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市场调查报告书
商品编码
1790117

半导体组装和封装设备市场规模、份额和趋势分析报告：按产品类型、封装类型、最终用途、地区和细分市场预测，2025 年至 2033 年

Semiconductor Assembly And Packaging Equipment Market Size, Share & Trends Analysis Report By Product (Dicing Equipment, Bonding Equipment), By Packaging Type, By End-use, By Region, And Segment Forecasts, 2025 - 2033
出版日期: | 出版商: Grand View Research | 英文 100 Pages | 商品交期: 2-10个工作天内

价格

半导体组装和封装设备市场摘要

预计 2024 年全球半导体组装和封装设备市场价值将达到 44.21 亿美元，预计 2025 年至 2033 年期间的复合年增长率为 8.4%，到 2030 年将达到 92.09 亿美元。这一增长是由对紧凑、高性能电子设备日益增长的需求所推动的。

随着家用电子电器和行动装置体积越来越小、功能越来越强大，对先进封装技术的需求也日益增长，以满足效能、效率和小型化方面的要求。市场成长的一个关键驱动力是无晶圆厂半导体公司外包业务的趋势日益增强。这种转变推动了对外包半导体组装测试公司 (OSAT) 提供的组装服务的需求。为此，OSAT 供应商正在积极投资先进的封装设备，以满足不断变化的客户需求。

此外，美国、中国和欧洲等地区的政府措施和半导体奖励策略正在进一步加速晶片生产和封装基础设施的资本投资。这些综合因素支撑着半导体组装和封装设备产业的强劲成长轨迹。

目录

第一章调查方法与范围

第二章执行摘要

第三章全球半导体组装与封装设备市场变数、趋势与范围

  • 绘製市场集中度与成长前景
  • 产业价值链分析
    • 原料和零件的前景
    • 製造商的展望
    • 分销展望
    • 最终使用者视角
  • 法律规范
  • 技术概述
  • 市场动态
    • 市场驱动因素分析
    • 市场限制因素分析
    • 市场问题分析
    • 市场机会分析
  • 经济大趋势分析
  • 产业分析工具
    • 波特五力分析
    • 宏观环境分析

第四章：全球半导体组装和封装设备市场：按最终用途的估计和趋势分析

  • 2024 年和 2033 年按最终用途分類的变化分析和市场占有率
  • 依最终用途，2021-2033 年
  • IDM（整合设备製造商）
  • OSAT（外包半导体组装和测试）

第五章全球半导体组装与封装设备市场：依封装类型估算与趋势分析

  • 2024年和2033年按包装类型分類的变化分析和市场占有率
  • 2021-2033 年包装类型
  • 覆晶构装设备
  • 晶圆层次电子构装（WLP）设备
  • 扇出型封装设备
  • 系统级封装(SiP) 设备
  • 3D/2.5D包装设备
  • 其他的

第六章：全球半导体组装和封装设备市场：按产品分類的估计和趋势分析

  • 2024 年和 2033 年产品变化分析和市场占有率
  • 按产品，2021-2033
  • 切割设备
    • 抄写员
    • 切丁机
    • 晶圆安装设备
  • 键合设备
    • 晶片焊接机
    • 引线键合机
    • 其他的
  • 包装设备
    • 成型设备
    • 焊锡电镀设备
    • 去毛刺器
    • 其他的
  • 其他的

第七章：全球半导体组装和封装设备市场：区域估计和趋势分析

  • 2024年和2033年区域分析和市场占有率
  • 北美洲
    • 2021-2033 年包装类型
    • 依最终用途，2021-2033 年
    • 按产品，2021-2033
    • 美国
    • 加拿大
    • 墨西哥
  • 欧洲
    • 2021-2033 年包装类型
    • 依最终用途，2021-2033 年
    • 按产品，2021-2033
    • 德国
    • 法国
    • 英国
    • 义大利
    • 西班牙
    • 荷兰
  • 亚太地区
    • 2021-2033 年包装类型
    • 依最终用途，2021-2033 年
    • 按产品，2021-2033
    • 中国
    • 印度
    • 日本
    • 台湾
    • 韩国
  • 拉丁美洲
    • 2021-2033 年包装类型
    • 依最终用途，2021-2033 年
    • 按产品，2021-2033
    • 巴西
  • 中东和非洲
    • 2021-2033 年包装类型
    • 依最终用途，2021-2033 年
    • 按产品，2021-2033
    • 以色列
    • 南非

8. 全球半导体组装与封装设备市场-竞争格局

  • 主要市场参与企业的近期趋势和影响分析
  • 公司分类
  • 企业仪錶板分析
  • 供应商格局
    • 主要原料/零件供应商名单
    • 主要製造商名单
    • 主要经销商名单
  • 2024年公司市场占有率分析
  • 2024年企业定位分析
  • 2024年企业热图分析
  • 战略地图
  • 公司简介
    • Applied Materials
    • ASM Pacific Technology
    • Veeco Instruments Inc.
    • Besi
    • Disco Corporation
    • Kulicke &Soffa Industries, Inc.（K&S）
    • Lam Research Corporation
    • Nikon Corporation
    • Plasma-Therm
    • Rudolph Technologies, Inc.
    • SCREEN Semiconductor Solutions Co., Ltd.
    • SUSS MicroTec SE
    • Teradyne, Inc.
    • Tokyo Electron Limited（TEL）
    • Ultratech, Inc.
Product Code: GVR-4-68040-685-9

Semiconductor Assembly & Packaging Equipment Market Summary

The global semiconductor assembly and packaging equipment market size was estimated at USD 4,421.0 million in 2024 and is projected to reach USD 9,209.0 million by 2030, growing at a CAGR of 8.4% from 2025 to 2033. This growth is driven by rising demand for compact, high-performance electronic devices.

