value Sales for Other End-Uses, Consumer Electronics, Automotive, Healthcare and Aerospace & Defense for the Years 2025 & 2030
    • TABLE 96: Rest of World Recent Past, Current & Future Analysis for 3D Through-Silicon Via (TSV) Package by Application - Memory Based Application, Logic Based Application and Mems & Sensors - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 97: Rest of World 6-Year Perspective for 3D Through-Silicon Via (TSV) Package by Application - Percentage Breakdown of Value Sales for Memory Based Application, Logic Based Application and Mems & Sensors for the Years 2025 & 2030

IV. COMPETITION