半导体工厂自动化：技术问题与市场预测

Semiconductor Factory Automation: Technology Issues and Market Forecasts

出版日期: 2024年08月01日 | 出版商:

Information Network | 英文 | 商品交期: 2-3个工作天内

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简介目录图表

简介

半导体产业的特点是技术进步迅速，不断追求更高的效率和精度。工厂自动化在实现这些目标方面发挥着关键作用，真空和常压机器人、自动化物料搬运系统 (AMHS) 和製造执行系统 (MES) 等技术可以帮助实现这一目标，我们处于变革的前沿。

本报告深入分析了半导体製造工厂的关键自动化技术，研究了它们对半导体製造流程的影响、新兴趋势和策略课题。我们也全面调查推动半导体工厂引入自动化的因素，并提供策略预测以指导未来的投资和发展。

半导体工厂自动化技术趋势

先进自动化技术在半导体製造中的整合正在重塑该行业，需要更高的吞吐量、更低的缺陷率和更高的营运效率。真空和大气机器人是这种自动化的重要组成部分。真空机器人专门设计用于在半导体晶圆处理室典型的高真空环境中运作。这些机器人以极高的精度处理精緻的晶圆，最大限度地减少污染和物理损坏。真空机器人技术的进步集中在提高速度、准确性和可靠性，这对于维持半导体製造的高良率至关重要。

另一方面，大气机器人在大气环境中运行，广泛用于在不同製程站之间运输晶圆。这些机器人设计用于在无尘室中处理晶圆，确保满足半导体製造的严格清洁度要求。在日益拥挤的工厂环境中，需要最大限度地利用空间，从而推动了更紧凑和敏捷的大气机器人的发展趋势。真空和大气机器人都变得越来越复杂，结合了先进的感测器和人工智慧演算法来优化其性能和适应性。

自动物料搬运系统（AMHS）是半导体工厂自动化的另一项重要技术。 AMHS 负责在整个工厂内有效率地运输晶圆、掩模版和消耗品等材料。这些系统包括各种自动化运输机制，例如高架起重机运输（OHT）和自动导引车（AGV），以确保物料及时且准确地运输到各个处理站。 AMHS 显然正在推进整合更智慧的路由和调度演算法，这增强了其适应动态製造环境并减少瓶颈的能力。

製造执行系统 (MES) 在协调半导体工厂内的复杂流程方面发挥关键作用。 MES 即时监控和控制生产活动，确保製造营运符合预先定义的规范和品质标准。这些系统收集并分析来自各种设备和流程的大量数据，从而实现主动决策和持续改进。更先进的 MES 解决方案的趋势特点是采用大数据分析和机器学习，透过提高系统预测和预防潜在问题的能力来提高工厂的整体绩效。

Introduction

The semiconductor industry is characterized by its rapid technological advancements and the constant pursuit of higher efficiency and precision. Factory automation plays a critical role in achieving these goals, with technologies such as vacuum and atmospheric robots, Automated Material Handling Systems (AMHS), and Manufacturing Execution Systems (MES) at the forefront of this transformation. Our report, "Semiconductor Factory Automation: Technology Issues and Market Forecasts," provides an in-depth analysis of these crucial automation technologies, examining their impact on the semiconductor manufacturing process, emerging trends, and strategic challenges. This report is tailored for industry professionals seeking comprehensive insights into the factors driving the adoption of automation in semiconductor factories and offering strategic forecasts to guide future investments and development.

Trends in Semiconductor Factory Automation Technology

The integration of advanced automation technologies in semiconductor manufacturing is reshaping the industry, driven by the need for higher throughput, lower defect rates, and greater operational efficiency. Vacuum and atmospheric robots are essential components of this automation landscape. Vacuum robots are specifically designed to operate in high-vacuum environments typical of semiconductor wafer processing chambers. These robots handle delicate wafers with extreme precision, minimizing contamination and physical damage. Advances in vacuum robot technology are focused on enhancing their speed, accuracy, and reliability, which are critical for maintaining high yield rates in semiconductor fabrication.

Atmospheric robots, on the other hand, operate in ambient environments and are used extensively for wafer transport between different processing stations. These robots are designed to handle wafers in cleanroom conditions, ensuring that the stringent cleanliness requirements of semiconductor manufacturing are met. The trend towards more compact and agile atmospheric robots is driven by the need to maximize space utilization in increasingly crowded fab environments. Both vacuum and atmospheric robots are becoming more sophisticated, incorporating advanced sensors and AI algorithms to optimize their performance and adaptability.

Automated Material Handling Systems (AMHS) are another pivotal technology in semiconductor factory automation. AMHS are responsible for the efficient movement of materials, such as wafers, reticles, and consumables, throughout the fab. These systems include a range of automated transport mechanisms, such as overhead hoist transport (OHT) and automated guided vehicles (AGVs), which ensure timely and accurate delivery of materials to various processing stations. The evolution of AMHS is marked by the integration of more intelligent routing and scheduling algorithms, which enhance their ability to adapt to dynamic manufacturing environments and reduce bottlenecks.

Manufacturing Execution Systems (MES) play a crucial role in orchestrating the complex processes within semiconductor fabs. MES provide real-time monitoring and control of production activities, ensuring that manufacturing operations adhere to predefined specifications and quality standards. These systems collect and analyze vast amounts of data from various equipment and processes, enabling proactive decision-making and continuous improvement. The trend towards more advanced MES solutions is characterized by the incorporation of big data analytics and machine learning, which enhance the ability of these systems to predict and prevent potential issues, thereby improving overall fab performance.