As consumer electronics and mobile devices become smaller yet more powerful, the need for advanced packaging technologies continues to grow to meet performance, efficiency, and miniaturization requirements. A significant driver of market growth is the increasing trend of outsourcing by fabless semiconductor companies. This shift has resulted in rising demand for assembly and packaging services provided by OSAT (Outsourced Semiconductor Assembly and Test) companies. In response, OSAT providers are heavily investing in advanced assembly and packaging equipment to meet evolving customer needs.

In addition, government initiatives and semiconductor stimulus programs in regions such as the U.S., China, and Europe are further accelerating capital investments in chip production and packaging infrastructure. Collectively, these factors are propelling the robust growth trajectory of the semiconductor assembly and packaging equipment industry.

Global Semiconductor Assembly & Packaging Equipment Market Report Segmentation

This report forecasts revenue growth at global, regional, and country levels and provides an analysis of the latest industry trends in each of the sub-segments from 2021 to 2033. For this study, Grand View Research has segmented the global semiconductor assembly and packaging equipment market report based on packaging type,end-use, product and region.

  • Packaging Type Outlook (Revenue, USD Million, 2021 - 2033)
  • Flip Chip Packaging Equipment
  • Wafer Level Packaging (WLP) Equipment
  • Fan-Out Packaging Equipment
  • System-in-Package (SiP) Equipment
  • 3D/2.5D Packaging Equipment
  • Others
  • End-use Outlook (Revenue, USD Million, 2021 - 2033)
  • IDMs (Integrated Device Manufacturers)
  • OSAT (Outsourced Semiconductor Assembly and Test)
  • Product Outlook (Revenue, USD Million, 2021 - 2033)
  • Dicing Equipment
    • Scriber
    • Dicer
    • Wafer Mounting Equipment
  • Bonding Equipment
    • Die Bonder
    • Wire Bonder
    • Others
  • Packaging Equipment
    • Molding Equipment
    • Solder Plating Equipment
    • Deflasher
    • Others
  • Others
  • Regional Outlook (Revenue, USD Million, 2021 - 2033)
  • North America
    • U.S.
    • Canada
  • Mexico
    • Europe
    • Germany
    • France
    • Italy
    • Spain
    • UK
    • Netherlands
  • Asia Pacific
    • China
    • India
    • Japan
    • South Korea
    • Taiwan
  • Latin America
    • Brazil
  • Middle East and Africa
    • Israel
    • South Africa

Table of Contents

Chapter 1. Methodology and Scope

  • 1.1. Market Segmentation & Scope
  • 1.2. Market Definition
  • 1.3. Information Procurement
    • 1.3.1. Purchased Database
    • 1.3.2. GVR's Internal Database
    • 1.3.3. Secondary Sources & Third-Party Perspectives
    • 1.3.4. Primary Research
  • 1.4. Information Analysis
    • 1.4.1. Data Analysis Models
  • 1.5. Market Formulation & Data Visualization
  • 1.6. Data Validation & Publishing

Chapter 2. Executive Summary

  • 2.1. Market Snapshot
  • 2.2. Segment Snapshot
  • 2.3. Competitive Landscape Snapshot

Chapter 3. Global Semiconductor Assembly and Packaging Equipment Market Variables, Trends & Scope

  • 3.1. Market Concentration & Growth Prospect Mapping
  • 3.2. Industry Value Chain Analysis
    • 3.2.1. Raw Material/Component Outlook
    • 3.2.2. Manufacturer Outlook
    • 3.2.3. Distribution Outlook
    • 3.2.4. End User Outlook
  • 3.3. Regulatory Framework
  • 3.4. Technology Overview
  • 3.5. Market Dynamics
    • 3.5.1. Market Driver Analysis
    • 3.5.2. Market Restraint Analysis
    • 3.5.3. Market Challenges Analysis
    • 3.5.4. Market Opportunity Analysis
  • 3.6. Economic Mega-Trend Analysis
  • 3.7. Industry Analysis Tools
    • 3.7.1. Porter's Five Forces Analysis
    • 3.7.2. Macro-environmental Analysis

Chapter 4. Global Semiconductor Assembly and Packaging Equipment Market: End Use Estimates & Trend Analysis

  • 4.1. End Use Movement Analysis & Market Share, 2024 & 2033
  • 4.2. Global Semiconductor Assembly and Packaging Equipment Market Estimates & Forecast, By End Use, 2021 to 2033 (USD Million)
  • 4.3. IDMs (Integrated Device Manufacturers)
    • 4.3.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 4.4. OSAT (Outsourced Semiconductor Assembly and Test)
    • 4.4.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)

Chapter 5. Global Semiconductor Assembly and Packaging Equipment Market: Packaging Type Estimates & Trend Analysis

  • 5.1. Packaging Type Movement Analysis & Market Share, 2024 & 2033
  • 5.2. Global Semiconductor Assembly and Packaging Equipment Market Estimates & Forecast, By Packaging Type, 2021 to 2033 (USD Million)
  • 5.3. Flip Chip Packaging Equipment
    • 5.3.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 5.4. Wafer Level Packaging (WLP) Equipment
    • 5.4.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 5.5. Fan-Out Packaging Equipment
    • 5.5.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 5.6. System-in-Package (SiP) Equipment
    • 5.6.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 5.7. 3D/2.5D Packaging Equipment
    • 5.7.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 5.8. Others
    • 5.8.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)

Chapter 6. Global Semiconductor Assembly and Packaging Equipment Market: Product Estimates & Trend Analysis

  • 6.1. Product Movement Analysis & Market Share, 2024 & 2033
  • 6.2. Global Semiconductor Assembly and Packaging Equipment Market Estimates & Forecast, By Product, 2021 to 2033 (USD Million)
  • 6.3. Dicing Equipment
    • 6.3.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
    • 6.3.2. Scriber
      • 6.3.2.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
    • 6.3.3. Dicer
      • 6.3.3.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
    • 6.3.4. Wafer Mounting Equipment
      • 6.3.4.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 6.4. Bonding Equipment
    • 6.4.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
    • 6.4.2. Die Bonder
      • 6.4.2.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
    • 6.4.3. Wire Bonder
      • 6.4.3.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
    • 6.4.4. Others
      • 6.4.4.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 6.5. Packaging Equipment
    • 6.5.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
    • 6.5.2. Molding Equipment
      • 6.5.2.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
    • 6.5.3. Solder Plating Equipment
      • 6.5.3.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
    • 6.5.4. Deflasher
      • 6.5.4.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
    • 6.5.5. Others
      • 6.5.5.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 6.6. Others
    • 6.6.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)

Chapter 7. Global Semiconductor Assembly and Packaging Equipment Market: Regional Estimates & Trend Analysis

  • 7.1. Regional Movement Analysis & Market Share, 2024 & 2033
  • 7.2. North America
    • 7.2.1. Market Estimates & Forecast, 2021 - 2033 (USD Million)
    • 7.2.2. Market estimates & forecast, by packaging type, 2021 - 2033 (USD Million)
    • 7.2.3. Market estimates & forecast, by end use, 2021 - 2033 (USD Million)
    • 7.2.4. Market estimates & forecast, by product, 2021 - 2033 (USD Million)
    • 7.2.5. U.S.
      • 7.2.5.1. Key country dynamics
      • 7.2.5.2. Market Estimates & Forecast, 2021 - 2033 (USD Million)
      • 7.2.5.3. Market estimates & forecast, by packaging type, 2021 - 2033 (USD Million)
      • 7.2.5.4. Market estimates & forecast, by end use, 2021 - 2033 (USD Million)
      • 7.2.5.5. Market estimates & forecast, by product, 2021 - 2033 (USD Million)
    • 7.2.6. Canada
      • 7.2.6.1. Key country dynamics
      • 7.2.6.2. Market Estimates & Forecast, 2021 - 2033 (USD Million)
      • 7.2.6.3. Market estimates & forecast, by packaging type, 2021 - 2033 (USD Million)
      • 7.2.6.4. Market estimates & forecast, by end use, 2021 - 2033 (USD Million)
      • 7.2.6.5. Market estimates & forecast, by product, 2021 - 2033 (USD Million)
    • 7.2.7. Mexico
      • 7.2.7.1. Key country dynamics
      • 7.2.7.2. Market Estimates & Forecast, 2021 - 2033 (USD Million)
      • 7.2.7.3. Market estimates & forecast, by packaging type, 2021 - 2033 (USD Million)
      • 7.2.7.4. Market estimates & forecast, by end use, 2021 - 2033 (USD Million)
      • 7.2.7.5. Market estimates & forecast, by product, 2021 - 2033 (USD Million)
  • 7.3. Europe
    • 7.3.1. Market Estimates & Forecast, 2021 - 2033 (USD Million)
    • 7.3.2. Market estimates & forecast, by packaging type, 2021 - 2033 (USD Million)
    • 7.3.3. Market estimates & forecast, by end use, 2021 - 2033 (USD Million)
    • 7.3.4. Market estimates & forecast, by product, 2021 - 2033 (USD Million)
    • 7.3.5. Germany
      • 7.3.5.1. Key country dynamics
      • 7.3.5.2. Market Estimates & Forecast, 2021 - 2033 (USD Million)
      • 7.3.5.3. Market estimates & forecast, by packaging type, 2021 - 2033 (USD Million)
      • 7.3.5.4. Market estimates & forecast, by end use, 2021 - 2033 (USD Million)
      • 7.3.5.5. Market estimates & forecast, by product, 2021 - 2033 (USD Million)
    • 7.3.6. France
      • 7.3.6.1. Key country dynamics
      • 7.3.6.2. Market Estimates & Forecast, 2021 - 2033 (USD Million)
      • 7.3.6.3. Market estimates & forecast, by packaging type, 2021 - 2033 (USD Million)
      • 7.3.6.4. Market estimates & forecast, by end use, 2021 - 2033 (USD Million)
      • 7.3.6.5. Market estimates & forecast, by product, 2021 - 2033 (USD Million)
    • 7.3.7. UK
      • 7.3.7.1. Key country dynamics
      • 7.3.7.2. Market Estimates & Forecast, 2021 - 2033 (USD Million)
      • 7.3.7.3. Market estimates & forecast, by packaging type, 2021 - 2033 (USD Million)
      • 7.3.7.4. Market estimates & forecast, by end use, 2021 - 2033 (USD Million)
      • 7.3.7.5. Market estimates & forecast, by product, 2021 - 2033 (USD Million)
    • 7.3.8. Italy
      • 7.3.8.1. Key country dynamics
      • 7.3.8.2. Market Estimates & Forecast, 2021 - 2033 (USD Million)
      • 7.3.8.3. Market estimates & forecast, by packaging type, 2021 - 2033 (USD Million)
      • 7.3.8.4. Market estimates & forecast, by end use, 2021 - 2033 (USD Million)
