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市场调查报告书
商品编码
1790004
美国有机基板包装材料市场规模、份额和趋势分析报告:按技术、应用和细分市场预测,2025-2033 年U.S. Organic Substrate Packaging Material Market Size, Share & Trends Analysis Report By Technology (SO Packages, GA Packages, Flat No-leads Packages), By Application (Consumer Electronics, Automotive), And Segment Forecasts, 2025 - 2033 |
美国有机基板包装材料市场摘要
美国有机基板包装材料市场规模预计在 2024 年为 21.6 亿美元,预计到 2033 年将达到 36.2 亿美元,2025 年至 2033 年的复合年增长率为 5.9%。电子和半导体应用的激增,尤其是在电动车、自动驾驶汽车、资料中心晶片和电子商务包装需求的推动下,有利于永续基板并推动市场成长。
有机基板封装材料市场的主要驱动力之一是对先进半导体封装技术(例如系统级封装(SiP)、覆晶和扇出晶圆层次电子构装(FOWLP))不断增长的需求。这些先进技术需要能够支援更高 I/O 密度、小型化和高速讯号传输的高性能基板。有机基板主要由树脂涂层铜、BT 树脂和味之素增材製造膜 (ABF) 製成,已成为下一代晶片组经济高效且可靠的解决方案。例如,随着 5G基地台和 AI 加速器的不断扩展部署,三星和英特尔等公司越来越多地采用有机基板进行晶片封装。
此外,消费性电子产品和行动装置(尤其是在新兴市场)的快速成长,正在推动有机基板市场的扩张。智慧型手机、平板电脑、穿戴式装置和智慧家庭技术等装置越来越多地整合更小、更复杂的积体电路,需要高层数位有机基板。随着苹果继续整合其M系列晶片等客製化SoC,以及安卓製造商专注于支援人工智慧的处理器,对紧凑、耐热且经济高效的基板材料的需求持续成长。这些趋势正在推动基板製造商扩大产能并投资于ABF等先进材料。
汽车电子产业也是一个主要的成长领域,尤其是在向电动车 (EV) 和高级驾驶辅助系统 (ADAS) 转型的过程中。汽车应用需要坚固、热稳定且可靠的基板,这使得有机基板非常适合用于电控系统(ECU)、电池管理系统和资讯娱乐系统。主要的汽车原始设备製造商 (OEM) 和一级供应商正越来越多地与半导体封装公司合作,以获取专为恶劣环境设计的有机基板。博世和大陆集团等公司正专注于电动车动力传动系统电子设备和自动驾驶系统,从而推动需求成长,间接加速了有机基板市场的成长。
U.S. Organic Substrate Packaging Material Market Summary
The U.S. organic substrate packaging material market size was estimated at USD 2.16 billion in 2024 and is expected to reach USD 3.62 billion by 2033, growing at a CAGR of 5.9% from 2025 to 2033. Surging electronics and semiconductor applications, especially due to EVs, autonomous vehicles, data center chips, and e commerce packaging needs that favor sustainable substrates, thus driving the market growth.
One of the primary drivers of the organic substrate packaging material market is the growing demand for advanced semiconductor packaging technologies such as System-in-Package (SiP), Flip Chip, and Fan-Out Wafer Level Packaging (FOWLP). These advanced technologies demand high-performance substrates capable of supporting greater I/O densities, miniaturization, and faster signal transmission. Organic substrates-primarily composed of resin-coated copper, BT resin, and Ajinomoto Build-up Film (ABF) have emerged as a cost-effective and reliable solution for next-generation chipsets. For example, the growing deployment of 5G base stations and AI accelerators has led companies like Samsung and Intel to increasingly adopt organic substrates for multi-die packaging.
Furthermore, the rapid growth of consumer electronics and mobile devices, particularly in emerging markets, is driving the expansion of the organic substrate market. Devices such as smartphones, tablets, wearables, and smart home technologies are incorporating increasingly compact and complex integrated circuits, necessitating high-layer-count organic substrates. As Apple continues to integrate custom SoCs like the M-series chips and Android manufacturers focus on AI-enabled processors, the demand for compact, thermally resilient, and cost-efficient substrate materials continues to rise. These trends are compelling substrate manufacturers to expand production capacity and invest in advanced materials like ABF.
The automotive electronics sector also represents a major growth area, especially with the shift toward electric vehicles (EVs) and advanced driver-assistance systems (ADAS). Automotive applications require substrates that are robust, thermally stable, and reliable-making organic substrates well-suited for use in Electronic Control Units (ECUs), battery management systems, and infotainment systems. Leading automotive OEMs and Tier-1 suppliers are increasingly collaborating with semiconductor packaging firms to obtain organic substrates designed for demanding environments. Companies such as Bosch and Continental are helping to propel demand by focusing on EV powertrain electronics and autonomous driving systems, thereby indirectly accelerating growth in the organic substrate market.
U.S. Organic Substrate Packaging Material Market Report Segmentation
This report forecasts revenue growth at the country level and provides an analysis of the latest industry trends in each of the sub-segments from 2021 to 2033. For this study, Grand View Research has segmented the U.S. organic substrate packaging material market report based on technology, and application: