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1757548

全球电子基板级底部填充和封装市场

Electronic Board Level Underfill and Encapsulation

出版日期: 2025年06月27日 | 出版商:

Global Industry Analysts, Inc. | 英文 380 Pages | 商品交期: 最快1-2个工作天内

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简介目录

预计到 2030 年全球电子基板级底部填充和封装市场规模将达到 4.043 亿美元

全球电子基板级底部填充和封装市场规模预计在2024年为3.33亿美元，预计到2030年将达到4.043亿美元，2024年至2030年的复合年增长率为3.3%。底部填充类型是本报告分析的细分市场之一，预计其复合年增长率为2.7%，到分析期结束时规模将达到2.581亿美元。在分析期间内，顶部灌封类型细分市场的复合年增长率预计为4.5%。

美国市场规模估计为 9,070 万美元，而中国市场预计复合年增长率为 6.0%

美国电子基板级底部填充和封装市场规模预计在2024年达到9,070万美元。作为世界第二大经济体，中国市场规模预计到2030年将达到7,950万美元，在2024-2030年的分析期间内，复合年增长率为6.0%。其他值得关注的区域市场包括日本和加拿大，预计在分析期间内，这两个市场的复合年增长率分别为1.3%和2.5%。在欧洲，预计德国市场的复合年增长率为1.9%。

全球电子基板级底部填充和封装市场—主要趋势和驱动因素摘要

为什么底部填充和封装解决方案对于 PCB 和微电子组装如此重要？

电子基板级底部填充和封装材料对于确保半导体封装和印刷电路基板(PCB) 的机械完整性、热稳定性和长期可靠性至关重要。随着电子设备体积越来越小、功率越来越大，它们对焊点、互连线和晶粒表面施加的应力也越来越大，尤其是在球栅阵列 (BGA)、晶片级封装 (CSP) 和覆晶配置中。

底部填充材料通常为环氧树脂基配方，用于晶片和基板之间，以增强焊点、缓解热膨胀係数 (CTE) 失配并吸收机械衝击。封装用于包覆成型和灌封，以防止湿气、化学物质和颗粒污染。这些材料可延长暴露于汽车、航太、工业或消费级环境中的电子设备的使用寿命。

底部填充材料和封装在智慧型手机、汽车电子控制单元 (ECU) 和可穿戴电子设备等易受热循环、振动和跌落衝击的设备中，充当物理缓衝和热通道。在 2.5D/3DIC 和系统级封装(SiP) 等先进封装架构中，底部填充材料解决方案有助于管理多个晶粒和内插器层的内部应力负载，已成为半导体封装中不可或缺的关键材料。

哪些材料创新和应用技术正在塑造这一领域？

底部填充和封装领域的材料创新着重于提高导热性、降低固化温度、增强流动特性以及缩短点胶週期。传统的毛细管底部填充系统已发展为无流动底部填充、预涂底部填充 (PAUF) 以及可返工的变体，以适应多样化的工艺流程和组装限制。

含有氧化铝、氮化硼和银片等填充材的导热底部填充材料在高功率设备和射频模组中的应用日益广泛。这些配方兼具低黏度和高散热性，可实现快速固化并最大程度地减少空隙形成。在高产量製造环境中，週期时间是关键的性能指标，而紫外线固化和快速固化系统正被广泛应用。

封装正朝着混合树脂系统发展，该系统融合了环氧树脂、硅树脂和聚氨酯的特性，以提高柔韧性以及对高难度基板的附着力。低应力、光学透明且低释气性的封装正成为MEMS装置和光学感测器的主流。在行动和家用电子电器中，喷射点胶和模板印刷等大批量生产技术正变得日益普遍。

哪些最终用途领域和包装趋势将推动需求？

半导体产业仍然是底部填充和封装解决方案的最大消费领域。代工厂和OSAT厂商在覆晶构装、晶圆级晶片尺寸封装（CSP）以及新兴的3D堆迭架构中使用这些材料。组装、日月光和安靠等领先公司为人工智慧晶片、射频前端模组以及逻辑和记忆体整合指定客製化底部填充材料。

消费性电子产品是第二大终端应用领域，包括智慧型手机、穿戴式装置、平板电脑、游戏设备等。随着设备变得越来越轻薄、越来越密集，热可靠性和机械可靠性对于使用者体验和保固週期至关重要。先进的封装可用于防止水浸和热劣化，尤其适用于 IP 等级的设备。

由于电子控制单元 (ECU)、感测器和电源模组数量的不断增加，汽车电子领域正快速发展。底部填充材料对于确保在严苛的汽车环境中具有抗振性和热循环耐久性至关重要。其主要应用包括 ADAS 处理器、资讯娱乐系统和电动车的电池控制单元。工业自动化、医疗用电子设备和航太应用也进一步丰富了其需求。

哪些因素推动了底部填充和封装市场的成长？

电子基板级底部填充和封装市场的成长受到多种因素的推动，例如电子产品的小型化、半导体功率密度的增加、恶劣环境下的可靠性要求以及封装技术中异质整合的兴起。

首先，追求更小、更轻、功能更强大的电子产品需要更坚固的保护材料。随着焊点间距越来越小，元件堆迭越来越紧密，底部填充材料提供的机械加固对于避免过早失效至关重要，尤其是在跌落测试和热循环过程中。

其次，5G、汽车和高效能运算中使用的功率半导体和射频组件会产生大量热量。导热性较高的底部填充材料和封装可以帮助有效地散热，防止热点故障并确保长期可靠性，尤其是在受限的PCB布局中。

第三，汽车和航太产业的可靠性阈值正在不断提高。这些环境中的设备必须能够承受剧烈的温度变化、振动以及腐蚀性介质的侵蚀。高温稳定、化学惰性的封装和可返工的底部填充材料必须符合AEC-Q100和MIL-STD-883等特定产业标准。

最后，扇出型晶圆级封装 (FOWLP)、系统级封装 (SiP) 和晶片级 (chiplet) 架构的兴起，迫使材料工程师开发高度可客製化、低热膨胀係数 (CTE)、无空洞的底部填充材料。这些架构将逻辑、记忆体和类比模组整合在一个模组中，高度依赖精确的材料沉积来确保讯号保真度和物理完整性。

部分

产品类型（底部填充型、GOB顶封装型）、材料（石英/硅胶材料、氧化铝基材料、环氧基材料、胺甲酸乙酯基材料、丙烯酸基材料、其他材料）、基板类型（晶片级构装基板、球栅阵列基板、覆晶基板）

调查企业范例（共41家企业）

Ablestik Laboratories
AI Technology Inc.
Advanced Technology & Materials Co., Ltd.
Dow Inc.
Dupont Electronics & Imaging
Henkel AG & Co. KGaA
Hitachi Chemical Co., Ltd.
JSR Corporation
Kyocera Corporation
LORD Corporation
Nagase ChemteX Corporation
Namics Corporation
NuSil Technology LLC
Panacol-Elosol GmbH
Sika AG
Shin-Etsu Chemical Co., Ltd.
Sumitomo Bakelite Company, Limited
Techsil Ltd
Trelleborg AB
UMC Electronics Co., Ltd.

人工智慧集成

我们正在利用可操作的专家内容和人工智慧工具来改变市场和竞争情报。

Global 特定产业SLM 的典型规范，而是建立了一个从全球专家收集的内容库，其中包括视讯录影、部落格、搜寻引擎研究以及大量的公司、产品/服务和市场数据。

关税影响係数

全球产业分析师根据公司总部所在国家、製造地、进出口状况（成品和原始OEM）预测其竞争态势的变化。这种复杂且多面向的市场动态预计将以多种方式影响竞争对手，包括销货成本成本 (COGS) 上升、盈利下降、供应链重组以及其他微观和宏观市场动态。

The global market for Electronic Board Level Underfill and Encapsulation estimated at US$333.0 Million in the year 2024, is expected to reach US$404.3 Million by 2030, growing at a CAGR of 3.3% over the analysis period 2024-2030. Underfills Type, one of the segments analyzed in the report, is expected to record a 2.7% CAGR and reach US$258.1 Million by the end of the analysis period. Growth in the Gob Top Encapsulations Type segment is estimated at 4.5% CAGR over the analysis period.

The U.S. Market is Estimated at US$90.7 Million While China is Forecast to Grow at 6.0% CAGR

The Electronic Board Level Underfill and Encapsulation market in the U.S. is estimated at US$90.7 Million in the year 2024. China, the world's second largest economy, is forecast to reach a projected market size of US$79.5 Million by the year 2030 trailing a CAGR of 6.0% over the analysis period 2024-2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at a CAGR of 1.3% and 2.5% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 1.9% CAGR.

Global Electronic Board Level Underfill and Encapsulation Market - Key Trends & Drivers Summarized

Why Are Underfill and Encapsulation Solutions Crucial in PCB and Microelectronics Assembly?

Electronic board-level underfill and encapsulation materials are critical to ensuring the mechanical integrity, thermal stability, and long-term reliability of semiconductor packages and printed circuit boards (PCBs). As electronic devices become more compact and powerful, the stresses exerted on solder joints, interconnects, and die surfaces intensify, particularly in ball grid arrays (BGAs), chip-scale packages (CSPs), and flip-chip configurations.

Underfill materials are typically epoxy-based formulations applied between the chip and substrate to reinforce solder joints, mitigate coefficient of thermal expansion (CTE) mismatch, and absorb mechanical shock. Encapsulation compounds-used for overmolding or potting-offer protection from moisture, chemicals, and particulate contamination. These materials extend the operational life of electronics exposed to automotive, aerospace, industrial, or consumer-grade environments.

In devices subject to thermal cycling, vibration, or drop impact-such as smartphones, automotive ECUs, and wearable electronics-underfill and encapsulants serve as a physical buffer and a thermal path. In advanced packaging architectures like 2.5D/3D ICs and system-in-package (SiP), underfill solutions help manage internal stress loads across multiple dies and interposer layers, making them indispensable in semiconductor packaging.

What Material Innovations and Application Techniques Are Reshaping the Segment?

Material innovations in underfill and encapsulation are focused on improving thermal conductivity, lowering curing temperatures, enhancing flow characteristics, and enabling faster dispense cycles. Conventional capillary underfill systems have evolved into no-flow underfills, pre-applied underfills (PAUF), and reworkable variants to suit diverse process flows and assembly line constraints.

Thermally conductive underfills with filler materials like alumina, boron nitride, and silver flakes are increasingly used in high-power devices and RF modules. These formulations combine low viscosity with high heat dissipation, allowing for rapid curing and minimal void formation. UV-curable and snap-cure systems are being adopted for high-throughput manufacturing environments where cycle time is a key performance metric.

Encapsulation materials are transitioning toward hybrid resin systems combining epoxy, silicone, and polyurethane characteristics for better flexibility and adhesion on challenging substrates. For MEMS devices and optical sensors, low-stress, optically clear encapsulants with low outgassing profiles are becoming mainstream. Jet-dispensing and stencil printing techniques are now common for volume production in mobile and consumer electronics.

Which End-Use Segments and Packaging Trends Are Driving Demand?

The semiconductor industry remains the largest consumer of underfill and encapsulation solutions. Foundries and OSATs (Outsourced Semiconductor Assembly and Test providers) use these materials in flip-chip packaging, wafer-level CSPs, and emerging 3D-stacked architectures. Leading players like TSMC, ASE, and Amkor are specifying custom underfills for AI chips, RF front-end modules, and logic-memory integration.

Consumer electronics is the second-largest end-use segment, encompassing smartphones, wearables, tablets, and gaming devices. As devices become thinner and more densely packed, thermal and mechanical reliability become central to user experience and warranty cycles. Advanced encapsulants are used to safeguard against water ingress and thermal degradation-especially in IP-rated devices.

Automotive electronics is a rapidly growing segment, driven by the increasing number of ECUs, sensors, and power modules. Underfill materials are essential for ensuring vibration resistance and thermal cycling endurance in harsh automotive environments. Key applications include ADAS processors, infotainment systems, and battery control units in EVs. Industrial automation, medical electronics, and aerospace applications further diversify demand.

What Factors Are Accelerating Growth in the Underfill and Encapsulation Market?

The growth in the electronic board level underfill and encapsulation market is driven by several factors including miniaturization of electronics, increasing power density in semiconductors, reliability requirements in harsh environments, and the rise of heterogeneous integration in packaging technologies.