      • 7.3.8.5. Market estimates & forecast, by product, 2021 - 2033 (USD Million)
    • 7.3.9. Spain
      • 7.3.9.1. Key country dynamics
      • 7.3.9.2. Market Estimates & Forecast, 2021 - 2033 (USD Million)
      • 7.3.9.3. Market estimates & forecast, by packaging type, 2021 - 2033 (USD Million)
      • 7.3.9.4. Market estimates & forecast, by end use, 2021 - 2033 (USD Million)
      • 7.3.9.5. Market estimates & forecast, by product, 2021 - 2033 (USD Million)
    • 7.3.10. Netherlands
      • 7.3.10.1. Key country dynamics
      • 7.3.10.2. Market Estimates & Forecast, 2021 - 2033 (USD Million)
      • 7.3.10.3. Market estimates & forecast, by packaging type, 2021 - 2033 (USD Million)
      • 7.3.10.4. Market estimates & forecast, by end use, 2021 - 2033 (USD Million)
      • 7.3.10.5. Market estimates & forecast, by product, 2021 - 2033 (USD Million)
  • 7.4. Asia Pacific
    • 7.4.1. Market Estimates & Forecast, 2021 - 2033 (USD Million)
    • 7.4.2. Market estimates & forecast, by packaging type, 2021 - 2033 (USD Million)
    • 7.4.3. Market estimates & forecast, by end use, 2021 - 2033 (USD Million)
    • 7.4.4. Market estimates & forecast, by product, 2021 - 2033 (USD Million)
    • 7.4.5. China
      • 7.4.5.1. Key country dynamics
      • 7.4.5.2. Market Estimates & Forecast, 2021 - 2033 (USD Million)
      • 7.4.5.3. Market estimates & forecast, by packaging type, 2021 - 2033 (USD Million)
      • 7.4.5.4. Market estimates & forecast, by end use, 2021 - 2033 (USD Million)
      • 7.4.5.5. Market estimates & forecast, by product, 2021 - 2033 (USD Million)
    • 7.4.6. India
      • 7.4.6.1. Key country dynamics
      • 7.4.6.2. Market Estimates & Forecast, 2021 - 2033 (USD Million)
      • 7.4.6.3. Market estimates & forecast, by packaging type, 2021 - 2033 (USD Million)
      • 7.4.6.4. Market estimates & forecast, by end use, 2021 - 2033 (USD Million)
      • 7.4.6.5. Market estimates & forecast, by product, 2021 - 2033 (USD Million)
    • 7.4.7. Japan
      • 7.4.7.1. Key country dynamics
      • 7.4.7.2. Market Estimates & Forecast, 2021 - 2033 (USD Million)
      • 7.4.7.3. Market estimates & forecast, by packaging type, 2021 - 2033 (USD Million)
      • 7.4.7.4. Market estimates & forecast, by end use, 2021 - 2033 (USD Million)
      • 7.4.7.5. Market estimates & forecast, by product, 2021 - 2033 (USD Million)
    • 7.4.8. Taiwan
      • 7.4.8.1. Key country dynamics
      • 7.4.8.2. Market Estimates & Forecast, 2021 - 2033 (USD Million)
      • 7.4.8.3. Market estimates & forecast, by packaging type, 2021 - 2033 (USD Million)
      • 7.4.8.4. Market estimates & forecast, by end use, 2021 - 2033 (USD Million)
      • 7.4.8.5. Market estimates & forecast, by product, 2021 - 2033 (USD Million)
    • 7.4.9. South Korea
      • 7.4.9.1. Key country dynamics
      • 7.4.9.2. Market Estimates & Forecast, 2021 - 2033 (USD Million)
      • 7.4.9.3. Market estimates & forecast, by packaging type, 2021 - 2033 (USD Million)
      • 7.4.9.4. Market estimates & forecast, by end use, 2021 - 2033 (USD Million)
      • 7.4.9.5. Market estimates & forecast, by product, 2021 - 2033 (USD Million)
  • 7.5. Latin America
    • 7.5.1. Market Estimates & Forecast, 2021 - 2033 (USD Million)
    • 7.5.2. Market estimates & forecast, by packaging type, 2021 - 2033 (USD Million)
    • 7.5.3. Market estimates & forecast, by end use, 2021 - 2033 (USD Million)
    • 7.5.4. Market estimates & forecast, by product, 2021 - 2033 (USD Million)
    • 7.5.5. Brazil
      • 7.5.5.1. Key country dynamics
      • 7.5.5.2. Market Estimates & Forecast, 2021 - 2033 (USD Million)
      • 7.5.5.3. Market estimates & forecast, by packaging type, 2021 - 2033 (USD Million)
      • 7.5.5.4. Market estimates & forecast, by end use, 2021 - 2033 (USD Million)
      • 7.5.5.5. Market estimates & forecast, by product, 2021 - 2033 (USD Million)
  • 7.6. Middle East & Africa
    • 7.6.1. Market Estimates & Forecast, 2021 - 2033 (USD Million)
    • 7.6.2. Market estimates & forecast, by packaging type, 2021 - 2033 (USD Million)
    • 7.6.3. Market estimates & forecast, by end use, 2021 - 2033 (USD Million)
    • 7.6.4. Market estimates & forecast, by product, 2021 - 2033 (USD Million)
    • 7.6.5. Israel
      • 7.6.5.1. Key country dynamics
      • 7.6.5.2. Market Estimates & Forecast, 2021 - 2033 (USD Million)
      • 7.6.5.3. Market estimates & forecast, by packaging type, 2021 - 2033 (USD Million)
      • 7.6.5.4. Market estimates & forecast, by end use, 2021 - 2033 (USD Million)
      • 7.6.5.5. Market estimates & forecast, by product, 2021 - 2033 (USD Million)
    • 7.6.6. South Africa
      • 7.6.6.1. Key country dynamics
      • 7.6.6.2. Market Estimates & Forecast, 2021 - 2033 (USD Million)
      • 7.6.6.3. Market estimates & forecast, by packaging type, 2021 - 2033 (USD Million)
      • 7.6.6.4. Market estimates & forecast, by end use, 2021 - 2033 (USD Million)
      • 7.6.6.5. Market estimates & forecast, by product, 2021 - 2033 (USD Million)