The Need to Purchase This Report

For businesses and professionals involved in the semiconductor industry, understanding the latest advancements and trends in factory automation is essential for maintaining a competitive edge. This report provides a detailed analysis of the technological issues, market drivers, and challenges associated with vacuum and atmospheric robots, AMHS, and MES. By purchasing this report, stakeholders will gain valuable insights into the factors influencing the adoption and implementation of these automation technologies, enabling them to make informed strategic decisions and capitalize on emerging opportunities.

Our report offers strategic recommendations for leveraging automation technologies to enhance manufacturing efficiency, reduce costs, and improve product quality. It includes comprehensive market forecasts, competitive landscape assessments, and an in-depth examination of the key players driving innovation in semiconductor factory automation. Companies looking to invest in or expand their automation capabilities will find this report indispensable for identifying growth opportunities and understanding the competitive dynamics of the market.

In conclusion, "Semiconductor Factory Automation: Technology Issues and Market Forecasts" is an essential resource for industry professionals, engineers, researchers, and business leaders. It provides a thorough exploration of the technological trends and market dynamics shaping the automation of semiconductor fabs, equipping readers with the knowledge necessary to navigate the complexities of this field and capitalize on its potential. This report is designed to inform strategic planning, investment decisions, and the development of innovative automation solutions that will drive future success in the semiconductor industry.

Chapter 1. Introduction

Chapter 2. Executive Summary

2.1. Summary of Major Issues
2.2. Summary of Market Forecasts

Chapter 3. Driving Forces

3.1. Chips Act-U.S. and Global
3.2. Trend to 200/300mm Wafers
3.2. Trends In Chip Linewidths
3.4. Trends in Processing Tools
3.5. Benefits of Automated Wafer Handling

Chapter 4. Software

4.1. Introduction
4.2. The Evolution of CIM
4.3. MES in Industry
- 4.3.1. MES Functionalities
- 4.3.1. MES and ERP Integration
- 4.3.2. MES Products

Chapter 5. Hardware

5.1. Introduction
5.2. Elements of Automation
- 5.2.1. Tool Automation
- 5.2.2. Intrabay Automation
- 5.2.3. Interbay Automation
- 5.2.4. Unified Transport System
5.3. Flexible Automation
5.4. Reliability
5.5. Tool Issues and Trends
- 5.5.1. Flexible Tool Interface
- 5.5.2. Vacuum Robotics
- 5.5.3. AGV
- 5.5.4. Robot Control Systems
- 5.5.5. 300mm Wafer Transport
- 5.5.6. Mini-Environments and Cleanroom Issues

Chapter 6. Market Analysis

6.1. Market Forces
6.2. Market Forecast
- 6.2.1. Automated Transfer Tool Market
- 6.2.2. Carrier Transport Market
- 6.2.3. MES Software Market

Chapter 7. User Issues

7.1. Current Automation Thinking
7.2. The New Factory Paradigm
7.3. The New Factory in Action
7.4. Return on Investment Considerations
7.5. Eight Symptoms of the Old Paradigm
7.6. Putting the New Paradigm to Work

简介目录图表

LIST OF FIGURES

1.1. Advanced CIM System
3.1. Global Market Share Of Semiconductor Industry By Region
3.2. Semiconductor Manufacturing Wafer Capacity By Region
3.3. Global Logic Process Technology By Region
3.4. National Chip Incentive Programs By Region
3.5. Illustration Of Custer Tool
4.1. Vertical Integration Of A Semiconductor Fab
4.2. MES 4.0 Manufacturing Network
5.1. TSMC'S Leading-Edge Fab Costs
5.2. Inter & Intrabay (Top) And Unified (Bottom) Transport Systems
5.3. Traditional (Left) And Flexible (Right) Automated Material Handling System
5.4. Overhead Monorail Delivery
5.5. Stocker Design and Interfaces
6.1. Semiconductor Equipment Utilization
6.2. Revenue Losses from Wafer Defects
6.3. Market Shares of Atmospheric Robot Suppliers
6.4. Market Shares of Vacuum Robot Suppliers
6.5. Worldwide Market Shares of Carrier Transport Suppliers
6.6. Carrier Transport Market By Region
6.7. Worldwide Market of Shares MES Software Suppliers

LIST OF TABLES

3.1. Semiconductor Revenue And Shipments To Region
3.2. Semiconductor Fab Plans In U.S.
3.3. Semiconductor Fab Plans In China
3.4. Semiconductor Fab Plans Outside U.S.
3.5. Raw Wafer Overall Supply-Demand And Utilization Rate Analysis By Wafer Size
3.6. Foundry Market-Overall Supply-Demand And Utilization Rate Analysis By Wafer
3.7. Different Applications' Distribution To 12-Inch, 8-Inch, And 6-Inch
3.8. Wafer Metrics By Technology Node
3.9. Equipment Needed Per 10k Wpm Of New Capacity
5.1. Chip Cost per Node
6.1. Three-Year Savings for Automation
6.2. Cost of Alternative Automated Systems
6.3. Three-year Costs for Alternative Automated Systems
6.4. Worldwide Forecast of Automated Transfer Tools
6.5. Bill Of Materials For Atmospheric Automation Tool
6.6. Bill Of Materials For PVD Vacuum Tool
6.7. Process Tool Automation For 300mm Fabs
6.8. Worldwide Forecast of Carrier Transport Market
6.9. Worldwide Forecast of MES Software