First, the push toward smaller, lighter, and multifunctional electronic devices necessitates more robust protective materials. As solder joint pitch narrows and component stacking increases, mechanical reinforcement via underfill becomes critical to avoid premature failures, especially during drop tests and thermal cycles.

Second, power semiconductors and RF components used in 5G, automotive, and high-performance computing generate substantial heat. Underfill and encapsulants with enhanced thermal conductivity help dissipate this heat efficiently, preventing hot-spot failures and ensuring long-term reliability-especially in confined PCB layouts.

Third, the automotive and aerospace sectors are increasing reliability thresholds. Devices in these environments must endure wide temperature swings, vibrations, and exposure to corrosive agents. High-temperature stable, chemically inert encapsulants and reworkable underfills are being demanded to meet industry-specific standards such as AEC-Q100 and MIL-STD-883.

Lastly, the emergence of fan-out wafer-level packaging (FOWLP), system-in-package (SiP), and chiplet architectures is pushing material engineers to develop highly customizable, low-CTE, and void-free underfills. These architectures, which blend logic, memory, and analog blocks on a single module, rely heavily on precision material deposition to ensure signal fidelity and physical integrity.

SCOPE OF STUDY:

The report analyzes the Electronic Board Level Underfill and Encapsulation market in terms of units by the following Segments, and Geographic Regions/Countries:

Segments:

Product Type (Underfills Type, Gob Top Encapsulations Type); Material (Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material, Other Materials); Board Type (Chip Scale Package Board, Ball Grid array Board, Flip Chips Board)

Geographic Regions/Countries:

World; United States; Canada; Japan; China; Europe (France; Germany; Italy; United Kingdom; Spain; Russia; and Rest of Europe); Asia-Pacific (Australia; India; South Korea; and Rest of Asia-Pacific); Latin America (Argentina; Brazil; Mexico; and Rest of Latin America); Middle East (Iran; Israel; Saudi Arabia; United Arab Emirates; and Rest of Middle East); and Africa.

Select Competitors (Total 41 Featured) -

Ablestik Laboratories
AI Technology Inc.
Advanced Technology & Materials Co., Ltd.
Dow Inc.
Dupont Electronics & Imaging
Henkel AG & Co. KGaA
Hitachi Chemical Co., Ltd.
JSR Corporation
Kyocera Corporation
LORD Corporation
Nagase ChemteX Corporation
Namics Corporation
NuSil Technology LLC
Panacol-Elosol GmbH
Sika AG
Shin-Etsu Chemical Co., Ltd.
Sumitomo Bakelite Company, Limited
Techsil Ltd
Trelleborg AB
UMC Electronics Co., Ltd.

AI INTEGRATIONS

We're transforming market and competitive intelligence with validated expert content and AI tools.

Instead of following the general norm of querying LLMs and Industry-specific SLMs, we built repositories of content curated from domain experts worldwide including video transcripts, blogs, search engines research, and massive amounts of enterprise, product/service, and market data.

TARIFF IMPACT FACTOR

Our new release incorporates impact of tariffs on geographical markets as we predict a shift in competitiveness of companies based on HQ country, manufacturing base, exports and imports (finished goods and OEM). This intricate and multifaceted market reality will impact competitors by increasing the Cost of Goods Sold (COGS), reducing profitability, reconfiguring supply chains, amongst other micro and macro market dynamics.

I. METHODOLOGY

II. EXECUTIVE SUMMARY

1. MARKET OVERVIEW
- Influencer Market Insights
- World Market Trajectories
- Tariff Impact on Global Supply Chain Patterns
- Electronic Board Level Underfill and Encapsulation - Global Key Competitors Percentage Market Share in 2025 (E)
- Competitive Market Presence - Strong/Active/Niche/Trivial for Players Worldwide in 2025 (E)
2. FOCUS ON SELECT PLAYERS
3. MARKET TRENDS & DRIVERS
- Rise in High-Density Chip Packaging Drives Demand for Underfill and Encapsulation Materials
- Growth in Mobile and Wearable Electronics Throws Spotlight on Board-Level Mechanical Protection
- Increased Use of Flip-Chip and BGA Components Strengthens Business Case for Capillary Underfill
- Expansion of 5G and High-Frequency Applications Spurs Innovation in Low-Dielectric Encapsulants
- OEM Focus on Product Miniaturization Encourages Development of Thin and Conformal Coatings
- Increased Use of High-Performance Processors in Consumer Electronics Drives Thermal Cycling Protection
- Integration With SMT and Wafer-Level Packaging Technologies Expands Adoption in Advanced PCBs
- Use in Harsh Environment Applications Spurs Demand for Moisture and Chemical Resistant Formulations
- Growing EV and Power Electronics Segments Fuel Demand for High-Voltage Underfill Materials
- Development of Reworkable and UV-Curable Underfill Systems Supports Cost-Effective Manufacturing
- Increased Importance of Reliability in Medical and Aerospace Electronics Boosts Encapsulation Standards
- Emergence of AI and Edge Computing Devices Strengthens Need for Stress-Absorbing Materials
- OEM and OSAT Partnerships Accelerate Commercialization of Custom Underfill Chemistries
- Surge in Chiplet and 3D IC Architectures Expands Scope of Multi-Component Encapsulation
- Stringent Thermal Shock and Drop Test Requirements Propel Focus on Mechanical Shock Absorption
- Regulatory Push for Lead-Free and Halogen-Free Materials Encourages Eco-Friendly Encapsulant Development
- Expansion of Smart Cards and RFID Devices Fuels Use in Secure Microelectronic Modules
- Material Innovation in Epoxy Resins and Silicones Enhances Long-Term Reliability
- Shift Toward Automation in Assembly Processes Drives Demand for Dispense-Friendly Formulations
- Increasing PCB Complexity in Automotive Electronics Promotes Advanced Encapsulation Strategies
4. GLOBAL MARKET PERSPECTIVE
- TABLE 1: World Electronic Board Level Underfill and Encapsulation Market Analysis of Annual Sales in US$ Thousand for Years 2014 through 2030
- TABLE 2: World Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
- TABLE 3: World Historic Review for Electronic Board Level Underfill and Encapsulation by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 4: World 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets for Years 2014, 2025 & 2030
- TABLE 5: World Recent Past, Current & Future Analysis for Underfills Type by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
- TABLE 6: World Historic Review for Underfills Type by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 7: World 16-Year Perspective for Underfills Type by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2025 & 2030
- TABLE 8: World Recent Past, Current & Future Analysis for Gob Top Encapsulations Type by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
- TABLE 9: World Historic Review for Gob Top Encapsulations Type by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 10: World 16-Year Perspective for Gob Top Encapsulations Type by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2025 & 2030
- TABLE 11: World Recent Past, Current & Future Analysis for Ball Grid array Board by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
- TABLE 12: World Historic Review for Ball Grid array Board by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 13: World 16-Year Perspective for Ball Grid array Board by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2025 & 2030
- TABLE 14: World Recent Past, Current & Future Analysis for Flip Chips Board by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
- TABLE 15: World Historic Review for Flip Chips Board by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 16: World 16-Year Perspective for Flip Chips Board by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2025 & 2030
- TABLE 17: World Recent Past, Current & Future Analysis for Chip Scale Package Board by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
- TABLE 18: World Historic Review for Chip Scale Package Board by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 19: World 16-Year Perspective for Chip Scale Package Board by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2025 & 2030
- TABLE 20: World Recent Past, Current & Future Analysis for Quartz / Silicone Material by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
- TABLE 21: World Historic Review for Quartz / Silicone Material by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 22: World 16-Year Perspective for Quartz / Silicone Material by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2025 & 2030
- TABLE 23: World Recent Past, Current & Future Analysis for Alumina Based Material by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
- TABLE 24: World Historic Review for Alumina Based Material by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 25: World 16-Year Perspective for Alumina Based Material by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2025 & 2030
- TABLE 26: World Recent Past, Current & Future Analysis for Epoxy Based Material by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
- TABLE 27: World Historic Review for Epoxy Based Material by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 28: World 16-Year Perspective for Epoxy Based Material by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2025 & 2030
- TABLE 29: World Recent Past, Current & Future Analysis for Urethane Based Material by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
- TABLE 30: World Historic Review for Urethane Based Material by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 31: World 16-Year Perspective for Urethane Based Material by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2025 & 2030
- TABLE 32: World Recent Past, Current & Future Analysis for Acrylic Based Material by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
- TABLE 33: World Historic Review for Acrylic Based Material by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 34: World 16-Year Perspective for Acrylic Based Material by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2025 & 2030
- TABLE 35: World Recent Past, Current & Future Analysis for Other Materials by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
- TABLE 36: World Historic Review for Other Materials by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 37: World 16-Year Perspective for Other Materials by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2025 & 2030