Chapter 8. Global Semiconductor Assembly and Packaging Equipment Market - Competitive Landscape

  • 8.1. Recent Developments & Impact Analysis, By Key Market Participants
  • 8.2. Company Categorization
  • 8.3. Company Dashboard Analysis
  • 8.4. Vendor Landscape
    • 8.4.1. List of Key Raw Material/Component Providers
    • 8.4.2. List of Key Manufacturers
    • 8.4.3. List of Key Distributors
  • 8.5. Company Market Share Analysis, 2024
  • 8.6. Company Positioning Analysis, 2024
  • 8.7. Company Heat Map Analysis, 2024
  • 8.8. Strategy Mapping
  • 8.9. Company Profiles
    • 8.9.1. Applied Materials
      • 8.9.1.1. Participant's overview
      • 8.9.1.2. Financial performance
      • 8.9.1.3. Product benchmarking
      • 8.9.1.4. Recent developments
    • 8.9.2. ASM Pacific Technology
      • 8.9.2.1. Participant's overview
      • 8.9.2.2. Financial performance
      • 8.9.2.3. Product benchmarking
      • 8.9.2.4. Recent developments
    • 8.9.3. Veeco Instruments Inc.
      • 8.9.3.1. Participant's overview
      • 8.9.3.2. Financial performance
      • 8.9.3.3. Product benchmarking
      • 8.9.3.4. Recent developments
    • 8.9.4. Besi
      • 8.9.4.1. Participant's overview
      • 8.9.4.2. Financial performance
      • 8.9.4.3. Product benchmarking
      • 8.9.4.4. Recent developments
    • 8.9.5. Disco Corporation
      • 8.9.5.1. Participant's overview
      • 8.9.5.2. Financial performance
      • 8.9.5.3. Product benchmarking
      • 8.9.5.4. Recent developments
    • 8.9.6. Kulicke & Soffa Industries, Inc. (K&S)
      • 8.9.6.1. Participant's overview
      • 8.9.6.2. Financial performance
      • 8.9.6.3. Product benchmarking
      • 8.9.6.4. Recent developments
    • 8.9.7. Lam Research Corporation
      • 8.9.7.1. Participant's overview
      • 8.9.7.2. Financial performance
      • 8.9.7.3. Product benchmarking
      • 8.9.7.4. Recent developments
    • 8.9.8. Nikon Corporation
      • 8.9.8.1. Participant's overview
      • 8.9.8.2. Financial performance
      • 8.9.8.3. Product benchmarking
      • 8.9.8.4. Recent developments
    • 8.9.9. Plasma-Therm
      • 8.9.9.1. Participant's overview
      • 8.9.9.2. Financial performance
      • 8.9.9.3. Product benchmarking
      • 8.9.9.4. Recent developments
    • 8.9.10. Rudolph Technologies, Inc.
      • 8.9.10.1. Participant's overview
      • 8.9.10.2. Financial performance
      • 8.9.10.3. Product benchmarking
      • 8.9.10.4. Recent developments
    • 8.9.11. SCREEN Semiconductor Solutions Co., Ltd.
      • 8.9.11.1. Participant's overview
      • 8.9.11.2. Financial performance
      • 8.9.11.3. Product benchmarking
      • 8.9.11.4. Recent developments
    • 8.9.12. SUSS MicroTec SE
      • 8.9.12.1. Participant's overview
      • 8.9.12.2. Financial performance
      • 8.9.12.3. Product benchmarking
      • 8.9.12.4. Recent developments
    • 8.9.13. Teradyne, Inc.
      • 8.9.13.1. Participant's overview
      • 8.9.13.2. Financial performance
      • 8.9.13.3. Product benchmarking
      • 8.9.13.4. Recent developments
    • 8.9.14. Tokyo Electron Limited (TEL)
      • 8.9.14.1. Participant's overview
      • 8.9.14.2. Financial performance
      • 8.9.14.3. Product benchmarking
      • 8.9.14.4. Recent developments
    • 8.9.15. Ultratech, Inc.
      • 8.9.15.1. Participant's overview
      • 8.9.15.2. Financial performance
      • 8.9.15.3. Product benchmarking
      • 8.9.15.4. Recent developments

List of Tables

  • Table 1 Global semiconductor assembly and packaging equipment market estimates and forecasts, 2021 - 2033 (USD Million)
  • Table 2 Global semiconductor assembly and packaging equipment market estimates and forecasts, by packaging type, 2021 - 2033 (USD Million)
  • Table 3 Global semiconductor assembly and packaging equipment market estimates and forecasts, by end use, 2021 - 2033 (USD Million)
  • Table 4 Global semiconductor assembly and packaging equipment market estimates and forecasts, by product, 2021 - 2033 (USD Million)
  • Table 5 Global semiconductor assembly and packaging equipment market estimates and forecasts, by region, 2021 - 2033 (USD Million)
  • Table 6 North America semiconductor assembly and packaging equipment market estimates and forecasts, by packaging type, 2021 - 2033 (USD Million)
  • Table 7 North America semiconductor assembly and packaging equipment market estimates and forecasts, by end use, 2021 - 2033 (USD Million)
  • Table 8 North America semiconductor assembly and packaging equipment market estimates and forecasts, by product, 2021 - 2033 (USD Million)
  • Table 9 U.S. semiconductor assembly and packaging equipment market estimates and forecasts, 2021 - 2033 (USD Million)
  • Table 10 U.S. semiconductor assembly and packaging equipment market estimates and forecasts, by packaging type, 2021 - 2033 (USD Million)
  • Table 11 U.S. semiconductor assembly and packaging equipment market estimates and forecasts, by end use, 2021 - 2033 (USD Million)
  • Table 12 U.S. semiconductor assembly and packaging equipment market estimates and forecasts, by product, 2021 - 2033 (USD Million)
  • Table 13 Canada semiconductor assembly and packaging equipment market estimates and forecasts, 2021 - 2033 (USD Million)
  • Table 14 Canada semiconductor assembly and packaging equipment market estimates and forecasts, by packaging type, 2021 - 2033 (USD Million)
  • Table 15 Canada semiconductor assembly and packaging equipment market estimates and forecasts, by end use, 2021 - 2033 (USD Million)
  • Table 16 Canada semiconductor assembly and packaging equipment market estimates and forecasts, by product, 2021 - 2033 (USD Million)
  • Table 17 Mexico semiconductor assembly and packaging equipment market estimates and forecasts, 2021 - 2033 (USD Million)
  • Table 18 Mexico semiconductor assembly and packaging equipment market estimates and forecasts, by packaging type, 2021 - 2033 (USD Million)
  • Table 19 Mexico semiconductor assembly and packaging equipment market estimates and forecasts, by end use, 2021 - 2033 (USD Million)
  • Table 20 Mexico semiconductor assembly and packaging equipment market estimates and forecasts, by product, 2021 - 2033 (USD Million)
  • Table 21 Europe semiconductor assembly and packaging equipment market estimates and forecasts, 2021 - 2033 (USD Million)
  • Table 22 Europe semiconductor assembly and packaging equipment market estimates and forecasts, by packaging type, 2021 - 2033 (USD Million)
  • Table 23 Europe semiconductor assembly and packaging equipment market estimates and forecasts, by end use, 2021 - 2033 (USD Million)
  • Table 24 Europe semiconductor assembly and packaging equipment market estimates and forecasts, by product, 2021 - 2033 (USD Million)
  • Table 25 Germany semiconductor assembly and packaging equipment market estimates and forecasts, by packaging type, 2021 - 2033 (USD Million)
  • Table 26 Germany semiconductor assembly and packaging equipment market estimates and forecasts, by end use, 2021 - 2033 (USD Million)
  • Table 27 Germany semiconductor assembly and packaging equipment market estimates and forecasts, by product, 2021 - 2033 (USD Million)
  • Table 28 France semiconductor assembly and packaging equipment market estimates and forecasts, by packaging type, 2021 - 2033 (USD Million)
  • Table 29 France semiconductor assembly and packaging equipment market estimates and forecasts, by end use, 2021 - 2033 (USD Million)
  • Table 30 France semiconductor assembly and packaging equipment market estimates and forecasts, by product, 2021 - 2033 (USD Million)
  • Table 31 Italy semiconductor assembly and packaging equipment market estimates and forecasts, by packaging type, 2021 - 2033 (USD Million)
  • Table 32 Italy semiconductor assembly and packaging equipment market estimates and forecasts, by end use, 2021 - 2033 (USD Million)
  • Table 33 Italy semiconductor assembly and packaging equipment market estimates and forecasts, by product, 2021 - 2033 (USD Million)
  • Table 34 Spain semiconductor assembly and packaging equipment market estimates and forecasts, by packaging type, 2021 - 2033 (USD Million)
  • Table 35 Spain semiconductor assembly and packaging equipment market estimates and forecasts, by end use, 2021 - 2033 (USD Million)
  • Table 36 Spain semiconductor assembly and packaging equipment market estimates and forecasts, by product, 2021 - 2033 (USD Million)
  • Table 37 Netherlands semiconductor assembly and packaging equipment market estimates and forecasts, by packaging type, 2021 - 2033 (USD Million)
  • Table 38 Netherlands semiconductor assembly and packaging equipment market estimates and forecasts, by end use, 2021 - 2033 (USD Million)