III. MARKET ANALYSIS

UNITED STATES
- Electronic Board Level Underfill and Encapsulation Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United States for 2025 (E)
- TABLE 38: USA Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
- TABLE 39: USA Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 40: USA 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
- TABLE 41: USA Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
- TABLE 42: USA Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 43: USA 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
- TABLE 44: USA Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
- TABLE 45: USA Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 46: USA 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
CANADA
- TABLE 47: Canada Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
- TABLE 48: Canada Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 49: Canada 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
- TABLE 50: Canada Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
- TABLE 51: Canada Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 52: Canada 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
- TABLE 53: Canada Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
- TABLE 54: Canada Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 55: Canada 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
JAPAN
- Electronic Board Level Underfill and Encapsulation Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Japan for 2025 (E)
- TABLE 56: Japan Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
- TABLE 57: Japan Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 58: Japan 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
- TABLE 59: Japan Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
- TABLE 60: Japan Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 61: Japan 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
- TABLE 62: Japan Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
- TABLE 63: Japan Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 64: Japan 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
CHINA
- Electronic Board Level Underfill and Encapsulation Market Presence - Strong/Active/Niche/Trivial - Key Competitors in China for 2025 (E)
- TABLE 65: China Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
- TABLE 66: China Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 67: China 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
- TABLE 68: China Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
- TABLE 69: China Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 70: China 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
- TABLE 71: China Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
- TABLE 72: China Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 73: China 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
EUROPE
- Electronic Board Level Underfill and Encapsulation Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Europe for 2025 (E)
- TABLE 74: Europe Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Geographic Region - France, Germany, Italy, UK, Spain, Russia and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
- TABLE 75: Europe Historic Review for Electronic Board Level Underfill and Encapsulation by Geographic Region - France, Germany, Italy, UK, Spain, Russia and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 76: Europe 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Geographic Region - Percentage Breakdown of Value Sales for France, Germany, Italy, UK, Spain, Russia and Rest of Europe Markets for Years 2014, 2025 & 2030
- TABLE 77: Europe Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
- TABLE 78: Europe Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 79: Europe 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
- TABLE 80: Europe Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
- TABLE 81: Europe Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 82: Europe 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
- TABLE 83: Europe Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
- TABLE 84: Europe Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 85: Europe 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
FRANCE
- Electronic Board Level Underfill and Encapsulation Market Presence - Strong/Active/Niche/Trivial - Key Competitors in France for 2025 (E)
- TABLE 86: France Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
- TABLE 87: France Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 88: France 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
- TABLE 89: France Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
- TABLE 90: France Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 91: France 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
- TABLE 92: France Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
- TABLE 93: France Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 94: France 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
GERMANY
- Electronic Board Level Underfill and Encapsulation Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Germany for 2025 (E)
- TABLE 95: Germany Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
- TABLE 96: Germany Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 97: Germany 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
- TABLE 98: Germany Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
- TABLE 99: Germany Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 100: Germany 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
- TABLE 101: Germany Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
- TABLE 102: Germany Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 103: Germany 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
ITALY
- TABLE 104: Italy Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
- TABLE 105: Italy Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 106: Italy 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
- TABLE 107: Italy Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
- TABLE 108: Italy Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 109: Italy 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
- TABLE 110: Italy Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
- TABLE 111: Italy Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 112: Italy 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
UNITED KINGDOM
- Electronic Board Level Underfill and Encapsulation Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United Kingdom for 2025 (E)
- TABLE 113: UK Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
- TABLE 114: UK Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 115: UK 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
- TABLE 116: UK Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
- TABLE 117: UK Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 118: UK 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
- TABLE 119: UK Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
- TABLE 120: UK Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 121: UK 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
SPAIN
- TABLE 122: Spain Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
- TABLE 123: Spain Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 124: Spain 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
- TABLE 125: Spain Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
- TABLE 126: Spain Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 127: Spain 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
- TABLE 128: Spain Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
- TABLE 129: Spain Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 130: Spain 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
RUSSIA
- TABLE 131: Russia Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
- TABLE 132: Russia Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 133: Russia 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
- TABLE 134: Russia Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
- TABLE 135: Russia Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 136: Russia 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
- TABLE 137: Russia Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
- TABLE 138: Russia Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 139: Russia 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
REST OF EUROPE
- TABLE 140: Rest of Europe Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
- TABLE 141: Rest of Europe Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 142: Rest of Europe 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
- TABLE 143: Rest of Europe Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
- TABLE 144: Rest of Europe Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 145: Rest of Europe 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
- TABLE 146: Rest of Europe Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
- TABLE 147: Rest of Europe Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 148: Rest of Europe 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
ASIA-PACIFIC
- Electronic Board Level Underfill and Encapsulation Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Asia-Pacific for 2025 (E)
- TABLE 149: Asia-Pacific Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Geographic Region - Australia, India, South Korea and Rest of Asia-Pacific Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
- TABLE 150: Asia-Pacific Historic Review for Electronic Board Level Underfill and Encapsulation by Geographic Region - Australia, India, South Korea and Rest of Asia-Pacific Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 151: Asia-Pacific 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Geographic Region - Percentage Breakdown of Value Sales for Australia, India, South Korea and Rest of Asia-Pacific Markets for Years 2014, 2025 & 2030
- TABLE 152: Asia-Pacific Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
- TABLE 153: Asia-Pacific Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 154: Asia-Pacific 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
- TABLE 155: Asia-Pacific Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
- TABLE 156: Asia-Pacific Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 157: Asia-Pacific 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
- TABLE 158: Asia-Pacific Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
- TABLE 159: Asia-Pacific Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 160: Asia-Pacific 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
AUSTRALIA
- Electronic Board Level Underfill and Encapsulation Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Australia for 2025 (E)
- TABLE 161: Australia Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
- TABLE 162: Australia Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 163: Australia 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
- TABLE 164: Australia Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
- TABLE 165: Australia Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 166: Australia 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
- TABLE 167: Australia Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
- TABLE 168: Australia Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 169: Australia 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
INDIA
- Electronic Board Level Underfill and Encapsulation Market Presence - Strong/Active/Niche/Trivial - Key Competitors in India for 2025 (E)
- TABLE 170: India Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
- TABLE 171: India Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 172: India 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
- TABLE 173: India Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
- TABLE 174: India Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 175: India 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
- TABLE 176: India Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
- TABLE 177: India Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 178: India 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
SOUTH KOREA
- TABLE 179: South Korea Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
- TABLE 180: South Korea Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 181: South Korea 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
- TABLE 182: South Korea Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
- TABLE 183: South Korea Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 184: South Korea 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
- TABLE 185: South Korea Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
- TABLE 186: South Korea Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 187: South Korea 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
REST OF ASIA-PACIFIC
- TABLE 188: Rest of Asia-Pacific Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
- TABLE 189: Rest of Asia-Pacific Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 190: Rest of Asia-Pacific 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
- TABLE 191: Rest of Asia-Pacific Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
- TABLE 192: Rest of Asia-Pacific Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 193: Rest of Asia-Pacific 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
- TABLE 194: Rest of Asia-Pacific Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
- TABLE 195: Rest of Asia-Pacific Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 196: Rest of Asia-Pacific 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
LATIN AMERICA
- Electronic Board Level Underfill and Encapsulation Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Latin America for 2025 (E)
- TABLE 197: Latin America Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Geographic Region - Argentina, Brazil, Mexico and Rest of Latin America Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
- TABLE 198: Latin America Historic Review for Electronic Board Level Underfill and Encapsulation by Geographic Region - Argentina, Brazil, Mexico and Rest of Latin America Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 199: Latin America 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Geographic Region - Percentage Breakdown of Value Sales for Argentina, Brazil, Mexico and Rest of Latin America Markets for Years 2014, 2025 & 2030
- TABLE 200: Latin America Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
- TABLE 201: Latin America Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 202: Latin America 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
- TABLE 203: Latin America Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
- TABLE 204: Latin America Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 205: Latin America 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
- TABLE 206: Latin America Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
- TABLE 207: Latin America Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 208: Latin America 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
ARGENTINA
- TABLE 209: Argentina Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
- TABLE 210: Argentina Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 211: Argentina 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
- TABLE 212: Argentina Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
- TABLE 213: Argentina Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 214: Argentina 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
- TABLE 215: Argentina Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