  • Table 39 Netherlands semiconductor assembly and packaging equipment market estimates and forecasts, by product, 2021 - 2033 (USD Million)
  • Table 40 U.K. semiconductor assembly and packaging equipment market estimates and forecasts, by packaging type, 2021 - 2033 (USD Million)
  • Table 41 U.K. semiconductor assembly and packaging equipment market estimates and forecasts, by end use, 2021 - 2033 (USD Million)
  • Table 42 U.K. semiconductor assembly and packaging equipment market estimates and forecasts, by product, 2021 - 2033 (USD Million)
  • Table 43 Asia Pacific semiconductor assembly and packaging equipment market estimates and forecasts, by packaging type, 2021 - 2033 (USD Million)
  • Table 44 Asia Pacific semiconductor assembly and packaging equipment market estimates and forecasts, by end use, 2021 - 2033 (USD Million)
  • Table 45 Asia Pacific semiconductor assembly and packaging equipment market estimates and forecasts, by product, 2021 - 2033 (USD Million)
  • Table 46 China semiconductor assembly and packaging equipment market estimates and forecasts, by packaging type, 2021 - 2033 (USD Million)
  • Table 47 China semiconductor assembly and packaging equipment market estimates and forecasts, by end use, 2021 - 2033 (USD Million)
  • Table 48 China semiconductor assembly and packaging equipment market estimates and forecasts, by product, 2021 - 2033 (USD Million)
  • Table 49 India semiconductor assembly and packaging equipment market estimates and forecasts, by packaging type, 2021 - 2033 (USD Million)
  • Table 50 India semiconductor assembly and packaging equipment market estimates and forecasts, by end use, 2021 - 2033 (USD Million)
  • Table 51 India semiconductor assembly and packaging equipment market estimates and forecasts, by product, 2021 - 2033 (USD Million)
  • Table 52 Japan semiconductor assembly and packaging equipment market estimates and forecasts, by packaging type, 2021 - 2033 (USD Million)
  • Table 53 Japan semiconductor assembly and packaging equipment market estimates and forecasts, by end use, 2021 - 2033 (USD Million)
  • Table 54 Japan semiconductor assembly and packaging equipment market estimates and forecasts, by product, 2021 - 2033 (USD Million)
  • Table 55 South Korea semiconductor assembly and packaging equipment market estimates and forecasts, by packaging type, 2021 - 2033 (USD Million)
  • Table 56 South Korea semiconductor assembly and packaging equipment market estimates and forecasts, by end use, 2021 - 2033 (USD Million)
  • Table 57 South Korea semiconductor assembly and packaging equipment market estimates and forecasts, by product, 2021 - 2033 (USD Million)
  • Table 58 Taiwan semiconductor assembly and packaging equipment market estimates and forecasts, by packaging type, 2021 - 2033 (USD Million)
  • Table 59 Taiwan semiconductor assembly and packaging equipment market estimates and forecasts, by end use, 2021 - 2033 (USD Million)
  • Table 60 Taiwan semiconductor assembly and packaging equipment market estimates and forecasts, by product, 2021 - 2033 (USD Million)
  • Table 61 Latin America semiconductor assembly and packaging equipment market estimates and forecasts, by packaging type, 2021 - 2033 (USD Million)
  • Table 62 Latin America semiconductor assembly and packaging equipment market estimates and forecasts, by end use, 2021 - 2033 (USD Million)
  • Table 63 Latin America semiconductor assembly and packaging equipment market estimates and forecasts, by product, 2021 - 2033 (USD Million)
  • Table 64 Brazil semiconductor assembly and packaging equipment market estimates and forecasts, by packaging type, 2021 - 2033 (USD Million)
  • Table 65 Brazil semiconductor assembly and packaging equipment market estimates and forecasts, by end use, 2021 - 2033 (USD Million)
  • Table 66 Brazil semiconductor assembly and packaging equipment market estimates and forecasts, by product, 2021 - 2033 (USD Million)
  • Table 67 Middle East & Africa semiconductor assembly and packaging equipment market estimates and forecasts, by packaging type, 2021 - 2033 (USD Million)
  • Table 68 Middle East & Africa semiconductor assembly and packaging equipment market estimates and forecasts, by end use, 2021 - 2033 (USD Million)
  • Table 69 Middle East & Africa semiconductor assembly and packaging equipment market estimates and forecasts, by product, 2021 - 2033 (USD Million)
  • Table 70 Israel semiconductor assembly and packaging equipment market estimates and forecasts, by packaging type, 2021 - 2033 (USD Million)
  • Table 71 Israel semiconductor assembly and packaging equipment market estimates and forecasts, by end use, 2021 - 2033 (USD Million)
  • Table 72 Israel semiconductor assembly and packaging equipment market estimates and forecasts, by product, 2021 - 2033 (USD Million)
  • Table 73 South Africa semiconductor assembly and packaging equipment market estimates and forecasts, by packaging type, 2021 - 2033 (USD Million)
  • Table 74 South Africa semiconductor assembly and packaging equipment market estimates and forecasts, by end use, 2021 - 2033 (USD Million)
  • Table 75 South Africa semiconductor assembly and packaging equipment market estimates and forecasts, by product, 2021 - 2033 (USD Million)
  • Table 76 Company Heat Map Analysis, 2024
  • Table 77 Strategy Mapping

List of Figures

  • Fig. 1 Market research process
  • Fig. 2 Data triangulation techniques
  • Fig. 3 Primary research pattern
  • Fig. 4 Market research approaches
  • Fig. 5 QFD modeling for market share assessment
  • Fig. 6 Information Procurement
  • Fig. 7 Market Formulation and Validation
  • Fig. 8 Data Validating & Publishing
  • Fig. 9 Market Segmentation & Scope
  • Fig. 10 Global Semiconductor Assembly and Packaging Equipment Market Snapshot
  • Fig. 11 Segment Snapshot
  • Fig. 12 Competitive Landscape Snapshot
  • Fig. 13 Parent market outlook
  • Fig. 14 Global Semiconductor Assembly and Packaging Equipment Market Value, 2024 (USD Million)
  • Fig. 15 Global Semiconductor Assembly and Packaging Equipment Market - Value Chain Analysis
  • Fig. 16 Global Semiconductor Assembly and Packaging Equipment Market - Market Dynamics
  • Fig. 17 Global Semiconductor Assembly and Packaging Equipment Market - PORTER's Analysis
  • Fig. 18 Global Semiconductor Assembly and Packaging Equipment Market - PESTEL Analysis
  • Fig. 19 Global Semiconductor Assembly and Packaging Equipment Market Estimates & Forecasts, By Packaging Type: Key Takeaways
  • Fig. 20 Global Semiconductor Assembly and Packaging Equipment Market Share, By Packaging Type, 2024 & 2033
  • Fig. 21 Global Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By Flip Chip Packaging Equipment, 2021 - 2033 (USD Million)
  • Fig. 22 Global Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By Wafer Level Packaging (WLP) Equipment, 2021 - 2033 (USD Million)
  • Fig. 23 Global Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By Fan-Out Packaging Equipment, 2021 - 2033 (USD Million)
  • Fig. 24 Global Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By System-in-Package (SiP) Equipment, 2021 - 2033 (USD Million)
  • Fig. 25 Global Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By 3D/25D Packaging Equipment, 2021 - 2033 (USD Million)
  • Fig. 26 Global Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By Others 2021 - 2033 (USD Million)
  • Fig. 27 Global Semiconductor Assembly and Packaging Equipment Market Estimates & Forecasts, By Product: Key Takeaways
  • Fig. 28 Global Semiconductor Assembly and Packaging Equipment Market Share, By Product, 2024 & 2033
  • Fig. 29 Global Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By Dicing Equipment, 2021 - 2033 (USD Million)
  • Fig. 30 Global Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By Scriber, 2021 - 2033 (USD Million)
  • Fig. 31 Global Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By Dicer, 2021 - 2033 (USD Million)
  • Fig. 32 Global Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By Wafer Mounting Equipment, 2021 - 2033 (USD Million)
  • Fig. 33 Global Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By Bonding Equipment, 2021 - 2033 (USD Million)
  • Fig. 34 Global Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By Die Bonder, 2021 - 2033 (USD Million)
  • Fig. 35 Global Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By Wire Bonder, 2021 - 2033 (USD Million)
  • Fig. 36 Global Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By Others, 2021 - 2033 (USD Million)
  • Fig. 37 Global Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By Packaging Equipment, 2021 - 2033 (USD Million)
  • Fig. 38 Global Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By Molding Equipment, 2021 - 2033 (USD Million)
  • Fig. 39 Global Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By Solder Plating Equipment, 2021 - 2033 (USD Million)
  • Fig. 40 Global Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By Deflasher, 2021 - 2033 (USD Million)
  • Fig. 41 Global Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By Others, 2021 - 2033 (USD Million)
  • Fig. 42 Global Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By Others, 2021 - 2033 (USD Million)
  • Fig. 43 Global Semiconductor Assembly and Packaging Equipment Market Estimates & Forecasts, By End Use: Key Takeaways
  • Fig. 44 Global Semiconductor Assembly and Packaging Equipment Market Share, By End Use, 2024 & 2033
  • Fig. 45 Global Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, In IDMs (Integrated Device Manufacturers) 2021 - 2033 (USD Million)
  • Fig. 46 Global Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, In OSAT (Outsourced Semiconductor Assembly and Test) 2021 - 2033 (USD Million)
  • Fig. 47 North America Semiconductor Assembly and Packaging Equipment Market Estimates & Forecasts, 2021 - 2033 (USD Million)
  • Fig. 48 US Semiconductor Assembly and Packaging Equipment Market Estimates & Forecasts, 2021 - 2033 (USD Million)
  • Fig. 49 Canada Semiconductor Assembly and Packaging Equipment Market Estimates & Forecasts, 2021 - 2033 (USD Million)
  • Fig. 50 Mexico Semiconductor Assembly and Packaging Equipment Market Estimates & Forecasts, 2021 - 2033 (USD Million)
  • Fig. 51 Europe Semiconductor Assembly and Packaging Equipment Market Estimates & Forecasts, 2021 - 2033 (USD Million)
  • Fig. 52 Germany Semiconductor Assembly and Packaging Equipment Market Estimates & Forecasts, 2021 - 2033 (USD Million)
  • Fig. 53 France Semiconductor Assembly and Packaging Equipment Market Estimates & Forecasts, 2021 - 2033 (USD Million)
  • Fig. 54 UK Semiconductor Assembly and Packaging Equipment Market Estimates & Forecasts, 2021 - 2033 (USD Million)
  • Fig. 55 Italy Semiconductor Assembly and Packaging Equipment Market Estimates & Forecasts, 2021 - 2033 (USD Million)
  • Fig. 56 Spain Semiconductor Assembly and Packaging Equipment Market Estimates & Forecasts, 2021 - 2033 (USD Million)
  • Fig. 57 Netherlands Semiconductor Assembly and Packaging Equipment Market Estimates & Forecasts, 2021 - 2033 (USD Million)
  • Fig. 58 Asia Pacific Semiconductor Assembly and Packaging Equipment Market Estimates & Forecasts, 2021 - 2033 (USD Million)
  • Fig. 59 China Semiconductor Assembly and Packaging Equipment Market Estimates & Forecasts, 2021 - 2033 (USD Million)
  • Fig. 60 Japan Semiconductor Assembly and Packaging Equipment Market Estimates & Forecasts, 2021 - 2033 (USD Million)
  • Fig. 61 India Semiconductor Assembly and Packaging Equipment Market Estimates & Forecasts, 2021 - 2033 (USD Million)
  • Fig. 62 Taiwan Semiconductor Assembly and Packaging Equipment Market Estimates & Forecasts, 2021 - 2033 (USD Million)
  • Fig. 63 South Korea Semiconductor Assembly and Packaging Equipment Market Estimates & Forecasts, 2021 - 2033 (USD Million)
  • Fig. 64 Taiwan Semiconductor Assembly and Packaging Equipment Market Estimates & Forecasts, 2021 - 2033 (USD Million)
  • Fig. 65 Latin America Semiconductor Assembly and Packaging Equipment Market Estimates & Forecasts, 2021 - 2033 (USD Million)
  • Fig. 66 Brazil Semiconductor Assembly and Packaging Equipment Market Estimates & Forecasts, 2021 - 2033 (USD Million)
  • Fig. 67 Argentina Semiconductor Assembly and Packaging Equipment Market Estimates & Forecasts, 2021 - 2033 (USD Million)
  • Fig. 68 Middle East & Africa Semiconductor Assembly and Packaging Equipment Market Estimates & Forecasts, 2021 - 2033 (USD Million)
  • Fig. 69 Saudi Arabia Semiconductor Assembly and Packaging Equipment Market Estimates & Forecasts, 2021 - 2033 (USD Million)
  • Fig. 70 South Africa Semiconductor Assembly and Packaging Equipment Market Estimates & Forecasts, 2021 - 2033 (USD Million)
  • Fig. 71 Israel Semiconductor Assembly and Packaging Equipment Market Estimates & Forecasts, 2021 - 2033 (USD Million)
  • Fig. 72 Key Company Categorization
  • Fig. 73 Company Market Positioning
  • Fig. 74 Key Company Market Share Analysis, 2024
  • Fig. 75 Strategy Mapping