- TABLE 216: Argentina Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 217: Argentina 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
BRAZIL
- TABLE 218: Brazil Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
- TABLE 219: Brazil Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 220: Brazil 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
- TABLE 221: Brazil Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
- TABLE 222: Brazil Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 223: Brazil 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
- TABLE 224: Brazil Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
- TABLE 225: Brazil Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 226: Brazil 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
MEXICO
- TABLE 227: Mexico Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
- TABLE 228: Mexico Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 229: Mexico 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
- TABLE 230: Mexico Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
- TABLE 231: Mexico Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 232: Mexico 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
- TABLE 233: Mexico Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
- TABLE 234: Mexico Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 235: Mexico 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
REST OF LATIN AMERICA
- TABLE 236: Rest of Latin America Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
- TABLE 237: Rest of Latin America Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 238: Rest of Latin America 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
- TABLE 239: Rest of Latin America Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
- TABLE 240: Rest of Latin America Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 241: Rest of Latin America 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
- TABLE 242: Rest of Latin America Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
- TABLE 243: Rest of Latin America Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 244: Rest of Latin America 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
MIDDLE EAST
- Electronic Board Level Underfill and Encapsulation Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Middle East for 2025 (E)
- TABLE 245: Middle East Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Geographic Region - Iran, Israel, Saudi Arabia, UAE and Rest of Middle East Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
- TABLE 246: Middle East Historic Review for Electronic Board Level Underfill and Encapsulation by Geographic Region - Iran, Israel, Saudi Arabia, UAE and Rest of Middle East Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 247: Middle East 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Geographic Region - Percentage Breakdown of Value Sales for Iran, Israel, Saudi Arabia, UAE and Rest of Middle East Markets for Years 2014, 2025 & 2030
- TABLE 248: Middle East Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
- TABLE 249: Middle East Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 250: Middle East 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
- TABLE 251: Middle East Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
- TABLE 252: Middle East Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 253: Middle East 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
- TABLE 254: Middle East Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
- TABLE 255: Middle East Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 256: Middle East 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
IRAN
- TABLE 257: Iran Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
- TABLE 258: Iran Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 259: Iran 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
- TABLE 260: Iran Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
- TABLE 261: Iran Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 262: Iran 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
- TABLE 263: Iran Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
- TABLE 264: Iran Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 265: Iran 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
ISRAEL
- TABLE 266: Israel Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
- TABLE 267: Israel Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 268: Israel 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
- TABLE 269: Israel Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
- TABLE 270: Israel Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 271: Israel 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
- TABLE 272: Israel Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
- TABLE 273: Israel Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 274: Israel 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
SAUDI ARABIA
- TABLE 275: Saudi Arabia Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
- TABLE 276: Saudi Arabia Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 277: Saudi Arabia 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
- TABLE 278: Saudi Arabia Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
- TABLE 279: Saudi Arabia Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 280: Saudi Arabia 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
- TABLE 281: Saudi Arabia Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
- TABLE 282: Saudi Arabia Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 283: Saudi Arabia 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
UNITED ARAB EMIRATES
- TABLE 284: UAE Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
- TABLE 285: UAE Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 286: UAE 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
- TABLE 287: UAE Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
- TABLE 288: UAE Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 289: UAE 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
- TABLE 290: UAE Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
- TABLE 291: UAE Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 292: UAE 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
REST OF MIDDLE EAST
- TABLE 293: Rest of Middle East Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
- TABLE 294: Rest of Middle East Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 295: Rest of Middle East 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
- TABLE 296: Rest of Middle East Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
- TABLE 297: Rest of Middle East Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 298: Rest of Middle East 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
- TABLE 299: Rest of Middle East Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
- TABLE 300: Rest of Middle East Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 301: Rest of Middle East 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
AFRICA
- Electronic Board Level Underfill and Encapsulation Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Africa for 2025 (E)
- TABLE 302: Africa Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
- TABLE 303: Africa Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 304: Africa 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
- TABLE 305: Africa Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
- TABLE 306: Africa Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 307: Africa 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
- TABLE 308: Africa Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
- TABLE 309: Africa Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
- TABLE 310: Africa 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030